Diamond dresser, chemical mechanical polishing system, and polishing method thereof

Abstract

The application provides a diamond dresser, a chemical mechanical polishing system and a polishing method thereof, and the diamond dresser comprises a support arm, a sliding rail is arranged in the support arm, and a first surface of the support arm faces a surface to be dressed; a diamond disc is movably connected with the sliding rail and is movable along the length direction of the sliding rail; and a temperature adjusting module is arranged on the support arm and is used for adjusting the temperature of at least a first region of the surface to be dressed when the actual temperature of the first region deviates from a target temperature and reaches a threshold value, wherein the first region is a region of the surface to be dressed which faces the first surface and is in contact with an object to be ground. In the above scheme, the process flexibility of the method for adjusting the grinding rate by the temperature is better.

Description

Technical Field

[0001] This application relates to the semiconductor field, and more particularly to a diamond dressing device, a chemical mechanical polishing system, and a polishing method thereof. Background Technology

[0002] Chemical mechanical polishing (CMP) is a process that combines chemical reactions with mechanical polishing. With the development of semiconductor technology, the application of CMP processes is increasing, and the differences between various CMP processes are becoming more pronounced.

[0003] Existing grinding methods cannot achieve satisfactory results; therefore, a new method for controlling the grinding rate is needed. Summary of the Invention

[0004] This application provides a diamond dressing tool, comprising: a support arm with a slide rail disposed therein, the first surface of the support arm facing the surface to be dressed; a diamond disc movably connected to the slide rail and movable along the length direction of the slide rail; and a temperature adjustment module disposed on the support arm, used to adjust the temperature of at least the first region when the actual temperature of a first region of the surface to be dressed deviates from a target temperature and reaches a threshold, wherein the first region is the area of ​​the surface to be dressed facing the first surface and in contact with the object to be polished. In one or more embodiments of the first aspect of this application, the temperature adjustment module is disposed around the slide rail and the diamond disc along the width direction of the slide rail.

[0005] In one or more embodiments of the first aspect of this application, the temperature regulation module includes: at least one medium channel disposed within the support arm and connected to a heat source or a cold source; and at least one nozzle disposed on the first surface and connected to the at least one medium channel.

[0006] In one or more embodiments of the first aspect of this application, the temperature regulation module is configured to: open the at least one nozzle in response to the actual temperature being higher than the target temperature and the difference between the actual temperature and the target temperature being greater than a first threshold, such that the cold source is sprayed from the at least one nozzle to the first region via the at least one medium channel; or, open the at least one nozzle in response to the actual temperature being lower than the target temperature and the difference between the target temperature and the actual temperature being greater than a second threshold, such that the heat source is sprayed from the at least one nozzle to the first region via the at least one medium channel.

[0007] In one or more embodiments of the first aspect of this application, the temperature regulation module further includes: at least one heating lamp disposed on the first surface; the temperature regulation module is further configured to: turn on the at least one heating lamp in response to the actual temperature being lower than the target temperature and the difference between the target temperature and the actual temperature being greater than a second threshold.

[0008] In one or more embodiments of the first aspect of this application, the radiant power of each heating lamp can be individually adjusted, and the adjustment range is from 0 to the maximum radiant power; or, the jet flow rate of each nozzle can be individually adjusted, and the adjustment range is from 0 to the maximum jet flow rate.

[0009] In one or more embodiments of the first aspect of this application, there are two media channels, which are respectively disposed on both sides of the slide rail along the width direction, and the heating lamp and the nozzle are respectively disposed near the media channel on each side.

[0010] A second aspect of this application provides a chemical mechanical polishing system, comprising: a polishing disc; a polishing head disposed above the polishing disc for fixing an object to be polished on the side of the polishing head facing the polishing disc; a diamond dressing device as described in any one or more of the above embodiments; wherein the support arm is disposed above the polishing disc, and the side of the polishing disc facing the first surface is the surface to be dressed; a temperature sensor and a controller, wherein the controller is coupled to the temperature regulation module and the temperature sensor; wherein, during the operation of the chemical mechanical polishing system, the radiation range of the temperature regulation module on the polishing disc at least covers the first region; the temperature sensor is used to detect at least the actual temperature of the first region, and the controller is used to control the temperature regulation module to adjust the temperature of at least the first region when the actual temperature deviates from the target temperature and reaches a threshold.

[0011] In one or more embodiments of the second aspect of this application, during the operation of the chemical mechanical polishing system, the support arm is parallel to the radial direction of the polishing disc.

[0012] In one or more embodiments of the second aspect of this application, the grinding disc includes a plurality of annular regions in the radial direction of the grinding disc, each annular region corresponding to a corresponding temperature sensor; the controller is further configured to obtain a set of all the annular regions that intersect with the first region; for each annular region in the set, in response to its actual temperature deviating from the target temperature and reaching a threshold, the controller controls the temperature adjustment module to adjust the temperature of the corresponding annular region.

[0013] A third aspect of this application provides a chemical mechanical polishing method, comprising: fixing an object to be polished on the side of the polishing head facing the polishing disc, and polishing the object to be polished using the polishing disc; the temperature sensor at least detects the actual temperature of a first region, and in response to the actual temperature deviating from a target temperature and reaching a threshold, the controller controls the temperature adjustment module to adjust the temperature of at least the first region. Attached Figure Description

[0014] Figure 1 A schematic diagram of the structure of a CMP system provided for one or more embodiments;

[0015] Figure 2 A schematic diagram of the structure of a diamond trimmer provided in one or more embodiments of this application;

[0016] Figure 3 Provided for one or more embodiments of this application Figure 2 Top view of the middle support arm;

[0017] Figure 4 Provided for one or more embodiments of this application Figure 2 Top view of the middle support arm;

[0018] Figure 5 Provided for one or more embodiments of this application Figure 2 Top view of the middle support arm;

[0019] Figure 6 Provided for one or more embodiments of this application Figure 2 Top view of the middle support arm;

[0020] Figure 7 This is a schematic diagram of the structure of a CMP system provided in one or more embodiments of this application;

[0021] Figure 8 Provided for one or more embodiments of this application Figure 7 Top view of the grinding disc, diamond dressing tool, and object to be ground;

[0022] Figure 9 Provided for one or more embodiments of this application Figure 7 A top view of the grinding disc;

[0023] Figure 10 A flowchart of a CMP method provided for one or more embodiments of this application. Detailed Implementation

[0024] The technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this specification.

[0025] Please see Figure 1 , Figure 1 This is a schematic diagram of a CMP system provided for one or more embodiments. A CMP system generally includes a polishing pad 10, a polishing head 12, a polishing slurry supply system 14, and a diamond dresser 16. The CMP system typically operates as follows: the polishing head 12 picks up the object to be polished (e.g., a wafer) and brings its surface into contact with the polishing pad 10; the polishing slurry supply system 14 provides polishing slurry to the surface of the polishing pad 10, which then polishes the surface of the object; the diamond dresser 16 is used to dress the polishing pad on the surface of the polishing pad 10 to prevent the polishing slurry from clogging the pad. Specifically, the polishing pad is a foamed material with many small pores. During polishing, abrasive particles in the polishing slurry are embedded in these pores to polish the object (e.g., a wafer). After polishing, the surface of the abrasive particles is dulled and needs to be polished using the diamond dresser 16. The diamond dresser 16 has many diamond particles embedded in its surface. These diamond particles scrape off the dulled abrasive particles from the polishing pad, and a portion of the polishing pad is also consumed, thus maintaining its activity.

[0026] Specifically, such as Figure 1 As shown, a rotating shaft 18 is provided below the grinding disc 10. The rotating shaft 18 can rotate under the action of the first drive motor (not shown), thereby driving the grinding disc 10 to rotate.

[0027] The CMP system also includes a first drive assembly 11, which is connected to the grinding head 12. The first drive assembly 11 includes a first connecting shaft 110, a grinding head support arm 112 connected to the upper end of the first connecting shaft 110, a grinding head shaft 114 disposed at the end of the grinding head support arm 112 away from the first connecting shaft 112, and a second drive motor (not shown) that rotates the grinding head 12 around its axis. The grinding head shaft 114 is connected to the lower end of the first connecting shaft 112, and the grinding head 12 is connected to the lower end of the grinding head shaft 114. The second drive motor can be disposed in the grinding head support arm 112 and can drive the grinding head shaft 114 to rotate, thereby causing the grinding head 12 to rotate. Furthermore, the first drive assembly 11 may also include a third drive motor (not shown), which is connected to the grinding head support arm 112 and is used to drive the grinding head support arm 112 to swing back and forth at predetermined angles clockwise and counterclockwise around the first connecting shaft 110. Of course, the first drive assembly 11 also includes a first lifting mechanism (not shown) for driving the grinding head 12 toward or away from the grinding disk 10.

[0028] The diamond dressing tool 16 includes a diamond disc 160 and a second drive assembly 162 connected to the diamond disc 160. The second drive assembly 162 includes a second connecting shaft 1620, a diamond disc support arm 1622 connected to the upper end of the second connecting shaft 1620, a diamond disc shaft 1624 disposed at the end of the diamond disc support arm 1622 away from the second connecting shaft 1620, and a fourth drive motor (not shown) that rotates the diamond disc 160 around its axis. The diamond connecting shaft 1624 is connected to the lower end of the second connecting shaft 1620, the diamond disc 160 is connected to the lower end of the diamond disc shaft 1624, and the fourth drive motor can be disposed in the diamond disc support arm 1622. The fourth drive motor drives the diamond disc shaft 1624 to rotate, thereby causing the diamond disc 160 to rotate. Furthermore, the second drive assembly 162 may also include a fifth drive motor (not shown), which can be connected to the diamond disc support arm 1622 to drive the diamond disc support arm 1622 to swing back and forth at predetermined angles in a clockwise and counterclockwise direction around the second connecting shaft 1620. Of course, the second drive assembly 162 also includes a second lifting mechanism (not shown) for driving the diamond disc 160 to move toward or away from the grinding disc 10.

[0029] With the development of semiconductor technology, the application of CMP (Chemical Motion Processing) is becoming increasingly common, and the differences between various processes are also widening. Generally, the polishing rate is adjusted in two ways: Method 1: Adjusting the polishing rate by changing the polishing pressure or rotation speed. For example, adjusting the pressure applied to the object being polished by the polishing head 12 during polishing, or adjusting the rotation speed of the polishing head 12 or the polishing disc 10. However, increasing the polishing pressure or rotation speed increases the mechanical force, which increases the probability of mechanical scratches; while too low a polishing pressure or rotation speed can lead to large fluctuations in the polishing rate or the thickness and morphology distribution of the polished film layer within the wafer, increasing the difficulty of process control. Method 2: Developing new polishing slurries to adjust the polishing rate through chemical additives; however, developing new polishing slurries is technically challenging and costly.

[0030] Therefore, a new method for controlling the grinding rate is needed. During the research and development process, the inventors of this application noticed a correlation between the grinding rate and temperature in a CMP system; the grinding rate increases with increasing temperature. Therefore, the grinding rate can be controlled by controlling the temperature.

[0031] Furthermore, this application innovatively proposes a method of integrating a temperature adjustment module into a diamond trimmer, specifically as follows: Figure 2 As shown, Figure 2 This is a schematic diagram of the structure of a diamond dressing device provided in one or more embodiments of this application. The diamond dressing device 20 of this application includes a support arm 200, a diamond disc 202, and a temperature regulation module 204.

[0032] In this regard, please combine Figure 3 , Figure 3 Provided for one or more embodiments of this application Figure 2 A top view of the support arm 200. A slide rail 206 is provided inside the support arm 200, and the first surface A of the support arm 200 faces the surface to be trimmed; optionally, the slide rail 206 can extend in a straight line, which can be the length direction X of the first surface A.

[0033] The diamond disc 202 is movably connected to the slide rail 206 and is movable along the length direction X of the slide rail 206. Optionally, the diamond trimmer 20 may also include a rotation drive motor and a translation drive motor connected to the diamond disc 202. The rotation drive motor and the translation drive motor can be housed in the support arm 200. The rotation drive motor is used to drive the diamond disc 202 to rotate around its center, and the translation drive motor is used to drive the diamond disc 202 to move back and forth along the length direction X of the slide rail 206.

[0034] A temperature regulation module 204 is mounted on the support arm 200 and is used to regulate the temperature of at least the first region when the actual temperature of the first region of the surface to be dressed deviates from the target temperature and reaches a threshold. The first region is the area of ​​the surface to be dressed that faces the first surface and is in contact with the object to be polished. For example, when the diamond dresser 20 is applied to a CMP system, the surface to be dressed can be the side of the polishing disc facing the first surface. The temperature of the first region can be regulated by heating or cooling, depending on the deviation of the actual temperature from the target temperature.

[0035] As can be seen, the method of controlling the grinding rate by temperature provided in this application has better process flexibility; and compared with the first method above, the probability of mechanical scratches is reduced, and the fluctuation of grinding rate or the thickness and morphology distribution of the ground film layer in the wafer is reduced; compared with the second method above, the investment cost is reduced. Furthermore, in this application, the temperature control module is integrated into the diamond dressing tool. Compared to adding a separate temperature control module, the method provided by this application has higher space utilization and avoids the problem of collisions between the grinding head, slurry supply system, diamond dressing tool, and temperature control module when they swing together in the CMP system when a separate temperature control module is added. In addition, the swing arm space of the grinding head and slurry supply system is increased, resulting in greater process flexibility. Compared to integrating the temperature control module into the grinding disc, the method provided by this application directly acts on the surface of the grinding disc, which is more efficient, responds faster, and can reduce the probability of grinding disc aging and wear. Compared to integrating the temperature control module into the grinding head, the method provided by this application can reduce the probability of aging of the rubber in the air bladder inside the grinding head during continuous heating and the fluctuation of the air bladder pressure inside the grinding head with temperature during intermittent heating. That is, it can reduce the probability of grinding head aging and damage and ensure the stability of the grinding head process.

[0036] In one or more embodiments of this application, such as Figure 3 As shown, the temperature regulation module 204 is positioned along the width Y direction of the slide rail 206 around the slide rail 206 and the diamond disc (not shown). This design is more rational and can reduce the impact of the introduced temperature regulation module 204 on the original diamond disc and other structures.

[0037] In one or more embodiments of this application, such as Figure 3As shown, the temperature regulation module 204 includes at least one medium channel 2040 and at least one nozzle 2042. The at least one medium channel 2040 is disposed within the support arm 200 and communicates with a heat source or a cold source; wherein the heat source and cold source are components independent of the diamond dressing tool; optionally, the medium channel 2040 may extend along the length direction X of the slide rail 2040; the heat source or cold source flowing within the medium channel 2040 may be a liquid (e.g., water) or a gas (e.g., nitrogen). At least one nozzle 2042 is disposed on a first surface A and communicates with at least one medium channel 2040; optionally, the structural shape of the nozzle 2042 can be selected according to actual conditions, and this application does not limit it. Optionally, the first surface A is planar, and the nozzle 2042 may protrude from the first surface A; or, the first surface A is non-planar, and at least one first recess is provided thereon, with one nozzle 2042 disposed within each first recess.

[0038] At this time, the temperature regulation module 204 can operate as follows: In response to the actual temperature being higher than the target temperature, and the difference between the actual and target temperatures being greater than a first threshold, at least one nozzle 2042 is opened, allowing a cold source to be sprayed from at least one nozzle 2042 through at least one medium channel 2040 to the first area; that is, the medium channel 2040 is connected to an external cold source, and the nozzle 2042 is used to cool at least the first area; or, in response to the actual temperature being lower than the target temperature, and the difference between the target and actual temperatures being greater than a second threshold, at least one nozzle 2042 is opened, allowing a heat source to be sprayed from at least one nozzle 2042 through at least one medium channel 2040 to the first area; that is, the medium channel 2040 is connected to an external heat source, and the nozzle 2042 is used to heat at least the first area. In this embodiment, the design of the medium channel 2040 and the nozzle 2042 allows for heating or cooling of the first area, resulting in a relatively simple structure.

[0039] In one or more embodiments of this application, the injection flow rate of each nozzle 2042 can be individually adjusted, and the adjustment range is from 0 to the maximum injection flow rate; that is, the injection flow rate of each nozzle 2042 can be different, and the injection flow rate of each nozzle 2042 can be 0, or the maximum injection flow rate, or any intermediate injection flow rate. On the one hand, this design can increase the flexibility and accuracy of temperature regulation; on the other hand, this design allows the temperature of only the first region to be adjusted when the actual temperature of the first region deviates from the target temperature and reaches a threshold, that is, only the nozzles 2042 covering the first region are controlled to work, while the other nozzles 2042 outside the first region are turned off, so as to reduce energy consumption.

[0040] Optionally, each nozzle 2042 has a corresponding flow switch connected to it, and each flow switch can be adjusted independently, with its opening and closing range adjustable. The adjustable flow switch design enables the adjustment of the injection flow rate of the corresponding nozzle 2042. Of course, in other embodiments, if a nozzle 2042 is connected to a medium channel 2040, this can also be achieved by adjusting the flow rate of the medium within the connected medium channel 2040.

[0041] Please refer to one or more embodiments of this application. Figure 3 In addition to the medium channel 2040 and the nozzle 2042, the temperature regulation module 204 may also include at least one heating lamp 2044 disposed on the first surface A. Optionally, the first surface A is planar, and the heating lamp 2044 may protrude from the first surface A; or, the first surface A is non-planar, and at least one second recess is provided thereon, with one heating lamp 2044 disposed in one of the second recesses.

[0042] At this time, the temperature regulation module 204 can also operate as follows: in response to the actual temperature being lower than the target temperature, and the difference between the target temperature and the actual temperature being greater than a second threshold, at least one heating lamp 2044 is turned on to heat at least the first area, and / or at least one nozzle 2042 is turned on, so that the heat source is sprayed from at least one nozzle 2042 to the first area through at least one medium channel 2040; that is, when heating is required, either the heating lamp 2044 or the medium channel 2040 can be used to supply heat to the first area, or both can be used; when both are used, the heating lamp 2044 can be the primary heating element, and when the heating effect of the heating lamp 2044 is insufficient, auxiliary heating can be provided by connecting the medium channel 2040 to an external heat source. Through the design of the medium channel 2040, nozzle 2042, and heating lamp 2044, heating or cooling of the first area can be achieved, the structure is relatively simple, and there are more application scenarios.

[0043] In one or more embodiments of this application, the radiant power of each heating lamp 2044 can be individually adjusted, and the adjustment range is from 0 to the maximum radiant power; that is, the radiant power of each heating lamp 2044 can be different, and the radiant power of each heating lamp 2044 can be 0, or the maximum radiant power, or any intermediate radiant power. On the one hand, this design can increase the flexibility and accuracy of temperature adjustment; on the other hand, this design allows the temperature of only the first region to be adjusted when the actual temperature of the first region is lower than the target temperature and reaches a threshold, that is, only the heating lamps 2044 covering the first region are controlled to work, while the other heating lamps 2044 outside the first region are turned off, thereby reducing energy consumption.

[0044] Optionally, each heating lamp 2044 has a corresponding current switch that is connected to it. Each current switch can be adjusted independently, and its opening and closing range is adjustable. The radiant power of the corresponding heating lamp 2044 can be adjusted by using the adjustable current switch design. Alternatively, the amount of current supplied to each heating lamp 2044 can be controlled individually.

[0045] In one or more embodiments of this application, such as Figure 3 As shown, there are two media channels 2040, which are respectively arranged on both sides of the slide rail 206 along the width direction Y. A heating lamp 2044 and a nozzle 2042 are respectively arranged near each media channel 2040. This design allows for the introduction of more nozzles 2042 and heating lamps 2044 onto the support arm 200, thereby improving the temperature regulation function of the temperature regulation module 204.

[0046] In one or more embodiments of this application, such as Figure 3 As shown, the heating lamp 2044 can be a local light source, meaning its illumination range is smaller in the length direction X. For example, its illumination range in the length direction X is less than half the radius of the grinding disc 10. In this case, multiple nozzles 2042 and multiple heating lamps 2044 are arranged near each side of the media channel 2040. Each of the multiple nozzles 2042 near the media channel 2040 can be connected to the media channel 2040. The multiple nozzles 2042 and multiple heating lamps 2044 near each side of the media channel 2040 are arranged in a row at intervals along the length direction X, i.e., multiple nozzles 2042 are arranged in one row and multiple heating lamps 2044 are arranged in another row. Furthermore, in the width direction Y, the multiple nozzles 2042 and multiple heating lamps 2044 are aligned with each other. The arrangement of the multiple nozzles 2042 and multiple heating lamps 2044 is relatively regular, resulting in high space utilization on the surface of the support arm 200.

[0047] In one or more embodiments of this application, such as Figure 4 As shown, Figure 4 Provided for one or more embodiments of this application Figure 2A top view of the support arm. The heating lamp 2044 can be a local light source, meaning its illumination range is smaller in the length direction X. In this case, multiple nozzles 2042 and multiple heating lamps 2044 are arranged near the medium channel 2040 on each side; the multiple nozzles 2042 near the medium channel 2040 on each side can all be connected to the medium channel 2040. The multiple nozzles 2042 and multiple heating lamps 2044 near the medium channel 2040 on each side are arranged in a row at intervals along the length direction X, that is, the multiple nozzles 2042 near the medium channel 2040 on each side are arranged in one row, and the multiple heating lamps 2044 near the medium channel 2040 on each side are arranged in another row; and in the width direction Y, the multiple nozzles 2042 and multiple heating lamps 2044 are staggered. The above-mentioned arrangement of multiple nozzles 2042 and multiple heating lamps 2044 is relatively regular, and the utilization rate on the surface of the support arm 200 is high.

[0048] In one or more embodiments of this application, such as Figure 5 As shown, Figure 5 Provided for one or more embodiments of this application Figure 2 A top view of the support arm. The heating lamp 2044 can be a local light source, meaning its illumination range is small along the length direction X. In this case, multiple nozzles 2042 and multiple heating lamps 2044 are arranged near the medium channel 2040 on each side; the multiple nozzles 2042 near the medium channel 2040 on each side can all be connected to the medium channel 2040. The multiple nozzles 2042 and multiple heating lamps 2044 near the medium channel 2040 on each side are arranged alternately in a row along the length direction X. The arrangement of the multiple nozzles 2042 and multiple heating lamps 2044 is relatively regular, and the utilization rate on the surface of the support arm 200 is high.

[0049] Of course, in other embodiments, the arrangement of the plurality of heating lamps 2044 and the plurality of nozzles 2042 can also be other, which will not be listed one by one in this application. It should be noted that in the above Figures 3-5 In this embodiment, since the heating lamp 2044 is a local light source, the radiation boundaries of two adjacent heating lamps 2044 in the length direction X can coincide exactly; this design can reduce the situation where the temperature at the radiation boundary of two adjacent heating lamps 2044 is too low or too high.

[0050] Of course, to reduce the occurrence of this situation, the heating lamp 2044 of the local light source can also be changed to a linear light source, such as... Figure 6 As shown, Figure 6 Provided for one or more embodiments of this application Figure 2A top view of the middle support arm. The heating lamp 2044 can be a linear light source, extending along the length direction X of the slide rail 206. Its irradiation range is relatively large in the length direction X, for example, its irradiation range in the length direction X is equal to the radius of the grinding disc 10. At this time, multiple nozzles 2042 and a heating lamp 2044 extending along the length direction X are arranged near the media channel 2040 on each side. The multiple nozzles 2042 near the media channel 2040 on each side are arranged in a row at intervals along the length direction X, and are arranged side by side with the heating lamp 2044 in the width direction Y.

[0051] In addition, in other embodiments, the number of media channels 2040 may also be one. The media channel 2040 is disposed on any side of the width direction Y of the slide rail 206, and heating lamps 2044 and nozzles 2042 may be respectively disposed on both sides of the width direction Y of the slide rail 206. In this case, all nozzles 2042 are connected to the same media channel 2040.

[0052] In addition, please refer to again Figure 2 The diamond dressing tool 20 of this application may further include a connecting arm 208, with a support arm 200 connected to the end of the connecting arm 208 and the two intersecting each other; the support arm 200 can move vertically relative to the connecting arm 208, or can swing clockwise or counterclockwise around the connecting arm 208. During the operation of the temperature regulation module 204, the vertical distance between the support arm 200 and the surface to be dressed below it (e.g., a grinding disc) is fixed, and the support arm 200 does not swing relative to the connecting arm 208, thereby improving the temperature control effect.

[0053] Please see Figure 7 , Figure 7 This is a schematic diagram of the structure of a CMP system provided in one or more embodiments of this application. The CMP system 2 specifically includes a grinding disc 22, a grinding head 24, a diamond dressing device 20 mentioned in any one or more of the above embodiments, a temperature sensor 26, and a controller (not shown).

[0054] Specifically, the grinding head 24 is disposed above the grinding disk 22 and is used to fix the object to be ground on the side of the grinding head 24 facing the grinding disk 22; the support arm 200 in the diamond dressing tool 20 is disposed above the grinding disk 22 and the first surface A faces the grinding disk 22; the controller is coupled to the temperature regulation module 204 and the temperature sensor 26.

[0055] like Figure 8 As shown, Figure 8 Provided for one or more embodiments of this application Figure 7 A top view of the grinding disc, diamond dressing tool, and object to be ground. The side of the grinding disc 22 facing the first surface is defined as the surface to be dressed, and the first region is the area of ​​the grinding disc 22 facing the first surface A. Figure 9 (Not shown in the diagram) and the area 30 in contact with the object to be polished; for example, assuming that during the operation of CMP system 2, the polishing disc 22 rotates while the polishing head 24 does not oscillate, then the first area is... Figure 9 The annular region defined by the two dotted lines; of course, when the grinding head 24 oscillates, the extent of the first region can be determined based on the actual contact conditions. Furthermore, Figure 7 In the process, the temperature regulation module 204 on the diamond dressing tool 20 has a radiation range on the grinding disc 22 that at least covers the first region; the temperature sensor 26 is used to detect the actual temperature of at least the first region; and the controller is used to control the temperature regulation module 204 to regulate the temperature of the first region when the actual temperature deviates from the target temperature and reaches a threshold.

[0056] As can be seen, the temperature-controlled method provided in this application offers better process flexibility; and compared to the first method in the background technology, the probability of mechanical scratches is reduced, and the fluctuation of grinding rate or the thickness and morphology distribution of the ground film layer within the wafer is reduced; compared to the second method in the background technology, the investment cost is reduced. Furthermore, in this application, the temperature control module is integrated into the diamond dressing tool. Compared to adding a separate temperature control module, the method provided by this application has higher space utilization and avoids the problem of collisions between the grinding head, slurry supply system, diamond dressing tool, and temperature control module when they swing together in the CMP system when a separate temperature control module is added. In addition, the swing arm space of the grinding head and slurry supply system is increased, resulting in greater process flexibility. Compared to integrating the temperature control module into the grinding disc, the method provided by this application directly acts on the surface of the grinding disc, which is more efficient, responds faster, and can reduce the probability of grinding disc aging and wear. Compared to integrating the temperature control module into the grinding head, the method provided by this application can reduce the probability of aging of the rubber in the air bladder inside the grinding head during continuous heating and the fluctuation of the air bladder pressure inside the grinding head with temperature during intermittent heating. That is, it can reduce the probability of grinding head aging and damage and ensure the stability of the grinding head process.

[0057] In one or more embodiments of this application, such as Figure 8 As shown, during the operation of the CMP system, the support arm 200 is parallel to the radial direction of the grinding disc 22. This design allows the temperature regulation module 204 on the support arm 200 to cover a larger area. Of course, in other embodiments, when the grinding head 24 swings and the coverage area of ​​the temperature regulation module 204 is sufficient, the support arm 200 may also intersect the radial direction of the grinding disc 22 to increase heating efficiency.

[0058] Please see Figure 9 , Figure 9 Provided for one or more embodiments of this application Figure 7A top view of the grinding disc 22. The grinding disc 22 is divided into multiple annular regions along its radial direction; this application does not limit the number of annular regions, such as... Figure 9 As shown, the grinding disc 22 is divided into six annular regions a, b, c, d, e, and f. The width of each annular region can be the same or different, and each annular region corresponds to a temperature sensor 260. For example, one annular region corresponds to one temperature sensor 260, and each temperature sensor 260 can detect the temperature at the center of the corresponding annular region. Optionally, the temperature sensor 26 includes an infrared temperature sensor located above the grinding disc 22; and / or, the temperature sensor 26 includes a contact temperature sensor located inside the grinding disc 22. That is, the temperature sensor 26 can take many forms, and this application does not limit it.

[0059] Furthermore, the controller is also used to obtain a set of all annular regions that intersect with the first region; for each annular region in the set, in response to its actual temperature deviating from the target temperature and reaching a threshold, the temperature adjustment module 204 is controlled to adjust the temperature of the corresponding annular region. For example, Figure 9 The annular regions that intersect with the first region include three: a, b, and c. The actual temperatures of annular regions a, b, and c are obtained using temperature sensor 26. Assuming that the actual temperature of annular region a deviates from the target temperature and reaches the threshold, while the actual temperatures of annular regions b and c do not deviate from the target temperature or deviate from the target temperature but do not reach the threshold, the controller only controls the temperature adjustment module 204 to adjust the actual temperature of annular region a, and does not adjust annular regions b and c. That is, it controls the nozzle or heating lamp corresponding to annular region a to turn on, and the nozzle or heating lamp corresponding to annular regions b and c to turn off.

[0060] Please see Figure 10 , Figure 10 This is a schematic diagram of a CMP method flow provided in one or more embodiments of this application. The CMP method utilizes the CMP system in any one or more of the above embodiments, and the CMP method specifically includes:

[0061] S101: Fix the object to be ground on the side of the grinding head facing the grinding disc, and use the grinding disc to grind the object;

[0062] S102: The temperature sensor detects at least the actual temperature of the first area. In response to the actual temperature deviating from the target temperature and reaching a threshold, the controller controls the temperature regulation module to regulate the temperature of the first area.

[0063] Step S102 specifically includes obtaining the actual temperature of all annular regions in the set of temperature sensor feedback, and adjusting the temperature of annular regions in the set whose actual temperature deviates from the target temperature and exceeds the threshold.

[0064] As can be seen, the temperature-controlled method provided in this application offers better process flexibility; and compared to the first method in the background technology, the probability of mechanical scratches is reduced, and the fluctuation of grinding rate or the thickness and morphology distribution of the ground film layer within the wafer is reduced; compared to the second method in the background technology, the investment cost is reduced. Furthermore, in this application, the temperature control module is integrated into the diamond dressing tool. Compared to adding a separate temperature control module, the method provided by this application has higher space utilization and avoids the problem of collisions between the grinding head, slurry supply system, diamond dressing tool, and temperature control module when they swing together in the CMP system when a separate temperature control module is added. In addition, the swing arm space of the grinding head and slurry supply system is increased, resulting in greater process flexibility. Compared to integrating the temperature control module into the grinding disc, the method provided by this application directly acts on the surface of the grinding disc, which is more efficient, responds faster, and can reduce the probability of grinding disc aging and wear. Compared to integrating the temperature control module into the grinding head, the method provided by this application can reduce the probability of aging of the rubber in the air bladder inside the grinding head during continuous heating and the fluctuation of the air bladder pressure inside the grinding head with temperature during intermittent heating. That is, it can reduce the probability of grinding head aging and damage and ensure the stability of the grinding head process.

[0065] The above description is merely a preferred embodiment of this specification and is not intended to limit this specification. Any modifications or equivalent substitutions made within the spirit and principles of this specification should be included within the scope of protection of this specification.

Claims

1. A diamond trimmer, wherein, include: A support arm, wherein a slide rail is provided inside the support arm, and the first surface of the support arm faces the surface to be repaired; The diamond disc is movably connected to the slide rail and is movable along the length of the slide rail; A temperature adjustment module, disposed on the support arm, is used to adjust the temperature of at least the first region when the actual temperature of the first region of the surface to be repaired deviates from the target temperature and reaches a threshold, wherein the first region is the region of the surface to be repaired facing the first surface and in contact with the object to be ground.

2. The diamond trimmer according to claim 1, wherein, The temperature regulation module is disposed around the slide rail and the diamond disc along the width direction of the slide rail.

3. The diamond trimmer according to claim 2, wherein, The temperature regulation module includes: At least one medium channel is disposed within the support arm and is connected to a heat source or a cold source; At least one nozzle is disposed on the first surface and is in communication with the at least one medium channel.

4. The diamond trimmer according to claim 3, wherein, The temperature regulation module is configured as follows: In response to the actual temperature being higher than the target temperature and the difference between the actual temperature and the target temperature being greater than a first threshold, the at least one nozzle is opened, so that the cold source is sprayed from the at least one nozzle to the first area via the at least one medium channel; or In response to the actual temperature being lower than the target temperature and the difference between the target temperature and the actual temperature being greater than a second threshold, the at least one nozzle is opened, causing the heat source to be sprayed from the at least one nozzle into the first region via the at least one medium channel.

5. The diamond trimmer as claimed in claim 4, wherein, The temperature regulation module further includes at least one heating lamp disposed on the first surface, and the temperature regulation module is further configured to: In response to the actual temperature being lower than the target temperature and the difference between the target temperature and the actual temperature being greater than a second threshold, the at least one heating lamp is turned on.

6. The diamond trimmer according to claim 5, wherein, The radiation power of each heating lamp can be individually adjusted, and the adjustment range is from 0 to the maximum radiation power; Alternatively, the injection flow rate of each nozzle can be individually adjusted, with the adjustment range being 0 to the maximum injection flow rate.

7. The diamond trimmer according to claim 5 or 6, wherein, There are two media channels, which are respectively arranged on both sides of the slide rail along the width direction, and the heating lamp and the nozzle are respectively arranged near the media channel on each side.

8. A chemical mechanical polishing system, wherein, include: Grinding disc; A grinding head is disposed above the grinding disk and is used to fix the object to be ground on the side of the grinding head facing the grinding disk. The diamond dressing device according to any one of claims 1-7; wherein the support arm is disposed above the grinding disc, and the side of the grinding disc facing the first surface is the surface to be dressed; A temperature sensor and a controller, wherein the controller is coupled to the temperature regulation module and the temperature sensor; During the operation of the chemical mechanical polishing system, the radiation range of the temperature regulation module on the polishing disc at least covers the first area; the temperature sensor is used to detect the actual temperature of the first area at least; and the controller is used to control the temperature regulation module to regulate the temperature of the first area at least when the actual temperature deviates from the target temperature and reaches a threshold.

9. The chemical mechanical polishing system according to claim 8, wherein, During operation of the chemical mechanical polishing system, the support arm is parallel to the radial direction of the polishing disc.

10. The chemical mechanical polishing system according to claim 8, wherein, In the radial direction of the grinding disc, the grinding disc includes multiple annular regions, and each annular region corresponds to a temperature sensor; The controller is also configured to obtain a set of all the annular regions that intersect with the first region; for each annular region in the set, in response to its actual temperature deviating from the target temperature and reaching a threshold, the controller controls the temperature adjustment module to adjust the temperature of the corresponding annular region.

11. A chemical mechanical polishing method, wherein, Using the chemical mechanical polishing system of any one of claims 8-10, the chemical mechanical polishing method comprises: The object to be ground is fixed on the side of the grinding head facing the grinding disc, and the grinding disc is used to grind the object to be ground. The temperature sensor detects at least the actual temperature of the first region. In response to the actual temperature deviating from the target temperature and reaching a threshold, the controller controls the temperature regulation module to regulate the temperature of at least the first region.

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