Intelligent design and stress analysis method and system for connecting node of new and old envelope structure
By establishing a three-dimensional finite element model and optimizing the layout of connecting components, combined with stress flow field control and energy dissipation technology, the scientific and precise design of the connection nodes between the new and old enclosure structures was solved, improving the load-bearing capacity and crack resistance, and meeting engineering requirements.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ARCHITECTURAL DESIGN & RES INST OF TSINGHUA UNIV
- Filing Date
- 2026-04-24
- Publication Date
- 2026-06-16
AI Technical Summary
Traditional design of connection nodes between new and old building envelopes relies on experience, lacks scientific rigor and precision, and is difficult to meet actual engineering needs. Furthermore, the load-bearing capacity and crack resistance of the connection nodes are insufficient.
By collecting stress analysis data, a three-dimensional finite element model is established, the stiffness distribution of nodes is calculated, the arrangement angle and spacing of connecting components are optimized, stress flow field control technology and stress wave energy dissipation technology are adopted to construct a multi-layer protective structure, control crack propagation, and output a detailed design scheme.
It improves the design accuracy and scientific nature of connection nodes, enhances load-bearing capacity and crack resistance, extends structural life, reduces maintenance costs, and improves construction quality and project benefits.
Smart Images
Figure CN122221601A_ABST