LED display device and method of manufacturing the same
By adopting a single-layer wiring design and rearranging the pin order in LED display devices, the problem of requiring two layers of wiring on the substrate is solved, thereby reducing costs and expanding the selection of substrate materials.
Patent Information
- Application Number
- CN202411806483.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2026-06-16
AI Technical Summary
Existing LED display devices require at least two layers of traces on the substrate, which increases the difficulty and cost of the process and limits the choice of substrate materials.
A single-layer wiring design is adopted, which avoids driver trace crossing through internal connections or equivalent connections of the driver chip. Package bonding wires or package redistribution layers are used to achieve internal connections of the chip, and the pin order is rearranged to reuse common pins.
This reduces the difficulty of process implementation, lowers product costs, and expands the range of substrate materials that can be selected.
Smart Images
Figure CN122227749A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of display technology, and more specifically, to an LED display device and its manufacturing method. Background Technology
[0002] Light-emitting diode (LED) display technology is widely used in various devices such as televisions, computer monitors, and advertising screens. Its basic principle is to display the desired image or video by controlling the brightness of each LED in an LED array. During the display process, current drivers are needed to control the current flowing through the LEDs to achieve precise control of LED brightness. As the size of the LED matrix increases, the number of current drivers required also increases, which not only increases cost but also design complexity. Related technologies use a shared column driver circuit to drive multiple LEDs and row drivers to time-division switch between different LED strings, thereby significantly reducing the number of driver power supplies required.
[0003] However, since row and column drives are scanned separately, the traces of either row or column drives will have a considerable degree of overlap, requiring LED chips to use at least two layers of traces. On the one hand, having at least two layers of traces on the substrate material increases the difficulty of process implementation and raises product costs. On the other hand, it limits the choice of substrate material, as not all substrate materials can support two layers of wiring. Summary of the Invention
[0004] In view of the above problems, the purpose of this invention is to provide an LED display device and a method for manufacturing the same.
[0005] According to a first aspect of the present invention, an LED display device is provided, comprising: a substrate for carrying an LED chip, the substrate including a first surface and a second surface, the LED chip being located on the first surface; a driver chip located on the first surface of the substrate; and a plurality of drive traces located on the first surface of the substrate for connecting the driver chip and the LED chip, the plurality of drive traces not intersecting each other; wherein the driver chip includes a plurality of first pins and a plurality of pin groups, wherein each pin group includes a plurality of second pins, wherein the second pins of the same driver in the plurality of pin groups are connected or equivalently connected inside the chip; and the LED chip includes one or more LED beads, the LED beads being connected to the first pins and the second pins respectively via the plurality of drive traces.
[0006] Optionally, the driver chip includes multiple driver switches, each driver switch being connected to the second pin of a corresponding driver in multiple pin groups to achieve internal connection.
[0007] Optionally, the second pin of the same driver in the plurality of pin groups is connected to the corresponding driver switch through a package bonding wire, a package redistribution layer, or a chip metal connection layer.
[0008] Optionally, the driver chip further includes multiple driver switches, with multiple second pins connected one-to-one with the driver switches, and the second pins of the same driver in the multiple pin groups using the same driver control signal to control the driver switches.
[0009] Optionally, the second pins of adjacent pin groups are arranged in reverse order, and adjacent pin groups reuse one second pin as a common pin of the adjacent pin groups.
[0010] Optionally, the LED beads and the driver chip can be connected in a common cathode or common anode manner.
[0011] Optionally, the first pin is a column driver pin and the second pin is a row driver pin; or, the first pin is a row driver pin and the second pin is a column driver pin.
[0012] According to another aspect of the present invention, a method for manufacturing an LED display device is provided, comprising: forming an LED chip and a driver chip on a first surface of a substrate; forming a plurality of driving traces on the first surface of the substrate, the driving traces being used to connect the driver chip and the LED chip, the plurality of driving traces not intersecting each other; wherein the driver chip includes a plurality of first pins and a plurality of pin groups, wherein each pin group includes a plurality of second pins, wherein the second pins of the same driver in the plurality of pin groups are connected or equivalently connected inside the chip; the LED chip includes one or more LED beads, the LED beads being connected to the first pins and second pins respectively via the plurality of driving traces.
[0013] Optionally, the driver chip includes multiple driver switches, each driver switch being connected to the second pin of a corresponding driver in multiple pin groups to achieve internal connection or equivalent connection.
[0014] Optionally, the second pin of the same driver in the plurality of pin groups is connected to the corresponding driver switch through a package bonding wire, a package redistribution layer, or a chip metal connection layer.
[0015] Optionally, the driver chip further includes multiple driver switches, with multiple second pins connected one-to-one with the driver switches, and the second pins of the same driver in the multiple pin groups using the same driver control signal to control the driver switches.
[0016] Optionally, the second pins of adjacent pin groups are arranged in reverse order, and adjacent pin groups reuse one second pin as a common pin of the adjacent pin groups.
[0017] According to an embodiment of the present invention, an LED display device and its fabrication method include a substrate, an LED chip, a driver chip, and multiple driver traces located on the substrate. The LED chip is connected to the driver chip via the multiple driver traces, and the multiple driver traces do not intersect each other. The driver chip includes multiple first pins and multiple pin groups, wherein each pin group includes multiple second pins, and the second pins of the same driver in the multiple pin groups are connected internally or equivalently connected within the chip. The LED chip includes one or more LED beads, and the LED beads are connected to the first pins and second pins respectively via the multiple driver traces. This application allows for single-layer wiring on the substrate, reducing the difficulty of process implementation and increasing product cost. Because single-layer wiring can be performed on the substrate, the range of substrate materials that can be selected can be expanded.
[0018] Furthermore, the internal connections of the chip can be achieved by using package bonding wires, package redistribution layers (RDL layers), or chip metal interconnects to connect to the corresponding driver switches.
[0019] Furthermore, the row driving circuit includes multiple driving switches, wherein multiple second pins are connected one-to-one with the driving switches, and the second pins of the same driving in the multiple pin groups are controlled by the same driving control signal to control the driving switches, and the second pins of the same driving in the multiple pin groups are connected or equivalently connected inside the chip.
[0020] Furthermore, rearranging the pin order so that the second pins of adjacent pin groups are arranged in reverse order, and adjacent pin groups reuse a second pin as a common pin of adjacent pin groups, can greatly reduce the number of pins, thereby reducing the number of peripheral drive traces. Attached Figure Description
[0021] The above and other objects, features and advantages of the present invention will become more apparent from the following description of embodiments of the invention with reference to the accompanying drawings, in which:
[0022] Figure 1 This diagram shows a circuit schematic of an LED display device in the prior art;
[0023] Figure 2 This diagram illustrates a PCB wiring diagram for an LED display device in the prior art.
[0024] Figure 3 This diagram illustrates another PCB wiring scheme for LED display devices in the prior art.
[0025] Figure 4 This diagram shows a circuit schematic of an LED display device provided in an embodiment of the present invention.
[0026] Figure 5This diagram illustrates the structure of a drive line according to an embodiment of the present invention.
[0027] Figure 6 This diagram illustrates another driving line structure provided by an embodiment of the present invention.
[0028] Figure 7 This diagram illustrates another driving line structure provided by an embodiment of the present invention.
[0029] Figure 8 This diagram shows a circuit schematic of another LED display device provided in an embodiment of the present invention;
[0030] Figure 9 A block diagram of a row driving circuit provided in an embodiment of the present invention is shown. Detailed Implementation
[0031] Various embodiments of the invention will now be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are indicated by the same or similar reference numerals. For clarity, the various parts in the drawings are not drawn to scale.
[0032] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples.
[0033] In related technologies, see Figure 1 The LED display device 100 includes an LED array 110, a row driving circuit 120, and a column driving circuit 130. The LED array 110 includes multiple LED strings arranged in rows and columns to form a matrix. The anodes of LED strings in the same row are connected to the same row driving power supply through corresponding row driving lines, and each row driving line is connected to the power supply via a corresponding row driving switch (S1-Sn). The cathodes of LED strings in the same column are connected to ground through corresponding column driving lines, and each column driving line is connected to ground via a corresponding column power supply. The LED display device 100 shares the same column driving circuit with multiple LED strings, and drives different LED strings in a time-division manner by controlling the on and off states of the row driving switches, which can greatly reduce the number of driving power supplies. When n row driving switches are turned on sequentially, the LED strings in each row, in conjunction with the column driving power supply, can complete current control within 1 / n cycles, and then the switches are continuously switched to finally complete the LED display.
[0034] When routing the LED display device 100 on the PCB board, if the column drive lines are routed separately, the row drive lines will have overlapping sections (see...). Figure 2 If the row drive lines are routed separately, the column drive lines will have overlapping routes (see...). Figure 3Due to the significant overlap in the overall wiring, LED chips require at least two layers of wiring. On one hand, having at least two layers of wiring on the substrate increases the difficulty of process implementation and raises product costs. On the other hand, it limits the choice of substrate material, as not all substrate materials can support two layers of wiring.
[0035] Based on the above technical problems, this application provides the following technical solutions:
[0036] Figure 4 A circuit diagram of an LED display device provided in an embodiment of the present invention is shown. Figure 4 As shown, the LED display device 200 includes a substrate 210 (not shown), a driver chip, and multiple driver traces.
[0037] The substrate 210 is used to support the LED chip. The substrate 210 includes a first surface and a second surface, and the LED chip 210 is located on the first surface.
[0038] In this embodiment, the LED chip includes one or more LED beads.
[0039] The driver chip is located on the first surface of the substrate.
[0040] In this embodiment, the driver chip includes a plurality of first pins and a plurality of pin groups. Specifically, the driver chip includes a row driver circuit 220 and a column driver circuit 230. The column driver circuit 230 includes a plurality of first pins 231, and the row driver chip 220 includes a plurality of pin groups, wherein each pin group includes a plurality of second pins 221.
[0041] Multiple drive traces are located on the first surface of the substrate for connecting the driver chip and the LED chip, and the multiple drive traces do not cross each other.
[0042] In this embodiment, the LED chip includes one or more LED beads, which are connected to the first pin 231 and the second pin 221 via multiple driving traces. The driving traces include multiple row driving traces 240 and multiple column driving traces 250. The LED beads are connected to the second pin 221 via corresponding row driving traces 240 and to the first pin 231 via corresponding column driving traces 250. The multiple row driving traces 240 and multiple column driving traces 250 do not intersect each other, allowing for single-layer wiring on the substrate, reducing the difficulty of process implementation and increasing product cost. Because single-layer wiring can be performed on the substrate, the range of substrate materials that can be selected can be expanded.
[0043] In one possible implementation, the row driving circuit 220 further includes a plurality of driving switches S1-Sn, wherein each driving switch is internally connected or equivalently connected to a second pin of the same drive in a plurality of pin groups.
[0044] In this embodiment, the drive switch is a row drive switch, but it is not limited to this.
[0045] See Figure 4 In each pin group, the row drive pin 1 is connected to the first drive switch S1, the row drive pin 2 in each pin group is connected to the second drive switch S2, and so on. The row drive pin n in each pin group is connected to the nth drive switch Sn, thus connecting or equivalently connecting inside the chip.
[0046] In the plurality of pin groups, the second pin of the same driver is connected to the corresponding driver switch through a package bonding wire, a package redistribution layer (RDL layer), or a chip metal interconnection layer. The connection method between the second pins of the same driver is not limited to the method mentioned in the embodiments, and any method that can be conceived by those skilled in the art can be applied to this application.
[0047] See Figure 5 Multiple row drive pins 1 are connected to the first drive switch S1 via bonding wires, multiple row drive pins 2 are connected to the second drive switch S2 via bonding wires, and so on, with multiple row drive pins n connected to the nth drive switch Sn via bonding wires.
[0048] See Figure 6 Multiple row drive pins 1 are connected to the first drive switch S1 through the package redistribution layer (RDL layer), multiple row drive pins 2 are connected to the second drive switch S2 through the package redistribution layer (RDL layer); ..., and so on, multiple row drive pins n are connected to the nth drive switch Sn through the package redistribution layer (RDL layer). Using the package redistribution layer to achieve internal connections can increase connection density and reduce packaging difficulty.
[0049] Specifically, multiple drive switches S1-Sn are led out to the package redistribution layer. On the package redistribution layer, multiple row drive pins 1 are connected to the first drive switch S1 through metal wiring, multiple row drive pins 2 are connected to the second drive switch S1, ..., multiple row drive pins n are connected to the nth drive switch Sn.
[0050] See Figure 7Multiple driving switches S1-Sn are formed on the substrate, with each second pin corresponding to one driving switch. Specifically, multiple first row driving pins 1 are connected one-to-one with multiple first driving switches S1, multiple second row driving pins 2 are connected one-to-one with multiple second driving switches S2, and so on, with multiple row driving pins n being connected one-to-one with multiple nth driving switches Sn. The multiple first driving switches S1 are connected through a chip metal interconnect layer, the multiple second driving switches are connected through a chip metal interconnect layer, and so on, with multiple nth driving switches Sn being connected through a chip metal interconnect layer. The LED display device includes 1 to 3 chip metal interconnect layers.
[0051] In one possible implementation, the row driving circuit 220 further includes a plurality of driving switches S1-Sn, wherein a plurality of second pins are connected one-to-one with the driving switches, and the second pins of the same driving in the plurality of pin groups use the same driving control signal to control the driving switches.
[0052] In this embodiment, the drive switch is a row drive switch, but it is not limited to this.
[0053] See Figure 8 Each second pin corresponds to a driving switch. Specifically, multiple first-row driving pins 1 are connected one-to-one with multiple first-drive switches S1, multiple second-row driving pins 2 are connected one-to-one with multiple second-drive switches S2, and so on, with multiple row driving pins n connected one-to-one with multiple nth-row driving switches Sn. Multiple first-drive switches S1 receive first switch control signals, multiple second-drive switches S2 receive second switch control signals, multiple third-drive switches S3 receive third control signals, and so on, with multiple nth-row driving switches receiving nth switch control signals. Pins with the same drive signal are effectively connected to the driving switches connected to the pins via the same switch control signal.
[0054] In one possible implementation, the second pins of adjacent pin groups are arranged in reverse order, and adjacent pin groups reuse one second pin as a common pin of the adjacent pin groups.
[0055] In this embodiment, see Figure 9The second pins of the chip are rearranged so that the order of the second pins in adjacent pin groups is reversed, thus allowing a single second pin to be reused as a common pin for adjacent pin groups. For example, the first pin group is arranged in the order of row driver pin 1 to row driver pin N, and the second pin group is arranged in the order of row driver pin N to row driver pin 1. In this way, the row driver pin N of the first and second pin groups can be used as a common pin. Specifically, the row driver pins are arranged as follows: 1, 2, 3, ..., N-2, N-1, N, N-1, N-2, ..., 1, 2, 3, ..., N-2, N-1, N, ... If the number of row drivers is 2, the second pins are arranged as follows: 1, 2, 1, 2, 1 ...; if the number of row drivers is 3, the second pins are arranged as follows: 1, 2, 3, 2, 1, 2, 3, ... The second driver pins are arranged from left to right, from right to left, or from the middle to both sides, and are not limited to the specific embodiments described above.
[0056] This embodiment rearranges the pin order so that the second pins of adjacent pin groups are arranged in reverse order. Adjacent pin groups reuse a second pin as a common pin of the adjacent pin groups, which can greatly reduce the number of pins and thus reduce the number of peripheral drive traces.
[0057] As described above, these embodiments of the present invention do not exhaustively cover all details, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to effectively utilize the invention and its modifications. The invention is limited only by the claims and their full scope and equivalents.
Claims
1. An LED display device, characterized in that, include: A substrate for carrying an LED chip, the substrate including a first surface and a second surface, the LED chip being located on the first surface; The driver chip is located on the first surface of the substrate; Multiple driving traces are located on the first surface of the substrate for connecting the driving chip and the LED chip, and the multiple driving traces do not cross each other; The driver chip includes multiple first pins and multiple pin groups, wherein each pin group includes multiple second pins, and the second pins of the same driver in the multiple pin groups are connected or equivalently connected inside the chip; The LED chip includes one or more LED beads, which are connected to the first pin and the second pin respectively via multiple driving lines.
2. The LED display device according to claim 1, characterized in that, The driver chip includes multiple driver switches, and each driver switch is connected to the second pin of the corresponding driver in multiple pin groups to achieve internal connection.
3. The LED display device according to claim 2, characterized in that, The second pin of the same driver in the multiple pin groups is connected to the corresponding driver switch through a package bonding wire, a package redistribution layer, or a chip metal connection layer.
4. The LED display device according to claim 1, characterized in that, The driver chip also includes multiple driver switches, and multiple second pins are connected to the driver switches one by one. The second pins of the same driver in the multiple pin groups use the same driver control signal to control the driver switch.
5. The LED display device according to any one of claims 1-4, characterized in that, The second pins of adjacent pin groups are arranged in reverse order, and adjacent pin groups reuse one second pin as the common pin of the adjacent pin groups.
6. The LED display device according to any one of claims 1-4, characterized in that, The LED beads and driver chip are connected in a common cathode or common anode manner.
7. The LED display device according to any one of claims 1-4, characterized in that, The first pin is a column driver pin, and the second pin is a row driver pin; or, the first pin is a row driver pin, and the second pin is a column driver pin.
8. A method for manufacturing an LED display device, characterized in that, include: An LED chip and a driver chip are formed on the first surface of the substrate; Multiple driving traces are formed on the first surface of the substrate. The driving traces are used to connect the driving chip and the LED chip. The multiple driving traces do not cross each other. The driver chip includes multiple first pins and multiple pin groups, wherein each pin group includes multiple second pins, and the second pins of the same driver in the multiple pin groups are connected or equivalently connected inside the chip; The LED chip includes one or more LED beads, which are connected to the first pin and the second pin respectively via multiple driving lines.
9. The method according to claim 8, characterized in that, The driver chip includes multiple driver switches, each of which is connected to the second pin of the corresponding driver in multiple pin groups to achieve internal connection or equivalent connection.
10. The method according to claim 8, characterized in that, The second pin of the same driver in the multiple pin groups is connected to the corresponding driver switch through a package bonding wire, a package redistribution layer, or a chip metal connection layer.
11. The method according to claim 8, characterized in that, The driver chip also includes multiple driver switches, and multiple second pins are connected to the driver switches one by one. The second pins of the same driver in the multiple pin groups use the same driver control signal to control the driver switch.
12. The method according to claim 8, characterized in that, The second pins of adjacent pin groups are arranged in reverse order, and adjacent pin groups reuse one second pin as the common pin of the adjacent pin groups.