Substrate hot spot correction for chemical mechanical polishing processes

By using orientation sensors and fluid delivery arms in the CMP process to determine the substrate rotation orientation, the problem of uncertain hot spot location was solved, enabling precise targeting of hot spots and improving polishing results.

CN122228155APending Publication Date: 2026-06-16APPLIED MATERIALS INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
APPLIED MATERIALS INC
Filing Date
2024-11-13
Publication Date
2026-06-16

AI Technical Summary

Technical Problem

In existing chemical mechanical polishing (CMP) processes, the rotational orientation of the substrate relative to the carrier head is unknown, resulting in uncertain hot spot locations and making it impossible to effectively target and process hot spots.

Method used

By setting an orientation sensor and a fluid delivery arm in the carrier head, the rotational orientation of the substrate relative to the carrier head is determined, and the second fluid delivery arm is used to selectively deliver fluid to radial positions on the polishing surface to target hot spots.

Benefits of technology

It achieves precise targeting of hot spots, improves polishing uniformity and efficiency, and reduces the impact of hot spots on the substrate surface.

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Patent Text Reader

Abstract

A method of processing a substrate includes placing a front surface of a substrate disposed in a carrier head on a polishing surface of a pad. The method further includes delivering a first fluid onto the polishing surface using a first fluid delivery arm. The method further includes determining a location of a hot spot on the front surface. The method further includes determining a rotational orientation of the substrate relative to the carrier head. The method further includes processing the hot spot while polishing the front surface on the polishing surface using a second fluid delivery arm to deliver a second fluid to a location on the polishing surface that will intersect with the hot spot during polishing of the front surface of the substrate.
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