A multi-spot switchable optical sensor emission module

Abstract

The application provides a multi-light-point switchable optical sensor emission module and relates to the technical field of sensors.The multi-light-point switchable optical sensor emission module comprises a shell mechanism, the shell mechanism comprises an outer shell, a heat dissipation window one is formed through the outer shell, a fixed guide groove one is formed in the inner wall of the heat dissipation window one, a wiring head assembly is connected to the bottom of the outer shell through a bottom cover, a window cover is installed on the top of the outer shell through a top cover, and an inner lining shell mechanism is arranged in the inner part of the outer shell.The sliding insertion of the heat dissipation window one of the outer shell, the wavy convex edge of the inner lining mechanism and the fixed guide groove one promotes air convection, the transverse guide groove in the inner wall of the plastic pipe of the inner lining mechanism is vertically crossed with the heat dissipation window two of the inner lining shell mechanism and cooperates with the through hole at the bottom of the plastic pipe to form a three-dimensional heat dissipation network, the heat generated by the VCSEL array chip is quickly led out, and the working life of the application is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and in particular to a multi-spot switchable optical sensor emission module. Background Technology

[0002] In metalworking environments, the heat dissipation performance of multi-spot switchable optical sensor transmitter modules is crucial. These environments typically involve high ambient temperatures, metal dust, oil mist, and coolant splashes. Poor heat dissipation can cause core components such as the VCSEL array chip to overheat, leading to decreased optical power, wavelength drift, or even permanent damage, severely impacting the accuracy and reliability of measurement or safety protection functions. Furthermore, the continuous operation of metalworking machinery requires sensor modules to operate stably for extended periods. Good heat dissipation effectively slows component aging and prevents false triggering or signal interruptions caused by heat accumulation, thus ensuring production safety and efficiency. In addition, within a compact installation space, an efficient passive cooling design reduces reliance on external cooling, improving the module's environmental adaptability and ease of maintenance.

[0003] However, in the existing technology, the multi-spot switchable optical sensor emission module often has structural defects in terms of heat dissipation. For example, the outer shell often lacks sufficient heat dissipation windows or the window design is simple, resulting in poor air convection and heat accumulation inside. At the same time, the internal heat dissipation path may only rely on a simple straight-through air duct, making it difficult to efficiently dissipate the heat generated by core heat-generating components such as VCSEL chips. This affects the stability and lifespan of the module during long-term operation and can easily lead to overheating of internal components in high-temperature and high-heat environments such as mold processing. Improvements are needed. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art. By sliding the heat dissipation window 1 of the outer shell with the wavy convex edge and the fixed guide groove 1 of the inner lining mechanism, air convection is promoted. At the same time, the transverse guide groove on the inner wall of the plastic tube of the inner lining mechanism intersects perpendicularly with the heat dissipation window 2 of the inner shell mechanism and works in conjunction with the through hole at the bottom of the plastic tube to form a three-dimensional heat dissipation network, which quickly dissipates the heat generated by the VCSEL array chip and greatly improves the working life of this invention.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a multi-spot switchable optical sensor transmitting module, comprising a housing mechanism, wherein the housing mechanism includes an outer shell, a heat dissipation window is provided through the outer shell, a fixing guide groove is provided on the inner wall of the heat dissipation window, a wiring assembly is connected to the bottom of the outer shell through a bottom cover, a window cover is installed on the top of the outer shell through a top cover, an inner liner housing mechanism is provided inside the outer shell, an inner liner mechanism is installed between the outer shell and the inner liner housing mechanism, a transmitting module body is installed inside the inner liner housing mechanism, and an inner liner frame is installed between the inner liner housing mechanism and the transmitting module body;

[0006] The inner lining mechanism includes a plastic tube with a wavy protrusion on its outer wall. The wavy protrusion is slidably inserted between the interval of the wavy protrusion and the fixed guide groove. The top of the wavy protrusion is provided with a top cover of the inner lining mechanism. The inner wall of the plastic tube is provided with a transverse guide groove. A through hole is provided on the plastic tube corresponding to the bottom of the transverse guide groove.

[0007] The inner shell mechanism includes an inner shell with a grid-shaped protrusion on the outer wall, the grid-shaped protrusion being slidably inserted into the inner wall of the plastic tube, a second heat dissipation window being provided on the inner shell, and a second fixing guide groove being provided on the inner wall of the inner shell.

[0008] The main body of the transmitting module includes circuit boards that are slidably inserted into the fixed guide grooves on both sides. The circuit boards integrate VCSEL array chips and power-connecting pins. The VCSEL array chips are provided with reflective concave mirrors.

[0009] In a preferred embodiment, the wavy convex edge is machined on the outer wall of the plastic tube using a milling cutter in a crisscross pattern.

[0010] In a preferred embodiment, the window cover includes a semi-circular cover made of transparent glass, with a fitting edge at the outer edge of the semi-circular cover, and fitting protrusions at the edge of the semi-circular cover corresponding to the fitting edge, fitting within the interval of the wavy convex edge, and a clamping edge that snaps into the port of the semi-circular cover is fixedly connected to the outer wall of the port.

[0011] In a preferred embodiment, the connector assembly includes a conduit that extends through the bottom cover. A clamp is fixedly installed on one end of the conduit inside the bottom cover, and a connector plate is installed in the middle of the clamp. The connector plate is inserted into the power pin.

[0012] In a preferred embodiment, the top cover has a through window in the middle that corresponds to the semi-circular cover.

[0013] In a preferred embodiment, the edge of the concave mirror is engaged with the port of the inner housing, and the middle port of the concave mirror is engaged with the chip of the liner mechanism of the transmitting module body.

[0014] In a preferred embodiment, the inner liner is an M-shaped plate with a circular arc in the middle, and the two ends of the inner liner are engaged at the corners of the inner shell and the second fixed guide groove.

[0015] In a preferred embodiment, the transverse guide groove and the extension direction of the second heat dissipation window are arranged perpendicular to each other.

[0016] In a preferred embodiment, the VCSEL array chip is integrated onto the extension platform of the circuit board via a soldering process, and the VCSEL array chip is directly connected to the conductive traces etched on the circuit board. The power pins are electrically connected to the power and signal terminals of the VCSEL array chip through the wire network inside the circuit board.

[0017] Compared with the prior art, the advantages and positive effects of the present invention are as follows:

[0018] 1. In this invention, the air convection is promoted by the sliding connection between the heat dissipation window 1 of the outer shell and the wavy convex edge and the fixed guide groove 1 of the inner lining mechanism. At the same time, the transverse guide groove of the inner wall of the plastic tube of the inner lining mechanism intersects perpendicularly with the heat dissipation window 2 of the inner shell mechanism and forms a three-dimensional heat dissipation network with the through hole at the bottom of the plastic tube, which quickly dissipates the heat generated by the VCSEL array chip and greatly improves the working life of this invention.

[0019] 2. In this invention, the insertion of the wavy convex edge into the first fixed guide groove, the interlocking of the grid-type convex edge into the inner wall of the plastic tube, and the elastic snap-fit ​​of the M-shaped plate of the inner liner at the corner of the inner shell and the second fixed guide groove, construct a multi-layer buffer support system, which enhances the vibration resistance and overall rigidity. Furthermore, the guiding design of the first and second fixed guide grooves ensures precise sliding insertion of the circuit board and rapid positioning of the reflective concave mirror at the port of the inner shell and the chip by snap-fit. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a multi-spot switchable optical sensor emission module proposed in this invention;

[0021] Figure 2 This invention provides a half-sectional view of an optical sensor emission module with switchable multi-spot illumination.

[0022] Figure 3 This is a schematic diagram of the housing mechanism of a multi-spot switchable optical sensor emission module proposed in this invention;

[0023] Figure 4This invention provides a schematic diagram of the structure of a window cover for a multi-spot switchable optical sensor emission module.

[0024] Figure 5 This invention provides a schematic diagram of the inner liner mechanism for a multi-spot switchable optical sensor emission module.

[0025] Figure 6 This invention provides a schematic diagram of the connection between the inner shell mechanism and the main body of a multi-spot switchable optical sensor transmitter module.

[0026] Figure 7 This invention provides a schematic diagram of the inner shell mechanism of a multi-spot switchable optical sensor emission module.

[0027] Figure 8 This invention presents a schematic diagram of the main body of a transmitter module for a multi-spot switchable optical sensor transmitter module.

[0028] Legend:

[0029] 1. Outer shell mechanism; 11. External shell; 12. Heat dissipation window 1; 13. Fixing guide groove 1;

[0030] 2. Bottom cover;

[0031] 3. Terminal assembly; 31. Conduit; 32. Clamp; 33. Connector plate;

[0032] 4. Top cover;

[0033] 5. Window cover; 51. Semi-circular cover; 52. Fitting edge; 53. Fitting protrusion; 54. Clamping edge;

[0034] 6. Inner lining mechanism; 61. Plastic tube; 62. Transverse guide groove; 63. Wavy raised edge;

[0035] 7. Inner shell liner mechanism; 71. Inner shell; 72. Second heat dissipation window; 73. Mesh-type raised edge; 74. Second fixing guide groove;

[0036] 8. Transmitter module body; 81. Circuit board; 82. VCSEL array chip; 83. Reflective concave mirror; 84. Power connection pins;

[0037] 9. Lining rack. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] Example

[0040] like Figures 1-8 As shown, the present invention provides a technical solution: a multi-spot switchable optical sensor emission module, including a housing mechanism 1, the housing mechanism 1 including an outer shell 11, a heat dissipation window 12 extending through the outer shell 11, a fixing guide groove 13 on the inner wall of the heat dissipation window 12, a wiring terminal assembly 3 connected to the bottom of the outer shell 11 via a bottom cover 2, and a window cover 5 mounted on the top of the outer shell 11 via a top cover 4. In this design, the outer shell 11 can serve as a main frame to provide mechanical support and environmental protection for the internal components, and the heat dissipation window 12 extending through... The outer housing 11 promotes air convection for passive heat dissipation. The fixed guide groove 13, located on the inner wall of the heat dissipation window 12, can be used to guide and fix other internal components. The bottom cover 2 is connected to the bottom of the outer housing 11 and the wiring assembly 3 to fix the detection and communication components. The top cover 4 is installed on the top of the outer housing 11 and fixes the window cover 5 to form a light transmission window while preventing external contaminants from entering. This design achieves basic protection of the module, efficient heat dissipation, reliable electrical connection and clear optical path output, providing basic protection for the normal operation of internal optical components.

[0041] Furthermore, the outer housing 11 is equipped with an inner housing mechanism 7, which includes an inner housing 71 with a grid-shaped protrusion 73 on its outer wall. The grid-shaped protrusion 73 is slidably inserted into the inner wall of the plastic tube 61. The inner housing 71 has a second heat dissipation window 72 and a second fixing guide groove 74 on its inner wall. In this design, the grid-shaped protrusion 73 on the outer wall of the inner housing 71 can be slidably inserted into the inner wall of the plastic tube 61, so that the inner housing mechanism 7 and the inner housing mechanism 6 can be mechanically interlocked and positioned. At the same time, the second heat dissipation window 72 on the inner housing 71 and the first heat dissipation window 12 on the outer housing 11 cooperate to form a layered heat dissipation path, which can enhance the heat exchange efficiency. The second fixing guide groove 74 on the inner wall of the inner housing 71 provides guidance and a fixed foundation for installing more internal components. This design not only strengthens the overall structural rigidity and assembly accuracy of the module, but also optimizes the internal heat dissipation channel, thereby ensuring the stability and reliability of the optical sensor emission module during long-term operation.

[0042] Furthermore, an inner liner mechanism 6 is installed between the outer shell 11 and the inner liner mechanism 7. The inner liner mechanism 6 includes a plastic tube 61 with a wavy protrusion 63 on its outer wall. The wavy protrusion 63 is machined on the outer wall of the plastic tube 61 in a crisscross pattern using a milling cutter. The intervals of the wavy protrusion 63 are slidably inserted into the fixed guide groove 13. A top cover 4 of the inner liner mechanism 6 is provided at the top of the wavy protrusion 63. A transverse guide groove 62 is provided on the inner wall of the plastic tube 61. The transverse guide groove 62 is perpendicular to the extension direction of the second heat dissipation window 72. A through hole is provided on the plastic tube 61 corresponding to the bottom of the transverse guide groove 62. In this design, the wavy protrusion 63 milled on the outer wall of the plastic tube 61 in a crisscross pattern is connected to the fixed guide groove 13 on the inner wall of the first heat dissipation window 12 on the outer shell 11. The sliding insertion position and fix the inner liner mechanism 6 inside the outer shell 11. Meanwhile, the top cover 4 of the inner liner mechanism 6 on the top of the wavy protrusion 63 provides an installation reference for the upper components. The transverse guide groove 62 on the inner wall of the plastic tube 61 and the heat dissipation window 72 of the inner shell mechanism 7 are perpendicular to each other. The two intersect to form a three-dimensional heat dissipation channel. The through hole at the bottom of the transverse guide groove 62 promotes the flow of air and heat exchange in this intersecting path. This design ensures the mechanical stability and vibration resistance of the overall module structure through the insertion of the wavy protrusion 63 and the fixed guide groove 13. The vertical intersection of the transverse guide groove 62 and the heat dissipation window 72, together with the through hole at the bottom of the plastic tube 61, greatly optimizes the multi-directional heat dissipation airflow inside the module and effectively improves the heat dissipation efficiency and long-term working stability of the core components.

[0043] Furthermore, the inner shell mechanism 7 houses the launch module body 8, and an inner frame 9 is installed between the inner shell mechanism 7 and the launch module body 8. The inner frame 9 is an M-shaped plate with an arc in the middle, and both ends of the inner frame 9 are engaged at the corners of the inner shell 71 and the second fixed guide groove 74. The launch module body 8 includes circuit boards 81 with both sides slidably inserted into the second fixed guide groove 74. The circuit boards 81 integrate VCSEL array chips 82 and power-connecting pins 84. The VCSEL array chips 82 are provided with A concave reflector 83 has its edge snapped into the port of the inner housing 71, and its middle port snapped into the chip location of the inner liner mechanism 6 of the transmitter module body 8. A VCSEL array chip 82 is integrated onto the extension platform of the circuit board 81 via a soldering process, and the VCSEL array chip 82 is directly connected to the conductive traces etched on the circuit board 81. Power pins 84 are connected to the power and signal terminals of the VCSEL array chip 82 via a wire network inside the circuit board 81. In this design, the inner liner 9, with its arc-shaped M-shaped plate at the middle, is designed to provide elastic support and stress buffering by being snapped at the corners of the inner housing 71 and the second fixed guide groove 74. The circuit board 81 of the transmitting module body 8 is fixed and aligned by sliding insertion into the second fixed guide groove 74 on both sides. The VCSEL array chip 82 integrated on the circuit board 81 is used to generate switchable multi-spot signals and completes electrical connection through the power pin 84. The reflective concave mirror 83 is set on the VCSEL array chip 82, with its edge snapped into the port of the inner housing 71 and its middle port snapped into the VCSEL array chip 82, which can ensure that the light is accurately reflected and focused. This design enhances the structural stability and impact resistance of the internal components of the module through the M-shaped structure of the inner liner 9. The sliding insertion design of the circuit board 81 simplifies the assembly process and ensures the reliability of the circuit connection. At the same time, the snap-fit ​​installation of the reflective concave mirror 83 realizes the precise positioning of the optical element, thereby optimizing the beam quality and sensor performance.

[0044] Furthermore, the connector assembly 3 includes a conduit 31 that penetrates the bottom cover 2. A clamp 32 is fixedly installed on one end of the conduit 31 inside the bottom cover 2. A connector plate 33 is installed in the middle of the clamp 32. The connector plate 33 is inserted into the power contact pin 84. In this design, the conduit 31 penetrates the bottom cover 2 to form a protective channel for external wires to enter the module. The clamp 32 is fixedly installed on the end of the conduit 31 inside the bottom cover 2 to provide stable support. The connector plate 33 is installed in the middle of the clamp 32 and achieves electrical connection by directly inserting it into the power contact pin 84, thereby transmitting external power or signals to the transmitter module body 8. This design ensures that the conduit 31 effectively protects and guides the wires. The clamp 32 firmly fixes the connector plate 33 to prevent loosening of the connection. The insertion method of the connector plate 33 and the power contact pin 84 simplifies the assembly process and establishes reliable electrical contact, ultimately ensuring the stability and durability of the module's power supply and signal transmission.

[0045] Furthermore, the window cover 5 includes a semi-circular cover 51 made of transparent glass. A through-hole window corresponding to the semi-circular cover 51 is located in the center of the top cover 4. A fitting edge 52 is located at the outer edge of the semi-circular cover 51. Fitting protrusions 53, spaced within the wavy protrusions 63, are located at the edge of the semi-circular cover 51 corresponding to the fitting edge 52. A clamping edge 54, which snaps onto the port of the outer housing 11, is fixedly connected to the outer wall of the port of the semi-circular cover 51. In this design, the semi-circular cover 51 made of transparent glass allows for efficient transmission of light generated by the emission module, and the through-hole window corresponding to the semi-circular cover 51 in the center of the top cover 4 provides precise security. The design of the fitting edge 52 and its fitting protrusion 53 at the outer edge of the semi-circular cover 51 fitting within the interval of the wavy protrusion 63 of the inner lining mechanism 6 achieves the positioning and lateral fixation of the semi-circular cover 51. At the same time, the clamping edge 54 on the outer wall of the port of the semi-circular cover 51 directly engages with the port of the outer housing 11, which can enhance the overall sealing and mechanical stability. This design ensures the firm installation of the window cover 5 and the clarity of optical transmission. The cooperation between the fitting protrusion 53 and the wavy protrusion 63 prevents component displacement and assists in dust prevention. The engagement of the clamping edge 54 with the outer housing 11 further improves the protection level and structural integrity of the module.

[0046] In this embodiment, the outer shell 11, serving as the main frame, provides a primary heat dissipation path and fixation through the sliding connection of its heat dissipation window 12 with the wavy protrusion 63 and the fixed guide groove 13 of the inner lining mechanism 6. The plastic tube 61 of the inner lining mechanism 6 forms a three-dimensional secondary heat dissipation channel by perpendicularly intersecting the heat dissipation window 72 of the inner shell mechanism 7 through the transverse guide groove 62 and the through hole at the bottom of the transverse guide groove 62. The inner shell 71 of the inner shell mechanism 7 is inserted into the inner wall of the plastic tube 61 by means of the mesh protrusion 73 and guided by the fixed guide groove 74. The circuit board 81 of the transmitter module body 8 is slidably inserted, while the inner liner 9 is clamped at the corner of the inner shell 71 and the fixed guide groove 74 with an M-shaped plate structure to provide buffer support, ensuring that the VCSEL array chip 82 and the reflective concave mirror 83 work stably and that the light is accurately reflected. The connector assembly 3's plug-in connector 33 is directly plugged into the power pin 84 to achieve electrical connection. The semi-circular cover 51 of the window cover 5 is sealed and light-transmitting by interlocking the interlocking protrusions 53 and the wavy protrusions 63 and the clamping edge 54 and being clamped to the outer shell 11.

[0047] Working principle:

[0048] like Figures 1-8 As shown, when the present invention is in use, external power and signals are first introduced through the wire tube 31 of the connector assembly 3, and then stably plugged into the power pin 84 of the transmitter module body 8 via the plug connector plate 33 fixed by the clamp plate 32, thereby powering the circuit board 81 and transmitting control commands. The VCSEL array chip 82 integrated on the circuit board 81 generates switchable multi-point light sources after being powered on. The multi-point light sources are precisely reflected and converged by the reflective concave mirror 83 to form the required optical pattern. The reflected light beam is transmitted out through the semi-circular cover 51 of the window cover 5.

[0049] The heat generated during the process is transferred from the VCSEL array chip 82 to the circuit board 81 and the inner shell mechanism 7. Then, through the vertical cross air duct formed by the heat dissipation window 2 72 on the inner shell 71 and the transverse guide groove 62 on the inner wall of the plastic tube 61, and the heat dissipation window 12 on the outer shell 11, the heat is dissipated to the outside of the module layer by layer under natural air convection.

[0050] Among them, the sliding connection between the wavy convex edge 63 and the fixed guide groove 13, the connection between the grid convex edge 73 and the inner wall of the plastic tube 61, the M-shaped elastic support of the inner liner frame 9, and the multiple fixation of the fitting protrusion 53 and the clamping edge 54 of the window cover 5 ensure the continuous stability and reliability of optical performance under vibration or temperature change environment.

[0051] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments that can be applied to other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A multi-spot switchable optical sensor emission module, characterized in that: The device includes an outer shell mechanism (1), which includes an outer shell (11). A heat dissipation window (12) is provided through the outer shell (11). A fixing guide groove (13) is provided on the inner wall of the heat dissipation window (12). A wiring terminal assembly (3) is connected to the bottom of the outer shell (11) through a bottom cover (2). A window cover (5) is installed on the top of the outer shell (11) through a top cover (4). An inner liner shell mechanism (7) is provided inside the outer shell (11). An inner liner mechanism (6) is installed between the outer shell (11) and the inner liner shell mechanism (7). A launch module body (8) is installed inside the inner liner shell mechanism (7). An inner liner frame (9) is installed between the inner liner shell mechanism (7) and the launch module body (8). The inner lining mechanism (6) includes a plastic tube (61) with a wavy protrusion (63) on its outer wall. The wavy protrusion (63) is slidably inserted between the interval of the wavy protrusion (63) and the fixed guide groove (13). The top of the wavy protrusion (63) is provided with a top cover (4) of the inner lining mechanism (6). The inner wall of the plastic tube (61) is provided with a transverse guide groove (62). A through hole is provided on the plastic tube (61) corresponding to the bottom of the transverse guide groove (62). The inner shell mechanism (7) includes an inner shell (71) with a grid-shaped protrusion (73) on the outer wall. The grid-shaped protrusion (73) is slidably inserted into the inner wall of the plastic tube (61). The inner shell (71) has a second heat dissipation window (72) and a second fixing guide groove (74) on the inner wall of the inner shell (71). The main body (8) of the transmitting module includes a circuit board (81) that is slidably inserted into the fixed guide groove (74) on both sides. The circuit board (81) integrates a VCSEL array chip (82) and power-connecting pins (84). The VCSEL array chip (82) is provided with a reflective concave mirror (83).

2. The multi-spot switchable optical sensor emission module according to claim 1, characterized in that: The wavy convex edge (63) is machined on the outer wall of the plastic tube (61) by a milling cutter in a crisscross pattern.

3. The multi-spot switchable optical sensor emission module according to claim 1, characterized in that: The window cover (5) includes a semi-circular cover (51) made of transparent glass. The outer edge of the semi-circular cover (51) is provided with a fitting edge (52). The edge of the semi-circular cover (51) corresponding to the fitting edge (52) is provided with fitting protrusions (53) that fit within the intervals of the wavy protrusions (63). The outer wall of the port of the semi-circular cover (51) is fixedly connected with a clamping edge (54) that is snapped into the port of the outer shell (11).

4. The multi-spot switchable optical sensor emission module according to claim 1, characterized in that: The connector assembly (3) includes a conduit (31) that passes through the bottom cover (2). A clamp (32) is fixedly installed on one end of the conduit (31) inside the bottom cover (2). A connector plate (33) is installed in the middle of the clamp (32). The connector plate (33) is inserted into the power connection pin (84).

5. The multi-spot switchable optical sensor emission module according to claim 1, characterized in that: The top cover (4) has a through window in the middle that corresponds to the semi-circular cover (51).

6. The multi-spot switchable optical sensor emission module according to claim 1, characterized in that: The edge of the concave mirror (83) is engaged in the port of the inner housing (71), and the middle port of the concave mirror (83) is engaged in the chip of the inner liner mechanism (6) of the transmitter module body (8).

7. The multi-spot switchable optical sensor emission module according to claim 1, characterized in that: The inner liner (9) is an M-shaped plate with a circular arc in the middle, and the two ends of the inner liner (9) are stuck at the corner of the inner shell (71) and the fixed guide groove (74).

8. The multi-spot switchable optical sensor emission module according to claim 1, characterized in that: The transverse guide groove (62) and the heat dissipation window 2 (72) are arranged perpendicular to each other in their extension directions.

9. The multi-spot switchable optical sensor emission module according to claim 1, characterized in that: The VCSEL array chip (82) is integrated on the extension platform of the circuit board (81) by a soldering process, and the VCSEL array chip (82) is directly connected to the conductive traces etched on the circuit board (81). The power pin (84) is electrically connected to the power and signal terminals of the VCSEL array chip (82) through the wire network inside the circuit board (81).

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