Belt feeder, mounting device, method of mounting a connecting membrane, and program for mounting a connecting membrane

Abstract

The object is to provide a current sensor capable of appropriately implementing single piece processing of a connection film provided to a base film. A tape feeder (20) is provided with a roller unit (25) including a roller (25a) that abuts a base film (24) configured with a plurality of connection film single pieces (23) on a back surface (24b) side of a configuration surface (surface (24a)) of the base film (24) in a manner that the base film (24) is folded back at an acute angle from a first direction of travel (arrow (D1)) to a second direction of travel (arrow (D2)) with respect to the single pieces (23), and an elastic support portion (25b) that elastically supports the roller (25a) in a direction (up-down direction (arrow (D4))) that approaches / withdraws with respect to the base film (24) conveyed in the first direction of travel (arrow (D1)), and the roller unit (25) is provided in a manner that is movable in the first direction of travel (arrow (D1)).

Description

Technical Field

[0001] This invention relates to a belt feeder, an installation device, a method for installing a connecting membrane, and an installation procedure for the connecting membrane. Background Technology

[0002] The mounting of surface mount devices (SMDs) to circuit boards often involves attaching various bonding films to the circuit board. These bonding films may include conductive films such as isotropic conductive films or anisotropic conductive films (ACFs), or non-conductive films such as non-conductive films (NCFs). Furthermore, mounting devices for attaching these bonding films to circuit boards, or tape feeders and bonding film mounting methods provided within mounting devices, have been consistently developed.

[0003] For example, Patent Document 1 discloses a belt feeder for an installation device, which has a blade that folds back a base film on which multiple connecting membrane sheets are disposed from a first traveling direction to a second traveling direction, so as to be movable along the first traveling direction. The sheets disposed on the base film are adsorbed by a transfer head, transferred and attached to a circuit board.

[0004] [Prior Technology Documents] [Patent Literature] [Patent Document 1] Japanese Patent Application Publication No. 2017-50382. Summary of the Invention

[0005] [The problem the invention aims to solve] However, such a belt feeder, for example, uses a transfer head to peel the connecting film monolith from the base film, and uses the transfer head to hold and transfer the monolith to the circuit board, but there is room for further improvement in such monolith processing.

[0006] The present invention was made in view of the above circumstances, and its object is to provide a belt feeder, an installation device, a method for installing the connecting membrane, and an installation procedure for the connecting membrane that can properly realize the monolithic processing of the connecting membrane disposed on the base membrane.

[0007] [Solutions for solving the problem] To achieve the above objectives, the belt feeder for the installation apparatus of the present invention includes a roller unit comprising: a roller that abuts a base film on which a plurality of connecting film sheets are disposed, such that the base film is folded back at an acute angle from a first traveling direction to a second traveling direction against the back side of the surface on which the base film is disposed; and an elastic support portion that elastically supports the roller in a direction that approaches / separates the base film being conveyed along the first traveling direction, and the roller unit is configured to be movable along the first traveling direction.

[0008] To achieve the above objectives, the mounting apparatus of the present invention includes: a belt feeder disposed in a feeder region; a circuit board mounting section disposed in a circuit board region for mounting a circuit board; and a transfer head disposed in such a way that it can reciprocate between the feeder region and the circuit board region. The transfer head includes a pick-up section for peeling the sheet from the base film, holding it, and transferring it to the circuit board. The feeder region is located on the opposite side of the roller that holds the base film and is disposed in such a way that it can approach and be separated from the base film. The circuit board region is disposed in such a way that it can approach and be separated from the circuit board on which the sheet is attached.

[0009] To achieve the above objectives, the method for installing the connecting film of the present invention includes a conveying step, an abutment step, and a single-piece holding step. Regarding the conveying step, in the installation apparatus, a belt feeder is used to move the single-piece connecting film along a first traveling direction, moving the single-piece to a head pick-up area where a pick-up unit peels the single-piece from the base film and holds it. The installation apparatus includes the aforementioned belt feeder and a transfer head. The belt feeder has a roller unit, which includes a roller and an elastic support. The roller abuts the base film, on which multiple single-pieces are disposed, against the back side of the single-piece on the disposed surface of the base film, folding it back at an acute angle from the first traveling direction to the second traveling direction. The elastic support provides elastic support to the roller in a direction that approaches / spaces away from the base film conveyed along the first traveling direction. The roller unit is arranged to be movable along the first travel direction. The transfer head is located on the opposite side of the roller that holds the base film and is arranged to be close to and separated from the base film. It includes the pick-up portion formed in a way that can peel the sheet from the base film and hold it. Regarding the abutting process, the pick-up portion of the transfer head holds the base film and abuts against the sheet located in the head pick-up area from the opposite side of the roller. Regarding the sheet holding process, while pushing the roller toward the pick-up portion through the base film, the roller unit is moved toward the opposite side of the first travel direction and is in a state of applying tension to the base film in the second travel direction, peeling the sheet from the base film and holding the sheet in the pick-up portion.

[0010] To achieve the above objectives, the installation procedure for the connecting film of the present invention enables a computer to perform transport processing, contact processing, and single-piece holding processing. Regarding the aforementioned transport processing, in the installation apparatus, a belt feeder is used to move the single-piece connecting film along a first traveling direction, moving the single-piece to a head pick-up area where a pick-up unit peels and holds the single-piece from the base film. The installation apparatus has the aforementioned belt feeder and a transfer head. The belt feeder has a roller unit, which includes a roller and an elastic support. The roller is configured to abut against the base film, on which multiple single-piece pieces are disposed, at an acute angle from the first traveling direction to a second traveling direction. The elastic support provides elastic support to the roller in a direction that approaches / spaces away from the base film being transported along the first traveling direction. The transfer head is positioned on the opposite side of the roller that holds the base film, and is positioned so as to be close to and separated from the base film. It has a pick-up portion formed in a manner that allows the sheet to be peeled off from the base film and held. Regarding the contact process, the pick-up portion of the transfer head holds the base film and contacts the sheet located in the pick-up area of ​​the head from the opposite side of the roller. Regarding the sheet holding process, while pushing the roller toward the pick-up portion through the base film, the roller unit is moved toward the opposite side of the first travel direction and is in a state where tension is applied to the base film in the second travel direction, thus peeling the sheet off from the base film and holding the sheet in the pick-up portion.

[0011] [The effects of the invention] The belt feeder, mounting device, connecting membrane mounting method, and connecting membrane installation method involved in this invention achieve the effect of properly realizing the single-piece processing of the connecting membrane set on the base membrane. Attached Figure Description

[0012] Figure 1 This is a front view showing the general configuration of the installation device involved in the embodiment.

[0013] Figure 2 This is a diagram used to illustrate the operation of the mounting device involved in the embodiment, and it is a front view showing the periphery of the head pickup area.

[0014] Figure 3 This is a diagram used to illustrate the operation of the mounting device involved in the embodiment, and it is a front view showing the periphery of the head pickup area.

[0015] Figure 4 This is a diagram used to illustrate the operation of the mounting device involved in the embodiment, and it is a front view showing the periphery of the head pickup area.

[0016] Figure 5 This is a diagram used to illustrate the operation of the mounting device involved in the embodiment, and is a front view showing the periphery of the head pickup area and the circuit board mounting portion.

[0017] Figure 6 This is a front view showing a transfer head equipped with a stop member in a modified example of the installation device according to the embodiment. It is also a diagram used to explain the operation of the transfer head equipped with the stop member.

[0018] Figure 7 This is a side view showing a transfer head equipped with a stop member in a modified example of the installation device according to the embodiment. It is also a diagram used to explain the operation of the transfer head equipped with the stop member.

[0019] Figure 8 This is a front view illustrating the operation of the transfer head equipped with a stop member in a modified example of the installation device according to the embodiment.

[0020] Figure 9 This is a side view illustrating the operation of the transfer head equipped with a stop member in a modified example of the installation device according to the embodiment.

[0021] Figure 10 This is a front view illustrating the operation of the transfer head equipped with a stop member in a modified example of the installation device according to the embodiment.

[0022] Figure 11 This is a front view illustrating the operation of the transfer head equipped with a stop member in a modified example of the installation device according to the embodiment.

[0023] Figure 12 This is a flowchart illustrating the steps of the method for installing the connecting membrane according to the embodiment.

[0024] Figure 13 This is a diagram used to illustrate T-type peeling in peeling test methods.

[0025] Figure 14 This is a front view showing the general structure and operation of the installation device involved in the comparative example.

[0026] Figure 15 This is a front view showing the general structure and operation of the installation device involved in the comparative example. Detailed Implementation

[0027] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, the present invention is not limited to these embodiments. Furthermore, the constituent elements in the following embodiments include constituent elements that can be easily substituted by those skilled in the art or substantially the same constituent elements.

[0028] [Implementation Method] Figure 1 This diagram schematically illustrates the mounting apparatus 10. The mounting apparatus 10 of this embodiment can be applied, for example, to a mounter for mounting surface-mount components such as electronic components onto the surface of a printed circuit board (PCB). The mounting apparatus 10 includes a feeder region E1, a circuit board region E2, and a transfer head 40, which is configured to reciprocate between the feeder region E1 and the circuit board region E2. The feeder region E1 is a region where a base film 24, on which a plurality of connecting film sheets 23 are disposed, is placed in the head pickup region E3, and the sheets 23 are peeled off from the base film 24 and held by the transfer head 40. The circuit board region E2 is a region where the sheets 23 held by the transfer head 40 are transferred to a circuit board 36. The head pickup region E3 is a region where the pickup portion 41 of the transfer head 40 peels the sheets 23 from the base film and holds them (in other words, the sheets 23 are transferred to the transfer head 40).

[0029] Furthermore, in the following explanation, observe Figure 1 The upper side is considered "upper," the lower side is considered "lower," the left side is considered "left," and the right side is considered "right."

[0030] A belt feeder 20 is provided in feeder area E1. The belt feeder 20 can be detachably installed in feeder area E1 of mounting device 10. For example, the belt feeder 20 is fixed to a frame (not shown) relative to the various parts of mounting device 10 via bolts or locking mechanisms, and can be detachably installed in feeder area E1. The belt feeder 20 has: an unwinding reel 21 on which a base film 24, on which a plurality of connecting film sheets 23 are wound, is disposed; and a winding reel 22 which winds the base film 24, on which the sheets 23 have been conveyed and peeled from the unwinding reel 21. The unwinding reel 21 and the winding reel 22 each have a drive device (not shown) equipped with a drive motor or the like.

[0031] Here, the base film 24 is formed in a film form from resin materials such as PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PS (Poly Styrene), PMP (Poly-4-methylpentene-1), and PTFE (Polytetrafluoroethylene). Alternatively, the base film 24 can be suitably made from a base film for example, by peeling at least the surface 24a of the side serving as the connecting membrane monolith 23 using silicone resin.

[0032] Furthermore, surface mount components (e.g., connectors, IC (Integrated Circuit) or LSI (Large Scale Integration) packages, LEDs (Light Emitting Diodes), switches, etc.) attached to the circuit board 36 are connected to the circuit board 36 via a bonding film monolith 23 assembled by transferring the components to the circuit board 36, thereby establishing a wiring electrical connection between the surface mount components and the circuit board 36. Moreover, the surface mount components are fixed to the circuit board 36 by being connected to the circuit board 36 via the bonding film monolith 23. Such a bonding film can be, for example, simply an adhesive such as NCF, or a film such as ACF in which conductive particles are disposed in the adhesive. Furthermore, when using a reflow oven to connect the surface mount components to the circuit board 36, a solder bonding film using solder particles as conductive particles is preferred. Additionally, the adhesive of the bonding film can be thermosetting or thermoplastic.

[0033] The belt feeder 20 includes a roller unit 25 and a transfer aid 26. The roller unit 25 includes a roller 25a and an elastic support 25b. The roller 25a is provided to abut against the back surface 24b side of the surface 24a on which the individual film sheets 23 are arranged, with the base film 24 on which multiple connecting film sheets 23 are disposed, in a manner that is folded back at an acute angle from the first travel direction (arrow D1) to the second travel direction (arrow D2). The elastic support 25b provides elastic support to the roller 25a in a direction that approaches / spaces away from the base film 24 conveyed along the first travel direction (arrow D1).

[0034] Furthermore, the first direction of travel (arrow D1) is the direction in which the base film 24 is delivered from the unwinding spool 21, that is, in Figure 1 The second direction of travel (arrow D2) from left to right is the direction in which the base film 24 is wound around the winding reel 22, i.e., in... Figure 1 The direction is from the upper right to the lower left.

[0035] More specifically, roller 25a has a generally cylindrical outer surface, formed along the width direction of base film 24 (and...). Figure 1The length is (vertical to the paper surface). The roller 25a only needs to be longer than the width of the base film 24. The elastic support 25b is, for example, an elastic support 25b in the form of two-end supports: two support members 25b1 connected to both ends of the roller 25a and formed in a generally rod-like shape hanging from both ends; and a helical spring 25b2 disposed on the underside of each support member 25b1 to elastically support each support member 25b1. Alternatively, the elastic support 25b can also be an elastic support 25b in the form of a cantilever: connected only to one end of the roller 25a, with the support member 25b1 hanging from that single end, including a helical spring 25b2 to elastically support the support member 25b1. In this case, a beam member extending approximately from the lower end of the support member 25b1 toward the center of the width direction of the roller 25a may also be provided, with the helical spring 25b2 elastically supporting the beam member disposed at a position corresponding to the approximately central portion of the width direction of the roller 25a. Roller 25a is rotatably connected to support member 25b1. The upper end of helical spring 25b2 abuts against the lower end of support member 25b1, and the lower end of helical spring 25b2 abuts against pedestal member 25b3 and is supported. Roller 25a is elastically supported by two helical springs 25b2 that elastically support support member 25b1 in the direction of approach / separation relative to base film 24 (more specifically, in the up-down direction orthogonal to the first travel direction (arrow D1) and the width direction of base film 24 (arrow D4)).

[0036] The base film 24, fed from the unwinding reel 21, is wound on the roller 25a and folded back at an acute angle, passing between the two support members 25b1 of the elastic support 25b. The base film 24, folded back at an acute angle by the roller 25a, extends in the direction along the second travel direction (arrow D2) and is wound by the winding reel 22.

[0037] Furthermore, as indicated by arrow D3, the roller unit 25 is arranged to move reciprocally along the first travel direction (arrow D1) (i.e., along the left-right direction). The roller unit 25 is connected to a drive unit 25c equipped with a suitable drive mechanism. Figure 1 As shown in E4, the roller unit 25 moves within a predetermined range along the first travel direction (arrow D1).

[0038] Furthermore, when the roller unit 25 applies tension to the base film 24 in the second travel direction (arrow D2), the roller 25a can rotate while abutting against the back surface 24b of the base film 24, and simultaneously move to the opposite side of the first travel direction (arrow D1). Specifically, during the movement of the roller unit 25 to the side opposite to the first travel direction (arrow D1) (i.e., towards the unwinding reel 21), the winding reel 22 continuously winds the base film 24, so that the base film 24 between the roller 25a and the winding reel 22 can be in a taut state, i.e., under tension. In addition, during such movement of the roller unit 25, the roller 25a abuts against the back surface 24b of the base film 24, thereby rotating the roller 25a. Furthermore, the roller 25a is not connected to a drive device such as a motor, but rotates in response to the relative movement of the abutting base film 24 with respect to the roller 25a.

[0039] A transfer assist device 26 is disposed below the roller unit 25. Specifically, the transfer assist device 26 can be a blower or the like, which is a temperature regulating device capable of conveying hot air or unheated air. In this embodiment, the hot air delivered from the transfer assist device 26 is directed to the area overlapping with the roller unit's movement range E4. Therefore, the area overlapping with the roller unit's movement range E4, where hot air from the transfer assist device 26 is delivered, is temperature-regulated. Alternatively, from a heating perspective, the transfer assist device 26 can also be formed by incorporating a heater into the roller 25a of the roller unit 25.

[0040] In the circuit board region E2, a circuit board mounting portion 31 for mounting the circuit board 36 is provided. Figure 1 The image shows only the plate-shaped component at the edge of the supporting circuit board 36, but it can be formed in various shapes such as a platform.

[0041] The circuit board 36 is not particularly limited as long as it has wiring. It can be broadly defined as a printed wiring board (PWB) with electrodes capable of mounting surface mount components. It can be a rigid substrate or a flexible substrate (FPC). Examples of substrates based on the substrate type include glass substrates, ceramic substrates, and plastic substrates. Furthermore, the circuit board 36 is not subjected to a stripping process. Additionally, there are cases where pre-installed mounting components 37 are mounted on the circuit board 36.

[0042] Furthermore, in the circuit board area E2, a transfer assist device 32 is provided on the lower side of the circuit board mounting portion 31. Specifically, the transfer assist device 32 can use a temperature regulating device such as a blower with hot air or air supply functions. In this embodiment, the transfer assist device 32 can regulate the temperature around the circuit board mounting portion 31.

[0043] The transfer head 40 is connected to the drive unit 40a and can reciprocate between the feeder region E1 and the circuit board region E2. Furthermore, the transfer head 40 is positioned in the feeder region E1, opposite to the roller 25a of the roller unit 25, on the side that holds the base film 24, and is positioned such that it can approach and be separated from the base film 24. In other words, the transfer head 40 is positioned so that it can move in the vertical direction (arrow D4). Additionally, the drive unit 40c may have, for example, a multi-joint arm that can be driven by a motor or the like. In this case, the transfer head 40 is positioned at the end of the multi-joint arm and is configured to move freely in three dimensions. Alternatively, the transfer head 40 may be fixed to a mechanism such that a moving mechanism consisting of a drive motor and a guide rail can move in two directions in the planar direction and in one direction in the vertical direction. In addition, the transfer head 40 is positioned in the circuit board region E2 in a manner that allows it to approach and be spaced apart from the circuit board 36 placed on the circuit board mounting section 31 (i.e., in a manner that allows it to move in the vertical direction (arrow D4)).

[0044] The transfer head 40 includes a pick-up section 41 that peels, holds, and transfers the wafer 23 from the base film 24 to the circuit board 36. The pick-up section 41 includes silicone rubber 41s constituting the transfer holding surface 41a of the wafer 23. The peel force between the transfer holding surface 41a of the pick-up section 41 and the wafer 23 is set to be greater than the peel force between the wafer 23 and the base film 24. Conversely, the peel force between the transfer holding surface 41a of the pick-up section 41 and the wafer 23 is set to be less than the peel force between the wafer 23 and the circuit board 36.

[0045] The mounting device 10 includes a control unit 50 for controlling the transfer head 40, roller unit 25, transfer aid 26, transfer aid 32, unwinding roll 21, and winding roll 22. The control unit 50 can use a PC (personal computer) equipped with a CPU (Central Processing Unit). The control unit 50 controls the controlled object using various programs, including an installation program for the connecting film stored in a storage device (not shown).

[0046] The control unit 50 uniformly controls all parts of the mounting device 10. The control unit 50 is, for example, composed of electronic circuitry based on a well-known microcomputer including a CPU, ROM, RAM, and interface.

[0047] The control unit 50 is electrically connected to various parts of the mounting device 10, including the drive units 25c and 40a, the transfer aid 26, the transfer aid 32, the unwinding reel 21, and the winding reel 22, and can send and receive various signals with them. Furthermore, the control unit 50 is also electrically connected to various sensors installed on various parts of the mounting device 10, and can also send and receive various signals with them. Sensors such as phototubes, proximity switches, and limit switches can be used to detect the presence or absence of the base film 24 or the single sheet 23, or to detect the movement of the unwinding reel 21, the winding reel 22, and the position of the transfer head 40. The control unit 50 executes programs stored in ROM, RAM, etc., and performs various processes to control the operation of various parts of the mounting device 101 based on the detection results from the sensors.

[0048] The control unit 50 controls the transfer head 40 and the roller unit 25 via the drive devices 25c and 40a. The control unit 50 can perform the following process: positioning the transfer head 40 in the head pickup area E3, pushing the roller 25a towards the pickup section 41 through the base film 24, and moving the roller unit 25 in the opposite direction of the first travel direction (arrow D1), thereby peeling the sheet 23 from the base film 24 and holding the sheet 23 in the pickup section 41. The operation of the mounting device 10 will be specifically described below.

[0049] First, such as Figure 2 As shown, the control unit 50 operates the unwinding reel 21 and winding reel 22 of the belt feeder 20, causing the base film 24 to move along the first travel direction (arrow D1). At this time, the roller unit 25 is located further along the first travel direction (arrow D1) than the head pickup area E3. Furthermore, the transfer head 40 is located outside the head pickup area E3 (for example, not in contact with the single sheet 23, but above the head pickup area E3). The base film 24 moves along the first travel direction (arrow D1) until the single sheet 23 reaches the head pickup area E3. After the single sheet 23 reaches the head pickup area E3, the control unit 50 stops the operation of the unwinding reel 21 and winding reel 22, stopping the movement of the base film 24.

[0050] Next, as Figure 3 As shown, the control unit 50 lowers the transfer head 40, causing the transfer holding surface 41a of the pickup unit 41 to clamp the base film 24 and abut against the single piece 23 located in the head pickup area E3 from the opposite side (i.e., above) of the roller 25a.

[0051] Next, as Figure 4As shown, the control unit 50 pushes the roller 25a toward the pickup section 41 of the transfer head 40 through the base film 24 while moving the roller unit 25 to the opposite side of the first travel direction (arrow D1), and applies tension to the base film 24 in the second travel direction (arrow D2). Here, the transfer head 40 stops at the head pickup area E3 (i.e., the position where the single sheet 23 abuts against the transfer holding surface 41a of the pickup section 41). In addition, the pushing force of the roller 25a toward the pickup section 41 through the base film 24 is adjusted by controlling the stop position of the transfer head 40 in the up and down direction. The roller 25a is elastically supported, so the single sheet 23 can be pushed onto the transfer holding surface 41a with a predetermined pressure.

[0052] Furthermore, during the movement of the roller unit 25, tension is applied to the base film 24 in the second travel direction (arrow D2), i.e., the winding roll 22 is wound, thus applying tension to the base film 24 in the second travel direction (arrow D2). This allows for lamination of the sheet 23 located in the head pickup area E3 from the base film 24, transferring the sheet 23 to the transfer holding surface 41a of the pickup section 41.

[0053] Next, as Figure 5 As shown, the control unit 50 moves the transfer head 40 holding the single chip 23 to a position corresponding to the circuit board 36 placed on the circuit board mounting unit 31, for example, a position above the position where the single chip 23 is transferred and attached to the circuit board 36. Figure 5 (The position of the transfer head 40 is indicated by the double-dotted line). Subsequently, the control unit 50 lowers the transfer head 40, assembling the wafer 23 held in the pick-up section 41 of the transfer head 40 onto the circuit board 36. At this time, the transfer head 40 pushes the wafer 23 onto the circuit board 36, applying pressure for a predetermined time. After pushing the wafer 23 onto the circuit board 36 and applying pressure, the transfer head 40 rises. Thus, the wafer 23 held in the pick-up section 41 is transferred to the circuit board 36.

[0054] Here, the pick-up portion 41 of the transfer head 40, including the silicone rubber 41s, can increase the peel force with the sheet 23 by heating. Therefore, the control unit 50 can control the transfer aid 26 to adjust the temperature around the transfer head 40, making the peel force between the transfer holding surface 41a of the pick-up portion 41 and the sheet 23 variable, so that the peel force between the transfer holding surface 41a and the sheet 23 is greater than the peel force between the sheet 23 and the base film 24. Furthermore, if the peel force between the transfer holding surface 41a of the pick-up portion 41 and the sheet 23 is already set to be greater than the peel force between the sheet 23 and the base film 24, the transfer aid 26 can be omitted.

[0055] Furthermore, the pick-up portion 41 of the transfer head 40, including the silicone rubber 41s, can reduce the peeling force between the transfer holding surface 41a of the pick-up portion 41 and the substrate 23 by cooling. Additionally, depending on the type of substrate 23, the peeling force between the substrate 23 and the circuit board 36 can sometimes be increased by heating the area around the circuit board 36. Therefore, the control unit 50 can control the transfer assist device 32 to make the peeling force between the transfer holding surface 41a of the pick-up portion 41 and the substrate 23 and the peeling force between the substrate 23 and the circuit board 36 variable, so that the peeling force between the transfer holding surface 41a and the substrate 23 is smaller than the peeling force between the substrate 23 and the circuit board 36. Furthermore, if the peeling force between the transfer holding surface 41a of the pick-up portion 41 and the substrate 23 is already set to be smaller than the peeling force between the substrate 23 and the circuit board 36, the transfer assist device 32 can be omitted.

[0056] [Variation Example] Next, based on Figures 6 to 11 A variation of this embodiment will be described. In this variation, the transfer head 40 is equipped with a stop member 60. In this case, the transfer head 40 rises from the circuit board 36 while the single piece 23 is held in a state where it is adhered to both the transfer holding surface 41a of the pickup section 41 and the circuit board 36. In this situation, the circuit board 36 flexes. Then, as the single piece 23 peels off from the rising transfer holding surface 41a, the flexing of the circuit board 36 is released, resulting in the circuit board 36 shaking, and the mounting parts 37 already mounted on the circuit board 36 shifting or detaching. Therefore, by using the stop member 60 to press the circuit board 36 when the transfer head 40 rises, the flexing of the circuit board 36 can be reduced.

[0057] Specifically, such as Figure 6 and Figure 7 As shown, the stop member 60 includes: a stop member body 61, which is provided to surround the outside of the transfer head 40; a generally rectangular plate 62, which is fixed to a shaft portion 42 that is erected vertically upward from the transfer head 40 and extends horizontally; two guide shafts 63, which are provided hanging down from the plate 62; and a helical spring 64, which is provided to be wound around each guide shaft 63 and is provided between the upper surface of the stop member body 61 and the lower surface of the plate 62.

[0058] The main body 61 of the stop component has an upper panel 61a that is approximately rectangular in shape and extends horizontally in the vertical direction. On the upper panel 61a, four quadrangular prism-shaped abutment rods 61b are provided hanging from the four corners of the lower surface of the upper panel 61a. A beam component 61c is provided between each abutment rod 61b.

[0059] Each guide shaft 63 passes through the upper panel 61a and can move freely up and down relative to the upper panel 61a. A circular plate-shaped limiting member 63a is provided at the lower end of each guide shaft 63. The limiting member 63a can abut against the lower surface of the upper panel 61a, preventing the guide shaft 63 from being pulled out of the upper panel 61a. The coil spring 64 is assembled in a slightly compressed state. Figure 6 and Figure 7 In the indicated state (without force applied to the stop body 61), the limiting member 63a abuts against the lower surface of the upper panel 61a, and the stop body 61 and the plate 62 are maximally separated. In other words, the transfer head 40 is in a maximally elevated relative position to the stop body 61.

[0060] like Figure 8 , Figure 9 As shown, if the transfer head 40, equipped with the stop member 60, is lowered to transfer the single chip 23 to the circuit board 36, the lower end 61b1 of the abutment rod 61b of the stop member body 61 first abuts against the upper surface of the circuit board 36. At this time, the mounting part 37 already mounted on the circuit board 36 can be positioned between the abutment rods 61b at a predetermined distance. In other words, the retraction portion 65 provided between the abutment rods 61b, avoiding the mounting part 37, is configured such that when the stop member 60 abuts against the circuit board 36, it can avoid the mounting part 37.

[0061] After that, as Figure 10 As shown, the shaft 42 connected to the transfer head 40 descends against the force of the coil spring 64, pushing the transfer head 40 against the circuit board 36 to apply pressure to the chip 23. After a predetermined period of pressure application, as... Figure 11 As shown, the transfer head 40 is raised. When the pickup portion 41 of the transfer head 40 is separated from the single piece 23, the coil spring 64 slightly returns to its original state, but since it is in a compressed state, the stop member body 61 is exerted with downward force relative to the transfer head 40 (shaft portion 42, plate 62). Therefore, the lower end 61b1 of the abutment rod 61b remains in contact with the upper surface of the circuit board 36. Thus, when the pickup portion 41 is separated from the single piece 23, the circuit board 36 is pressed by the stop member body 61, thereby reducing the displacement or detachment of the mounting parts 37 caused by the vibration of the circuit board 36.

[0062] [Installation method for the connecting membrane] based on Figure 12 The installation method of the connecting membrane in this embodiment will be described using the flowchart shown.

[0063] Conveying process (step S10); In the mounting device 10, the connecting film sheet 23 is moved along the first traveling direction (arrow D1) by using a belt feeder 20, so that the sheet 23 is moved to the head pick-up area E3 of the pick-up part 41 to peel and hold the sheet 23 from the base film 24. The mounting device 10 has a belt feeder 20 and a transfer head 40. The belt feeder 20 has a roller unit 25, which includes a roller 25a and an elastic support part 25b. The roller 25a carries the base film 24 on which multiple sheets 23 are arranged from the first traveling direction (arrow D1) to the second traveling direction (arrow D2). The single sheet 23 is provided on the back side 24b of the arrangement surface (surface 24a) of the base film 24 in an acute angle folding manner. The elastic support 25b provides elastic support to the roller 25a in a direction that approaches / separates the base film 24 conveyed in the first travel direction (arrow D1). The roller unit 25 is provided in a manner that allows it to move along the first travel direction (arrow D1). The transfer head 40 is located on the opposite side of the roller 25a that holds the base film 24 and is provided in a manner that allows it to approach and separate from the base film 24. It includes a pick-up part 41 formed in a manner that allows the single sheet 23 to be peeled from the base film 24 and held.

[0064] The contact process (step S20) involves the pick-up section 41 of the transfer head 40 clamping the base film 24 and contacting it from the opposite side of the roller 25a with the single piece 23 located in the head pick-up area E3.

[0065] Single-piece holding process (step S30): While pushing the roller 25a toward the pickup section 41 through the base film 24, the roller unit 25 is moved to the opposite side of the first travel direction (arrow D1) and is in a state where tension is applied to the base film 24 in the second travel direction (arrow D2), and the single piece 23 is peeled off from the base film 24 and held in the pickup section 41.

[0066] The single-piece holding process (step S30) may also include the following steps: by adjusting the temperature around the transfer head 40 through the transfer aid device 26, which is set in an area that overlaps with the predetermined moving range ((roller unit moving range E4)) of the roller unit 25 moving along the first traveling direction (arrow D1), the peel force between the transfer holding surface 41a of the silicone rubber 41s constituting the single piece 23 and the single piece 23 is variable, so that the peel force between the transfer holding surface 41a and the single piece 23 is greater than the peel force between the single piece 23 and the base film 24.

[0067] Moving process (step S40): The transfer head 40 holding the single piece 23 is moved to a position corresponding to the circuit board 36 placed on the circuit board mounting section 31.

[0068] Single-chip assembly process (step S50): The single chip 23 held in the pick-up part 41 of the transfer head 40 is assembled onto the circuit board 36.

[0069] The single-piece assembly process (step S50) may also include the following process: by adjusting the temperature around the circuit board mounting portion 31 by the transfer assist device 32, the peel force between the transfer holding surface 41a of the pick-up portion 41, which includes the transfer holding surface 41a constituting the single piece 23, and the peel force between the single piece 23 and the circuit board 36 can be varied, so that the peel force between the transfer holding surface 41a and the single piece 23 is smaller than the peel force between the single piece 23 and the circuit board 36.

[0070] The installation procedure for the connecting membrane includes a conveying process (step S10) in which the control unit 50 performs a conveying process (step S20), a contact process (step S20) in which the control unit 50 performs a contact process (step S30) in which the control unit 50 performs a single-piece holding process (step S30), a movement process (step S40) in which the control unit 50 performs a movement process (step S40) in which the control unit 50 performs a single-piece assembly process (step S50).

[0071] [Peel force test] In this embodiment, the installation apparatus 10 shows the test results regarding the peeling of the base film 24 and the monolayer 23 in Table 1. Additionally, as a comparative example, in a device equipped with... Figure 14 and Figure 15 The mounting device 10A for the blade-type belt feeder 20A shown is similarly illustrated in Table 2, which shows the test results regarding the peeling of the base film 24 from the monolith 23.

[0072] The base film 24 used in each test has a peel strength of 100 mN / 5 cm, 150 mN / 5 cm, 200 mN / 5 cm, 250 mN / 5 cm, and 300 mN / 5 cm. Furthermore, the base film 24 with each peel strength is used in three thicknesses (50 μm, 38 μm, and 25 μm). Additionally, the silicone rubber used in the pickup unit 41 is tested with a peel strength of 200 mN / 5 cm for the 50 μm thick base film 24. Similarly, for the 38 μm thickness, a silicone rubber with a peel strength of 250 mN / 5 cm is used, and for the 25 μm thickness, a silicone rubber with a peel strength of 300 mN / 5 cm is used.

[0073] The peel force of the base film 24 and the peel force of the silicone rubber of the pickup part 41 are determined by a predetermined peel force test method as shown below. The materials and test conditions used in the predetermined peel force test method are as follows.

[0074] Connecting membrane: ACF (acrylic adhesive, particle density 300 pcs / mm) 2 (thickness 25 μm) Base film: PET material film Pick-up section: Silicone rubber Measurement conditions: 23±2 ℃, 65±10%RH environment In the peel force test method, the test sample is prepared by attaching a PP tape to the side of the connecting film (ACF side), which is cut into 20 cm × 5 cm widths along the ACF flow direction, and laminating it using a hand roller. Then, the sample prepared by bonding ACF to the base film or ACF to silicone rubber is tested using a tensile testing machine (Orientec Co., Ltd., model STA-1150) at a tensile speed of 300 mm / min. Figure 13 As shown, the peel force is determined by T-shaped peeling.

[0075] Here, as Figure 14 and Figure 15 As shown, the knife-edge type belt feeder 20A is provided with a knife edge 28 instead of a roller unit 25, and a transfer head, which is a vacuum adsorption type adsorption unit 70, is provided instead of a transfer head 40 of the belt feeder 20. The adsorption unit 70 includes an adsorption pad 71 as a pickup part.

[0076] The blade 28 is formed in a generally flat shape, with an acute-angled inclined surface on the underside of the end where the base film 24 is folded back. The blade 28 is positioned such that its upper surface contacts the back surface 24b of the base film 24, as shown by arrow D3, and is capable of reciprocating along the first traveling direction (arrow D1). The adsorption unit 70 is positioned such that it can move in the vertical direction (arrow D4). The peeling of the monolayer 23 from the base film 24 is performed by moving the blade 28 to the side opposite to the first traveling direction (arrow D1) when the adsorption pad 71 abuts against and adsorbs the monolayer 23. The monolayer 23 peeled from the base film 24 is adsorbed by the adsorption pad 71.

[0077] Furthermore, both this embodiment and the comparative example use a transfer aid 26, which functions as a blower, to adjust the temperature around the transfer head 40 and the adsorption unit 70. The temperature is set to ambient temperature (23°C), 40°C, and 60°C. The peeling angle is the angle θ between the first traveling direction (arrow D1) and the second traveling direction (arrow D2) (also refer to...). Figure 14 and Figure 1 The angle θ formed is 20 degrees, 25 degrees, and 30 degrees. The winding tension is the tension applied to the base film 24 in the second travel direction (arrow D2) as the roller unit 25 and the blade 28 move; it is the winding force of the winding roll 22. Winding tensions were tested at 1 N, 2 N, and 3 N. Regarding the blade 28 in the comparative example, the radius R (mm) at its end was tested at 0.5R, 1R, and 2R. The connecting film sheet 23 was tested using a 5 mm × 5 mm sheet.

[0078] As mentioned above, Table 1 shows the test results of peeling the single sheet 23 from the base film 24 by the transfer head 40 (pick-up part 41) of the embodiment (the mounting device 10 of this embodiment).

[0079] Here, the symbols in the test results indicate the following states.

[0080] 〇: Can be peeled off; △: Can be peeled off but with poor appearance; ×: Cannot be peeled off. [Table 1] (Table 1) As mentioned above, Table 2 shows the test results of the test conducted by the adsorption unit 70 of the comparative example (installation device 10A) in which the monolith 23 was peeled off from the base film 24.

[0081] Here, the symbols in the test results indicate the following states.

[0082] 〇: Can be peeled off; △: Can be peeled off but with poor appearance; ×: Cannot be peeled off; ××: Base film broken. [Table 2] (Table 2) The results of the experiment showed that, compared with the comparative example, the embodiment had a greater number of "0" marks at a blower temperature of 40°C, confirming the effectiveness of this embodiment. The installation device 10 of the embodiment yielded good results under the following conditions.

[0083] Peel force of base film 24: 100 mN / 5 cm to 250 mN / 5 cm, preferably 100 mN / 5 cm to 200 mN / 5 cm. The thickness of the base film 24 is 25 μm to 38 μm, preferably 38 μm. Blower temperature: ambient temperature (20℃) to 40℃, preferably 23℃ to 40℃. Peeling angle: 20 to 30 degrees The peel strength of the silicone rubber is 200 mN / 5 cm to 300 mN / 5 cm, preferably 250 mN / 5 cm to 300 N / 5 cm, and more preferably 300 mN / 5 cm. Furthermore, regarding the heat-induced peel force based on the transfer aid 26, the base film 24 has a peel force of 300 mN / 5 cm at 40 °C and 500 mN / 5 cm at 60 °C. The silicone rubber has a peel force of 300 mN / 5 cm at 40 °C and 400 mN / 5 cm at 60 °C.

[0084] Furthermore, Table 3 shows the results of tests conducted on the peeling of the connecting membrane monolayer 23 from the base film 24 using the transfer head 40 (silicone rubber 41s of the pickup section 41) and the adsorption unit 70. In addition, the adsorption unit 70 was tested with and without the adsorption pad 71, using a stainless steel adsorption nozzle that underwent silicone treatment. The adsorption pore size of the adsorption unit 70 was tested for φ0.8, φ1.5, and φ3.0. The air pressure of the vacuum generator of the adsorption unit 70 was tested for 0.2 MPa and 0.5 MPa. The peeling force of the silicone rubber of the pickup section 41 of the transfer head 40 was tested for 100 mN / 5 cm and 200 mN / 5 cm.

[0085] The symbols in the test results indicate the following states.

[0086] 〇: No suction marks; △: Slight suction marks, but appearance is not affected; ×: Obvious suction marks, poor appearance; ××: Vacuum failure occurred, cannot be peeled off. [Table 3] (Table 3) The test results showed that no residue remained on the single sheet 23 on the transfer head 40 of the mounting device 10 in this embodiment, which is a good result. Therefore, for picking up the single sheet 23, the silicone rubber lamination peeling method is more suitable than the vacuum adsorption method.

[0087] The belt feeder 20 described in this embodiment includes a roller unit 25, which includes: a roller 25a, which holds a base film 24 on which a plurality of connecting film sheets 23 are disposed, and is disposed at an acute angle from a first traveling direction (arrow D1) to a second traveling direction (arrow D2) against the back side 24b of the disposed surface (surface 24a) of the base film 24; and an elastic support portion 25b, which elastically supports the roller 25a in a direction that approaches / separates the base film 24 conveyed along the first traveling direction (arrow D1) (vertical direction (arrow D4)). The roller unit 25 is configured to be movable along the first traveling direction (arrow D1).

[0088] Therefore, the connecting film sheet 23 disposed on the base film 24 can be pressed from the back side 24b of the base film 24 using the roller 25a. Thus, for example, the sheet 23 can be peeled from the base film 24 according to the lamination principle by a transfer means such as the pick-up section 41 of the transfer head 40, thereby transferring the sheet 23. By peeling the sheet 23 from the base film 24 according to the lamination principle, the blocking (shrinkage) of the sheet 23 relative to the pick-up section 41 or the poor appearance of the sheet 23 can be reduced. In this way, according to the belt feeder 20, while pushing the sheet 23 to the pick-up section 41 using the roller 25a, the roller unit 25 having the roller 25a can be moved to the side opposite to the first travel direction (arrow D1), so that the sheet 23 can be well peeled from the base film 24 and held in the pick-up section 41 according to the lamination principle, thus properly realizing the processing of the connecting film sheet 23 disposed on the base film 24.

[0089] That is, in the mounting device 10A and the like involved in the comparative example, the viscosity or thickness of the ACF, the thickness of the base film, the peel force of the base film, etc., are limited to the specifications of the inherent bonding film (e.g., ACF). However, according to the belt feeder 20 of this embodiment, the single sheet 23 can be peeled from the base film 24 according to the lamination principle by moving the roller unit equipped with roller 25a, which can alleviate the need for fine adjustments of various conditions at this time and expand the range of predetermined conditions that can achieve proper peeling of the single sheet 23.

[0090] Furthermore, while the roller unit 25 applies tension to the base film 24 in the second travel direction (arrow D2), the roller 25a can rotate while abutting against the back surface 24b of the base film 24, and simultaneously move to the opposite side in the first travel direction (arrow D1). This allows for a more reliable configuration that peels the single sheet 23 from the base film 24.

[0091] Additionally, the mounting device 10 includes: a belt feeder 20 disposed in the feeder region E1; a circuit board mounting section 31 disposed in the circuit board region E2, which mounts the circuit board 36; and a transfer head 40 disposed in such a way that it can reciprocate between the feeder region E1 and the circuit board region E2. The transfer head 40 includes a pick-up section 41 that peels the monolith 23 from the base film 24, holds it, and transfers it to the circuit board 36. In the feeder region E1, it is located on the opposite side of the roller 25a that holds the base film 24 and is disposed in such a way that it can approach and be separated from the base film 24. In the circuit board region E2, it is disposed in such a way that it can approach and be separated from the circuit board 36 on which the monolith 23 is attached.

[0092] Thus, the monolith 23 is reliably peeled from the base film 24, transferred, and held in the transfer head 40. Then, the monolith 23 held in the transfer head 40 can be bonded to the circuit board 36. Therefore, the process of bonding the monolith 23 to the circuit board 36 can be properly realized by peeling the monolith 23 from the base film 24 and holding it in the transfer head 40.

[0093] Furthermore, the predetermined movement range of the roller unit 25 along the first travel direction (arrow D1) includes the head pick-up area E3 where the pick-up section 41 peels and holds the single sheet 23 from the base film 24. Thus, the roller 25a can be moved by pressing against the pick-up section 41 of the transfer head 40 across the base film 24, enabling a more reliable peeling process of the single sheet 23 from the base film 24.

[0094] Furthermore, the pickup section 41 includes silicone rubber 41s forming the transfer holding surface 41a of the single sheet 23, and the peel force between the transfer holding surface 41a and the single sheet 23 is greater than the peel force between the single sheet 23 and the base film 24. Therefore, the pickup section 41 can be constructed from silicone rubber 41s, reliably enabling the peeling of the single sheet 23 from the base film 24 and its transfer to the transfer head 40 by utilizing the difference in peel force. Moreover, when using the adsorption unit 70, it requires design that matches the nozzle diameter or nozzle material, the presence or absence of an adsorption pad, or, if using an adsorption pad, its material or shape, and the inherent connecting film (ACF, etc.). However, by including the silicone rubber 41s in the pickup section 41, the shape of the pickup section 41 can be easily prepared simply by designing it according to the width and length of the connecting film single sheet 23.

[0095] Additionally, a transfer assist device 26 is provided, which serves as a temperature control device for adjusting the temperature of the area (e.g., the head pickup area E3) overlapping with the predetermined movement range (roller unit movement range E4) of the roller unit 25 moving along the first travel direction (arrow D1). The transfer assist device 26 adjusts the temperature around the transfer head 40. As a result, the peel force of the transfer means with variable peel force (e.g., the pickup portion 41 of the transfer head 40 using silicone rubber 41s) can be adjusted by temperature adjustment, reliably making the peel force between the transfer holding surface 41a and the sheet 23 greater than the peel force between the sheet 23 and the base film 24.

[0096] Furthermore, the pickup section 41 includes silicone rubber 41s forming the transfer holding surface 41a of the monolith 23, and the peel force between the transfer holding surface 41a and the monolith 23 is smaller than the peel force between the monolith 23 and the circuit board 36. Therefore, the pickup section 41 can be formed from silicone rubber 41s, reliably enabling the peeling of the monolith 23 from the pickup section 41 and its transfer to the circuit board 36 by utilizing the difference in peel force.

[0097] Furthermore, the mounting apparatus 10 includes a transfer assist device 32, which adjusts the temperature around the circuit board mounting portion 31 to make the peel force between the transfer holding surface 41a and the single sheet 23 and the single sheet 23 and the circuit board 36 variable. This allows for adjustment of the peel force between the transfer holding surface 41a and the single sheet 23 and the single sheet 23 and the circuit board 36, reliably making the peel force between the transfer holding surface 41a and the single sheet 23 smaller than the peel force between the single sheet 23 and the circuit board 36.

[0098] Furthermore, the belt feeder 20 is detachably mounted in the feeder area E1. Therefore, the belt feeder 20 can also be mounted on existing equipment such as installers.

[0099] In addition, the transfer head 40 includes a stop member 60, which is provided in such a way that it can abut against the circuit board 36 when the pick-up section 41 is separated from the wafer 23. As a result, the wafer 23 can be transferred from the transfer head 40 to the circuit board 36 and the vibration of the circuit board 36 when the wafer 23 is peeled off from the pick-up section 41 can be reduced.

[0100] Furthermore, the stop member 60 is provided with a retraction portion 65 that avoids the mounting part 37 mounted on the circuit board 36. Therefore, the stop member 60 can also be used for circuit boards 36 pre-assembled with the mounting part 37.

[0101] Furthermore, the belt feeder, mounting device, and connecting membrane involved in the above-described embodiments of the present invention are not limited to the above-described embodiments, and various modifications can be made within the scope of the claims.

[0102] In the above description, the bonding film was described as ACF, but other bonding films can also be used. The pick-up part 41 of the transfer head 40 uses silicone rubber 41s, but other forms can also be used, such as the adsorption unit 70 with an adsorption pad 71 or an adsorption nozzle as a comparative example. In addition, the transfer assist device 26 and the transfer assist device 32 are illustrated as a blower as a temperature control device, but other devices that adjust the peeling force between the pick-up part 41 and the single sheet 23, and between the circuit board 36 and the single sheet 23 can also be used.

[0103] The belt feeder, mounting device, and connecting membrane involved in this embodiment can also be configured by appropriately combining the constituent elements of the embodiments and variations described above.

[0104] [Explanation of reference numerals in the attached figures] 10, 10A: Installation device 20, 20A: Belt feeder 23: Single chip 24: Base membrane 24a: Surface 24b: Back 25: Roller Unit 25a: Roller 25b: Elastic support section 26: Transfer Auxiliary Device 31: Circuit board mounting section 32: Transfer Auxiliary Device 36: Circuit board 37: Installing parts 40: Transfer head 41: Pick-up Department 41a: Transfer to maintain surface 50: Control Department 60: Stopping components 65: Retreat Department E1: Feeder area E2: Circuit board area E3: Head Pickup Area E4: Roller unit movement range.

Claims

1. A belt feeder comprising a roller unit, the roller unit including: A roller is used to abut against the back side of the base film on which multiple connecting film sheets are arranged, such that the sheets are folded back at an acute angle from the first traveling direction to the second traveling direction. And an elastic support portion that elastically supports the roller in a direction relative to / spaced from the base film being conveyed along the first traveling direction. The roller unit is configured to be movable along the first travel direction.

2. The belt feeder according to claim 1, wherein, When the roller unit applies tension to the base film in the second travel direction, the roller can rotate while abutting against the back side of the base film, and simultaneously move to the opposite side of the first travel direction.

3. The belt feeder according to claim 1, wherein, It has a temperature regulating device for adjusting the temperature of the area overlapping with the predetermined movement range of the roller unit along the first travel direction.

4. An installation device comprising: The belt feeder according to any one of claims 1 to 3 is disposed in the feeder area; A circuit board mounting portion is disposed in the circuit board area and mounts the circuit board; and A transfer head is configured to reciprocate between the feeder region and the circuit board region. The transfer head includes a pick-up section that peels, holds, and transfers the monolith from the base film to the circuit board. In the feeder region, it is located on the opposite side of the roller that holds the base film and is positioned such that it can be approached and spaced apart from the base film. In the circuit board region, it is positioned such that it can be approached and spaced apart from the circuit board to which the monolith is attached.

5. The installation device according to claim 4, wherein, The predetermined range of movement of the roller unit along the first travel direction includes the head pickup area where the pickup unit peels and holds the sheet from the base film.

6. The installation device according to claim 5, wherein, It includes a control unit for controlling the transfer head and the roller unit. The control unit is capable of performing the following processing: positioning the transfer head in the head pickup area, pushing the roller towards the pickup side through the base film, and moving the roller unit to the opposite side of the first travel direction, thereby peeling the single piece from the base film and keeping the single piece in the pickup.

7. The installation device according to claim 4, wherein, The pickup section includes silicone rubber constituting the transfer holding surface of the single piece. The peel force between the transfer holding surface and the single sheet is greater than the peel force between the single sheet and the base film.

8. The installation device according to claim 7, wherein, The device includes a transfer aid, which is positioned in an area overlapping with a predetermined movement range of the roller unit along the first travel direction. By adjusting the temperature around the transfer head, the peeling force between the transfer holding surface and the single sheet can be varied.

9. The installation device according to claim 4, wherein, The pickup section includes silicone rubber constituting the transfer holding surface of the single piece. The peel force between the transfer holding surface and the monolith is smaller than the peel force between the monolith and the circuit board.

10. The mounting device according to claim 9, wherein, The device includes a transfer aid, which adjusts the temperature around the circuit board mounting portion to make the peeling force between the transfer holding surface and the monolith and the peeling force between the monolith and the circuit board variable.

11. The mounting device according to claim 4, wherein, The belt feeder is detachably mounted and detached within the feeder area.

12. The installation device according to claim 4, wherein, The transfer head includes a stop component. The stop member is provided in such a way that it can abut against the circuit board when the pickup part is separated from the monolith.

13. The mounting device according to claim 12, wherein, The stop member is provided with a retraction portion that avoids mounting parts installed on the circuit board.

14. A method for installing a connecting membrane, comprising: In the conveying process, the installation device uses a belt feeder to move the connecting film sheet along a first traveling direction, moving the sheet to a pickup area where a pickup unit peels the sheet from the base film and holds it. The installation device has the belt feeder and a transfer head. The belt feeder has a roller unit, which includes a roller and an elastic support. The roller is arranged to abut the base film, on which multiple sheets are arranged, against the back side of the arrangement surface of the base film, with the sheets folded back at an acute angle from the first traveling direction to a second traveling direction. The elastic support provides elastic support to the roller in a direction that approaches / separates the base film conveyed along the first traveling direction. The roller unit is arranged to be movable along the first traveling direction. The transfer head is located on the opposite side of the roller that holds the base film, and is arranged to be able to approach and separate from the base film. It includes the pickup unit formed in a manner that allows the sheet to be peeled from the base film and held. The contacting process involves the pickup portion of the transfer head clamping the base film and contacting it from the opposite side of the roller relative to the monolith located in the pickup area of ​​the head; and In the single-piece holding process, while pushing the roller towards the pickup section through the base film, the roller unit is moved to the opposite side of the first travel direction and is in a state of applying tension to the base film in the second travel direction, thereby peeling the single piece from the base film and holding the single piece at the pickup section.

15. The method for installing the connecting membrane according to claim 14, comprising: The moving process moves the transfer head holding the single chip to a position corresponding to the circuit board placed on the circuit board mounting portion; and The single-chip assembly process assembles the single chip held in the pick-up portion of the transfer head onto the circuit board.

16. The method for installing the connecting membrane according to claim 14 or claim 15, wherein, The single-piece holding process includes the following steps: by adjusting the temperature around the transfer head through a transfer aid device located in an area overlapping with a predetermined movement range of the roller unit moving along the first travel direction, the peel force between the transfer holding surface of the pick-up portion, which includes the silicone rubber constituting the transfer holding surface of the single piece, and the single piece is variable, so that the peel force between the transfer holding surface and the single piece is greater than the peel force between the single piece and the base film.

17. The method for installing the connecting membrane according to claim 15, wherein, The single-piece assembly process includes the following steps: by adjusting the temperature around the circuit board mounting portion using a transfer aid device, the peel force between the transfer holding surface of the pickup portion (including the silicone rubber constituting the transfer holding surface of the single piece) and the single piece and the peel force between the single piece and the circuit board are made variable, so that the peel force between the transfer holding surface and the single piece is smaller than the peel force between the single piece and the circuit board.

18. An installation program for a connecting membrane, which causes a computer to perform: The conveying process, in an installation device, involves using a belt feeder to move a single sheet of connecting film along a first traveling direction, moving the sheet to a pickup area where a pickup unit peels the sheet from the base film and holds it. The installation device includes the belt feeder and a transfer head. The belt feeder has a roller unit, which includes a roller and an elastic support. The roller is configured to abut against the base film, on which a plurality of the sheets are disposed, at an acute angle from the first traveling direction to a second traveling direction. The elastic support provides elastic support to the roller in a direction that approaches / separates the base film being conveyed along the first traveling direction. The roller unit is configured to be movable along the first traveling direction. The transfer head is located on the opposite side of the roller that holds the base film, and is configured to be able to approach and separate from the base film. It has a pickup unit formed in a manner that allows the sheet to be peeled from the base film and held. The contact process involves the pickup portion of the transfer head clamping the base film and contacting it from the opposite side of the roller relative to the monolith located in the pickup area of ​​the head. as well as The single-piece holding process involves pushing the roller towards the pickup section while passing it through the base film, and moving the roller unit to the opposite side of the first travel direction, thereby applying tension to the base film in the second travel direction, and peeling the single piece from the base film to hold the single piece at the pickup section.

Images