A noise-cancelling headset and method of assembly thereof
By embedding acoustic damping components in the earcups and using positioning pins for heating and melting to limit positioning and fixing components for circumferential pressing, the problem of consistent and reliable sound pickup in industrial active noise-canceling earcups and microphones is solved, achieving stable sound pickup under complex working conditions.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGDONG JINHAINA IND CO LTD
- Filing Date
- 2026-04-28
- Publication Date
- 2026-06-19
AI Technical Summary
Existing industrial active noise-canceling earmuffs suffer from insufficient microphone pickup consistency and poor long-term reliability. Adhesive connections are susceptible to vibration, temperature and humidity changes, and dust, leading to displacement and detachment of damping materials.
An acoustic damping component is embedded in the mounting groove. The positioning pin is heated and melted to form a limit, and combined with the circumferential pressing of the fixing component, the damping component is double-fixed, avoiding dependence on adhesives.
It improves the stability and long-term reliability of microphone pickup, reduces the risk of damping components shifting and loosening under vibration and temperature and humidity changes, and ensures the consistency of the acoustic channel.
Smart Images

Figure CN122229622A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of earmuff technology, and more particularly to a headband-style noise-canceling earmuff and its assembly method. Background Technology
[0002] Over-ear noise-canceling headphones are widely used in industrial noise reduction, voice calls, gaming, and multimedia scenarios. Especially in the field of industrial noise reduction, the work site is usually a complex environment with high noise, strong airflow, dust, and equipment vibration. In order to meet the needs of active noise cancellation, personnel communication, and instruction transmission, industrial noise-canceling headphones usually integrate microphones (also known as "microphones") to pick up ambient sound or user voice signals, so as to achieve active noise cancellation and communication needs.
[0003] In existing technologies, earcups commonly employ two types of microphone pickup structures: one is an external microphone rod structure, where the microphone is mounted on an adjustable, exposed microphone rod to bring the pickup port closer to the user's mouth, improving the voice signal-to-noise ratio. However, exposed components are not suitable for high-intensity use in industrial settings. Some technologies utilize an embedded microphone structure, where the microphone is embedded in the side of the earcup shell. To reduce the impact of environmental noise on microphone pickup, embedded structures typically incorporate acoustic damping materials (such as microphone foam / cotton) at the sound hole to buffer airflow, attenuate high-frequency noise, or dampen and reshape the pickup channel, thereby improving call quality.
[0004] However, the acoustic damping materials in existing embedded microphones are mostly fixed to the inside of the shell or near the sound hole using adhesive. This adhesive bonding process is highly dependent on the alignment and compaction of the material, and inconsistent adhesive application can easily affect the microphone's sound pickup performance. Furthermore, in industrial settings, earcups are frequently subjected to vibration, temperature and humidity changes, and the intrusion of sweat and dust. Adhesive connections are prone to cracking or detachment, leading to displacement of the damping material and a decline in sound pickup performance over time, affecting call stability. Therefore, existing industrial active noise-canceling earcups still suffer from insufficient sound pickup consistency and poor long-term reliability. Summary of the Invention
[0005] The purpose of this invention is to provide a headband noise-canceling earmuff and its assembly method, which solves the problems of insufficient sound pickup consistency and poor long-term reliability of microphones in existing industrial active noise-canceling earmuffs.
[0006] To achieve this objective, the present invention adopts the following technical solution: A headband noise-canceling earmuff includes a headband and earmuffs rotatably connected to both ends of the headband. The earmuffs include at least an earmuff shell, and a mounting groove is provided on the side of the earmuff shell. The bottom of the mounting groove is provided with a through hole communicating with the inside of the earmuff shell. The mounting groove is fitted with an acoustic damping component and a fixing component. The fixing component matches the contour of the mounting groove to fix the acoustic damping component in the mounting groove. A positioning post is provided on the side of the fixing component facing the earcup shell. The positioning post limits the acoustic damping component after being heated, melted and deformed. A through hole corresponding to the positioning post is opened at the bottom of the mounting groove.
[0007] Optionally, the acoustic damping component is one of porous foam, foamed elastomer, or multilayer composite damping material, and the fixing component is an annular decorative ring, which is embedded in the mounting groove by an interference fit.
[0008] Optionally, the headband is divided into two forked sections at its end, and the ends of the two forked sections are rotatably connected to the two sides of the earmuff shell, with the mounting groove positioned opposite one of the forked sections.
[0009] The present invention also provides an earmuff assembly method for assembling the above-described over-ear noise-canceling earmuffs, comprising the following steps: Step S1: Install acoustic damping components and fixing components into the mounting slots of the two earcup shells respectively, and perform hot pressing and melting treatment on the positioning post to press and position the acoustic damping components in the mounting slots. Step S2: On the earcup housing with pre-set mounting holes, insert the silicone sealing sleeve of the functional device into the corresponding mounting hole. Step S3: Install the power supply component and circuit board component into the two earcup housings and complete the electrical connection; Step S4: Pass the connecting wires connecting the left and right earcups through the headband and connect them to the internal circuitry of the left and right earcups respectively, so that the left and right earcups and the headband are assembled and connected. Step S5: Complete the assembly of the earcups' sealing structure and perform overall functional testing.
[0010] Optionally, step S1 specifically includes: Step S11: Place the acoustic damping component into the mounting groove, so that it covers the bottom of the mounting groove and partially protrudes from the perforation; Step S12: Press the fastener into the mounting groove and circumferentially engage with the mounting groove so that the fastener provides circumferential restraint to the acoustic damping component; Step S13: Perform hot-press melting treatment on the multiple positioning posts located near the inner side of the ear cup shell of the perforation, so that the melted positioning posts are bonded to the part of the acoustic damping element that protrudes from the perforation and is embedded in the positioning posts to form a pressure cap point, so as to fix the acoustic damping element in the mounting groove.
[0011] Optionally, in step S13, during the hot-pressing and melting treatment of the positioning post, a heating tool is used to locally heat the end of the positioning post, and after heating, it is flattened and shaped to form a cap point at the end of the positioning post. The end of the positioning post communicates with the through hole and is located at the cap point. The edge of the positioning post is partially bonded to the acoustic damping component. Optionally, in step S2, the functional device includes at least one or more of the following: a monitoring microphone sealing silicone sleeve, a silicone wire sleeve, and a Bluetooth microphone sealing silicone sleeve.
[0012] Optionally, step S3 specifically includes: Step S31: Insert the power supply components into the preset receiving slots inside the two earcup shells respectively, and secure them with the cover plate; Step S32: Install the circuit board into the earcup housing and secure it with fasteners; Step S33: Solder the pickup device to the wires and form an electrical connection with the circuit board and power supply components; Step S34: Install and lock the speaker assemblies inside the two earcups respectively, so that they are electrically connected to the power supply and circuit board components; Step S35: Apply hot melt adhesive or adhesive material to the terminal area, soldering area and mating area of the circuit board for reinforcement.
[0013] Optionally, step S4 specifically includes: Step S41: Pass the multi-core connecting wire harness connecting the left and right earcups through the wire sleeve holes on the left and right earcups from the outside to the inside. Step S42: Install cable ties on the wire harness section near the wire sleeve hole to form a stress relief section; Step S43: Connect both ends of the wire harness to the circuit boards inside the left and right earcups respectively, and apply hot melt adhesive to the wire harness where it enters the earcup and the electrical connection area for fixation; Step S44: Arrange the wire harness along the wiring structure of the headband and press it into the headband wire groove for fixation, so that the left and right earcups and the headband form a stable assembly connection.
[0014] Optionally, step S5 specifically includes: Step S51: Provide a lip protector assembly, install a sealing ring on the lip protector assembly, install an outer sponge on the earcup shell, and then install the lip protector assembly with the sealing ring onto the earcup shell. Step S52: After assembling the two ear cups, perform a full-machine test on the appearance, assembly direction and fit of the ear cups, flatness of the terminals and rubber sleeves, correctness of wiring, feel of the control components, and noise reduction function.
[0015] Compared with the prior art, the present invention has the following beneficial effects: In this invention, an embodiment of a noise-canceling headphone and its assembly method are provided. During assembly, an acoustic damping component is embedded in a mounting groove, covering a through hole to allow external sound waves to enter through the damping component and the through hole. Then, a fixing component is installed into the mounting groove, and a positioning post passes through a perforation and enters the earphone shell to fix the acoustic damping component. Subsequently, the positioning post is heated to melt and plastically deform its end. After cooling, the end of the positioning post forms a flattened limiting part, which limits the acoustic damping component, thereby preventing displacement, loosening, or warping of the acoustic damping component under vibration, impact, or temperature and humidity cycling.
[0016] The limiting part of the fixing component and the positioning post work together to achieve dual fixation of the acoustic damping component. The limiting part formed by the thermal deformation of the positioning post provides axial limitation, and the fixing component provides frame compression limitation. This allows the acoustic damping component to maintain a stable position in the mounting groove and maintain the consistency of the acoustic channel over a long period of time, without relying on the amount of adhesive applied, the curing state, or the cleanliness of the bonding interface. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.
[0019] Figure 1 This is a schematic diagram of the structure of a headband-style noise-canceling earmuff.
[0020] Figure 2 This is an exploded view of the earcup component.
[0021] Figure 3 This is an exploded view of the earcup component.
[0022] Illustrations: 1. Headband; 2. Earmuff; 21. Earmuff shell; 22. Mounting groove; 23. Through hole; 24. Perforation; 3. Acoustic damping component; 4. Fixing component; 41. Positioning post. Detailed Implementation
[0023] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.
[0024] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.
[0025] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0026] Example 1: like Figure 1 , Figure 2 and Figure 3 As shown, this embodiment of the invention provides a headband noise-canceling earmuff, including a headband 1 and earmuff components 2 rotatably connected to both ends of the headband 1. The earmuff component 2 includes at least an earmuff shell 21. A mounting groove 22 is provided on the side of the earmuff shell 21. The bottom of the mounting groove 22 is provided with multiple through holes 23 communicating with the inside of the earmuff shell 21. An acoustic damping component 3 and a fixing component 4 are embedded in the mounting groove 22. The fixing component 4 matches the contour of the mounting groove 22 to fix the acoustic damping component 3 in the mounting groove 22. A positioning post 41 is provided on the side of the fixing component 4 facing the earmuff shell 21. After being heated, melted and deformed, the positioning post 41 limits the acoustic damping component 3. A through hole 24 corresponding to the positioning post 41 is provided at the bottom of the mounting groove 22.
[0027] Specifically, the headband 1 can be configured as a telescopic structure to improve fit and comfort. The earcup shell 21 can be a one-piece molded shell with an open side for installing the internal structure and lip protector. A mounting groove 22 is formed on the side of the earcup shell 21 and is recessed inward along the thickness direction of the earcup shell 21 to form a receiving cavity. A through hole 23 is provided at the bottom of the mounting groove 22, which connects the receiving cavity with the inside of the earcup shell 21 to realize an acoustic path between external sound waves and the internal cavity of the earcup. The acoustic damping component 3 can be made of a porous elastic material with a certain degree of resilience. The through hole 23 can form a stable acoustic damping channel and also buffer airflow. The acoustic damping component 3 can be partially squeezed through the perforation 24 and enter the positioning post 41.
[0028] Furthermore, a fixing member 4 is also provided in the mounting groove 22, and the fixing member 4 matches the contour of the mounting groove 22. The fixing member 4 can be an annular decorative ring or a frame-shaped pressure ring. The fixing member 4 is installed in the mounting groove 22 by embedding, snapping or interference fit, so that the fixing member 4 presses and covers the circumferential edge of the acoustic damping member 3. In order to facilitate the reliable fixing of the acoustic damping member 3, a positioning post 41 is integrally formed on the side of the fixing member 4 facing the inside of the earcup shell 21. The positioning post 41 protrudes inward along the thickness direction of the earcup shell 21. The positioning post 41 is a hollow cylindrical structure. Holes adapted to the positioning post 41 can be opened on the acoustic damping member 3 for the positioning post 41 to pass through. A through hole 24 corresponding to the positioning post 41 is opened at the bottom of the mounting groove 22 to facilitate the insertion of the positioning post 41 and into the inside of the earcup shell 21.
[0029] During assembly, the acoustic damping component 3 is embedded in the mounting groove 22, covering the through hole 23, allowing external sound waves to enter through the acoustic damping component 3 and the through hole 23. Then, the fixing component 4 is installed into the mounting groove 22, and the positioning post 41 passes through the through hole 24 and enters the earcup shell 21 to fix the acoustic damping component 3. Subsequently, the positioning post 41 is heated, causing its end to melt and undergo plastic deformation, bonding with the acoustic damping component 3 located inside the positioning post 41. After cooling, the end of the positioning post 41 forms a flattened limiting part, which limits the acoustic damping component 3, thereby suppressing displacement, loosening, or warping of the acoustic damping component 3 under vibration, impact, or temperature and humidity cycling.
[0030] The fixing component 4 and the limiting part of the positioning post 41 work together to achieve dual fixation of the acoustic damping component 3. That is, the limiting part formed by the heat-melting deformation of the positioning post 41 provides axial limitation, and the fixing component 4 provides frame compression limitation, thereby keeping the acoustic damping component 3 in a stable position within the mounting groove 22 and maintaining the consistency of the acoustic channel over a long period of time. The positioning post 41 forms a limiting part after being heated and melted, which reliably limits the acoustic damping component 3, regardless of the amount of adhesive applied, the curing state, or the cleanliness of the bonding interface. The circumferential pressing fit with the fixing component 4 significantly reduces the probability of the damping component loosening or shifting during long-term use, thereby improving the consistency and repeatability of call pickup.
[0031] Furthermore, the acoustic damping component 3 is one of porous foam, foamed elastomer or multilayer composite damping material, and the fixing component 4 is an annular decorative ring, which is embedded in the mounting groove 22 by interference fit.
[0032] For example, the acoustic damping component 3 is made of porous foam material, such as open-cell polyurethane foam, whose pores are interconnected to allow sound waves to pass through and form an acoustic damping channel; or it is made of foamed elastomer material, such as foamed silicone or foamed rubber, so that it has better resilience and weather resistance while maintaining a certain sound transmission; or it is made of multi-layer composite damping material, such as an outer hydrophobic mesh / film, a middle porous foam layer, and an inner fine-pore damping layer, to achieve graded attenuation of wind noise, dust and noise of different frequency bands.
[0033] The fastener 4 is an annular decorative ring, which can be made of metal, injection molded material, or elastic material, and its outer periphery matches the contour of the mounting groove 22. During assembly, the acoustic damping element 3 is first placed into the mounting groove 22, covering the area of the perforation 24; then, the annular decorative ring is pressed in along the opening direction of the mounting groove 22, so that the outer periphery of the decorative ring forms an interference fit with the inner wall of the mounting groove 22. After the decorative ring is pressed in, it forms an annular pressure on the circumferential edge of the acoustic damping element 3, limiting the in-plane displacement and edge warping of the acoustic damping element 3. Furthermore, a stepped surface or a pressing edge structure can be provided on the inner side of the annular decorative ring, so that it generates a predetermined compression amount on the acoustic damping element 3 when it is pressed in, thereby stabilizing the pressing state of the damping element in the thickness direction.
[0034] For example, the annular decorative ring can serve both decorative and protective functions. Its opening area forms a shielding boundary for the mounting groove 22, reducing direct damage to the damping component from external scratches. Its inner edge can fit into the acoustic damping component 3, reducing the exposure of the damping component's edge, thereby improving overall durability and consistency.
[0035] Furthermore, the headband 1 is divided into two forked sections at the end, and the ends of the two forked sections are rotatably connected to the two sides of the earmuff shell 21, with the mounting groove 22 positioned directly opposite one of the forked sections.
[0036] Specifically, the headband 1 has two bifurcated sections at its end, spaced apart in the left-right direction to form a Y-shaped or fork-shaped structure. The ends of the two bifurcated sections are rotatably connected to both sides of the earcup shell 21 via pivots, hinges, or rotating connectors, allowing the earcup 2 to rotate relative to the headband 1 to accommodate different head shapes and wearing angles. A mounting groove 22 is located on the side of the earcup shell 21, directly opposite one of the bifurcated sections. For example, the mounting groove 22 is located on the outer side surface of the earcup shell 21, and its position, after the earcup and headband are assembled, corresponds to one of the bifurcated sections along the circumferential direction of the earcup shell 21, so that the bifurcated section provides partial obstruction or adjacent protection to the mounting groove 22 in appearance. The forked section of the headband naturally shields and protects the grooved area during wearing, handling, and operation, reducing the risk of direct impact from collisions and scratches on the pickup area in industrial settings. This reduces the risk of loosening of the decorative ring, damage to the damping components, foreign object entry or deformation, and improves reliability under high-intensity industrial use.
[0037] Example 2: This invention also provides a method for assembling earmuffs, for assembling the over-ear noise-canceling earmuffs provided in Embodiment 1, comprising the following steps: Step S1: Insert the acoustic damping component 3 and the fixing component 4 into the mounting grooves 22 of the two earcup shells 21 respectively, and perform hot pressing and melting treatment on the positioning post 41 to press and position the acoustic damping component 3 in the mounting grooves 22. The positioning post 41 is hot-pressed and melted to form the pressure cap position, and the damping part is partially fused and bonded to the fused positioning post 41. At the same time, the fixing part 4 and the groove cooperate circumferentially to provide circumferential limit. It does not depend on the amount of glue, curing state or interface cleanliness, and the assembly result is more repeatable and the batch consistency is higher.
[0038] Step S2: On the earcup housing 21 with pre-set mounting holes, insert the silicone sealing sleeve of the functional device into the corresponding mounting hole. On the earcup housing 21 with pre-set mounting holes, the silicone sealing sleeve of the functional device is press-fitted into the corresponding mounting hole. The silicone sealing sleeve can be used to elastically cover and seal the holes of the pickup device, interface holes, or wire exit holes; after the sealing sleeve is pressed into place, its flange part fits against the outer surface of the earcup housing 21, and the sleeve part extends into the inner side of the earcup housing 21, thereby achieving circumferential sealing and buffering of the hole.
[0039] Step S3: Install the power supply component and circuit board component into the two earcup housings 21 and complete the electrical connection; The power supply component is installed into the preset receiving position inside the earcup housing 21 and secured with a cover plate and fasteners to ensure that the power supply component does not loosen or shift under vibration conditions. The circuit board is installed into the board mounting position inside the earcup housing 21 and locked in place; then the pickup device, speaker assembly, or interface assembly is electrically connected to the circuit board by soldering or plugging. To improve vibration resistance reliability, hot melt adhesive or other adhesive materials can be applied to the terminal area, solder joint area, or where the wiring harness enters the earcup housing 21 for reinforcement.
[0040] Step S4: Pass the connecting wires connecting the left and right earcups through the headband and connect them to the internal circuitry of the left and right earcups respectively, so that the left and right earcups and the headband are assembled and connected. The connecting wires for the left and right earcups are led out from one earcup and threaded into the wiring structure of the headband component 1, arranged along the headband's wire groove and fixed. Then, both ends of the connecting wires are plugged into or soldered to the internal circuitry of the left and right earcups, forming an assembly connection between the left and right earcups and the headband, completing the electrical connection across the earcups. To prevent stress on the solder joints due to pulling during use, a limiting device can be installed near the wire harness exit point, or localized adhesive can be used to release stress.
[0041] Step S5: Complete the assembly of the earcups' sealing structure and perform overall functional testing.
[0042] In this embodiment of the invention, step S1 specifically includes: Step S11: Place the acoustic damping component 3 into the mounting groove 22, so that it covers the bottom of the mounting groove 22 and partially protrudes out of the through hole 24; The acoustic damping element 3 is placed into the mounting groove 22 on the side of the earcup shell 21, so that the acoustic damping element 3 covers the multiple perforations 24 at the bottom of the mounting groove 22, so that external sound waves or airflow pass through the acoustic damping element 3 before entering the perforations 24. Preferably, the acoustic damping element 3 is made of a porous material with resilience, and its thickness can be slightly greater than the effective depth of the mounting groove 22, so as to form pre-compression after the subsequent pressing and fixing of the fastener 4; and the acoustic damping element 3 can locally protrude from the perforation 24 or be close to the opening of the perforation 24 in the corresponding area of the perforation 24 in a natural rebound state, so that it can form an effective interlocking interface with the positioning post 41 area during the subsequent hot pressing process.
[0043] Step S12: Press the fastener 4 into the mounting groove 22 and circumferentially fit the mounting groove 22 so that the fastener 4 forms a circumferential limit on the acoustic damping component 3; The fastener 4 is pressed into the mounting groove 22 along the opening direction of the mounting groove 22, and the fastener 4 is circumferentially fitted with the inner wall contour of the mounting groove 22. After the fastener 4 is pressed into place, it forms a circumferential holding and circumferential limit on the periphery of the acoustic damping component 3, and suppresses the acoustic damping component 3 from lateral slippage, edge lifting or exposure in the plane.
[0044] Preferably, the fastener 4 can be an annular decorative ring or a frame-shaped pressure ring, and its inner edge can be provided with a stepped surface / pressure edge structure so that the acoustic damping component 3 generates a predetermined compression amount after being pressed, thereby stabilizing the pressed state of the acoustic damping component 3 in the thickness direction.
[0045] Step S13: Perform hot pressing and melting treatment on the multiple positioning posts 41 located on the inner side of the ear cup shell 21 near the perforation 24, so that the molten positioning posts 41 are bonded to the part of the acoustic damping element 3 protruding from the perforation 24 and embedded in the positioning posts 41, forming a pressure cap point to fix the acoustic damping element 3 in the mounting groove 22.
[0046] Multiple positioning posts 41 located on the inner side of the earcup shell 21 adjacent to the perforation 24 are subjected to hot pressing and melting treatment one by one. Specifically, a heating tool can be used to locally heat the end of the positioning post 41, so that the material at the end of the positioning post 41 melts and softens, and collapses and deforms under the action of external force to flatten it, and forms a cap point after cooling (such as a riveted cap shape, a flattened cap shape, or a mushroom head shape structure).
[0047] Meanwhile, since the acoustic damping component 3 has a local protrusion in the perforation 24 area and is embedded in the positioning post 41 area in step S11, the positioning post 41 can be locally bonded and fixed to the acoustic damping component 3 embedded therein after melting, so that the acoustic damping component 3 is firmly fixed in the mounting groove 22, avoiding displacement or falling off under subsequent use conditions.
[0048] Furthermore, in step S13, when hot-pressing and melting the positioning post 41, a heating tool is used to locally heat the end of the positioning post 41, and after heating, it is flattened and shaped to form a pressure cap point at the end of the positioning post 41. The end of the positioning post 41 is connected to the perforation 24 and located at the pressure cap point. The edge of the positioning post 41 is partially bonded to the acoustic damping component 3.
[0049] For example, the positioning post 41 is a cylindrical structure. The positioning post 41 can be integrally formed with the earcup shell 21. When the positioning post 41 is hot-pressed and melted, the end of the positioning post 41 is locally heated and the molten end is bonded to the acoustic damping component 3 and flattened. After the end of the positioning post 41 cools down, the acoustic damping component 3 is fixed to the positioning post 41. The end of the positioning post 41 is not blocked, and ambient sound can still enter the earcup through the perforation 24 and the acoustic damping component 3.
[0050] For example, in step S2, the functional device includes at least one or more of the following: a monitoring microphone sealing silicone sleeve, a silicone wire sleeve, and a Bluetooth microphone sealing silicone sleeve.
[0051] In this embodiment of the invention, step S3 specifically includes: Step S31: Insert the power supply components into the preset receiving slots inside the two earcup housings 21 respectively, and secure them with the cover plate; Left and right earcup housings 21 are provided respectively, and the inside of the earcup housing 21 is pre-formed with receiving grooves for accommodating the power supply component. The power supply component is installed into the corresponding receiving groove according to its polarity marking and placement direction, so that the power supply component is in contact with the limiting surface of the earcup housing 21; then the cover plate is placed on top of the power supply component, and the cover plate is locked to the earcup housing 21 with fasteners, so that the power supply component remains in a restricted position under vibration conditions, preventing it from moving, tilting, or interfering with surrounding devices.
[0052] Step S32: Install the circuit board into the earcup housing 21 and secure it with fasteners; The circuit board is installed into the preset mounting position inside the earcup housing 21, preferably with the interface terminals of the circuit board facing the corresponding opening position of the earcup housing 21 (such as the charging port, audio port, indicator light guide hole, etc.). The circuit board is then secured to the earcup housing 21 with fasteners, forming a stable assembly reference between the circuit board and the earcup housing 21. If necessary, positioning posts 41, positioning steps, or limiting ribs can be provided at the contact point between the circuit board and the earcup housing 21 to ensure the correct assembly orientation of the board and reduce assembly deviation.
[0053] Step S33: Solder the pickup device to the wires and form an electrical connection with the circuit board and power supply components; The pickup device is soldered to the wire to form an electrical connection. After soldering, the pickup device is installed in the earcup housing 21 to the corresponding pickup mounting position (such as a slot or support position) so that the pickup direction of the pickup device matches the direction of the sound hole / perforation 24 of the earcup housing 21. Then the wire is connected to the circuit board by soldering or plugging, so that the pickup device, the circuit board, and the power supply components form a power supply and signal path.
[0054] Step S34: Install and lock the speaker assemblies inside the two earcup housings 21 respectively, so that they are electrically connected to the power supply and circuit board components. Speaker assemblies are installed inside the two earcup housings 21, and the speaker assemblies are positioned and connected to the brackets. Preferably, adhesive material is applied to the contact area between the speaker and the bracket to form a positioning tape / strip to improve the stability of the speaker relative to the bracket; then the bracket is positioned in the screw holes or positioning structures inside the earcup housings 21 and secured with fasteners to fix the speaker assemblies inside the earcup housings 21. After soldering the speaker to the wires, it is plugged into or soldered to the circuit board to electrically connect the speaker assembly to the power supply and circuit board, thereby realizing audio output or monitoring playback functions.
[0055] Step S35: Apply hot melt adhesive or adhesive material to the terminal area, soldering area and mating area with the earcup shell 21 of the circuit board for reinforcement; Hot melt adhesive or adhesive material is applied to the terminal area, soldering area and mating area of the circuit board and the earcup shell 21 to reinforce and hold them in place, so that the terminals, solder joints and wire harnesses are not easy to loosen, crack or have poor soldering under external pulling force and long-term vibration; at the same time, the vibration resistance and sealing stability of the joint between the circuit board and the earcup shell 21 are improved.
[0056] In this embodiment of the invention, step S4 specifically includes: Step S41: Pass the multi-core connecting wire harness connecting the left and right earcup shells 21 through the wire sleeve holes on the left and right earcup shells 21 from the outside to the inside respectively; Pre-set wire sleeve holes are made on the left and right earcup shells 21, and silicone wire sleeves are installed at these holes. The multi-core connecting wires connecting the left and right earcup shells 21 are passed through the corresponding wire sleeve holes from the outside to the inside, so that the wires are elastically covered by the silicone wire sleeves at the insertion point, forming a sealed channel for the wires. Preferably, after the wires are inserted, a slack length is reserved on the inside of the earcup shell 21 to allow for subsequent electrical connections, in order to avoid tension on the terminals due to wire tension.
[0057] Step S42: Install cable ties on the wire harness section near the wire sleeve hole to form a stress relief section; A cable tie is installed and tightened on the section of the wire harness near the cable sleeve hole. The cable tie engages with the limiting structure inside the earcup housing 21, the end of the cable sleeve, or the outer sheath of the wire harness, creating a stress-relief section near the wire hole. This stress-relief section is used to limit the inward transmission of tension when pulled externally or when the headband swings, preventing the electrical connection area from being subjected to axial tension.
[0058] Step S43: Connect the two ends of the wire harness to the circuit board components inside the left and right earcup shells 21 respectively, and apply hot melt adhesive to the point where the wire harness enters the earcup shell 21 and the electrical connection area for fixation; The two ends of the wire harness are electrically connected to the circuit boards inside the left and right earcup housings 21, respectively. The electrical connection method can be plug-in connection or solder connection. After the electrical connection is completed, hot melt adhesive is applied to the point where the wire harness enters the earcup housing 21, the periphery of the wire sleeve, and the electrical connection area for fixation, so that the wire harness forms an integrated fixation structure with the housing, wire sleeve, and circuit board, thereby suppressing wire harness swing and reducing the risk of fatigue damage at solder joints and terminals.
[0059] Step S44: Arrange the wire harness along the wiring structure of the headband and press it into the headband wire groove for fixation, so that the left and right earcups and the headband form a stable assembly connection. The wire harness is introduced into the pre-set wiring structure of the headband 1 and arranged along the wire groove, buckle or limiting rib of the headband. The wire harness is then pressed into the wire groove of the headband and fixed. Then the left and right ear cups 2 are assembled and connected to the headband 1, so that the wire harness forms an orderly wiring on the outside of the headband and does not expose or interfere, ensuring that the wire harness is not squeezed, twisted or scratched when the ear cups are rotated and adjusted.
[0060] In this embodiment of the invention, step S5 specifically includes: Step S51: Provide a lip protector assembly, install a sealing ring on the lip protector assembly, install an outer sponge on the earcup shell 21, and then install the lip protector assembly with the sealing ring onto the earcup shell 21. Specifically, a rubber ring matching the shape of the lip protector is installed on the outside of the lip protector assembly, an outer sponge is installed on one of the earcup shells 21, and then the lip protector with the rubber ring is installed on the earcup shell 21; the above operation is repeated to install the lip protector assembly on the other earcup shell 21.
[0061] Step S52: After assembling the two ear cup parts 2, perform a whole-machine test on the appearance assembly direction and fit of the ear cup parts 2, the flatness of the terminals and rubber sleeves, the correctness of the wiring, the feel of the control components, and the noise reduction function.
[0062] For example, after assembling the earcup 2 and headband 1, check that the left and right earcup shells 21 are not reversed with the headband, and that the connecting wires are routed correctly; check that the silkscreen printing on the left earcup shell 21 is clear, complete, and accurate, and that the earcup shell 21 is free of burrs, scratches, and dirt; check that the Y-shaped fastener of the headband 1 is properly tightened, swings smoothly, and is not misplaced; check that the rubber sleeve, charging terminal, and audio terminal are installed flat, and that the mainboard light guide post is not reversed; check that the buttons on the right earcup shell 21 are correctly installed and feel normal; check that the outer foam is free of dirt and that the mesh is on the outside; finally, correctly install the function knob onto the potentiometer, check that the knob feels normal, and turn it to the zero position.
[0063] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A type of over-ear noise-canceling earmuff, characterized in that, The device includes a headband (1) and earmuffs (2) rotatably connected to both ends of the headband (1). The earmuffs (2) include at least an earmuff shell (21). An installation groove (22) is provided on the side of the earmuff shell (21). The bottom of the installation groove (22) is provided with a through hole (23) communicating with the inside of the earmuff shell (21). The mounting groove (22) is fitted with an acoustic damping component (3) and a fixing component (4). The fixing component (4) matches the contour of the mounting groove (22) to fix the acoustic damping component (3) in the mounting groove (22). The fixing component (4) has a positioning post (41) on the side facing the earmuff shell (21). The positioning post (41) limits the acoustic damping component (3) after being heated, melted and deformed. The bottom of the mounting groove (22) has a through hole (24) corresponding to the positioning post (41).
2. The headband noise-canceling earmuffs according to claim 1, characterized in that, The acoustic damping component (3) is made of one of porous foam, foamed elastomer or multilayer composite damping material, and the fixing component (4) is an annular decorative ring, which is embedded in the mounting groove (22) by interference fit.
3. The headband noise-canceling earmuffs according to claim 1, characterized in that, The headband (1) is divided into two forked sections at its end. The ends of the two forked sections are rotatably connected to the two sides of the earmuff shell (21). The mounting groove (22) is set opposite to one of the forked sections.
4. A method for assembling earmuffs, used for assembling a headband noise-canceling earmuff as described in any one of claims 1-3, characterized in that, Includes the following steps: Step S1: Insert the acoustic damping component (3) and the fixing component (4) into the mounting grooves (22) of the two ear cup shells (21) respectively, and perform hot pressing and melting treatment on the positioning post (41) to press and position the acoustic damping component (3) in the mounting groove (22); Step S2: On the earcup housing (21) with pre-set mounting holes, insert the silicone sealing sleeve of the functional device into the corresponding mounting hole; Step S3: Install the power supply component and circuit board component into the two ear cup housings (21) and complete the electrical connection; Step S4: Pass the connecting wires connecting the left and right earcups through the headband and connect them to the internal circuitry of the left and right earcups respectively, so that the left and right earcups and the headband are assembled and connected. Step S5: Complete the assembly of the sealing structure of the earcups and perform overall functional testing.
5. The earmuff assembly method according to claim 4, characterized in that, Step S1 specifically includes: Step S11: Place the acoustic damping component (3) into the mounting groove (22) so that it covers the bottom of the mounting groove (22) and partially protrudes out of the through hole (24); Step S12: Press the fastener (4) into the mounting groove (22) and circumferentially cooperate with the mounting groove (22) so that the fastener (4) forms a circumferential limit on the acoustic damping component (3); Step S13: Perform hot pressing and melting treatment on the multiple positioning posts (41) located near the inner side of the earmuff shell (21) of the perforation (24), so that the molten positioning posts (41) are bonded to the part of the acoustic damping member (3) protruding from the perforation (24) and embedded in the positioning post (41) to form a pressure cap point, so as to fix the acoustic damping member in the mounting groove (22).
6. The earmuff assembly method according to claim 5, characterized in that, In step S13, when the positioning post (41) is hot-pressed and melted, a heating tool is used to locally heat the end of the positioning post (41), and after heating, it is flattened and shaped. The end of the positioning post (41) forms a pressure cap point. The end of the positioning post (41) is connected to the perforation (24) and located at the pressure cap point. The edge of the positioning post (41) is partially bonded to the acoustic damping component (3).
7. The earmuff assembly method according to claim 4, characterized in that, In step S2, the functional device includes at least one or more of the following: a monitoring microphone sealing silicone sleeve, a silicone wire sleeve, and a Bluetooth microphone sealing silicone sleeve.
8. The earmuff assembly method according to claim 4, characterized in that, Step S3 specifically includes: Step S31: Insert the power supply components into the preset receiving slots inside the two ear cup shells (21) respectively, and secure them with the cover plate; Step S32: Install the circuit board into the earcup housing (21) and secure it with fasteners; Step S33: Solder the pickup device to the wires and form an electrical connection with the circuit board and power supply components; Step S34: Install and lock the speaker assemblies in the two earcup shells (21) respectively, so that they are electrically connected to the power supply and the circuit board. Step S35: Apply hot melt adhesive or adhesive material to the terminal area, soldering area and mating area with the earcup housing (21) of the circuit board for reinforcement.
9. The earmuff assembly method according to claim 4, characterized in that, Step S4 specifically includes: Step S41: Pass the multi-core connecting wire harness connecting the left and right earcup shells (21) through the wire sleeve holes on the left and right earcup shells (21) from the outside to the inside; Step S42: Install cable ties on the wire harness section near the wire sleeve hole to form a stress relief section; Step S43: Connect the two ends of the wire harness to the circuit board components inside the left and right earcup shells (21) respectively, and apply hot melt adhesive to the wire harness where it enters the earcup shell (21) and the electrical connection area for fixation; Step S44: Arrange the wire harness along the wiring structure of the headband and press it into the headband wire groove for fixation, so that the left and right earcups and the headband form a stable assembly connection.
10. The earmuff assembly method according to claim 4, characterized in that, Step S5 specifically includes: Step S51: Provide a lip protector assembly, install a sealing ring on the lip protector assembly, install an outer sponge on the earcup shell (21), and then install the lip protector assembly with the sealing ring onto the earcup shell (21). Step S52: After assembling the two ear cup parts (2), perform a whole-machine test on the appearance assembly direction and fit of the ear cup parts (2), the flatness of the terminals and rubber sleeves, the correctness of the wiring, the feel of the control parts and the noise reduction function.