Gripping device for sheet elements, related systems and methods
By designing a gripping device suitable for sheet elements, and using a rod and a reset mechanism to bend the sheet elements, the problem of gripping and placing sheet elements in the prior art is solved, achieving precise positioning and avoiding resin contact.
Patent Information
- Application Number
- CN202480073193.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-11-22
- Filing Date
- 2024-11-20
- Publication Date
- 2026-06-12
AI Technical Summary
Existing technologies are difficult to effectively grip and place sheet components, especially carbon fiber-containing chips, and are prone to pulling up multiple components when lifting components at the top of the stack. Furthermore, the suction cup device may malfunction due to contact with liquid resin.
A gripping device is designed, including a support and a gripping mechanism. A movable rod and a reset mechanism are used to bend the sheet element, which contacts the sheet element through a suction cup or adhesive part. The bending action of the rod ensures that only one element is gripped, avoiding contact with the resin.
It achieves precise positioning and placement of thin-film components, avoiding malfunctions caused by simultaneous gripping of multiple components and contact between the suction cup and resin, and is adaptable to thin-film components with different mechanical properties.