Scale cup structure and method for measuring glue output using the same

By designing a glue-receiving platform in the weighing cup structure to increase friction, the problem of residual glue caused by viscosity changes in the glue material during semiconductor manufacturing was solved. This improved the accuracy of glue supply measurement and the stability of the glue application process, thereby enhancing production efficiency and quality.

CN122192480APending Publication Date: 2026-06-12HORNG TERNG AUTOMATION

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HORNG TERNG AUTOMATION
Filing Date
2024-12-10
Publication Date
2026-06-12

AI Technical Summary

Technical Problem

In semiconductor manufacturing processes, variations in the viscosity of adhesive materials can lead to inaccurate adhesive dispensing, often resulting in residual adhesive and pin embedding issues. This affects the accuracy of adhesive supply calibration and the stability and consistency of subsequent adhesive application processes.

Method used

A weighing cup structure was designed, comprising a cup body and a glue-receiving platform. The glue-receiving platform has roughness to increase friction. By continuing to move the glue dispensing needle after stopping the glue supply, the friction of the glue-receiving platform is used to pull out the remaining glue, ensuring that the glue is completely removed.

Benefits of technology

It effectively reduces adhesive residue, improves the accuracy of adhesive supply measurement, enhances the stability and consistency of subsequent adhesive application processes, and improves overall production efficiency and quality.

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Abstract

The present application provides a kind of scale cup structure and the method for carrying out glue output measurement using this scale cup structure.The scale cup structure is suitable for the glue output measurement device of glue distribution equipment, to receive the glue to be measured.The scale cup structure includes a cup body and a glue receiving platform.The cup body has a receiving space.The glue receiving platform protrudes in the receiving space, wherein the top surface of the glue receiving platform is a horizontal surface and has a roughness.The friction between the glue to be measured and the top surface is greater than the friction between the glue to be measured and the inner wall of the glue needle head of the glue distribution equipment.The present application can effectively solve the problem of residual glue during glue supply, ensure complete removal of the glue and accurate attachment of the glue to the glue receiving platform, thereby improving the measurement accuracy.
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Description

Technical Field

[0001] This invention relates to a weighing cup structure and its application, particularly a weighing cup structure and a method for measuring glue dispensing using this weighing cup structure. Background Technology

[0002] Generally, adhesives used in semiconductor manufacturing processes need to be stored in a frozen environment and removed before use, allowed to warm to a suitable temperature before application. The viscosity of the adhesive changes with temperature, and adhesives of different viscosities may remain inside the nozzle, leading to variations in the amount of adhesive dispensed. Therefore, the adhesive supply must be calibrated before application, and the product manufacturing process can continue only after calibration.

[0003] Specific glue dispensing calibration is typically performed by measuring the weight of the dispensed glue. Theoretically, the expected glue dispensing rate should be achieved within a fixed dispensing time. However, variations in glue viscosity affect the flow rate, which further impacts the glue dispensing rate per unit time. Therefore, to address variations in glue material, it is usually necessary to adjust the dispensing time through gravimetric measurements to ensure the accuracy of the glue dispensing rate meets the expected requirements.

[0004] However, during adhesive supply measurement experiments, residual adhesive often remains at or around the needle outlet, and needle embedding may also occur. This residual adhesive can lead to inaccurate adhesive supply measurement results, affecting the calibration of the adhesive supply and negatively impacting subsequent adhesive application processes. Summary of the Invention

[0005] The purpose of this invention is to provide a weighing cup structure and a method for measuring glue dispensing using this weighing cup structure, so as to solve the above-mentioned problems.

[0006] To achieve the above objectives, the present invention provides a weighing cup structure suitable for the glue dispensing and measuring device of a glue application equipment, for receiving the glue to be tested. The weighing cup structure includes a cup body and a glue receiving platform. The cup body has an accommodating space. The glue receiving platform protrudes into the accommodating space, wherein the top surface of the glue receiving platform is a horizontal surface and has roughness, and the frictional force between the glue to be tested and the top surface is greater than the frictional force between the glue to be tested and the inner wall of the glue dispensing needle of the glue application equipment.

[0007] In one embodiment of the present invention, the above-mentioned scale cup structure further includes at least three support structures disposed on the bottom surface of the cup body.

[0008] To achieve the above objectives, the present invention further provides a method for measuring adhesive dispensing using the aforementioned weighing cup structure. This method includes: moving an adhesive dispensing needle along a predetermined direction from an initial position on the top surface of the adhesive receiving platform while simultaneously dispensing adhesive, until the dispensing needle reaches a predetermined position, at which point the dispensing needle stops dispensing adhesive; after stopping dispensing adhesive, the dispensing needle continues to move along the predetermined direction to an endpoint position, thereby utilizing the frictional force of the roughness of the top surface of the adhesive receiving platform to pull out any remaining adhesive at the outlet of the dispensing needle, leaving the remaining adhesive on the top surface of the adhesive receiving platform.

[0009] In one embodiment of the present invention, the speed at which the dispensing needle moves from the preset position to the endpoint position is greater than the speed at which it moves from the initial position to the preset position.

[0010] In one embodiment of the present invention, the moving speed of the dispensing needle from the initial position to the preset position and the moving speed from the preset position to the end position are both calculated based on the dispensing time of the dispensing needle, the distance between the initial position and the preset position, and the distance between the preset position and the end position.

[0011] In one embodiment of the present invention, the distance between the dispensing needle and the top surface of the dispensing platform is less than or equal to the inner diameter of the dispensing needle.

[0012] In one embodiment of the present invention, the distance between the dispensing needle and the top surface of the dispensing platform remains unchanged during the process of the dispensing needle moving from the initial position to the end position.

[0013] In one embodiment of the present invention, the direction of movement of the dispensing needle remains unchanged during the process of moving from the initial position to the end position.

[0014] In one embodiment of the present invention, the distance between the initial position and the preset position is 40% to 60% of the top surface width of the adhesive application platform.

[0015] In one embodiment of the present invention, the distance between the initial position and the preset position plus the distance between the preset position and the end position is less than the top surface width of the adhesive application platform.

[0016] As described above, the weighing cup structure and its application in the glue dispensing measurement method provided by this invention effectively solves problems such as residual glue remaining at or around the needle outlet during glue dispensing measurement, and glue embedding in the needle. By continuing to move the dispensing needle after stopping glue dispensing and using the rough friction of the glue receiving platform to pull out the residual glue at the needle outlet, the glue is ensured to be completely removed and accurately adhered to the platform. This significantly reduces the amount of residual glue, improves the accuracy of glue dispensing measurement, and thus makes the calibration of glue dispensing more precise. Therefore, the weighing cup structure and its application method of this invention help improve the stability and consistency of subsequent glue application processes, thereby improving overall production efficiency and quality. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a scale cup structure according to one embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of another angle of a scale cup structure according to one embodiment of the present invention.

[0019] Figure 3 This is a flowchart of a method for measuring glue dispensing using a weighing cup structure, according to one embodiment of the present invention.

[0020] Figures 4A to 4C A schematic diagram of the steps involved in measuring adhesive dispensing using a weighing cup structure according to one embodiment of the present invention. Detailed Implementation

[0021] To make the above and other objects, features, and advantages of the present invention more apparent and understandable, preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Furthermore, the directional terms used in this invention, such as up, down, top, bottom, front, back, left, right, inside, outside, side, surrounding, center, horizontal, transverse, vertical, longitudinal, axial, radial, uppermost, or lowermost, are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding the present invention, and not for limiting the present invention.

[0022] Please refer to the following at the same time Figure 1 and Figure 2 The weighing cup structure 1 of this embodiment is mainly used in, for example, the glue dispensing measuring device in a glue dispensing equipment. Specifically, the weighing cup structure 1 is designed to be placed on the measuring instrument of the glue dispensing measuring device to receive the glue to be tested. In this embodiment, the weighing cup structure 1 includes a cup body 11 and a glue receiving platform 12. The cup body 11 has an accommodating space 11a, and the glue receiving platform 12 protrudes from the accommodating space 11a. The top surface 121 of the glue receiving platform 12 is a horizontal surface and has roughness. In this embodiment, the frictional force between the glue to be tested and the top surface 121 of the glue receiving platform 12 is greater than the frictional force between the glue to be tested and the inner wall of the glue dispensing needle of the glue dispensing equipment.

[0023] Specifically, the top surface 121 of the adhesive receiving platform 12 can be roughened by methods such as machining, sandblasting, or chemical surface treatment. The frictional force between the adhesive to be tested and the inner wall of the dispensing needle of the adhesive application device can be calculated based on the viscosity coefficient of the adhesive to be tested. In this embodiment, the design that the frictional force between the adhesive to be tested and the top surface 121 of the adhesive receiving platform 12 is greater than the frictional force between the adhesive to be tested and the inner wall of the dispensing needle helps to smoothly pull the adhesive to be tested out of the dispensing needle and avoids adhesive residue in the dispensing needle. The specific operation method will be described in detail in the following sections. In this embodiment, the cup body 11 is a hollow cylinder design and the adhesive receiving platform 12 is a cylinder design, but this is not intended to limit the invention. In other embodiments, the adhesive receiving platform 12 may also be a square column or other structural design with a horizontal top surface.

[0024] In one embodiment, the weighing cup structure 1 further includes at least three support structures 13, which are disposed on the bottom surface of the cup body 11 and arranged, for example, around a circle, but are not limited thereto. The main function of the support structures 13 is to securely fix the weighing cup structure 1 to the platform of the dispensing measuring device through three-point positioning. In another embodiment, a protruding positioning structure 14 is provided on the outer edge of the bottom surface of the weighing cup structure 1, so that the weighing cup structure 1 can be stably positioned on the platform of the dispensing measuring device. The positioning structure 14 is arranged, for example, around a circle, and the circle around which the support structures 13 are arranged is concentric with the circle around which the positioning structure is arranged.

[0025] This invention also provides a method for measuring adhesive dispensing using the above-described weighing cup structure. Please refer to... Figure 3 , Figures 4A to 4C The method S1 includes the following steps. First, step S11 is performed, in which adhesive is supplied using a dispensing needle and moved to a preset position. Specifically, as follows... Figure 4A As shown, in this step, the dispensing needle 2, at its initial position on the top surface 121 of the adhesive receiving platform 12, moves along a preset direction D1 while simultaneously dispensing adhesive. Then, step S12 is performed to stop the adhesive dispensing. Specifically, as... Figure 4B As shown, when the dispensing needle 2 moves to the preset position, the dispensing needle 2 stops dispensing glue. Then, step S13 is performed, continuing to move the dispensing needle to the end position and pulling out the remaining glue. Specifically, as... Figure 4B and Figure 4C As shown, after the glue supply stops, the glue dispensing needle 2 continues to move along the preset direction D1 to the end position, and the residual glue remaining at the outlet of the glue dispensing needle 2 is pulled out by the friction generated by the roughness of the top surface 121 of the glue receiving platform 12, so that the residual glue is left on the top surface 121 of the glue receiving platform 12.

[0026] During the process of method S1 described above, a certain gap needs to be maintained between the dispensing needle 2 and the adhesive receiving platform 12 to ensure that the adhesive can adhere smoothly to the platform. The height of the gap depends on the viscosity coefficient of the adhesive; adhesives with higher viscosity require a larger gap to ensure smooth dispensing. In a specific example, the gap size can be designed to range from 0.2 mm to 1.5 mm.

[0027] like Figures 4A to 4C As shown, in one embodiment, the distance between the dispensing needle 2 and the top surface 121 of the adhesive receiving platform 12 remains constant as the needle moves from its initial position to its final position. That is, the dispensing needle 2 maintains the same height throughout the entire operation, ensuring stable dispensing. In another embodiment, dispensing needles 2 with different inner diameters can be selected based on different preset dispensing volumes, and the distance between the dispensing needle 2 and the top surface 121 of the adhesive receiving platform 12 is less than or equal to the inner diameter of the dispensing needle 2. This also contributes to stable control of the dispensing volume.

[0028] In another embodiment, the dispensing needle 2 maintains the same direction of movement as it moves from the initial position to the final position. That is, even after the glue supply stops, the dispensing needle 2 continues to move in the same direction as during the glue supply process, moving along the preset direction D1. This design helps to utilize the friction of the top surface 121 of the glue receiving platform 12 to pull out any residual glue at the outlet of the dispensing needle 2, preventing glue from accumulating inside the needle or at the outlet, thereby ensuring the accuracy of each operation. Figure 4C As shown, after the dispensing needle 2 moves to the end position, the thickness (or height) of the adhesive tail end of the dispensing needle 2 is small. This is because the adhesive supply has stopped, and as the dispensing needle 2 continues to move, the adhesive accumulated at the needle outlet is pulled out, avoiding adhesive residue.

[0029] In one embodiment, the speed at which the dispensing needle 2 moves from a preset position to a destination position is greater than its speed from an initial position to the preset position. That is, the speed at which the dispensing needle 2 moves after dispensing glue stops is greater than its speed during the glue dispensing process, thus helping to pull the glue out of the dispensing needle 2. In the design of the operation flow, the speed at which the dispensing needle 2 moves from the initial position to the preset position, and the speed at which it moves from the preset position to the destination position, are calculated based on the glue dispensing time of the dispensing needle 2, the distance between the initial position and the preset position, and the distance between the preset position and the destination position.

[0030] In method S1 of this embodiment, the initial position, preset position, and end position of the dispensing needle 2 can be designed according to requirements. The distance between the initial position and the preset position plus the distance between the preset position and the end position should be designed to be less than the width of the top surface 121 of the dispensing platform 12 to prevent the dispensing needle 2 from moving beyond the range of the top surface 121. In this embodiment, the dispensing platform 12 is cylindrical, so the "width" of the top surface 121 of the dispensing platform 12 refers to its diameter; when the dispensing platform 12 is of other shapes, the "width" can be defined as the extension distance of the top surface 121 of the dispensing platform 12 in the preset direction D1. In a specific embodiment, the distance between the initial position and the preset position is designed to be 40% to 60% of the width of the top surface 121 of the dispensing platform 12. In other words, in step S11, the glue supply distance of the dispensing needle 2 is 40% to 60% of the width of the top surface 121 of the receiving platform 12. This ensures that after the dispensing needle 2 stops supplying glue, the top surface 121 of the receiving platform 12 still has sufficient length to allow the dispensing needle 2 to continue moving and leave any remaining glue on the top surface 121 of the receiving platform 12, effectively preventing glue residue from remaining inside the needle. Furthermore, since the distance between the initial position and the end position is limited by the width of the top surface 121 of the receiving platform 12, when a larger glue dispensing volume is required, the moving speed of the dispensing needle 2 should be slowed down to extend the glue supply time (i.e., increase the glue supply seconds) to ensure that the glue dispensing volume meets the predetermined requirements.

[0031] As can be seen from the embodiments of the present invention described above, the weighing cup structure provided by the present invention and its application in the glue dispensing measurement method can effectively solve problems such as residual glue remaining at or around the needle outlet during glue dispensing measurement, and glue embedding in the needle. By continuing to move the dispensing needle after stopping glue dispensing and using the rough friction of the glue receiving platform to pull out the residual glue remaining at the needle outlet, the glue is ensured to be completely removed and accurately adhered to the platform. This can significantly reduce the amount of residual glue, improve the accuracy of glue dispensing measurement, and thus make the calibration of glue dispensing more precise. Therefore, the weighing cup structure of the present invention and its application method help improve the stability and consistency of subsequent glue application processes, thereby improving overall production efficiency and quality.

[0032] Although the present invention has been disclosed with reference to preferred embodiments, it is not intended to limit the invention. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A weighing cup structure, suitable for a glue dispensing measurement device in glue application equipment, for receiving and measuring glue, characterized in that... The scale cup structure includes: The cup body has a storage space; and A glue-receiving platform protrudes from the accommodating space, wherein the top surface of the glue-receiving platform is a horizontal surface and has roughness, and the frictional force between the glue to be tested and the top surface is greater than the frictional force between the glue to be tested and the inner wall of the glue dispensing needle of the glue application device.

2. The scale cup structure as described in claim 1, characterized in that... The scale cup structure also includes at least three support structures disposed on the bottom surface of the cup body.

3. A method for measuring glue dispensing using the weighing cup structure as described in claim 1 or 2, characterized in that... The method includes: The dispensing needle is used to move along a preset direction from an initial position on the top surface of the adhesive receiving platform while simultaneously dispensing adhesive, until the dispensing needle moves to a preset position, at which point the dispensing needle stops dispensing adhesive. After the glue supply stops, the glue dispensing needle continues to move along the preset direction to an end position, so as to use the friction force of the roughness of the top surface of the glue receiving platform to pull out the residual glue at the outlet of the glue dispensing needle, so that the residual glue is left on the top surface of the glue receiving platform.

4. The method as described in claim 3, characterized in that... The speed at which the dispensing needle moves from the preset position to the endpoint position is greater than the speed at which it moves from the initial position to the preset position.

5. The method as described in claim 3, characterized in that... The moving speed of the dispensing needle from the initial position to the preset position and the moving speed from the preset position to the end position are both calculated based on the dispensing time of the dispensing needle, the distance between the initial position and the preset position, and the distance between the preset position and the end position.

6. The method as described in claim 3, characterized in that... The distance between the dispensing needle and the top surface of the adhesive receiving platform is less than or equal to the inner diameter of the dispensing needle.

7. The method as described in claim 3, characterized in that... During the process of the dispensing needle moving from the initial position to the final position, the distance between it and the top surface of the dispensing platform remains unchanged.

8. The method as described in claim 3, characterized in that The direction of the dispensing needle remains unchanged as it moves from the initial position to the final position.

9. The method as described in claim 3, characterized in that... The distance between the initial position and the preset position is 40% to 60% of the top surface width of the adhesive application platform.

10. The method as described in claim 3, characterized in that... The distance between the initial position and the preset position plus the distance between the preset position and the end position is less than the top width of the adhesive application platform.