Chip bonding device using reverse displacement coupling damping technology

Abstract

Chip bonding device adopting reverse displacement coupling damping technology belongs to the field of semiconductor equipment. The chip die bonder adopting the existing offset damping technology has the problems that when the moving shaft is operated at high speed, there is driving delay between the chip pickup shaft and the offset damping shaft, which causes the chip pickup shaft and the offset damping shaft to be unable to start and stop at the same frequency, and the inertia vibration generated by the chip pickup shaft cannot be completely offset. Meanwhile, the introduction of the offset damping shaft to suppress the inertia vibration causes the unit energy consumption to increase (electricity consumption and clean gas) for producing one chip, and the production cost increases. The Y linear motor stator is fixed on the Y motor stator fixing seat and is fixed on the three-axis base through the reverse displacement guide rail, the Y motor rotor is fixed on the Y moving shaft, the Y moving shaft is fixed on the Y shaft base through the Y shaft guide rail, the stator and the rotor of the Y motor are fixedly connected in a mechanical contact-free mode, the connection structure of the Y linear motor rotor and the stator is decoupled, the structure is compact and simple, the modular design has high integration degree, the control difficulty of the control system is reduced, the inertia vibration suppression effect is good, the vibration suppression effect and the production energy efficiency are excellent, and the chip bonding quality and the economic benefit are improved.

Description

Technical Field

[0001] This invention relates to a chip bonding device, specifically a chip bonding device employing reverse displacement coupling vibration reduction technology, belonging to the field of semiconductor equipment. Background Technology

[0002] The rapid development of China's digital economy has led to increasingly higher demands on chip performance in fields such as AI and autonomous driving, while simultaneously raising the requirements for chip bonding and placement accuracy. Driven by market growth and the need for cost control, packaging and testing companies are placing higher demands on chip production efficiency per unit time. Furthermore, as the number of ICs bonded per unit area of ​​the chip bonding frame increases, the requirements for chip placement accuracy become increasingly stringent. When balancing operational efficiency and bonding process accuracy, vibration will have a significant impact on chip bonding precision.

[0003] Most existing active vibration damping devices employ independent pickup and damping systems or coaxial damping mechanisms, fixed to a support component. The inertial force generated by the pickup system due to vibration and the inertial force generated by the damping system need to be transmitted and canceled through the support component. For example, patent CN222300630U discloses "a die bonding head device" and patent CN116207022A discloses "a vibration-damping die bonding structure and die bonding equipment." Although this type of device using an active vibration damping system has a certain ability to suppress vibration, it requires high precision in the synchronous damping control of the pickup and damping systems, and increases the difficulty in designing the structural mechanical properties and space utilization of the support component. At the same time, the addition of the damping system increases equipment costs and energy consumption (electricity and clean gas) in the chip bonding process, thus reducing production profitability. Summary of the Invention

[0004] A brief overview of the invention is given below to provide a basic understanding of certain aspects of it. It should be understood that this overview is not an exhaustive summary of the invention. It is not intended to identify key or essential parts of the invention, nor is it intended to limit the scope of the invention. Its purpose is merely to present certain concepts in a simplified form as a prelude to the more detailed description that follows.

[0005] In view of this, existing chip bonding machines using counter-damping technology suffer from a drive delay between the chip pickup axis and the counter-damping axis during high-speed operation of the motion axis. This delay prevents the chip pickup axis and the counter-damping axis from starting and stopping at the same frequency, thus failing to completely offset the inertial vibration generated by the chip pickup axis. Furthermore, this addresses the issue of increased energy consumption per chip produced (electricity and clean air consumption) and increased production costs resulting from the introduction of counter-damping axes to suppress inertial vibration. Therefore, a chip bonding device employing reverse displacement coupling damping technology is proposed. Structurally, the stator of a Y-axis linear motor is fixed on a Y-axis motor stator mounting base and then fixed to a three-axis base via a reverse displacement guide rail. Simultaneously, the Y-axis motor mover is fixed to the Y-axis motion axis, which is in turn fixed to the Y-axis base via a Y-axis guide rail. This forms a mechanically contactless connection between the stator and mover of the Y-axis motor, decoupling the connection structure between the mover and stator of the Y-axis linear motor. This solves the problem of existing chip bonding machines using counter-damping technology, where a drive delay exists between the chip pickup axis and the counter-damping axis during high-speed operation of the motion axis, preventing them from starting and stopping synchronously and making it difficult to completely offset the inertial vibration generated by the chip pickup axis. At the same time, it also solves the problem of increased energy consumption (electricity and clean gas consumption) and increased production costs per chip caused by introducing the counter-damping axis to suppress inertial vibration.

[0006] Solution: An active vibration suppression device for chip bonding, comprising a chip bonding device employing reverse displacement coupling vibration reduction technology, including an X-axis motion unit, a Y-axis motion unit, a Z-axis motion unit, and a reverse displacement motion vibration suppression unit, characterized in that: the X-axis motion unit includes an X-axis motion axis, an X-axis motor stator, an X-axis motor mover, and an X-axis guide rail; the Y-axis motion unit includes a Y-axis base, a Y-axis motion axis, a Y-axis motor mover, and a Y-axis guide rail; the Z-axis motion unit includes a Z-axis base, a decoupling guide rail fixing plate, a decoupling connector, a Z-axis motor stator, a Z-axis motor stator, a decoupling guide rail, and a Z-axis motion axis; the reverse displacement motion vibration suppression unit includes a Y-axis linear motor stator, a Y-axis motor stator fixing base, a reverse displacement guide rail, a damper, a damping plate, a counterweight, and a damping fixing plate.

[0007] Furthermore: the Y-axis linear motor stator, damper, and counterweight are fixed on the Y-axis motor stator mounting base and fixed on the triaxial base via a reverse displacement guide rail.

[0008] Furthermore, the damping plate is fixed to the triaxial base by a damping fixing plate and is centrally embedded in the damper.

[0009] Furthermore: the Y-axis motor mover is horizontally fixed on the Y-axis motion axis, and the Y-axis motion axis is fixed on the Y-axis base through the Y-axis guide rail, ensuring that the Y-axis linear motor stator is in the center position inside the Y-axis base cavity.

[0010] Furthermore, the Y-axis motion unit and the Z-axis motion unit are decoupled and connected through a decoupling connector.

[0011] The above-mentioned technical features and solutions of the present invention can be combined arbitrarily without causing structural conflicts.

[0012] The effects achieved by this invention are as follows: The device of this invention has a simple structure, is easy to install and disassemble, and occupies little structural space.

[0013] In this invention, the stator, damper, and counterweight of the Y-axis linear motor are fixed on the Y-axis motor stator mounting base, and are further fixed on the triaxial base via a reverse displacement guide rail.

[0014] In this invention, the damping plate is fixed to the triaxial base by a damping fixing plate and is centrally embedded in the damper.

[0015] In this invention, the Y-axis motor mover is horizontally fixed on the Y-axis motion axis, and the Y-axis motion axis is fixed on the Y-axis base through the Y-axis guide rail, ensuring that the Y-axis linear motor stator is in the center position inside the Y-axis base cavity.

[0016] The Y-axis motion unit and the Z-axis motion unit of the device of the present invention are decoupled and connected by a decoupling connector. Attached Figure Description

[0017] Figure 1 This is an isometric view of a chip bonding device employing reverse displacement coupling vibration reduction technology according to this embodiment; Figure 2 This is a rear axonometric view of a chip bonding device employing reverse displacement coupling vibration reduction technology according to this embodiment. Figure 3 This is a schematic diagram of the Z-axis drive of a chip bonding device employing reverse displacement coupling vibration reduction technology according to this embodiment; Figure 4 This is a schematic diagram of the Y-axis structure of a chip bonding device employing reverse displacement coupling vibration reduction technology according to this embodiment; Figure 5 This is a diagram illustrating the reverse displacement axis of a chip bonding device employing reverse displacement coupling vibration reduction technology according to this embodiment. Figure 6 This is a schematic diagram of the X-axis structure of a chip bonding device employing reverse displacement coupling vibration reduction technology in this embodiment.

[0018] The correspondence between the part names in the diagram and the attached drawing numbers is as follows: 1-Welding head; 2-Y-axis motion; 3-Y-axis linear motor stator; 4-Y-axis base; 5-Decoupling guide rail fixing plate; 6-X-axis motion; 7-Z-axis base; 8-Three-axis base; 9-Damping fixing plate; 10-Damping plate; 11-Damper; 12-Y-axis motor stator fixing seat; 13-Y-axis motor mover; 14-Decoupling connector; 15-Z-axis motion; 16-Counterweight; 17-Spring; 18-Z-axis motor stator; 19-Z-axis motor mover; 20-X-axis motor stator; 21-X-axis motor mover; 22-Reverse displacement guide rail; 23-Y-axis guide rail; 24-Decoupling guide rail; 25-X-axis guide rail. Detailed Implementation

[0019] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0020] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0021] In this application, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0022] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0023] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0026] Example: See Figures 1-6 This embodiment of a chip bonding device employing reverse displacement coupling vibration reduction technology includes an X-axis motion unit, a Y-axis motion unit, a Z-axis motion unit, and a reverse displacement motion vibration suppression unit. The X-axis motion unit includes an X-axis motion axis (6), an X-axis motor stator (20), an X-axis motor mover (21), and an X-axis guide rail (25); the Y-axis motion unit includes a Y-axis base (4), a Y-axis motion axis (2), a Y-axis motor mover (13), and a Y-axis guide rail (23); the Z-axis motion unit includes a Z-axis base (7), a decoupling guide rail fixing plate (5), a decoupling connector (14), a Z-axis motor stator (18), a Z-axis motor stator (19), a decoupling guide rail (24), and a Z-axis motion axis (15); the reverse displacement motion vibration damping unit includes a Y-axis linear motor stator (3), a Y-axis motor stator fixing seat (12), a reverse displacement guide rail (22), a damper (11), a damping plate (10), a counterweight (16), and a damping fixing plate (9).

[0027] The chip bonding device using reverse displacement coupling vibration reduction technology is characterized in that: the Y-axis linear motor stator (3), damper (11) and counterweight (16) are fixed on the Y-axis motor stator fixing seat (12) and fixed on the triaxial base (8) by the reverse displacement guide rail (22). The chip bonding device using reverse displacement coupling vibration reduction technology is characterized in that: the damping plate (10) is fixed on the triaxial base (8) by the damping fixing plate (9) and embedded in the damper (11) in the center; The chip bonding device using reverse displacement coupling vibration reduction technology is characterized in that: the Y-axis motor mover (13) is horizontally fixed on the Y-axis motion shaft (2), and the Y-axis motion shaft (2) is fixed on the Y-axis base (4) through the Y-axis guide rail (23), ensuring that the Y-axis linear motor stator (3) is in the center position inside the Y-axis base (4); The chip bonding device using reverse displacement coupling vibration reduction technology is characterized in that: the Y-axis motion unit and the Z-axis motion unit are decoupled and connected by a decoupling connector (14).

[0028] The working principle is as follows: In this embodiment, a chip bonding device employing reverse displacement coupling vibration reduction technology has a Y-axis linear motor stator fixed on a Y-axis motor stator mounting base and further fixed to a three-axis base via a reverse displacement guide rail. Simultaneously, the Y-axis motor mover is fixed to the Y-axis motion axis, which is in turn fixed to the Y-axis base via a Y-axis guide rail. This forms a mechanically contactless connection between the stator and mover of the Y-axis motor, achieving decoupling of the connection structure between the Y-axis linear motor mover and stator. (Refer to the appendix of the specification.) Figures 1-6 During operation, the Y-axis motor mover drives the Y-axis motion axis to move in the positive Y-direction. Under the reaction force, the Y-axis linear motor stator drives the Y-axis linear motor stator fixed seat to be guided by the reverse displacement guide rail, generating a certain displacement in the negative Y-direction. The inertial energy and inertial amplitude generated are eliminated by the damper fixed on the Y-axis linear motor stator fixed seat and the damping plate fixed on the triaxial base through the magnetic cutting and heating of the reciprocating damper and damping plate. While the embodiments disclosed in this invention are as described above, their content is merely for the purpose of facilitating understanding of the technical solutions of this invention and is not intended to limit the invention. Any person skilled in the art to which this invention pertains may make any modifications and changes to the form and details of the implementation without departing from the core technical solutions disclosed in this invention; however, the scope of protection defined by this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A chip bonding device employing reverse displacement coupling vibration damping technology, comprising an X-axis motion unit, a Y-axis motion unit, a Z-axis motion unit, and a reverse displacement motion vibration damping unit, characterized in that: The X-axis motion unit includes an X-axis motion axis (6), an X-axis motor stator (20), an X-axis motor mover (21), and an X-axis guide rail (25); the Y-axis motion unit includes a Y-axis base (4), a Y-axis motion axis (2), a Y-axis motor mover (13), and a Y-axis guide rail (23); the Z-axis motion unit includes a Z-axis base (7), a decoupling guide rail fixing plate (5), a decoupling connector (14), a Z-axis motor stator (18), a Z-axis motor stator (19), a decoupling guide rail (24), and a Z-axis motion axis (15); the reverse displacement motion vibration damping unit includes a Y-axis linear motor stator (3), a Y-axis motor stator fixing seat (12), a reverse displacement guide rail (22), a damper (11), a damping plate (10), a counterweight (16), and a damping fixing plate (9).

2. The chip bonding device employing reverse displacement coupling vibration reduction technology according to claim 1, characterized in that: The Y-axis linear motor stator (3), damper (11) and counterweight (16) are fixed on the Y-axis motor stator mounting base (12) and fixed on the triaxial base (8) by the reverse displacement guide rail (22).

3. A chip bonding device employing reverse displacement coupling vibration reduction technology according to claim 1, characterized in that: The damping plate (10) is fixed on the triaxial base (8) by the damping fixing plate (9) and embedded in the damper (11) in the center.

4. A chip bonding device employing reverse displacement coupling vibration reduction technology according to claim 1, characterized in that: The Y-axis motor mover (13) is horizontally fixed on the Y-axis motion shaft (2), and the Y-axis motion shaft (2) is fixed on the Y-axis base (4) through the Y-axis guide rail (23), ensuring that the Y-axis linear motor stator (3) is in the center position in the cavity of the Y-axis base (4).

5. A chip bonding device employing reverse displacement coupling vibration reduction technology according to claim 1, characterized in that: The Y-axis motion unit and the Z-axis motion unit are decoupled and connected by a decoupling connector (14).

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