Glass substrate processing apparatus and method

Abstract

This application relates to the field of semiconductor manufacturing and discloses a glass substrate processing equipment and method. The equipment includes: a grinding unit, comprising a first grinding element, a second grinding element, and a carrier element. The first and second grinding elements are disposed opposite each other and used for grinding the glass substrate. The carrier element is located between the first and second grinding elements and has at least two carrier areas for carrying the glass substrate. The carrier element is configured to drive the glass substrate it carries to rotate relative to the first and second grinding elements, so as to achieve simultaneous grinding of both sides of at least two glass substrates. A cleaning unit is disposed downstream of the grinding unit and is used to clean the ground glass substrate. A drying unit is disposed downstream of the cleaning unit and is used to dry the cleaned glass substrate. A transfer unit is used to transfer the glass substrate between the grinding unit, the cleaning unit, and the drying unit, realizing integrated dry-in and dry-out processing of multiple square or round glass substrates of different specifications.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, specifically to a glass substrate processing equipment and method. Background Technology

[0002] As semiconductor packaging technology advances towards higher density and performance, through-glass via (TGV) technology has gradually become a research hotspot in the 2.5D / 3D packaging field due to its excellent high-frequency electrical characteristics, simple process, low cost, and strong mechanical stability. In the TGV process, the glass substrate first needs to be a material with a thickness between 100 and 1000 micrometers. Then, holes are drilled into its surface, and conductive metal materials such as copper or tungsten are filled into the holes through electroplating to form in-hole metallization. Finally, mechanical and chemical polishing is used to remove excess metal residue from both sides of the glass substrate.

[0003] Traditional mechanical-chemical polishing (TGV) equipment is primarily designed for circular wafer substrates, such as 8-inch or 12-inch wafers. Its polishing units, transfer systems, and cleaning and drying modules are all built around the rotational symmetry of the circular substrate, making it incompatible with square glass substrates of different sizes. Existing equipment can only process one substrate at a time, and the substrate needs to be transferred between different devices during processing, making it difficult to achieve fully automated continuous processing from feeding to output. Furthermore, conventional single-wafer polishing machines have shortcomings in processing accuracy, simultaneous processing of multiple wafers, and automation control, hindering the industrial application of TGV technology. Summary of the Invention

[0004] This application provides a glass substrate processing equipment and method to solve the problems that existing mechanical and chemical polishing equipment cannot be compatible with square glass substrates of different sizes and is difficult to achieve simultaneous polishing of multiple substrates and automated continuous processing.

[0005] This application provides a glass substrate processing apparatus, comprising: a grinding unit including a first grinding element, a second grinding element, and a carrier element, wherein the first grinding element and the second grinding element are disposed opposite to each other and are used for grinding a glass substrate, and the carrier element is located between the first grinding element and the second grinding element and is provided with at least two bearing areas for bearing the glass substrate; the carrier element is configured to drive the glass substrate it carries to rotate relative to the first grinding element and the second grinding element, so as to achieve simultaneous grinding of both sides of at least two glass substrates; a cleaning unit disposed downstream of the grinding unit for cleaning the ground glass substrate; a drying unit disposed downstream of the cleaning unit for drying the cleaned glass substrate; and a transfer unit for transferring the glass substrate between the grinding unit, the cleaning unit, and the drying unit.

[0006] Optionally, the carrier is a parade wheel; and / or, the carrier area is three, and the three carrier areas are evenly spaced along the circumference of the carrier.

[0007] Optionally, the bearing area is a square recessed platform formed on the bearing member, the recessed platform having a sunken support plane for supporting the circumferential edge of the glass substrate.

[0008] Optionally, the bottom of the settling platform is provided with an opening extending through the thickness direction of the support member, so that the lower surface of the glass substrate is exposed through the opening and contacts the first grinding member.

[0009] Optionally, it further includes: a stabilizing unit comprising a plurality of circumferentially arranged support gears, the support gears meshing with the carrier member for supporting and guiding the movement of the carrier member.

[0010] Optionally, it further includes: a driving unit, including a first driving part and a second driving part; the first driving part is used to drive the first grinding member and the second grinding member to rotate; the second driving part is used to drive the carrier member to rotate relative to the first grinding member and the second grinding member.

[0011] Optionally, it further includes a supply unit and / or a spraying unit; the supply unit is used to supply polishing fluid to the polishing surface of the first polishing workpiece and / or the second polishing workpiece; the spraying unit is used to spray cleaning fluid into the polishing area.

[0012] Optionally, the transmission unit includes: a storage unit for storing glass substrates to be processed and processed; multiple robotic arms for transferring glass substrates between the storage unit, the grinding unit, the cleaning unit, and the drying unit; and a buffer unit disposed between the grinding unit and the cleaning unit for temporarily storing the ground glass substrates and adjusting the transmission direction.

[0013] Optionally, the cleaning unit includes a megasonic cleaning subunit and a chemical cleaning subunit for performing megasonic cleaning and chemical cleaning on the glass substrate, wherein the megasonic cleaning subunit is located upstream of the chemical cleaning subunit.

[0014] Optionally, it also includes a direction conversion unit disposed between the grinding unit and the cleaning unit, for converting the ground glass substrate from a horizontal state to a vertical state so that the glass substrate enters the cleaning unit vertically.

[0015] Optionally, it also includes a detection unit, located downstream of the drying unit, for performing appearance inspection on the dried glass substrate.

[0016] A second aspect of this application provides a glass substrate processing method based on the aforementioned glass substrate processing equipment, comprising the following steps: placing at least two glass substrates on at least two bearing areas of the carrier; driving a first grinding element and a second grinding element to rotate, and simultaneously driving the carrier to rotate between the first grinding element and the second grinding element, and supplying grinding fluid to the grinding surface of the first grinding element and / or the second grinding element; removing the ground glass substrate from the carrier; cleaning the removed glass substrate; and drying the cleaned glass substrate.

[0017] Beneficial effects: The glass substrate processing equipment provided in this application features at least two bearing areas on a carrier within the grinding unit. Each bearing area can hold one glass substrate, and the carrier is configured to drive the glass substrate to move relative to a first and second grinding element, thereby enabling simultaneous double-sided grinding of at least two glass substrates. This structure overcomes the limitation of traditional circular wafer grinding equipment, which can only process one substrate at a time, significantly increasing the number of glass substrates processed per unit time. Furthermore, since the carrier can accommodate multiple glass substrates simultaneously, and the number and size of the bearing areas can be designed as needed, the equipment is also compatible with square or circular glass substrates of different specifications, solving the problem of limited compatibility with traditional equipment. In addition, by sequentially arranging a cleaning unit and a drying unit downstream of the grinding unit, and configuring a transfer unit to transfer glass substrates between units, the entire grinding, cleaning, and drying process is automatically connected, achieving integrated dry-in, dry-out processing of multiple glass substrates. This avoids the risk of contamination from intermediate transfers, improving processing efficiency and product yield. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the glass substrate processing equipment according to an embodiment of this application; Figure 2 This is a schematic diagram showing the structure of the first and second grinding components as described in an embodiment of this application. Figure 3 This is a schematic diagram of the fastening structure of the first and second grinding parts in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the carrier and stabilizing unit in an embodiment of this application; Figure 5 A top view of the first and second grinding components according to an embodiment of this application; Figure 6 This is an exploded view of the grinding unit in an embodiment of this application; Figure 7 This is a schematic diagram of the structure of the carrier component according to an embodiment of this application; Figure 8 This is a schematic diagram of the processing procedure of the cleaning unit in an embodiment of this application; Figure 9 This is a schematic diagram of the processing procedure of the drying unit in an embodiment of this application; Figure 10 This is a schematic flowchart of a glass substrate processing method according to an embodiment of this application.

[0020] Explanation of reference numerals in the attached figures: 1. Grinding Unit; 101. First Grinding Component; 102. Second Grinding Component; 103. Support Component; 1031. Support Area; 1032. Grinding Fluid Supply Position; 104. Grinding Disc; 105. Belt; 106. Hydraulic Controller; 107. Supply Unit; 2. Cleaning Unit; 201. Megasonic Cleaning Subunit; 2011. Inner Tank; 2012. Outer Tank; 202. Chemical Cleaning Subunit; 2021. Cleaning Pump; 2022. Heater; 2023. Filter; 2024. First Nozzle; 3. Drying Unit; 301. Second Nozzle; 302 1. Third nozzle; 303. Heating wire; 4. Stabilizing unit; 401. Support gear; 5. Direction conversion unit; 6. Detection unit; 7. Transmission unit; 701. Equipment front-end module; 7011. First buffer unit; 7012. Second buffer unit; 702. Conveyor box; 703. First positioning station; 704. Second positioning station; 705. First robot arm; 706. Second robot arm; 707. Third robot arm; 708. Fourth robot arm; 709. Fifth robot arm; 710. Sixth robot arm; 711. Robot arm track; 8. Glass substrate. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] The first aspect of this application provides a glass substrate processing apparatus. The apparatus will now be described in detail with reference to the accompanying drawings.

[0023] Reference Figures 1 to 9 As shown, a glass substrate processing equipment includes a grinding unit 1, a cleaning unit 2, a drying unit 3, and a transfer unit 7.

[0024] Specifically, the polishing unit 1 includes a first polishing element 101, a second polishing element 102, and a carrier element 103. The first polishing element 101 and the second polishing element 102 are arranged opposite to each other, and both are used to polish the glass substrate 8.

[0025] The carrier 103 is located between the first grinding member 101 and the second grinding member 102. The carrier 103 has at least two bearing areas 1031 for bearing glass substrates 8. Each bearing area 1031 can independently hold one glass substrate 8. The carrier 103 is configured to drive the glass substrate 8 it carries to rotate relative to the first grinding member 101 and the second grinding member 102, so as to achieve simultaneous double-sided grinding of at least two glass substrates 8.

[0026] The cleaning unit 2 is located downstream of the polishing unit 1 and is used to clean the polished glass substrate 8. The drying unit 3 is located downstream of the cleaning unit 2 and is used to dry the cleaned glass substrate 8. The transfer unit 7 is used to transfer the glass substrate 8 between the polishing unit 1, the cleaning unit 2, and the drying unit 3.

[0027] By providing at least two bearing areas 1031 on the carrier 103 in the grinding unit 1, each bearing area 1031 can bear one glass substrate 8. The carrier 103 is configured to drive the carried glass substrate 8 to move relative to the first grinding element 101 and the second grinding element 102, thereby achieving simultaneous double-sided grinding of at least two glass substrates 8. This structure breaks through the limitation of traditional circular wafer grinding equipment that can only process one wafer at a time, significantly increasing the number of glass substrates 8 processed per unit time. At the same time, since the carrier 103 can accommodate multiple glass substrates 8 at the same time, and the number and size of the bearing areas 1031 can be designed as needed, the equipment can also be compatible with square or circular glass substrates 8 of different specifications, solving the problem of single compatibility of traditional equipment. In addition, by sequentially setting a cleaning unit 2 and a drying unit 3 downstream of the grinding unit 1, and configuring a transfer unit 7 to transfer glass substrates 8 between the units, the automatic connection of the entire process of grinding, cleaning, and drying is realized, that is, the integrated processing of multiple glass substrates 8 dry in and dry out is realized, avoiding the risk of contamination caused by intermediate transfer, and improving processing efficiency and product yield.

[0028] In one optional embodiment, the grinding unit 1 further includes a grinding disc 104, also referred to as a polishing disc or polishing base. A first grinding element 101 is disposed on the grinding disc 104 and rotates with the grinding disc 104. The first grinding element 101 includes a first grinding head and a first grinding pad. The first grinding head is disc-shaped or cylindrical and can be made of metal, possessing high rigidity and flatness. The first grinding pad has a circular plate-like structure and can be made of polyurethane, possessing certain elasticity and wear resistance. The first grinding pad can be adhered to the side of the first grinding head facing the second grinding element 102, i.e., the inner surface of the first grinding head, using an adhesive. The adhesion method can be uniform application of adhesive followed by pressure curing to ensure that the first grinding pad does not shift during operation. The second grinding element 102 can have the same structure as the first grinding element 101 or a different structure.

[0029] Specifically, the second grinding element 102 includes a second grinding head and a second grinding pad. The second grinding head is generally disc-shaped and can be made of metal, possessing high flatness and rigidity. The second grinding pad is annular and can be made of the same polyurethane material as the first grinding pad. The second grinding pad is adhered to the side of the second grinding head facing the first grinding element 101, i.e., the upper surface of the second grinding head, using an adhesive. The second grinding head and the first grinding head are positioned opposite each other, with the second grinding head located directly above the first grinding head. A support member 103 is disposed between the second grinding head and the first grinding head, i.e., the upper surface of the support member 103 faces the second grinding pad, and the lower surface of the support member 103 faces the first grinding pad. The second grinding head can be raised and lowered relative to the first grinding head and can rotate synchronously with or independently of the first grinding head.

[0030] In one alternative implementation, refer to Figure 4 , Figure 5 and Figure 7 As shown, the carrier 103 is a parade wheel. A parade wheel is a disc-shaped carrier with teeth evenly distributed around its outer circumference for meshing with a drive gear to obtain rotational power. The parade wheel is typically made of high-strength, wear-resistant materials, such as stainless steel or engineering plastics, to ensure it can withstand pressure and wear during the grinding process. The thickness of the parade wheel matches the thickness of the glass substrate 8 to ensure the substrate remains stable during grinding. In practical applications, the parade wheel can be detachable and replaceable, with different specifications of parade wheels corresponding to different sizes and numbers of carrier areas 1031, facilitating quick switching between processing different products. The outer diameter of the parade wheel can be determined based on the size of the grinding disc 104 of the equipment; for example, it can be designed with a diameter greater than 700mm to accommodate three square carrier areas 1031 with sides of 700mm.

[0031] It should be noted that in practical applications, the support member 103 can adopt a disc-shaped structure with gear teeth on its outer periphery for easy driving. The support area 1031 can be a square opening penetrating the support member 103, or it can be a groove with supporting steps.

[0032] In another alternative embodiment, the carrier 103 can also be other forms of rotating carrier, such as a planetary disk or a turntable. The planetary disk has a central tooth that meshes with the drive gear, and multiple bearing areas 1031 are formed on the disk body for placing the glass substrate 8. The drive unit causes the planetary disk to revolve around the central axis through gear transmission, and the disk body itself can also rotate, which can also drive the substrate and the upper and lower grinding parts to generate relative movement, and complete the simultaneous grinding of both sides.

[0033] Optionally, three support areas 1031 can be provided, and the three support areas 1031 are evenly spaced along the circumference of the support member 103. Each support area 1031 is square to match the shape of the square glass substrate 8, and the specific dimensions of the three support areas 1031 can be the same. Alternatively, the specific dimensions of the three support areas 1031 can also be flexibly set according to actual processing requirements. For example, three sizes of support areas 1031, namely small, medium, and large, can be provided to accommodate square glass substrates 8 of different sizes. Furthermore, the three support areas 1031 are distributed at 120° intervals on the circumference of the parade wheel, so that the force on each substrate is uniform when the parade wheel rotates, while making full use of the area of ​​the parade wheel.

[0034] In actual processing, three square glass substrates 8 with a side length of 700mm can be placed simultaneously on the wheel. The revolution and rotation of the wheel cause each substrate to generate a complex relative motion trajectory with the upper and lower grinding pads, which helps to improve the uniformity of grinding. The number and arrangement of the above-mentioned bearing areas 1031 can be adjusted according to actual processing requirements. For example, two or four bearing areas 1031 can be set to meet different grinding processing requirements, and the shape of the bearing areas 1031 can also be designed as rectangles or other polygons according to the shape of the glass substrate 8.

[0035] In one alternative embodiment, the support area 1031 is a square recessed platform formed on the support member 103. The recessed platform has a recessed support plane for supporting the circumferential edge of the glass substrate 8.

[0036] Specifically, the parade wheel has a square recessed groove or through hole. A step protrudes from the center of the side wall of the recessed groove or the center of the inner wall of the through hole, and the upper surface of this step serves as the support plane. The support plane is recessed to a certain depth relative to the upper surface of the parade wheel, slightly less than the thickness of the glass substrate 8. This ensures that when the glass substrate 8 is placed, its upper surface is slightly higher than the upper surface of the parade wheel, while its lower surface is slightly lower. After the glass substrate 8 is placed in the bearing area 1031, its circumferential edge rests on the support plane, while the rest of the substrate is suspended. This structure ensures stable positioning of the substrate within the parade wheel, preventing it from becoming eccentric or falling off due to centrifugal force during high-speed rotation, while also allowing the upper and lower surfaces of the substrate to be fully exposed to contact the upper and lower grinding pads. The width of the support plane can be designed according to the dimensions of the substrate edge, ranging from 2mm to 5mm, to ensure sufficient support area without obstructing too much of the grinding area. It should be noted that in practical applications, the specific depth of the square recessed platform and the width of the supporting plane can be flexibly set according to the actual load-bearing requirements, which will not be elaborated here.

[0037] In another alternative embodiment, the support area 1031 can also be composed of a separate substrate holder. This holder is embedded in a mounting hole on the support member 103, and the inner wall of the holder forms a square recessed platform structure, whose recessed support plane supports the circumferential edge of the glass substrate 8. By replacing holders of different specifications, square glass substrates 8 of different sizes can be quickly adapted without replacing the entire support member 103, thus improving the processing flexibility of the equipment.

[0038] Furthermore, the bottom of the settling platform has an opening extending through the thickness direction of the support member 103. This opening allows the lower surface of the glass substrate 8 to be exposed and contact the first grinding member 101.

[0039] Specifically, the square recessed platform on the parade wheel has a completely hollow bottom, meaning there is no bottom wall, only a square through-hole matching the shape of the upper part of the platform. After the glass substrate 8 is placed on the supporting plane, its lower surface extends out from the opening and directly contacts the first polishing pad. At the same time, the upper surface of the glass substrate 8 is also exposed above the parade wheel and contacts the second polishing pad. In this way, the two polishing pads can act on the upper and lower surfaces of the glass substrate 8 simultaneously, achieving simultaneous polishing of both sides of the glass substrate 8. The shape of the opening matches the shape of the glass substrate 8 and can be square or other shapes. The opening size is slightly smaller than the outer dimensions of the glass substrate 8 so that the supporting plane can support the edges of the glass substrate 8. The size of the opening can also be adjusted according to the thickness of the glass substrate 8 and the polishing process requirements. For example, for a thicker glass substrate 8, the opening size can be appropriately increased to ensure full exposure.

[0040] In another alternative embodiment, the support area 1031 can also be directly configured as a square through-hole penetrating the thickness direction of the support member 103, with a removable support ring installed on the inner wall of the through-hole near the bottom. The upper surface of the support ring serves as a support plane to support the circumferential edge of the glass substrate 8, while the lower surface of the substrate extends from the bottom of the through-hole to contact the first polishing pad. The support ring can be directly replaced after wear, reducing maintenance costs.

[0041] In one alternative embodiment, the glass substrate processing equipment further includes a stabilizing unit 4. The stabilizing unit 4 includes a plurality of support gears 401 arranged circumferentially. The support gears 401 mesh with the carrier 103 and are used to support and guide the movement of the carrier 103.

[0042] The support gears 401 include four large gears and four small gears. Specifically, four large gears and four small gears are evenly arranged on the outer circumference of the parade wheel, with the large and small gears alternating. Each of these gears meshes with the teeth of the parade wheel. These support gears 401 not only transmit power but also provide radial support to the parade wheel, preventing it from wobbling when rotating at high speed.

[0043] In actual installation, these support gears 401 are mounted on the fixed base of the equipment, and their teeth mesh precisely with the teeth on the outer circumference of the walking wheel. When the walking wheel rotates, the support gears 401 rotate accordingly, always maintaining contact with the walking wheel, thereby limiting the radial offset and wobble of the walking wheel. The design of alternating large and small gears can disperse the meshing impact force, reduce operating noise, improve the smoothness of the transmission and grinding process, and significantly improve the grinding accuracy. When processing three glass substrates 8 simultaneously, it can also ensure that the grinding rate of each substrate is consistent and the thickness uniformity is better.

[0044] Furthermore, the number of support gears 401 can be adjusted according to the size and weight of the carrier 103, for example, using six or eight support gears 401. The tooth shape of the support gears 401 can be spur or helical; helical meshing can improve transmission smoothness and reduce noise. Alternatively, the stabilizing unit 4 can also be equipped with a detection sensor to monitor the running smoothness of the carrier 103 in real time, and issue an alarm signal when abnormal sway is detected.

[0045] In one alternative embodiment, the glass substrate processing equipment further includes a drive unit.

[0046] The drive unit includes a first drive section and a second drive section. The first drive section is used to drive the first grinding element 101 and the second grinding element 102 to rotate. For example, the first drive section may include a first motor connected to a grinding disc 104, which drives the first grinding element 101 to rotate; and a second motor. The second grinding head is driven by the second motor, which can independently control the rotation direction and speed of the second grinding head, so that the second grinding head rotates in the same direction or in the opposite direction to the first grinding element 101, and the speeds may be the same or different. Alternatively, the first drive section may also include only one drive motor, which drives the grinding disc 104 to rotate, and the grinding disc 104 drives the second grinding element 102 to rotate synchronously through a transmission mechanism (such as a gear or belt 105).

[0047] The second drive unit is used to drive the carrier 103 to rotate relative to the first grinding element 101 and the second grinding element 102. The second drive unit includes a drive gear meshing with the walking wheel and its motor. The drive gear is mounted on the central main shaft or side of the equipment and causes the walking wheel itself to rotate relative to the grinding disc 104 through gear transmission.

[0048] It should be noted that the roller and the grinding disc 104 can rotate in the same or different directions at the same or different speeds to adapt to different grinding process requirements. For example, in the coarse grinding stage, the roller and the grinding disc 104 can rotate in the same direction to accelerate the removal rate, while in the fine grinding stage, they can rotate in opposite directions to obtain a smoother surface. By adjusting the speed and direction of the first and second drive units, the glass substrate 8 can form a complex relative motion trajectory on the grinding pad, which is beneficial to improving grinding uniformity and material removal rate.

[0049] In actual processing, the settings can be adapted to meet processing requirements. For example, the first drive unit can also include a speed reducer to adjust the output torque. The lifting and lowering movement of the second grinding head can also be achieved by an independent lifting motor in conjunction with a lead screw or cylinder. All motors in the drive unit can be servo motors and connected to the equipment controller. The controller automatically adjusts the operating status of each motor according to preset grinding process parameters (such as speed, time, and pressure).

[0050] In one optional embodiment, the second grinding element 102 can be connected to the first grinding element 101 via a hinge. Furthermore, a hydraulic connector and a hydraulic controller 106 can be provided between them. The hydraulic controller 106 drives the second grinding element 102 to move up and down relative to the first grinding element 101 by controlling the hydraulic connector, thereby facilitating the opening and closing of the second grinding element 102 and making it easier to pick up and put down the glass substrate 8. During grinding, the hydraulic controller 106 presses the second grinding element 102 down to a set position; after grinding, the hydraulic controller 106 controls the second grinding element 102 to rise, opening the grinding space. During grinding, the hydraulic controller 106 presses the second grinding element 102 down to a set position, so that the second grinding pad contacts the upper surface of the glass substrate 8, cooperating with the first grinding pad to grind both sides of the substrate simultaneously. After grinding, the hydraulic controller 106 controls the second grinding element 102 to rise, opening the grinding space, facilitating the removal of the glass substrate 8 by a robotic arm. Alternatively, in practical applications, the second grinding element 102 can also be equipped with an independent rotary drive mechanism, which can drive it to rotate around its own axis.

[0051] In an optional embodiment, the glass substrate processing apparatus further includes a supply unit 107. The supply unit 107 supplies polishing slurry to the polishing surfaces of the first polishing pad 101 and the second polishing pad 102. The supply unit 107 may include a polishing slurry storage tank, a pump, pipelines, and a distribution channel disposed inside the polishing pad 104 or the second polishing head. The polishing slurry is transported to the surfaces of the first and second polishing pads via pipelines.

[0052] Specifically, the supply unit 107 can be equipped with multiple independent polishing slurry pipelines, for example, three polishing slurry supply pipelines. One supply pipeline corresponds to the first polishing pad, one supply pipeline corresponds to the second polishing pad, and the remaining supply pipeline corresponds to each bearing area 1031 on the wheel, realizing zoned supply to adapt to the different polishing requirements of different substrates. Furthermore, each branch pipeline can also be equipped with an independent flow regulating valve to accommodate differences in the thickness or polishing rate of the glass substrate 8 at different polishing positions. The polishing slurry supply pipeline can be in the form of a conveying pipeline or in the form of polishing slurry orifice holes. (Refer to...) Figure 4 As shown, the cruise ship has three grinding fluid supply positions 1032, corresponding to three bearing areas 1031. In practical applications, the grinding fluid can be a slurry prepared with abrasives such as alumina, silica, or cerium dioxide and deionized water. The flow rate and concentration of the grinding fluid can be flexibly adjusted according to process requirements.

[0053] It should be noted that the above-described configuration of the supply unit 107 is merely an exemplary arrangement. The supply unit 107 employs multiple independent small pumps and pipelines, with each pump corresponding to a bearing area 1031 on the wheel. The polishing slurry is independently delivered to the nozzles above each bearing area 1031. The flow rate and on / off state can be individually adjusted according to the polishing status of each glass substrate 8, making it suitable for simultaneous processing of substrates of different thicknesses or in different batches, with higher control precision.

[0054] Alternatively, the polishing head has an internal channel for supplying polishing slurry, through which the slurry flows to the lower surface of the first polishing pad. The polishing disc also has a slurry supply line inside or at its edge, through which the slurry flows to the upper surface of the second polishing pad. During polishing, both the first and second polishing pads are supplied with polishing slurry simultaneously. After polishing, the slurry supply line switches to high-pressure deionized water to rinse the polishing head, polishing disc, and the glass substrate 8 on the polishing wheel, removing residual slurry and abrasive debris.

[0055] In one alternative embodiment, the glass substrate processing equipment further includes a spraying unit. The spraying unit is used to spray cleaning fluid into the grinding area.

[0056] Specifically, the spraying unit may include a high-pressure deionized water source, a pump, and nozzles. The nozzles of the spraying unit may be designed with a swingable structure to intermittently spray small amounts of deionized water during the grinding process to keep the grinding pad moist and prevent the grinding fluid from drying out and clogging the pores. The nozzles may be installed on the edge of the grinding disc 104 or the side of the second grinding head, facing the grinding area. After grinding, high-pressure deionized water is sprayed to rinse the first grinding pad, the second grinding pad, and the glass substrate 8 on the carrier 103, promptly removing grinding debris remaining in the pores of the grinding pad, preventing the grinding pad from clogging, and maintaining the cutting ability of the grinding pad; removing grinding fluid and particles from the surface of the glass substrate 8 to prevent crystallization or scratches after drying; rinsing the residual liquid on the second grinding head and connectors to prevent corrosion and crystal accumulation; reducing the frequency of equipment maintenance and extending the service life of the grinding pads and pipelines.

[0057] Specifically, the spraying unit can also be set independently and may include a high-pressure deionized water source, a booster pump, an air tank, and multiple nozzles. The nozzles can be installed on the edge of the grinding disc 104 or the side of the second grinding head, arranged in a ring and facing the grinding area. After grinding, the booster pump pressurizes the deionized water to a high pressure and then sprays high-pressure deionized water through the nozzles onto the surfaces of the first grinding pad, the second grinding pad, and the glass substrate 8 on the wheel, rinsing away residual grinding fluid, grinding debris, and glass fragments. During spraying, the grinding disc 104 and the second grinding head can rotate at a low speed, ensuring that the high-pressure water evenly covers the entire grinding surface. The spraying time can be set to 10 to 30 seconds until the discharged wastewater becomes clear.

[0058] In practical applications, a separate spraying unit can be omitted, or the supply unit 107 can be designed as a dual-path switching structure: one path supplies grinding slurry, and the other path supplies high-pressure deionized water. During grinding, the system switches to the grinding slurry path, and during rinsing, it switches to the deionized water path, using the same pump and nozzles. This method saves equipment space and cost, and the pipeline can be purged with compressed air before switching to solve the problem of residual mixing during pipeline switching.

[0059] In one optional embodiment, the grinding unit 1 further includes a polishing pad dresser. Specifically, a set of dressers is installed on each of the outer periphery of the polishing disc, and each set of dressers includes a dresser head and its drive mechanism. The working surface of the dresser head is inlaid with diamond particles or has carbide teeth for grinding and smoothing the surface of the polishing pad. The dresser is mounted on a swingable support arm, and the dresser is driven to rotate by an independent drive motor via belt 105. During the grinding process or intervals, the dresser is driven to descend and contact the polishing pad, while the polishing disc rotates. The dresser rotates under the drive of belt 105 of the drive motor and swings back and forth along the radial direction of the polishing pad to remove residual polishing fluid, abrasive debris, and aged surface layers from the surface of the polishing pad, restoring the roughness and cutting ability of the polishing pad. Using two sets of dressers allows for alternating or simultaneous operation, improving dressing efficiency, ensuring stable grinding performance of the polishing pad throughout the grinding cycle, extending the life of the polishing pad, and improving the planarization quality of the substrate.

[0060] In one alternative implementation, refer to Figure 1 and Figure 8 As shown, the cleaning unit 2 includes a mega-sonic cleaning subunit 201 and a chemical cleaning subunit 202.

[0061] Specifically, the megasonic cleaning subunit 201 is located upstream of the chemical cleaning subunit 202. The megasonic cleaning subunit 201, also known as the Mega Cleaning unit, generates high-frequency acoustic waves (e.g., 0.7 to 1.0 MHz, wavelength 1 μm) to create a cavitation effect in the cleaning solution, effectively removing submicron-sized particles from the substrate surface. The megasonic cleaning subunit 201 can simultaneously accommodate multiple vertically placed glass substrates 8, such as three, with each substrate receiving uniform cleaning under the action of megasonic waves.

[0062] The internal structure of the megasonic cleaning subunit 201 includes an inner tank 2011 and an outer tank 2012. Ultrapure water or chemical liquid is pumped to the heater 2022 through pipelines. After heating, it is filtered through the filter 2023 and then transported to the inner tank 2011. At the same time, the megasonic generator below the inner tank 2011 starts working. When the inner tank 2011 is full, it overflows into the outer tank 2012. After overflowing from the outer tank 2012, it is discharged to the waste liquid treatment device. Specifically, the megasonic cleaning subunit 201 can also be equipped with a heating module and a temperature sensor to heat the cleaning liquid to 40 to 60°C to improve cleaning efficiency.

[0063] The chemical cleaning subunit 202, also known as the Clean cleaning unit, cleans the glass substrate using chemical solutions or ultrapure water. The chemical cleaning subunit 202 may include a cleaning pump 2021, a heater 2022, a filter 2023, and a first nozzle 2024. The cleaning pump 2021 delivers ultrapure water to the first nozzle 2024. The heater 2022 preheats the cleaning solution. The filter 2023 removes particulate impurities from the fluid to prevent secondary contamination. The first nozzle 2024 can be an ultrapure water nozzle, or other nozzles, such as a deionized water nozzle or an isopropanol / nitrogen nozzle. Further cleaning of the glass substrate 8 is performed using acidic or alkaline chemical solutions to remove organic residues and metal ions. For example, the nozzle flow rate can be controlled between 80 ml / min and 500 ml / min, and the tilt angle can be controlled within the range of 3° to 45°. Alternatively, a multi-step cleaning process can be performed using ammonia, hydrochloric acid, diluted hydrofluoric acid, and deionized water sequentially, or a thorough cleaning can be performed using a mixture of hydrogen peroxide and ammonia.

[0064] The chemical cleaning subunit 202 can be equipped with multiple independent cleaning tanks, each holding a different chemical solution, through which the substrate sequentially passes. Each cleaning tank can be equipped with a circulating filtration system to maintain the cleanliness of the cleaning solution. After cleaning, a deionized water rinsing tank can be added to remove any residual chemical solution from the surface of the glass substrate 8. All cleaning tanks are vertically positioned, and the glass substrate 8 is vertically inserted and removed by a robotic arm.

[0065] In one alternative implementation, refer to Figure 1 and Figure 9 As shown, the drying unit 3 is located downstream of the cleaning unit 2 and is used to dry the cleaned glass substrate 8. The drying unit 3 includes a second nozzle 301, a third nozzle 302, and a heating wire 303.

[0066] Specifically, the second nozzle 301 can be a deionized water nozzle, which first sprays deionized water onto the surface of the vertically placed glass substrate 8 for final rinsing. The third nozzle 302 is a gas nozzle, such as an isopropanol / nitrogen nozzle. Specifically, the third nozzle 302 sprays an isopropanol / nitrogen mixture from above the substrate and moves downwards at a uniform speed to the bottom of the substrate. The nitrogen flow rate can be 2 m / s to 10 m / s, and the isopropanol flow rate can be 0 to 1 g / min. The low surface tension of isopropanol replaces the moisture on the substrate surface, while nitrogen acts as a carrier gas to carry away the replaced moisture. The heating wire starts working, and the heating temperature can be 0 to 100°C to heat and dry the substrate, ensuring that the substrate surface is completely dry. The drying unit 3 can simultaneously carry one or more vertically positioned square glass substrates 8, for example, it can dry three square glass substrates 8 simultaneously, maintaining an appropriate distance between each substrate to ensure uniform airflow distribution.

[0067] In one optional embodiment, the glass substrate processing equipment further includes an orientation conversion unit 5. The orientation conversion unit 5 is disposed between the grinding unit 1 and the cleaning unit 2, and is used to convert the ground glass substrate 8 from a horizontal state to a vertical state, so that the glass substrate 8 enters the cleaning unit 2 vertically. The orientation conversion unit 5 can be implemented using a cleaning buffer unit. The cleaning buffer unit can store one or more ground glass substrates 8, thereby adjusting the orientation of the glass substrate 8 from a horizontal direction to a vertical direction; and while the cleaning unit 2 is operating, it can pre-store the glass substrate 8 to await subsequent cleaning tasks. Specifically, when the robotic arm places the horizontal substrate into the cleaning buffer unit, the clamping mechanism within the buffer unit rotates the substrate 90°, making the substrate vertical. Then, another robotic arm vertically grasps the substrate and directly feeds it into the megasonic cleaning subunit 201.

[0068] The above embodiment is merely an exemplary configuration. In actual processing equipment, the direction conversion unit 5 can also be an independent rotary table, on which the glass substrate 8 is placed and rotated 90° by a motor. Vacuum suction holes can be provided on the rotary table to fix the glass substrate 8 and prevent it from slipping during rotation. The cleaning buffer unit can also have multiple stations, for example, simultaneously buffering three glass substrates 8, each station capable of independent rotation. Humidification nozzles can be installed inside the cleaning buffer unit to spray deionized water onto the surface of the glass substrate 8 or maintain a high humidity environment during the waiting period, preventing the glass substrate 8 from drying out.

[0069] In one optional embodiment, the glass substrate processing equipment further includes an inspection unit 6. The inspection unit 6 is located downstream of the drying unit 3 and is used to perform visual inspection on the dried glass substrate 8. The inspection unit 6 can be a high-speed, high-resolution camera, equipped with a suitable light source, to capture images of the surface features of the glass substrate 8 and analyze the presence of scratches, dents, protrusions, or residual particles. The inspection unit 6 is installed on the same side as the front-end module 701 at the front of the equipment, adjacent to the transmission unit 7. After the dried glass substrate 8 is removed from the drying unit 3, it is placed under the camera for imaging. The imaging results are analyzed using image processing algorithms to determine the state of the metal surface within the through-holes and the overall flatness of the glass substrate 8. Qualified glass substrates 8 are returned to the storage module, while unqualified glass substrates 8 can be marked or sent to a recycling channel.

[0070] In practical applications, the detection unit 6 may include multiple cameras, such as a top camera and a bottom camera, to simultaneously capture images of both sides of the glass substrate 8. The light source can be a ring light source or a coaxial light source to improve image contrast. The detection unit 6 may also include a laser displacement sensor for measuring the thickness distribution and warpage of the glass substrate 8. The detection data can be uploaded to the equipment control system for real-time adjustment of the grinding process parameters, achieving closed-loop control.

[0071] In one alternative implementation, the transmission unit 7 is an important part of the automated processing flow of the glass substrate 8. The transmission unit 7 includes a storage unit, a buffer unit, and multiple robotic arms.

[0072] The storage unit is used to store glass substrates 8 that are to be processed and those that have already been processed. The storage unit includes two transfer boxes 702, namely a front-opening unified pod (FOUP) for storing glass substrates 8, which is used to store square glass substrates 8 to be processed and glass substrates 8 that have already been processed.

[0073] The processing equipment also includes an Equipment Front End Module (EFEM) 701, which is an automated interface module for connecting the FOUP (Front End Unit) to the internal environment of the equipment. It contains a robotic arm and a buffer unit, responsible for the entry and exit of the glass substrates 8 and the initial transfer and sealing of the connection ports between the two FOUPs. Specifically, the Equipment Front End Module 701 integrates a robotic arm, a first buffer unit 7011, and a second buffer unit 7012. The first buffer unit 7011 is a temporary storage platform located inside the EFEM, used to temporarily store the substrates to be processed taken from the FOUP to coordinate the difference in cycle time between the preceding and following processes. The second buffer unit 7012 is located between the drying unit 3 and the inspection unit 6, used to temporarily store the dried glass substrates 8. The second buffer unit 7012 is a horizontally placed platform that can simultaneously accommodate three dried square glass substrates 8, facilitating the robotic arm to sequentially pick up the substrates for appearance inspection and classification and return. The rear of the Equipment Front End Module 701 is sequentially connected to the grinding unit 1, the cleaning unit 2, and the drying unit 3. The automatic transfer of substrates between these units is achieved through multiple robotic arms and positioning stations.

[0074] The processing equipment also includes a first positioning station 703 and a second positioning station 704. The first positioning station 703, located between the EFEM and the grinding unit 1, consists of a set of precision positioning pins and is used to pre-align the single glass substrate 8 to ensure that the subsequent multi-axis robot can accurately pick it up. The second positioning station 704, located between the grinding unit 1 and the cleaning unit 2, is used to temporarily store the substrate after grinding and to provide repositioning. Positioning pins can be installed on both the first positioning station 703 and the second positioning station 704 to assist in positioning.

[0075] Specifically, the multiple robotic arms are the first robotic arm 705, the second robotic arm 706, the third robotic arm 707, the fourth robotic arm 708, the fifth robotic arm 709, and the sixth robotic arm 710.

[0076] The first robotic arm 705 is located inside the front-end module 701 of the equipment. It is responsible for taking the substrates out of the transfer box 702 where the glass substrates to be processed are stored and placing them on the buffer unit; at the same time, after the process is completed, it takes out the dried and measured substrates from the second buffer unit 7012 and puts them back into the transfer box 702 where the finished products are stored according to the test results.

[0077] The second robotic arm 706 is also located inside the front-end module 701 of the equipment. It is responsible for taking the substrate to be processed from the buffer unit and accurately placing it on the positioning pin of the first positioning station 703 to complete the pre-alignment of the substrate.

[0078] The third robotic arm 707 is a multi-axis robotic arm located in front of the grinding unit 1. It is responsible for picking up the substrate from the first positioning station 703 by vacuum adsorption and then placing it into the bearing area 1031 of the rotating wheel in the grinding unit 1. When processing three substrates simultaneously, the three substrates are placed into the three bearing areas 1031 in sequence.

[0079] The fourth robotic arm 708 is a multi-axis robotic arm located behind the grinding unit 1. It is responsible for removing the ground substrate from the bearing area 1031 of the parade wheel and placing it on the positioning pin of the second positioning station 704.

[0080] The fifth robotic arm 709 is located between the second positioning station 704 and the cleaning buffer unit. It is responsible for taking the substrate from the second positioning station 704, changing it from a horizontal to a vertical position, and inserting it into the cleaning buffer unit for temporary storage.

[0081] The sixth robotic arm 710 is located at the cleaning unit 2 and the drying unit 3. It is responsible for vertically removing the substrate from the cleaning buffer unit, sequentially feeding it into the megasonic cleaning subunit 201, the chemical cleaning subunit 202, and the drying unit 3, and finally placing the dried substrate horizontally onto the second buffer unit 7012. Robotic arm tracks 711 can also be configured according to different transmission positions and requirements, allowing each robotic arm to perform corresponding operations more conveniently throughout the entire device via the robotic arm tracks 711.

[0082] The detailed process steps are as follows: The first robotic arm 705 takes a square glass substrate 8 from the transfer box 702 containing the glass substrates to be processed and places it horizontally on the buffer unit inside the front-end module 701 of the equipment. The second robotic arm 706 then picks up the substrate from the buffer unit and precisely places it on the positioning pin of the first positioning station 703 to complete the center alignment of the substrate.

[0083] The third robotic arm 707 uses a vacuum suction cup to pick up the substrate from the first positioning station 703 and transport it to the grinding unit 1's rotating wheel. The rotating wheel has three square platforms as support areas 1031, and the third robotic arm 707 sequentially places the three substrates into the three support areas 1031 respectively. The circumferential edges of the substrates are supported by the support planes of the platforms, and the lower surface of the substrates protrudes from the opening at the bottom of the platforms to contact the workpiece to be ground.

[0084] Grinding unit 1 is activated. The lower and upper grinding components rotate relative to each other, and the rotating wheel revolves and rotates under the drive of the surrounding support gear 401. Grinding fluid is supplied to the surface of the grinding pad from the upper and lower sides respectively, performing mechanical and chemical grinding on the front and back sides of the three substrates simultaneously. During the grinding process, the upper grinding component applies a set pressure through the hydraulic connector to ensure uniform grinding.

[0085] After grinding, the fourth robot arm 708 removes the substrates from the bearing area 1031 of the wheel and places them one by one onto the positioning pins of the second positioning station 704. The fifth robot arm 709 removes the substrates from the second positioning station 704, changes the substrates from a horizontal to a vertical position, and inserts them into the cleaning buffer unit. The cleaning buffer unit can hold three substrates vertically at the same time, keeping the interior moist to prevent particles from drying out.

[0086] The sixth robotic arm 710 vertically removes a substrate from the cleaning buffer unit and sends it into the megasonic cleaning subunit 2. The inner tank 2011 of this unit is filled with heated ultrapure water or a chemical solution, while a megasonic generator produces high-frequency sound waves to perform non-destructive precision cleaning on the substrate surface. After cleaning, the sixth robotic arm 710 removes the substrate.

[0087] The sixth robotic arm 710 transfers the substrate from the mega-sonic cleaning subunit 201 to the chemical cleaning subunit 202. In this unit, nozzles sequentially spray ammonia, hydrochloric acid, dilute hydrofluoric acid, and deionized water, with flow rates and spray angles set according to the process parameters, performing multi-step chemical cleaning on the substrate. After cleaning, the substrate is removed by the same robotic arm.

[0088] The sixth robotic arm 710 delivers the substrate into the drying unit 3. The drying unit 3 first rinses the substrate with deionized water, then a nozzle containing a mixture of nitrogen and isopropanol gas moves downwards at a constant speed to clean the substrate surface. Finally, a heating wire heats the substrate for drying. After drying, the sixth robotic arm 710 places the substrate horizontally on the second buffer unit.

[0089] The first robotic arm 705 removes the dried substrate from the second buffer unit 7012 and delivers it to a high-speed, high-definition camera. The camera captures the surface morphology of the substrate, inspects the metal filling status within the vias, and identifies surface defects. After measurement, the first robotic arm 705 sorts the substrates according to the inspection results and places them back into the finished product storage box 702.

[0090] Through the above-described configuration, this equipment can process glass substrates 8, compatible with various shapes such as square and round. For square substrates, the applicable size range includes, but is not limited to, 500mm×510mm, 650mm×550mm, 200mm×200mm, and 615mm×625mm; for round substrates, it is compatible with common sizes such as 8 inches and 12 inches. The applicable substrate thickness range is 100μm to 1000μm. The grinding unit 1 has three bearing areas 1031 on its rotating wheel, which can simultaneously hold three substrates for processing. During grinding, the upper and lower grinding parts work in conjunction with the movement of the rotating wheel to achieve synchronous grinding of both sides of the substrate, without the need to flip the substrate. The entire equipment integrates grinding, cleaning, drying, and measurement modules, and all transfer actions are completed by six robotic arms. The substrate enters the equipment in a dry state from the transfer box 702 and returns to the transfer box 702 in a dry state, realizing continuous dry-in and dry-out operation and avoiding the risk of contamination caused by intermediate transfer. After processing by this equipment, the number of particles on the surface of the glass substrate 8 is controlled to no more than 200 with a particle size of 0.12μm, and the surface flatness is good, which can meet the production requirements of glass through-holes in higher processes. In addition, the equipment can quickly switch to process substrates of different sizes and shapes through replaceable rotating wheels and adjustable process parameters, which significantly improves equipment utilization and production flexibility, and realizes highly integrated automated production.

[0091] A second aspect of this application provides a processing method based on the aforementioned glass substrate processing equipment, referring to... Figure 10 As shown, the specific steps include: At least two glass substrates 8 are respectively placed on at least two bearing areas 1031 of the carrier 103; The first grinding element 101 and the second grinding element 102 are driven to rotate, and the support element 103 is driven to rotate between the first grinding element 101 and the second grinding element 102, while the grinding fluid is supplied to the grinding surface of the first grinding element 101 and / or the second grinding element 102. Remove the polished glass substrate 8 from the support 103; The removed glass substrate 8 is cleaned; The cleaned glass substrate 8 is dried.

[0092] In actual operation, the square glass substrate 8 to be processed is first taken out of the storage unit and transferred to the buffer station by the first robot 705 in the front-end module 701. Then, the second robot 706 places the substrate on the positioning pin of the first positioning station 703. The multi-axis robot picks up the substrate from the first positioning station 703 by vacuum adsorption and places it into the various bearing areas 1031 of the parade wheel in sequence. After the substrate is placed on the parade wheel, the grinding disc 104 is driven to rotate, and the second grinding head is driven to rotate and descend to the set position, so that the first grinding pad and the second grinding pad contact the upper and lower surfaces of the substrate, respectively. At the same time, the parade wheel is driven to rotate and the grinding fluid is supplied. After grinding is completed, the multi-axis robot removes the substrate from the parade wheel and places it on the second positioning station 704. The third robot 707 takes the substrate from the second positioning station 704 and places it vertically into the cleaning buffer unit, where the substrate changes from a horizontal state to a vertical state. Then, the fourth robotic arm 708 sequentially feeds the substrate into the megaacoustic cleaning subunit 201 and the chemical cleaning subunit 202 for cleaning, and finally into the drying unit 3. The drying unit 3 first cleans with a deionized water nozzle, then uses an isopropanol / nitrogen nozzle to blow the substrate downwards at a uniform speed, and finally dries it with a heating wire. After drying, the robotic arm places the substrate horizontally into the second buffer station, then the first robotic arm 705 picks it up and sends it to the detection unit 6 for inspection, and finally returns it to the storage unit.

[0093] Furthermore, the actual grinding process can be divided into multiple stages. For example, coarse grinding can be performed first, using a larger particle size grinding fluid and higher grinding pressure to quickly remove most of the metal residue; then fine grinding can be performed, using a smaller particle size grinding fluid and lower grinding pressure to obtain a flat and smooth surface. Different grinding fluids and grinding parameters can be used at different stages. During the grinding process, the grinding pad can also be periodically dressed using a dresser placed near the grinding pad to maintain its flatness and cutting ability.

[0094] The cleaning process may also include a deionized water rinsing step between megasonic cleaning and chemical cleaning to remove residual chemicals. During the drying step, the nozzle moves uniformly downwards from above the substrate during isopropanol / nitrogen purging. The speed can be set according to the substrate size and drying requirements, for example, 10 mm to 50 mm per second. The heating and drying temperature can be controlled between 50 and 100°C for 1 to 5 minutes. The entire process is automatically executed by the equipment controller, achieving dry-in, dry-out operation.

[0095] Thus, a square glass substrate 8 has completed the fully automated continuous processing from loading, grinding, cleaning, drying to measurement and unloading. Throughout the process, the substrate enters the equipment in a dry state and returns to the transfer box 702 in a dry state, without the need for manual intervention.

[0096] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and all such modifications and variations fall within the scope defined by the appended claims.

Claims

1. A glass substrate processing equipment, characterized in that, include: The grinding unit (1) includes a first grinding element (101), a second grinding element (102) and a carrier (103). The first grinding element (101) and the second grinding element (102) are arranged opposite to each other and are used to grind the glass substrate (8). The carrier (103) is located between the first grinding element (101) and the second grinding element (102) and is provided with at least two carrier areas (1031) for carrying the glass substrate (8). The carrier (103) is configured to drive the glass substrate (8) it carries to rotate relative to the first grinding member (101) and the second grinding member (102) so as to achieve simultaneous grinding of both sides of at least two glass substrates (8); A cleaning unit (2) is located downstream of the grinding unit (1) and is used to clean the ground glass substrate (8). A drying unit (3) is located downstream of the cleaning unit (2) and is used to dry the cleaned glass substrate (8). The transfer unit (7) is used to transfer the glass substrate (8) between the grinding unit (1), the cleaning unit (2) and the drying unit (3).

2. The glass substrate processing equipment according to claim 1, characterized in that, The carrier (103) is a cruise ship; and / or, There are three bearing areas (1031), and the three bearing areas (1031) are evenly spaced along the circumference of the bearing member (103).

3. The glass substrate processing equipment according to claim 1, characterized in that, The bearing area (1031) is a square recessed platform formed on the bearing member (103), the recessed platform having a sunken support plane for supporting the circumferential edge of the glass substrate (8).

4. The glass substrate processing equipment according to claim 3, characterized in that, The bottom of the settling platform has an opening that extends through the thickness direction of the support member (103) so that the lower surface of the glass substrate (8) is exposed through the opening and contacts the first grinding member (101).

5. The glass substrate processing equipment according to claim 1, characterized in that, Also includes: The stabilizing unit (4) includes a plurality of support gears (401) arranged circumferentially, which mesh with the carrier (103) to support and guide the movement of the carrier (103).

6. The glass substrate processing equipment according to claim 1, characterized in that, Also includes: The drive unit includes a first drive section and a second drive section; The first driving unit is used to drive the first grinding piece (101) and the second grinding piece (102) to rotate; The second driving unit is used to drive the carrier (103) to rotate relative to the first grinding member (101) and the second grinding member (102).

7. The glass substrate processing equipment according to claim 1, characterized in that, It also includes a supply unit (107) and / or an injection unit; The supply unit (107) is used to supply polishing fluid to the polishing surfaces of the first polishing workpiece (101) and / or the second polishing workpiece (102); The spraying unit is used to spray cleaning fluid into the grinding area.

8. The glass substrate processing equipment according to claim 1, characterized in that, The transmission unit (7) includes: Storage unit for storing glass substrates to be processed and processed (8); Multiple robotic arms are used to transfer glass substrates (8) between the storage unit, the grinding unit (1), the cleaning unit (2) and the drying unit (3). A buffer unit is disposed between the grinding unit (1) and the cleaning unit (2) for temporarily storing the ground glass substrate (8) and adjusting the conveying direction.

9. The glass substrate processing equipment according to claim 1, characterized in that, The cleaning unit (2) includes a megasonic cleaning subunit (201) and a chemical cleaning subunit (202) for performing megasonic cleaning and chemical cleaning on the glass substrate (8). The megasonic cleaning subunit (201) is located upstream of the chemical cleaning subunit (202).

10. The glass substrate processing equipment according to claim 1, characterized in that, It also includes a direction conversion unit (5), which is disposed between the grinding unit (1) and the cleaning unit (2) for converting the ground glass substrate (8) from a horizontal state to a vertical state so that the glass substrate (8) enters the cleaning unit (2) vertically.

11. The glass substrate processing equipment according to claim 1, characterized in that, It also includes a detection unit (6), which is located downstream of the drying unit (3) and is used to perform appearance inspection on the dried glass substrate (8).

12. A method for processing a glass substrate based on the glass substrate processing equipment according to any one of claims 1 to 11, characterized in that, Includes the following steps: At least two glass substrates (8) are respectively placed on at least two bearing areas (1031) of the carrier (103); Drive the first grinding element (101) and the second grinding element (102) to rotate, and simultaneously drive the carrier (103) to rotate between the first grinding element (101) and the second grinding element (102), and supply grinding fluid to the grinding surface of the first grinding element (101) and / or the second grinding element (102); Remove the polished glass substrate (8) from the carrier (103); The removed glass substrate (8) is cleaned; The cleaned glass substrate (8) is dried.

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