Arc source for uniform removal from target surface

Abstract

The invention relates to an arc evaporation source comprising: a target (1) comprising a material to be evaporated, operated as a cathode, the target (1) having a target front face (10), a target back face (20) and a target lateral face (30), wherein the target lateral face (30) extends from a border of the target front face (10) to a border of the target back face (20) and a distance between the target front face (10) and the target back face (20) along a respective vertical axis (A-A) corresponds to a target thickness; an electrode as an anode (70) having an inner surface serving as an electron receiving surface; a magnetic guiding system comprising a mechanism (100) for generating a magnetic field comprising magnetic field lines located in front of the target front face (10); and a confinement mechanism (50) arranged at least partially around the target lateral face (30).

Description

[0001] This invention relates to an electric arc evaporation source and a method for depositing a coating using the electric arc evaporation source, wherein the electric arc evaporation source of the present invention can achieve uniform removal of target material and stable deposition of different types of coatings (e.g., metal layers, nitride layers, oxide layers, carbide layers, oxynitride layers, carbon oxide layers, carbon nitride layers, carbon nitride layers, and combinations thereof).

[0002] This invention is particularly suitable for the stable deposition of metal layers, and can even achieve the stable deposition of thick metal layers.

[0003] In the context of this invention, a metal layer (also referred to as a metal coating) is a coating that has metallic properties, for example, a coating that has metallic properties because of its chemical elemental composition.

[0004] In the context of this invention, the metal layer is not limited to a specific chemical element composition, but may, for example, have a chemical element composition expressed in atomic concentration that conforms to the following formula: Me a X 1-a , in: • a This refers to the atomic concentration of Me, with values ​​≤ 0.95. a Within the range of ≤1, preferably 0.98≤ a Within the range of ≤1; and •Me is one or more elements classified as metals, alkali metals, alkaline earth metals, transition metals, late transition metals, or metalloids in the periodic table, including, but not limited to, one or more elements selected from Ti, Cr, Ni, Co, Cr, Al, Y, Zr, Hf, Mo, and Ta; and • X is one or more chemical elements different from Me, which are present in the coating as unavoidable impurities. In particular, X can be one or more chemical elements selected from those classified as noble gases or nonmetals in the periodic table of elements, such as including (but not limited to) one or more elements selected from C, O, Ar, and Kr.

[0005] In the context of this invention, a metal layer may be considered a thick metal layer if its thickness is, for example, greater than 3 μm, preferably in the range of 5 μm to 250 μm, and more preferably in the range of 10 μm to 100 μm.

[0006] Existing technology Many arc evaporation sources are well known in the prior art and are used as coating material sources in physical vapor deposition (PVD) processes of the arc evaporation type.

[0007] For example, WO 2021 / 001536 A1 describes an arc evaporation source (also referred to as a cathode arc source or cathode arc evaporation device in WO 2021 / 001536 A1) which includes a target as a cathode, an electrically suspended constraint located near the side of the target, and an electrode as an anode.

[0008] However, existing arc evaporation technology cannot enable such arc evaporation sources to achieve a sufficiently long service life to meet current needs where thick layers (especially thick metal layers) must be deposited.

[0009] Existing arc evaporation technology also has the following drawbacks: it cannot achieve a sufficiently high metal layer deposition rate to achieve cost-effective preparation of thick metal layers.

[0010] Another drawback of using existing arc evaporation technology to produce thick metal layers is the high rate of electrical short circuits, which often leads to interruptions in the coating process. This results in increased time and resource consumption and reduced coating quality, which is very economically disadvantageous.

[0011] Purpose of the invention The main objective of this invention is to provide a novel arc evaporation source for overcoming the shortcomings of existing technologies. In particular, the novel arc evaporation source of this invention should be able to efficiently perform an arc evaporation PVD process for preparing a metal layer including a thick metal layer on a substrate to be coated.

[0012] The novel arc evaporation source and method should also be able to achieve higher target utilization, more uniform target removal, longer arc evaporation source lifespan, higher coating deposition rate, and a more stable and efficient coating process overall compared to existing technologies. Summary of the Invention

[0013] The object of this invention is achieved by providing an arc evaporation source according to claim 1, a coating apparatus according to claim 17, and an arc evaporation coating method according to claim 19. Preferred embodiments of the invention are disclosed in the dependent claims.

[0014] According to the present invention, an arc evaporation source comprises: a target containing material to be evaporated, operating as a cathode, the target having a front side, a back side, and a side side, wherein the side side extends from a boundary of the front side to a boundary of the back side, and the distance between the front side and the back side along their respective vertical axes corresponds to the target thickness; an electrode serving as an anode, the electrode having an inner surface serving as an electron receiving surface; a magnetic guiding system including a mechanism for generating a magnetic field, the magnetic field including magnetic field lines located in front of the front side; and a constraint mechanism disposed at least partially around the side side, wherein the constraint mechanism is designed as one or more annular constraint members, wherein at least a portion of the side side adjacent to the front side is surrounded by the at least one annular constraint member, and the at least one annular constraint member has an inner diameter and an inner surface, and an outer diameter and an outer surface, wherein the inner diameter is smaller than the outer diameter, and wherein, at least at the location where the at least one annular constraint member is disposed around the side side, the inner diameter is variable in a direction parallel to the vertical axis.

[0015] The term "inner diameter is variable in a direction parallel to the vertical axis" can preferably refer to a funnel-shaped internal shape. In arc evaporation sources, constraint elements with a funnel-shaped internal shape that produces a variable inner diameter offer several unique advantages in terms of target utilization and coating quality.

[0016] For example, in a funnel that narrows along the substrate direction, optimized and enhanced arc confinement can be achieved because the funnel shape guides the evaporated material to the central region of the source. This improves arc stability by more effectively confining the arc, reducing arc drift, and maintaining a constant discharge path.

[0017] Furthermore, (within the funnel shape that widens along the substrate direction) improved target utilization can be achieved because the funnel shape allows for more efficient distribution of the arc spot across the target surface. This contributes to more uniform target utilization and reduces the likelihood of deep pits or localized erosion on the target. Increased utilization not only extends target life but also reduces material costs.

[0018] Additionally, the funnel shape of the constraint (within a funnel that widens along the substrate direction) helps to distribute the heat load more evenly on the target. By preventing excessive heat accumulation in localized areas, this design alleviates thermal stress on the target material, reducing the risk of cracking or other forms of degradation.

[0019] In order to effectively evaporate the target material, at least the front side of the target can be made of the material to be evaporated.

[0020] To ensure directional and controllable target evaporation, a constraint mechanism with a constraint height can be arranged in the arc evaporation source in such a way that a lateral gap is formed between the target and the constraint mechanism, wherein the lateral gap preferably has a variable diameter.

[0021] Regarding directional and controlled evaporation, the inner diameter of the confinement mechanism can be continuously varied, preferably along its entire confinement height. This continuous variation in diameter helps guide the vapor plume in a controlled manner. It contributes to a uniform density distribution throughout the vapor cloud, improving the uniformity of deposition on the substrate. This smooth variation reduces the formation of hot spots or low-density areas within the vapor, resulting in a more uniform, high-quality coating.

[0022] Regarding the formation of the funnel shape of the restraint mechanism that expands along the substrate direction and the realization of the aforementioned benefits associated with this design, the inner diameter of the restraint mechanism can be maximized in the region surrounding the side of the target.

[0023] Regarding enhanced arc control and reduced contamination, it is also conceivable that the confinement mechanism is located between the target and the anode, preferably entirely between them. By completely surrounding the target and isolating it from the anode, the confinement helps focus the arc spot on the target, reducing arc drift and improving the consistency of the evaporation process. Additionally, this configuration helps prevent the ingress of harmful particles or contaminants. This improves the purity of the evaporating material, thereby enhancing the quality of the deposited coating.

[0024] In a favorable design, the outer diameter can be constant or variable in the direction parallel to the vertical axis. Maintaining a constant outer diameter ensures compatibility with standard cooling systems, enabling efficient heat dissipation while adapting the internal funnel shape to plasma dynamics. Furthermore, with a constant outer diameter, the constraint can be seamlessly integrated with existing arc evaporation devices, minimizing the need for system redesign.

[0025] Furthermore, regarding an advantageous design, a gap may exist between the point on the inner surface of the at least one annular constraint closest to the target side and the target side, wherein the gap preferably corresponds to a distance in a direction perpendicular to the vertical axis, particularly in the range of 0.5 mm to 5 mm.

[0026] Regarding directional, controllable, and effective target evaporation, the at least one annular constraint may have a constraint height extending from a target reference position at the same height as the target face to an anode reference position at the topmost surface of the at least one annular constraint. Preferably, the constraint height is the distance between the target reference position and the anode reference position in a direction parallel to the vertical axis. In particular, the constraint height can be kept constant during the coating process, even if the target thickness is reduced.

[0027] In addition, regarding the effective evaporation of the target material, the mechanism can be designed and adjusted to generate a magnetic field region comprising magnetic field lines that are substantially perpendicular to the front of the target, i.e., substantially parallel to the vertical axis.

[0028] Advantageously, the constraint height and constraint mechanism can be selected and adjusted to allow the electric spark to move at the boundary line on the front of the target, and if an electric spark is moving at the boundary line on the front of the target, it can be prevented from following the magnetic lines of force to the electron receiving surface of the anode, but instead guided by the magnetic lines of force to cross the target boundary line in a direction toward the mechanism, so that the electric spark is extinguished and subsequently one of the electric sparks remaining on the front of the target gains an increment in current density, thereby causing the electric spark gaining the increment in current density to split into two electric sparks.

[0029] Regarding uniform material removal, the constraint height and constraint mechanism can be selected and adjusted to enable uniform movement of the electric spark along the entire front of the target, thereby achieving uniform removal of the target surface material through evaporation.

[0030] In addition, it has proven particularly advantageous that the target can have an initial thickness greater than 10 mm, preferably 15 mm to 40 mm, especially 20 mm.

[0031] It has also proven particularly advantageous that the target, magnetic guidance system, and constraint mechanism can be designed to operate with at least two arc spots, and preferably allow one of the arc spots to move randomly outside the target area and extinguish.

[0032] Preferably, the gap may correspond to a distance in the range of 1 mm to 3 mm, especially in the range of 1 mm to 2.5 mm.

[0033] However, the constraint height is preferably in the range of 2 mm to 100 mm.

[0034] Regarding the effective generation of a stable and strong magnetic field, according to the invention, the mechanism may advantageously include an electromagnetic coil and a permanent magnet, wherein both preferably have the same north and south poles, and both may be positioned relative to the target in such a way that the back of the target is closer to its north pole than to its south pole relative to each of the electromagnetic coil and the permanent magnet, or the back of the target is closer to its south pole than to its north pole relative to each of the electromagnetic coil and the permanent magnet.

[0035] Therefore, in other words, according to a particular preferred embodiment, the present invention relates particularly to an arc evaporation source comprising a target operating as a cathode and a constraint mechanism designed to be at least partially surrounding a side surface of the target with one or more annular constraint members, wherein at least a portion of the side surface of the target adjacent to the front surface of the target is surrounded by the at least one annular constraint member, wherein a gap exists between the point on the inner surface of the at least one annular constraint member closest to the side surface of the target and the side surface, the gap corresponding to a direction perpendicular to the front surface of the target, particularly between 0.5 mm and 5 mm. The distance is within the range of mm, and a mechanism for generating a magnetic field region is provided, the magnetic field region including magnetic lines of force substantially perpendicular to the front of the target, wherein the constraint mechanism and the magnetic mechanism are selected and adjusted so that the electric spark can move at the boundary line of the front of the target and be guided by the magnetic lines of force to cross the target boundary line in the direction toward the magnetic mechanism, so that all electric sparks crossing the boundary line of the front of the target are extinguished, and then at least one of the electric sparks remaining on the front of the target is given an increment of current density, which causes the electric spark that has obtained the increment of current density to split into two or more electric sparks. This allows the electric spark to move uniformly along the entire front of the target, thereby achieving uniform removal of the target surface material by evaporation during the operation of the arc evaporation source of the present invention.

[0036] Another object of the present invention is to provide a coating apparatus comprising a vacuum coating chamber including at least one inner wall, wherein an arc evaporation source as described above is fixed to the surface of the inner wall by means of a fixing mechanism, wherein the fixing mechanism preferably includes at least a back plate, and wherein the fixing mechanism particularly includes a lateral fixing system.

[0037] Another object of the present invention is to provide an arc evaporation coating method, which is preferably performed using an arc evaporation source as described above, wherein the method includes the following steps: a) At least within a specific time period, at least a first arc spot and a second arc spot are generated on the front of the target and the two operate independently; b) This causes the first arc spot to split into two separate arc spots, thereby forming a third and a fourth arc spot. The splitting of the first arc spot into two separate arc spots is triggered by extinguishing the second arc spot.

[0038] Preferably, the extinguishing of the second arc spot can be achieved by allowing the second arc spot to cross the target boundary and move to a region on its surface from which electrons can no longer be extracted.

[0039] Furthermore, it has been shown that the target material can be MCrAlY material, which is particularly advantageous.

[0040] Furthermore, it has been shown to be advantageous that this method can be performed within the vacuum chamber of the coating apparatus, and after a vacuum has been established within the vacuum coating chamber.

[0041] In the context of this invention, improving target utilization refers particularly to improvements related to the following aspects: - Increase the amount of target material evaporated during the coating process and transported from the target surface to the surface of the substrate to be coated placed inside the coating chamber, thereby forming a metal layer on the corresponding substrate surface; - Reduce the amount of target material that evaporates during the coating process and is not transported from the target surface to the surface of the substrate to be coated, which is placed inside the coating chamber, but is transported to the surface of a component that is also placed inside the coating chamber but is not the substrate to be coated, thereby forming a metal layer on the surface of the aforementioned component.

[0042] In the context of this invention, extending the lifespan of an arc evaporation source refers particularly to improvements related to the following aspects: - Increase the amount of target material that can be evaporated during the coating process, especially by increasing the target thickness.

[0043] In the context of this invention, improving the deposition rate refers particularly to improvements related to the following aspects: - Allows for faster deposition of thick metal layers.

[0044] In the context of this invention, achieving a more stable and efficient coating process refers particularly to improvements related to the following aspects: - Enables stable operation of the arc evaporation source to perform repeatable coating processes throughout the entire lifespan of the arc evaporation source, thereby allowing for the deposition of high-quality thick metal layers in a cost-effective manner (e.g., without electrical short circuits that could interrupt the coating process).

[0045] Figures 1 to 9 These illustrations are intended to visualize the invention and should not be construed as limiting the invention, but are merely examples.

[0046] Figure 1 An embodiment of the arc evaporation source according to the invention is shown, wherein the annular constraint has a constant inner diameter 51 and a constant outer diameter 52, and the north pole of the coil 100a and the north pole of the permanent magnet 100b are closer to the target 1 than their south poles, respectively.

[0047] Figure 2 Another embodiment of the arc evaporation source according to the invention is shown, in which the annular constraint has a variable inner diameter 51 and a constant outer diameter 52, and the north pole of the coil 100a and the north pole of the permanent magnet 100b are closer to the target 1 than their south poles.

[0048] Figure 3This illustrates yet another embodiment of the arc evaporation source according to the invention, in which the annular constraint has a variable inner diameter 51 and a constant outer diameter 52, and the south pole of the coil 100a and the south pole of the permanent magnet 100b are respectively closer to the target 1 than their north poles.

[0049] Figure 4 This illustrates another embodiment of the arc evaporation source according to the invention, in which the annular constraint has a variable inner diameter 51 and a constant outer diameter 52, and the north pole of the coil 100a and the north pole of the permanent magnet 100b are closer to the target 1 than their south poles, and the upper surface of the anode 70 is designed to be farther from the target front 10 in a direction parallel to the axis AA perpendicular to the target front 10 than the anode reference position 59 in the annular constraint.

[0050] Figure 5 This illustrates another embodiment of the arc evaporation source according to the invention, in which the annular constraint has a variable inner diameter 51 and a constant outer diameter 52, and the north pole of the coil 100a and the north pole of the permanent magnet 100b are closer to the target 1 than their south poles, and the upper surface of the anode 70 is designed to be farther from the target front 10 in a direction parallel to the axis AA perpendicular to the target front 10 than the anode reference position 59 of the annular constraint, and the surface of the annular constraint closest to the target back 20 in a direction parallel to the axis AA perpendicular to the target front 10 coincides with the target front 10, and thus coincides with the target surface reference position 57 of the annular constraint.

[0051] Figure 6 This invention illustrates another embodiment of the arc evaporation source according to the invention, in which the annular constraint has a variable inner diameter 51 and a variable outer diameter 52, and the north pole of the coil 100a and the north pole of the permanent magnet 100b are closer to the target 1 than their south poles, and the upper surface of the anode 70 is designed to be at the same distance from the target front 10 in a direction parallel to the axis AA perpendicular to the target front 10, relative to the anode reference position 59 of the annular constraint, and the surface of the annular constraint closest to the target back 20 in a direction parallel to the axis AA perpendicular to the target front 10 does not coincide with the target front 10, and therefore does not coincide with the target surface reference position 57 of the annular constraint. Instead, the distance between the surface of the annular constraint closest to the target back 20 in a direction parallel to the axis AA perpendicular to the target front 10 and the target back 20 is shorter than the distance between the target surface reference position 57 of the annular constraint and the target back 20.

[0052] Figure 7 The arc evaporation source according to the present invention is shown with Figure 6 The same implementation method is shown. Additionally, in Figure 7The image shows three electric sparks positioned on the front surface 10 of the target, which actually move above the front surface 10 of the target, wherein each electric spark has the same current density.

[0053] Figure 8 The magnetic field lines generated in the arc evaporation source according to the invention are shown, and... Figure 8 The image also shows how one of the electric sparks, located at the boundary line of the target's front, moves outside the target's front 10 in a "falling" manner under the guidance of magnetic field lines (an image showing the electric spark extinguishing is not shown), and then extinguishes.

[0054] Figure 9 It also shows how one of the electric sparks located at the boundary line of the target front moves outside the target front 10 in a "falling" manner (an image showing the electric spark extinguishing is not shown) and then extinguishes.

[0055] The inventors observed that after an electric spark crosses the boundary line of the target face 10 and falls and extinguishes, one of the electric sparks remaining on the target face 10 gains an increase in current intensity equal to the current intensity of the just-extinguished spark. Subsequently, the spark gaining the current density increase splits into two sparks, each with half the previously achieved increased current density. In this way, the electric spark continues to move along the entire target face 10, thereby achieving uniform evaporation and removal of the target material and stable process operation, with a higher layer deposition rate than when using known arc evaporation sources.

[0056] Therefore, the deposition rate is increased due to the uniform removal of the target surface during the arc evaporation process.

[0057] Furthermore, the design of the arc evaporation source of the present invention allows the target 1 to be operated as a cathode for the entire lifetime of the target 1 (i.e., as long as the target material can be used for evaporation). In this way, thick layers (especially thick metal layers) can be deposited in a highly efficient and reliable manner without interrupting the coating process during layer deposition.

[0058] One significant advantage of the design described above is that target thicknesses of at least 20 mm can be efficiently used to coat thick coatings. While in earlier devices only target thicknesses of no more than 10 mm were economically feasible, the target 1 can be selected to be much thicker than 10 mm due to the excellent uniformity of target removal using the arc evaporation source of this invention. In cases requiring thick coatings, the 10 mm limitation means that the coating process must be stopped and the target replaced before the actually desired coating thickness is reached.

[0059] In most cases, using the novel arc evaporation source according to the present invention, it is no longer necessary to stop and switch the coating process to finally achieve the desired coating thickness.

[0060] The main embodiments used to explain the invention relate to the ability to manufacture coatings consisting of thick metal layers. However, since the coating process can be carried out, for example, in a reactive manner, various aspects of the invention are not limited to coatings consisting of metal layers, but can also be applied to coatings that at least partially comprise oxides, carbides, and other reactive materials.

[0061] Each of the aspects described in this application can be implemented individually or in combination with other aspects.

Claims

1. An electric arc evaporation source, comprising: - A target (1) containing the material to be evaporated, which operates as a cathode, has a front side (10), a back side (20), and a side side (30), wherein the side side (30) extends from the boundary of the front side (10) to the boundary of the back side (20), and the distance between the front side (10) and the back side (20) along their respective vertical axes (AA) corresponds to the target thickness. - As the anode (70), the electrode has an inner surface that serves as an electron receiving surface. - A magnetic guidance system comprising a mechanism (100) for generating a magnetic field, the magnetic field comprising magnetic field lines located in front of the front surface (10) of the target, and - A constraint mechanism (50) is provided at least partially around the side (30) of the target. The constraint mechanism (50) is characterized in that it is designed as one or more annular constraint members, wherein at least a portion of the target side surface (30) adjacent to the target front surface (10) is surrounded by the at least one annular constraint member, and the at least one annular constraint member has an inner diameter and an inner surface (51) and an outer diameter and an outer surface (52), wherein the inner diameter is smaller than the outer diameter, and wherein, at least at the position where the at least one annular constraint member is disposed around the target side surface (30), the inner diameter is variable in a direction parallel to the vertical axis (AA).

2. The arc evaporation source according to claim 1, characterized in that, At least the front of the target (10) is made of the material to be evaporated.

3. The arc evaporation source according to claim 1 or 2, characterized in that, The constraint mechanism (50) having a constraint height (55) is arranged in the arc evaporation source in such a way that a lateral gap is formed between the target (1) and the constraint mechanism (50), wherein the lateral gap preferably has a variable diameter.

4. The arc evaporation source according to any one of the preceding claims, characterized in that, The inner diameter of the constraint mechanism (50) varies continuously, preferably along its entire constraint height (55).

5. The arc evaporation source according to any one of the preceding claims, characterized in that, The inner diameter of the constraint mechanism (50) is largest in the region surrounding the side surface (30) of the target.

6. The arc evaporation source according to any one of the preceding claims, characterized in that, The constraint mechanism (50) is located between the target (1) and the anode (70), preferably entirely between the target (1) and the anode (70).

7. The arc evaporation source according to any one of the preceding claims, characterized in that, The outer diameter is either constant or variable in the direction parallel to the vertical axis (AA).

8. The arc evaporation source according to any one of the preceding claims, characterized in that, There is a gap (80) between the point on the inner surface (51) of the at least one annular constraint closest to the target side (30) and the target side (30), wherein the gap (80) preferably corresponds to a distance in a direction perpendicular to the vertical axis (AA), particularly in the range of 0.5 mm to 5 mm.

9. The arc evaporation source according to any one of the preceding claims, characterized in that, The at least one annular constraint has a constraint height (55) extending from a target reference position (57) at the same height as the target front (10) to an anode reference position (59) at the topmost surface of the at least one annular constraint. The constraint height (55) is preferably the distance between the target reference position (57) and the anode reference position (59) in a direction parallel to the vertical axis (AA). In particular, the constraint height (55) can remain constant during the coating process, even if the thickness of the target (1) decreases.

10. The arc evaporation source according to any one of the preceding claims, characterized in that, The mechanism (100) is designed and adjusted to generate a magnetic field region comprising magnetic lines of force substantially perpendicular to the front of the target (10), i.e. substantially parallel to the vertical axis (AA).

11. The arc evaporation source according to any one of the preceding claims, characterized in that, The constraint height (55) and constraint mechanism (50) are selected and adjusted to allow the electric spark to move at the boundary line of the target front (10), and if an electric spark is moving at the boundary line of the target front (10), the electric spark cannot follow the magnetic field lines to reach the electron receiving surface of the anode (70), but is guided by the magnetic field lines to cross the target boundary line in the direction toward the mechanism (100), so that the electric spark is extinguished and then one of the electric sparks remaining on the target front (10) gains an increment in current density, thereby causing the electric spark that gains the increment in current density to split into two electric sparks.

12. The arc evaporation source according to any one of the preceding claims, characterized in that, The constraint height (55) and constraint mechanism (50) are selected and adjusted to enable the electric spark to move uniformly along the entire front surface (10) of the target, thereby achieving uniform removal of the target material through evaporation.

13. The arc evaporation source according to any one of the preceding claims, characterized in that, The target (1) has an initial thickness greater than 10 mm, preferably between 15 mm and 40 mm, especially 20 mm.

14. The arc evaporation source according to any one of the preceding claims, characterized in that, The target, the magnetic guidance system, and the constraint mechanism (50) are designed to operate with at least two arc spots, and preferably allow one of the arc spots to move out of the target area and extinguish.

15. The arc evaporation source according to any one of the preceding claims, characterized in that, The gap (80) corresponds to a distance in the range of 1 mm to 3 mm.

16. The arc evaporation source according to any one of the preceding claims, characterized in that, The gap (80) corresponds to a distance in the range of 1 mm to 2.5 mm.

17. The arc evaporation source according to any one of the preceding claims, characterized in that, The constraint height (55) is in the range of 2 mm to 100 mm.

18. The arc evaporation source according to any one of the preceding claims, characterized in that, The mechanism (100) includes an electromagnetic coil (100a) and a permanent magnet (100b), wherein preferably both have the same north and south pole orientations, and both are positioned relative to the target (1) in such a way that the back face (20) of the target is closer to its north pole than to its south pole relative to each of the electromagnetic coil (100a) and the permanent magnet (100b), or the back face (20) of the target is closer to its south pole than to its north pole relative to each of the electromagnetic coil (100a) and the permanent magnet (100b).

19. A coating apparatus comprising a vacuum coating chamber, said vacuum coating chamber including at least one inner wall, characterized in that, The arc evaporation source according to any one of the preceding claims is fixed to the surface of the interior wall using a fixing mechanism (60a; 60b), wherein the fixing mechanism (60a; 60b) preferably includes at least a back plate.

20. The coating apparatus according to claim 19, characterized in that, The fixing mechanism (60a; 60b) includes a lateral fixing system.

21. An arc evaporation coating method, preferably performed using an arc evaporation source according to any one of the preceding claims, the method comprising the following steps: a) At least within a specific time period, at least a first arc spot and a second arc spot are generated on the front side of the target and operated independently of each other. b) This causes the first arc spot to split into two separate arc spots, thereby forming a third and a fourth arc spot. The feature is that the splitting of the first arc spot into two separate arc spots is triggered by extinguishing the second arc spot.

22. The arc coating method according to claim 21, characterized in that, The extinguishing of the second arc spot is achieved by allowing the second arc spot to move across the boundary of the target to a region on its surface from which electrons can no longer be extracted.

23. The arc coating method according to any one of claims 21 to 22, characterized in that, The target material is MCrAlY.

24. The arc coating method according to any one of claims 21 to 23, characterized in that, This method is performed within the vacuum chamber of the coating equipment, after a vacuum has been established within that vacuum coating chamber.

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