Wafer drying apparatus and drying method

Abstract

The application discloses a wafer drying device and a drying method. The wafer drying device comprises a drying box body, a lifting mechanism, a turnover mechanism, a supporting mechanism and a spraying mechanism. The turnover mechanism comprises a sliding rail and a turnover arm, and has at least a first, a second and a third turnover angle. The third turnover angle is used for switching the wafer to a horizontal state. The supporting mechanism is arranged on the sliding rail and can move along the sliding rail under the action of the wafer. The lifting mechanism is located above the liquid level of the cleaning solution and is used for tilting and supporting and lifting the wafer upward. The lifting mechanism is provided with a supporting surface which can abut against the wafer. The movement track of the lifting mechanism is parallel to the extension direction of the sliding rail at the first turnover angle. When the wafer is switched from the first turnover angle to the second turnover angle, the wafer is obliquely abutted against the supporting surface and the supporting surface, and the wafer continuously rises under the joint action of the lifting mechanism and the supporting mechanism until the wafer is separated from the liquid level. The wafer drying process realizes the function of turning over and lifting at the same time, and the best drying effect is achieved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor integrated circuit chip manufacturing technology, and in particular relates to a wafer drying device and drying method, which uses the Marangoni effect to bring the wafer out of the liquid surface and dry the wafer. Background Technology

[0002] Chemical mechanical planarization (CMP) is a processing technique used in integrated circuit manufacturing. As technology advances, the requirements for processing techniques increase. CMP is a wet process in wafer fabrication, utilizing large amounts of polishing slurry and various chemical reagents. Therefore, at the end of the process, the wafer needs to be cleaned and dried to remove particles adhering to its surface, allowing it to proceed to the next processing step.

[0003] Existing Marangoni drying apparatus typically employs an ejector to remove the wafer from the liquid surface, while an atomized IPA (Integrated Permeable Atomizer) is positioned at the liquid interface on both sides of the wafer to create a surface tension gradient, thereby removing water adhering to the wafer surface. This method effectively reduces the possibility of water stains and particulate matter adhering to the wafer surface. However, when the ejector removes the entire wafer from the gas-liquid interface, water stains or dirt can easily accumulate at the contact point between the bottom of the wafer and the ejector mechanism, such as... Figure 22 As shown, this affects the drying quality of the wafer; generally, the cleanliness requirement for the front side of the wafer is higher than that for the back side. Process verification shows that a certain angle of tilt is beneficial to the cleanliness of the upper surface of the wafer.

[0004] In recent years, related innovations have emerged. One approach involves first using a first lifting mechanism to elevate the wafer more than halfway above the liquid surface, then using a second lifting mechanism to clamp the exposed portion and pull the wafer out of the liquid. Examples include the technical solutions disclosed in Chinese patents CN108831849A, CN114843181B, and CN211507583U. In these second lifting mechanisms, a combination of clamping and lifting mechanisms is used. This function is complex, requiring the coordination of three mechanisms. Each action must be confirmed in place (by a sensor) before the next action can begin, resulting in a relatively long overall time. Stable coordination between actions is also crucial; any disruption will lead to discontinuous wafer removal from the liquid surface, resulting in inconsistent drying. The multiple power sources for the second lifting mechanism also increase the weight of the moving parts, affecting the speed and thus the efficiency of wafer drying. The wafer clamping mechanism in the second lifting mechanism exerts a greater impact on the wafer, as shown in the technical solutions disclosed in patents CN108831849A, CN114843181B, CN211507583U, and JP2003031544A5.

[0005] The existing application cases mentioned above all use a single tilt angle or a single lifting device to lift the wafer, making it difficult to find solutions for the Marangoni phenomenon under various process media, flow rates, and concentration conditions. Summary of the Invention

[0006] To overcome the shortcomings of the prior art, the present invention provides a wafer drying apparatus and drying method, which effectively solves the problem of poor drying effect on the bottom front of the wafer.

[0007] The technical solution adopted by this invention to solve its technical problem is: a wafer drying apparatus, comprising: The drying chamber has an opening at the top and contains a cleaning solution. The lifting mechanism can be vertically raised and lowered within the drying chamber to push the wafer upwards; The flipping mechanism is located on the top of the drying chamber and includes a slide rail and a flipping arm. It has at least a first flipping angle, a second flipping angle, and a third flipping angle. The third flipping angle is used to switch the wafer rotation to a horizontal state. The support mechanism is slidably mounted on the slide rail, can move along the slide rail under the action of the wafer, and has a support surface that can abut against the wafer; The lifting mechanism is at least partially located below the support mechanism and above the surface of the cleaning solution. It is used to tilt and lift the wafer upwards, and has a support surface that can abut against the wafer. At the first flip angle, the movement trajectory of the lifting mechanism is parallel to the extension direction of the slide rail; From the first flip angle to the second flip angle, the wafer tilts and abuts against the support surface and the bearing surface, and the wafer continues to rise under the combined action of the lifting mechanism and the support mechanism until the entire wafer is removed from the liquid surface.

[0008] Furthermore, when switching from the first flip angle to the second flip angle, the diameter of the wafer below the surface of the cleaning solution is less than or equal to 1 / 4.

[0009] Furthermore, the third flip angle is greater than the second flip angle, and the second flip angle is greater than the first flip angle.

[0010] Furthermore, the first flip angle is 0-15°; the second flip angle is 1-60°.

[0011] Furthermore, the lifting mechanism includes a drive device, a track connected to the drive device, and a clamping member that is movable along the track, the track having at least a straight section and a curved section. When a portion of the clamping member moves from the curved section into the straight section, the clamping member approaches the wafer so that the supporting surface contacts the wafer.

[0012] Furthermore, the clamping member is provided with a movable part that can move within the track, the curved section is located below the straight section, and the curved section extends from the end of the straight section in a direction away from the support surface.

[0013] Furthermore, the lifting mechanism includes a middle lifting member and a side lifting member, and the side lifting member detaches from the wafer before the lifting mechanism supports the wafer.

[0014] Furthermore, it also includes a spraying mechanism for spraying drying gas onto the wafer, which is located at the top opening of the drying chamber, below the lifting mechanism.

[0015] This invention also discloses a wafer drying method, comprising the following steps: The entire wafer is immersed in the cleaning solution within the drying chamber; The lifting mechanism pushes the wafer vertically upward, causing the top of the wafer to detach from the surface of the cleaning solution. The spraying mechanism sprays drying gas onto the wafer. At this time, the flipping mechanism with the slide rail is at the first flipping angle. At this first flipping angle, the movement trajectory of the lifting mechanism is parallel to the extension direction of the slide rail. The top of the wafer contacts the support mechanism located above the surface of the cleaning solution, and moves upward with the support mechanism until the bottom of the wafer is below the surface of the cleaning solution. The lifting mechanism supports the wafer, the lifting mechanism detaches from the wafer, and the lifting mechanism drives the wafer to move upward with the cooperation of the support mechanism. At the same time, the flipping mechanism switches from the first flipping angle to the second flipping angle until the bottom of the wafer is completely removed from the surface of the cleaning solution. The flipping mechanism switches from the second flipping angle to the third flipping angle, causing the wafer to switch to a horizontal state.

[0016] Furthermore, during the switching process from the first switching angle to the second switching angle, the bottom of the wafer is completely removed from the surface of the cleaning solution; or, the switching mechanism switches from the first switching angle to the second switching angle just in time, and the bottom of the wafer is completely removed from the surface of the cleaning solution; or, after the switching mechanism switches from the first switching angle to the second switching angle, the wafer is raised at the second switching angle until the bottom of the wafer is completely removed from the surface of the cleaning solution.

[0017] Furthermore, the lifting mechanism includes a middle lifting member and a side lifting member; in the step of the lifting mechanism vertically pushing the wafer out, the middle lifting member and the side lifting member work together on the wafer; after the top of the wafer contacts the support mechanism, the side lifting member detaches from the wafer, and the middle lifting member and the support mechanism work together on the wafer; after the lifting mechanism supports the wafer, the middle lifting member detaches from the wafer.

[0018] The beneficial effects of this invention are: 1) During the wafer drying process, after the lifting mechanism pushes the wafer more than halfway out of the liquid surface, the lifting mechanism continuously extends, supports, and lifts the wafer through its curved motion, ultimately lifting the wafer out of the liquid surface. Simultaneously, the flipping mechanism, where the lifting mechanism is located, rotates and tilts the wafer, achieving the function of flipping and lifting simultaneously, thus achieving the best drying effect; 2) By setting the support mechanism and lifting mechanism on the flipping mechanism, the support mechanism and lifting mechanism can adjust their angles as the flipping mechanism rotates. Regardless of the initial flipping angle at which the lifting mechanism lifts the wafer, it can adapt to the next tilting and lifting action; 3) The lifting mechanism extends and supports the wafer from bottom to top, resulting in less impact on the wafer compared to clamping the wafer. The action is simple, and one power source achieves both actions; 4) By adjusting the angle of the flipping mechanism outside the liquid surface, the second flipping angle when the wafer exits the water can be freely configured to achieve the optimal drying angle; 5) Utilizing a rail... The straight and curved sections of the track are lifted by converting curves into straight lines. The lifting mechanism and the raising mechanism are parallel and lift upwards, reducing the motion connection process and ensuring stable motion. This makes the wafer's exit from the liquid surface smooth and controllable, thus ensuring the uniformity of the wafer surface drying effect; 6) Since the wafer tilts and leaves the liquid surface, the raising mechanism has detached from the wafer, and there will be no water stains accumulating on the front side of the wafer bottom; 7) In order to minimize the accumulation of liquid at the bottom of the wafer, the existing technology usually uses the intermediate raising component of the raising mechanism to lift the wafer upwards. The intermediate raising component is a single support structure, and it needs to accelerate the lifting before the bottom of the wafer is completely exposed from the liquid surface. This places high requirements on the intermediate raising component and shortens its service life. The present invention adopts a raising mechanism set outside the liquid surface. The raising mechanism has two grippers and is a double support structure. It does not need to solve the problem of liquid accumulation at the bottom of the wafer, and can make a smooth and continuous rise. The raising mechanism has a long service life. Attached Figure Description

[0019] Figure 1 The three-dimensional wafer drying apparatus provided by the present invention Figure 1 .

[0020] Figure 2 for Figure 1 Enlarged view of the structure at point A in the image.

[0021] Figure 3 The three-dimensional wafer drying apparatus provided by the present invention Figure 2 At this point, the top of the wafer has just come into contact with the support mechanism, and the side lifting components have not yet detached from the wafer.

[0022] Figure 4 Side view of the wafer drying apparatus provided by the present invention Figure 1 .

[0023] Figure 5This is a schematic diagram of the layout of the lifting mechanism provided by the present invention, in which the grippers are at a certain distance from the wafer.

[0024] Figure 6 The three-dimensional wafer drying apparatus provided by the present invention Figure 3 .

[0025] Figure 7 Side view of the wafer drying apparatus provided by the present invention Figure 2 .

[0026] Figure 8 This is a schematic diagram of the layout of the lifting mechanism provided by the present invention, in which the grippers support the wafer.

[0027] Figure 9 The three-dimensional wafer drying apparatus provided by the present invention Figure 4 .

[0028] Figure 10 for Figure 9 Enlarged view of the structure at point B in the image.

[0029] Figure 11 A perspective view of the lifting mechanism provided by the present invention.

[0030] Figure 12 for Figure 11 Enlarged view of the structure at point C.

[0031] Figure 13 This is an exploded structural diagram of the lifting mechanism provided by the present invention.

[0032] Figure 14 Side view of the wafer drying apparatus provided by the present invention Figure 3 .

[0033] Figure 15 This is a simplified diagram of the wafer rising at the second flip angle.

[0034] Figure 16 Side view of the wafer drying apparatus provided by the present invention Figure 4 .

[0035] Figure 17 The three-dimensional wafer drying apparatus provided by the present invention Figure 4 At this point, the wafer is in a horizontal position.

[0036] Figure 18 Side view of the wafer drying apparatus provided by the present invention Figure 5 .

[0037] Figure 19 This is a simplified side view of the wafer, drying chamber, cleaning solution, and spraying mechanism with the flipping mechanism in the first flipping angle.

[0038] Figure 20 This is a simplified side view of the wafer, drying chamber, cleaning solution, and spraying mechanism with the flipping mechanism in the second flipping angle.

[0039] Figure 21 This is a simplified diagram of a wafer being removed from a cleaning solution.

[0040] Figure 22 This is a simplified diagram illustrating how water stains easily accumulate at the bottom of a wafer when it is vertically ejected from the liquid surface by a lifting mechanism in the prior art.

[0041] Figure 23a This is a simplified diagram illustrating the spraying of drying gas onto a wafer by a spraying mechanism when the wafer is vertically ejected from the liquid surface by a lifting mechanism in the prior art.

[0042] Figure 23b A simplified diagram illustrating the spray mechanism spraying dry gas onto the front side of the wafer as it is tilted and lifted off the liquid surface.

[0043] Among them, 1-drying chamber, 11-top opening of drying chamber, 2-cleaning solution, 3-lifting mechanism, 31-middle lifting component, 32-side lifting component, 4-wafer, 5-flipping mechanism, 51-slide rail, 52-flipping arm, 521-shaft, 53-horizontal receiving platform, 54-wafer support rod, 6-support mechanism, 61-support surface, 62-support claw, 7-lifting mechanism, 71-supporting surface, 72-drive device, 73-track, 731-straight section, 732-bent section, 74-clamping component, 741-moving part, 742-part one, 743-part two, 744-clamping claw, 8-spraying mechanism. Detailed Implementation

[0044] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0045] like Figures 1-18As shown, a wafer drying apparatus includes a drying chamber 1 with an opening 11 at the top and storing a cleaning solution 2 inside; a lifting mechanism 3 that can be vertically raised and lowered within the drying chamber 1 to push a wafer 4 upward; a flipping mechanism 5, a support mechanism 6, and a lifting mechanism 7 disposed at the top of the drying chamber 1; and a spraying mechanism 8 disposed at the opening 11 at the top of the drying chamber 1 for spraying drying gas onto the wafer 4. The spraying mechanism 8 is located below the lifting mechanism 7 to ensure that drying gas can be sprayed onto the wafer 4 once the top of the wafer 4 extends beyond the surface of the cleaning solution. The drying gas can be a mixture of atomized IPA and N2 gas to ensure the effectiveness and cleanliness of the Marangoni effect at the surface of the wafer 4.

[0046] like Figure 9 , Figure 10 As shown, the flipping mechanism 5 includes a slide rail 51 and a flipping arm 52. In this embodiment, the slide rail 51 and the flipping arm 52 are connected together. The flipping arm 52 can rotate relative to the shaft 521 under the action of an external force, rotating the slide rail 51 along with it. The specific driving method is existing technology and will not be described in detail. The flipping mechanism 5 has at least a first flipping angle, a second flipping angle, and a third flipping angle. The third flipping angle is used to rotate the wafer 4 to a horizontal state. The third flipping angle is greater than the second flipping angle, and the second flipping angle is greater than the first flipping angle. The first flipping angle is 0-15°, and the second flipping angle is 1°-60°. Figure 20 In this context, α ranges from 1° to 60°, and the flip angle is explained based on the vertical plane.

[0047] The flipping mechanism 5 also includes a horizontal receiving platform 53, which is located below the slide rail 51 and is provided with a wafer support rod 54 for receiving the wafer 4. The wafer support rod 54 is vertically arranged. When the flipping arm 52 flips the support mechanism 6, the lifting mechanism 7, and the wafer 4 to the third flipping angle, the wafer 4 can be placed horizontally on the wafer support rod 54. Under the combined action of the wafer support rod 54 and the lifting mechanism 7, the wafer 4 is stably placed horizontally, waiting for the next process flow. At this time, the support mechanism 6 is disengaged from the wafer 4.

[0048] The support mechanism 6 is slidably mounted on the slide rail 51. Under its own weight, the support mechanism 6 slides down to the bottom of the slide rail 51. Under the upward ejection action of the wafer 4, the support mechanism 6 can move along the slide rail 51. The support mechanism 6 has a support surface 61 that can abut against the wafer 4. This abutment can be against the back of the wafer 4 or against the side edge of the wafer 4. In this embodiment, the support mechanism 6 forms a V-shaped support surface 61 that abuts against two side edges of the wafer 4. Specifically, the support mechanism 6 includes support claws 62 located on both sides, each of which has a support surface 61 formed on it.

[0049] Both the lifting mechanism 7 and the support mechanism 6 are located above the surface of the cleaning solution 2. At least a portion of the lifting mechanism 7 is located below the support mechanism 6. The lifting mechanism 7 is used to tilt and support the wafer 4 and lift it upward. It is provided with a support surface 71 that can abut against the wafer 4. The support surface 71 can abut only against the side of the wafer 4, or it can abut not only against the side of the wafer 4, but also against the back of the wafer 4.

[0050] Specifically, the lifting mechanism 7 includes a drive unit 72, a track 73 connected to the drive unit 72, and a clamping member 74. The drive unit 72 is connected to the tilting arm 52. The track 73 is fixed relative to the drive unit 72, and the clamping member 74 can move along the track 73. The track 73 has at least a straight section 731 and a curved section 732. The clamping member 74 includes a first part 742 and a second part 743 that are perpendicular to each other. A movable part 741 is provided on the first part 742. The movable part 741 can move within the track 73. Specifically, the movable part 741 is a roller structure. A gripper 744 is provided on the second part 743, and a supporting surface 71 is provided on the gripper 744.

[0051] like Figure 2 , Figure 5 , Figure 8 , Figure 10 , Figure 13 As shown, the track 73 has at least a straight segment 731 and a curved segment 732. The curved segment 732 is located below the straight segment 731 and extends from the end of the straight segment 731 in a direction away from the support surface 61. Figure 5 , Figure 8 As shown, the curved section 732 extends to the left from the end of the straight section 731. Therefore, when the movable part 741 on the clamping member 74 enters the straight section 731 from the curved section 732, the clamping member 74 approaches the wafer 4, specifically, the clamping member 74 moves upwards and towards the wafer 4, thereby bringing the supporting surface 71 into contact with the wafer 4. Figure 8 As shown.

[0052] The lifting mechanism 3 includes a middle lifting member 31 and a side lifting member 32. Its specific structure can be an existing structure. In the initial upward ejection stage of the wafer 4, the middle lifting member 31 and the side lifting member 32 work together at the bottom of the wafer 4. When the support mechanism 6 contacts the wafer 4 from the top, the side lifting member 32 disengages from the wafer 4, and the middle lifting member 31 continues to lift the wafer 4. The middle lifting member 31 and the support mechanism 6 form a three-point clamping state for the wafer 4.

[0053] At the first flip angle, the movement trajectory of the lifting mechanism 3 is parallel to the extension direction of the slide rail 51. In other words, if the slide rail 51 extends vertically relative to the horizontal plane, the lifting mechanism 3 pushes the wafer 4 vertically upwards. Figure 19As shown. In the initial stage, the wafer 4 is pushed upward by the combined action of the middle lifting member 31 and the side lifting member 32 of the lifting mechanism 3. When the wafer 4 rises to abut against the support surface 61 of the support mechanism 6, that is, when the top of the wafer 4 contacts the support mechanism 6, the side lifting member 32 can detach from the wafer 4, and the wafer 4 is clamped by the three points formed by the middle lifting member 31 and the support mechanism 6.

[0054] At this time, the supporting surface 71 of the lifting mechanism 7 is at a certain distance from the back side of the wafer 4, and will not interfere with the rising of the wafer 4. Figure 5 As shown.

[0055] When the bottom of wafer 4 is less than or equal to 1 / 4 of its diameter below the surface of cleaning solution 2, that is... Figure 19 In the case where S≤1 / 4D, where D is the diameter of wafer 4, when switching from the first flip angle to the second flip angle, wafer 4 is tilted and abuts against the support surface 61 and the supporting surface 71. Under the combined action of the lifting mechanism 7 and the support mechanism 6, wafer 4 continues to rise until it completely leaves the surface of the cleaning solution 2. In other words, during the rotation of the flipping mechanism 5 from the first flip angle to the second flip angle, wafer 4 continues to rise under the combined action of the lifting mechanism 7 and the support mechanism 6, achieving the purpose of flipping and rising simultaneously. Wafer 4 leaves the liquid surface during this process, or it can be that the bottom of wafer 4 just leaves the liquid surface at the exact moment the flipping mechanism 5 rotates from the first flip angle to the second flip angle. Figure 20 As shown, at this time, the lifting mechanism 7 takes over from the lifting mechanism 3 as the power source for lifting the wafer 4. The upward trajectory of the wafer 4 switches to the slide rail 51, and at the same time, the flipping mechanism 5 flips around the axis 521 to the second flipping angle. During this flipping angle switching process, the lifting mechanism 7 drives the wafer 4 and the support mechanism 6 to move along the slide rail 51. Under the combined motion of lifting and flipping, the wafer 4 is lifted off the liquid surface as a whole. Figure 21 As shown, the wafer 4 is still supported and limited by the lifting mechanism 7 and the support mechanism 6.

[0056] The Marangoni effect is influenced by a combination of factors, including surface tension, contact angle, and liquid gravity, driving wafer 4 to detach from the liquid surface at the second flip angle. Figure 15 As shown, when wafer 4 is lifted and tilted, it generates accelerations g1 and g2 in two directions, which increases the shear force between the liquid surface and wafer 4, and increases the Marangoni effect. This helps to form a greater force to peel off the liquid surface on the front side of wafer 4, thereby achieving a cleaning effect on the front side of wafer 4 and ensuring that the bottom of wafer 4 achieves the best drying effect.

[0057] Moreover, as Figure 23bAs shown, when the spraying mechanism 8 sprays drying gas onto the front side of the wafer 4, because the wafer 4 is tilted and driven off the liquid surface by the lifting mechanism 7 and the support mechanism 6, the liquid will not accumulate on the front side of the wafer 4. Figure 23a As shown, in the prior art, the intermediate lifting member 31 of the lifting mechanism 3 vertically pushes the wafer 4 upward, and the spraying mechanism 8 sprays drying gas onto the front side of the wafer 4. However, some liquid will still accumulate on the front side of the wafer 4, resulting in poor drying effect on the front side of the wafer 4. The cleanliness requirement for the front side of the wafer 4 is higher than that for the back side of the wafer 4.

[0058] Before the wafer 4 is switched to the second flip angle, the distance between the two grippers 744 of the lifting mechanism 7 is less than the diameter of the wafer 4. The support surface 71 on the gripper 744 is a certain distance from the back of the wafer 4. However, the distance between the grippers 744 is controlled to match the width of the part of the wafer 4 that is facing it. Here, matching means that when the gripper 744 is close to the wafer 4 and the wafer 4 is tilted, the support surface 71 on the gripper 744 can effectively support the wafer 4 and prevent the wafer 4 from falling off.

[0059] A wafer drying method includes the following steps: Wafer 4 was completely immersed in the cleaning solution in the drying chamber 1; The lifting mechanism 3 pushes the wafer 4 vertically upward. At this time, the middle lifting member 31 and the side lifting member 32 of the lifting mechanism 3 work together on the bottom of the wafer 4, so that the top of the wafer 4 is separated from the liquid surface of the cleaning solution 2. The spraying mechanism 8 sprays dry gas onto the wafer 4. At this time, the flipping mechanism 5 with the slide rail 51 is at the first flipping angle. At this first flipping angle, the movement trajectory of the lifting mechanism 3 is parallel to the extension direction of the slide rail 51. The top of wafer 4 contacts the support mechanism 6 located above the surface of cleaning solution 2 and moves upward with the support mechanism 6. At this time, the side lifting member 32 of the lifting mechanism 3 disengages from wafer 4, and the middle lifting member 31 and the support mechanism 6 work together on the bottom of wafer 4 until the bottom of wafer 4 is left below the surface of cleaning solution 2; specifically, the bottom of wafer 4 with a diameter less than 1 / 4 remains below the surface of cleaning solution 2. The wafer 4 continues to rise until its lateral width at the height of the lifting mechanism 7 matches the distance between the two grippers 744 of the lifting mechanism 7. The gripper 74 of the lifting mechanism 7 is controlled to move upward and towards the wafer 4, so that the grippers 744 extend forward and move upward to catch up with the two back sides of the wafer 4, so that the lifting mechanism 7 supports the wafer 4. The middle lifting member 31 disengages from the wafer 4, completing the switch between the lifting mechanism 7 and the lifting mechanism 3. The lifting mechanism 7 drives the wafer 4 to move upward with the cooperation of the support mechanism 6. At the same time, the flipping mechanism 5 switches from the first flipping angle to the second flipping angle until the bottom of the wafer 4 is completely removed from the surface of the cleaning solution 2. It should be noted that during the above process, when the flipping mechanism 5 switches from the first flipping angle to the second flipping angle, the bottom of the wafer 4 is completely removed from the surface of the cleaning solution 2; or, at the exact moment the flipping mechanism 5 switches from the first flipping angle to the second flipping angle, the bottom of the wafer 4 is also just removed from the surface of the cleaning solution 2; the main purpose is to achieve the simultaneous flipping and lifting of the wafer 4 from the liquid surface; or, after the flipping mechanism 5 switches from the first flipping angle to the second flipping angle, the wafer 4 is lifted at the second flipping angle until the bottom of the wafer 4 is completely removed from the surface of the cleaning solution 2. In other words, after the switch between the first and second flipping angles is completed, a portion of the bottom of the wafer 4 is still below the liquid surface.

[0060] The flipping mechanism 5 switches from the second flipping angle to the third flipping angle, causing the wafer 4 to switch to a horizontal state. At this time, the lifting mechanism 7 and the support mechanism 6 still work together to support the wafer 4. The wafer support rod 54 on the horizontal support platform 53 supports the back of the wafer 4. The support mechanism 6 detaches from the wafer 4, and the wafer 4 waits to be transferred to the next process.

[0061] The above specific embodiments are used to explain and illustrate the present invention, but not to limit the present invention. Any modifications and changes made to the present invention within the spirit and scope of the claims shall fall within the protection scope of the present invention.

Claims

1. A wafer drying apparatus, characterized in that: include: The drying chamber (1) has an opening (11) at the top and a cleaning solution (2) is stored inside. The lifting mechanism (3) can be vertically raised and lowered within the drying chamber (1) to push the wafer (4) upward. The flipping mechanism (5) is located on the top of the drying chamber (1) and includes a slide rail (51) and a flipping arm (52). It has at least a first flipping angle, a second flipping angle and a third flipping angle. The third flipping angle is used to rotate the wafer (4) to a horizontal state. The support mechanism (6) is slidably disposed on the slide rail (51), and can move along the slide rail (51) under the action of the wafer (4), and has a support surface (61) that can abut against the wafer (4). The lifting mechanism (7) is at least partially located below the support mechanism (6) and above the surface of the cleaning solution (2), for tilting to support and lift the wafer (4) upward, and is provided with a support surface (71) that can abut against the wafer (4). At the first flip angle, the movement trajectory of the lifting mechanism (3) is parallel to the extension direction of the slide rail (51); When the first flip angle is switched to the second flip angle, the wafer (4) is tilted against the support surface (61) and the supporting surface (71), and the wafer (4) continues to rise under the combined action of the lifting mechanism (7) and the support mechanism (6) until the wafer (4) is completely removed from the liquid surface.

2. The wafer drying apparatus according to claim 1, characterized in that: When switching from the first flip angle to the second flip angle, the diameter of the wafer (4) below the surface of the cleaning solution (2) is less than or equal to 1 / 4.

3. The wafer drying apparatus according to claim 1, characterized in that: The third flip angle is greater than the second flip angle, and the second flip angle is greater than the first flip angle.

4. The wafer drying apparatus according to claim 3, characterized in that: The first flip angle is 0-15°; the second flip angle is 1-60°.

5. The wafer drying apparatus according to claim 1, characterized in that: The lifting mechanism (7) includes a drive device (72), a track (73) connected to the drive device (72), and a clamping member (74). The clamping member (74) is movable along the track (73). The track (73) has at least a straight section (731) and a curved section (732). When a portion of the clamping member (74) moves from the curved section (732) into the straight section (731), the clamping member (74) approaches the wafer (4) so ​​that the supporting surface (71) contacts the wafer (4).

6. The wafer drying apparatus according to claim 5, characterized in that: The clamping member (74) is provided with a movable part (741) that can move within the track (73), the curved section (732) is located below the straight section (731), and the curved section (732) extends from the end of the straight section (731) in a direction away from the support surface (61).

7. The wafer drying apparatus according to claim 1, characterized in that: The lifting mechanism (3) includes a middle lifting member (31) and a side lifting member (32). Before the lifting mechanism (7) supports the wafer (4), the side lifting member (32) is removed from the wafer (4).

8. The wafer drying apparatus according to claim 1, characterized in that: It also includes a spraying mechanism (8) for spraying dry gas onto the wafer (4), which is located at the top opening (11) of the drying chamber (1) below the lifting mechanism (7).

9. A wafer drying method, characterized in that, Includes the following steps: The entire wafer is immersed in the cleaning solution within the drying chamber; The lifting mechanism pushes the wafer vertically upward, causing the top of the wafer to detach from the surface of the cleaning solution. The spraying mechanism sprays drying gas onto the wafer. At this time, the flipping mechanism with the slide rail is at the first flipping angle. At this first flipping angle, the movement trajectory of the lifting mechanism is parallel to the extension direction of the slide rail. The top of the wafer contacts the support mechanism located above the surface of the cleaning solution, and moves upward with the support mechanism until the bottom of the wafer is below the surface of the cleaning solution. The lifting mechanism supports the wafer, the lifting mechanism detaches from the wafer, and the lifting mechanism drives the wafer to move upward with the cooperation of the support mechanism. At the same time, the flipping mechanism switches from the first flipping angle to the second flipping angle until the bottom of the wafer is completely removed from the surface of the cleaning solution. The flipping mechanism switches from the second flipping angle to the third flipping angle, causing the wafer to switch to a horizontal state.

10. The wafer drying method according to claim 9, characterized in that: During the switching process from the first switching angle to the second switching angle, the bottom of the wafer is completely removed from the surface of the cleaning solution; or, the switching mechanism just switches from the first switching angle to the second switching angle, and the bottom of the wafer is completely removed from the surface of the cleaning solution; or, after the switching mechanism switches from the first switching angle to the second switching angle, the wafer is raised at the second switching angle until the bottom of the wafer is completely removed from the surface of the cleaning solution.

11. The wafer drying method according to claim 9, characterized in that: The lifting mechanism includes a middle lifting component and a side lifting component; in the step of vertically pushing the wafer out of the lifting mechanism, the middle lifting component and the side lifting component work together on the wafer; After the top of the wafer contacts the support mechanism, the side lifting component detaches from the wafer, and the middle lifting component and the support mechanism work together on the wafer; after the lifting mechanism supports the wafer, the middle lifting component detaches from the wafer.

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