A heat dissipating device for a thick-film high-pressure heater

Abstract

This invention relates to the technical field of high-pressure heaters and discloses a heat dissipation device for a thick-film high-pressure heater, comprising a flow channel shell assembly, a flow channel heat-conducting component fixedly installed above the flow channel shell assembly, a liquid mounting cavity between the flow channel shell assembly and the flow channel heat-conducting component, and an equipment mounting groove inside the flow channel heat-conducting component; a heat insulation layer, a thick-film heater, and an inorganic heat-conducting layer are fixedly installed inside the equipment mounting groove; the flow channel heat-conducting component is provided with several sets of S-shaped guide fins, and the flow channel shell assembly is provided with a spiral guide component; this invention, through the matching arrangement of the thick-film heater and the inorganic heat-conducting layer, ensures that the thick-film heater is completely placed inside the equipment mounting groove, forming a physical isolation state from the antifreeze in the liquid mounting cavity, preventing direct contact with the liquid, and effectively avoiding damage such as corrosion, erosion, and scaling caused by the antifreeze to the heating element.

Description

Technical Field

[0001] This invention belongs to the technical field of high-pressure heaters, and more specifically, relates to a heat dissipation device for a thick-film high-pressure heater. Background Technology

[0002] With the rapid development of the new energy vehicle industry, vehicle air conditioning systems and power battery thermal management systems are placing increasingly stringent demands on the response speed, operational stability, environmental adaptability, and service life of heating devices. Currently, the widely used water-cooled high-pressure heating devices in the industry mainly consist of PTC heaters, stainless steel substrate thick-film heaters, and conventional thin-film heaters. However, these technologies have revealed significant technical shortcomings in actual vehicle applications, making it difficult to simultaneously meet the comprehensive requirements of low-temperature start-up, low-pressure operation, long-term stability, efficient heat exchange, and low-cost mass production.

[0003] Traditional PTC heaters, limited by their material physical properties, suffer from difficulties starting up, significant drops in heating efficiency, or even malfunction under extremely low temperatures and low voltage power supply conditions. This severely restricts the user experience of vehicles in cold northern regions and prevents them from achieving rapid and stable heating in low-temperature and low-pressure environments. Commonly used stainless steel substrate thick-film heaters, where the heating substrate needs to be in direct contact with the coolant inside the flow channel, are highly susceptible to chemical corrosion, impurity contamination, mineral crystallization, and scale buildup during long-term cyclic operation. This can lead to issues such as substrate vibration, buzzing noises, and hissing noises. Conventional thin-film heaters suffer from low power density and limited heat exchange efficiency. To meet the heating needs of the entire vehicle, they often require significant installation space, have complex and cumbersome overall structures, demanding high-precision manufacturing processes, and incurring high material and manufacturing costs, making them unsuitable for the large-scale, highly integrated, and low-cost application trends of new energy vehicles.

[0004] Therefore, in view of this, we have studied and improved the existing structure and its shortcomings, and provided a heat dissipation device for a thick film high-pressure heater, in order to achieve a more practical and valuable purpose. Summary of the Invention

[0005] The present invention provides a heat dissipation device for a thick film high-pressure heater, which overcomes the above-mentioned defects in the prior art.

[0006] The purpose and effect of the heat dissipation device for a thick film high-pressure heater of the present invention are achieved by the following specific technical means: A heat dissipation device for a thick film high-pressure heater includes a flow channel housing assembly, a flow channel heat conduction component is fixedly installed on the top of the flow channel housing assembly, a liquid mounting cavity is provided between the flow channel housing assembly and the flow channel heat conduction component, and an equipment mounting groove is provided on the inner side of the flow channel heat conduction component; The equipment mounting slot is fixedly installed with a heat insulation layer, a thick film heater and an inorganic heat-conducting layer; the flow channel heat-conducting component is provided with several sets of S-shaped flow guide fins, and the flow channel shell component is provided with a spiral flow guide component. The S-shaped guide fins are equipped with auxiliary guide vanes, and the liquid mounting cavity is filled with antifreeze. The S-shaped guide fins and the spiral guide components enhance the flow path and optimize heat dissipation.

[0007] In a further technical solution, the flow channel housing assembly includes a flow channel housing, with an inlet and an outlet fixedly connected to the outside of the flow channel housing, and an inlet guide hood and an outlet guide hood correspondingly installed inside the inlet and the outlet.

[0008] In a further technical solution, the bottom of the flow channel housing is provided with several sets of small grooves, the inside of the flow channel housing is provided with a liquid mounting cavity, and several sets of spiral guide components are fixedly installed inside the liquid mounting cavity, the spiral guide components corresponding to the small grooves.

[0009] A further technical solution is that the flow channel heat conduction assembly includes a heat conduction shell, the heat conduction shell is provided with a downward protruding boss, the boss is provided with a number of S-shaped flow guide fins, and auxiliary flow guide fins are provided on the inner wall of each pair of S-shaped flow guide fins on opposite sides, and each pair of auxiliary flow guide fins are arranged in an alternating manner. The upper opening of the heat conduction shell is provided with a rubber strip mounting groove.

[0010] In a further technical solution, the auxiliary guide vane and the S-shaped guide fin form a swirling angle, the swirling angle being 30 degrees.

[0011] In a further technical solution, a rectangular protrusion is provided on the left side of the S-shaped guide fin, the height of the rectangular protrusion is the same as the height of the S-shaped guide fin, and a number of rectangular grooves are provided on the side of the rectangular protrusion near the S-shaped guide fin.

[0012] A further technical solution is provided with a power tube placement groove at the upper end of the rectangular protrusion. The power tube placement groove is located on the outside of the equipment mounting groove. The equipment mounting groove is provided with a heat insulation layer, a thick film heater and an inorganic heat-conducting layer in sequence from top to bottom. The inorganic heat-conducting layer is specifically made of silicon carbide.

[0013] In a further technical solution, the spiral guide includes a fixed column, a water flow channel in the middle of the fixed column, and the opening of the water flow channel gradually decreases in size from the outlet to enhance the drainage effect. A small bearing is fixedly installed at the upper end of the fixed column, and a rotating impeller is rotatably installed on the small bearing.

[0014] In a further technical solution, the thick film heater includes a printed insulating layer and an alumina substrate. A printed resistive heating layer is provided between the printed insulating layer and the alumina substrate. A printed electrode layer and a surface-mount thermistor are fixedly connected to the front end of the alumina substrate. A copper strip electrode assembly is electrically connected between the printed insulating layer, the printed resistive heating layer and the alumina substrate.

[0015] In a further technical solution, the thick film heater 4 is an alumina substrate thick film heating plate, using a 95 or 96 ceramic alumina substrate, which is formed into a conductive layer, a heating resistance layer and an insulating layer through multiple printing and sintering processes.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The heat dissipation device for a thick-film high-pressure heater of the present invention, through the matching arrangement of the thick-film heater and the inorganic heat-conducting layer, allows the thick-film heater to be completely placed inside the equipment mounting tank, forming a physical isolation state from the antifreeze in the liquid mounting cavity. It does not directly contact the liquid, effectively avoiding damage such as corrosion, erosion and scaling caused by the antifreeze to the heating body; at the same time, it eliminates the potential for vibration and abnormal noise caused by the substrate directly contacting the liquid, ensuring that the heater body is in a stable and reliable working state for a long time, thereby achieving the beneficial effects of extending the overall service life of the device and improving operational stability.

[0017] The heat dissipation device of the thick film high-pressure heater of the present invention forms a multi-level disturbance and long-distance flow guiding structure inside the liquid installation cavity through the sequential linkage of spiral flow guide, S-shaped flow guide fins and auxiliary flow guide fins. This causes the antifreeze to be continuously disturbed, dispersed and guided during the flow process, effectively breaking the boundary layer formed during the liquid flow process. It significantly extends the contact path and contact time between the antifreeze and the heat-conducting shell and heat-conducting surfaces such as bosses, avoiding water flow short circuits and heat exchange blind spots. This achieves the beneficial effects of enhancing heat exchange efficiency, improving overall heat exchange uniformity, and ensuring a more thorough heating and heat dissipation process.

[0018] The heat dissipation device of the thick film high-pressure heater of the present invention effectively collects and directionally conducts the heat energy generated by the thick film heater through the structural cooperation of the insulation layer and the heat conduction component of the flow channel. This prevents the heat from dissipating disorderly into the upper space and allows the heat energy to be transferred more concentratedly to the antifreeze in the liquid mounting cavity, making full use of heat energy resources and reducing energy loss. At the same time, the high thermal conductivity and high insulation properties of the alumina substrate ensure efficient and stable heat transfer, avoid the risk of local overheating, and thus achieve the beneficial effects of improving heat energy utilization, reducing device energy consumption, and ensuring stable and safe operation of the device in complex environments. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Figure 1 This is a schematic diagram of the overall first appearance structure of the present invention; Figure 2 This is a schematic diagram of the overall second appearance structure of the present invention; Figure 3 This is a top view of the overall structure of the present invention; Figure 4 This is a schematic diagram of the overall side section structure of the present invention; Figure 5 This is a bottom view of the overall structure of the heat conduction component of the flow channel of the present invention; Figure 6 This is a top view schematic diagram of the overall structure of the heat conduction component of the flow channel of the present invention; Figure 7 This is a schematic diagram of the overall side cross-sectional structure of the heat conduction component of the flow channel of the present invention; Figure 8 This is a schematic diagram of the overall exploded structure of the present invention; Figure 9 This is a schematic diagram of the first partial explosion structure of the present invention; Figure 10 This is a schematic diagram of the second partial explosion structure of the present invention; Figure 11 This is a schematic diagram of the external structure of the spiral guide component of the present invention; Figure 12 This is a schematic diagram of the overall exploded structure of the thick film heater of the present invention.

[0022] Explanation of reference numerals in the attached figures: 1. Flow channel housing assembly; 11. Flow channel housing; 12. Inlet; 13. Outlet; 14. Small groove; 15. Liquid mounting cavity; 16. Spiral guide; 161. Fixed column; 162. Water flow channel; 163. Rotating impeller; 17. Inlet water guide shroud; 18. Outlet water guide shroud; 2. Flow channel heat conduction assembly; 21. Heat conduction shell; 22. Boss; 23. S-shaped guide fins; 24. Auxiliary guide fins; 25. Rectangular protrusion; 26. Rectangular groove; 27. Adhesive strip mounting groove; 28. Power tube placement groove; 29. ​​Equipment mounting groove; 3. Insulation layer; 4. Thick film heater; 41. Copper strip electrode assembly; 42. Printed insulating layer; 43. Printed resistive heating layer; 44. Printed electrode layer; 45. Alumina substrate; 46. Chip thermistor; 5. Inorganic thermal conductive layer. Detailed Implementation

[0023] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0024] In the description of this invention, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] As attached Figure 1 To be continued Figure 12 As shown: The present invention provides a heat dissipation device for a thick film high pressure heater, including a flow channel housing assembly 1, a flow channel heat conduction assembly 2 fixedly installed on the top of the flow channel housing assembly 1, a liquid mounting cavity 15 between the flow channel housing assembly 1 and the flow channel heat conduction assembly 2, and an equipment mounting groove 29 provided on the inner side of the flow channel heat conduction assembly 2; The equipment mounting slot 29 is fixedly installed with a heat insulation layer 3, a thick film heater 4 and an inorganic heat-conducting layer 5. The flow channel heat conduction component 2 is provided with several sets of S-shaped flow guide fins 23, and the flow channel shell component 1 is provided with a spiral flow guide 16; the S-shaped flow guide fins 23 are provided with auxiliary flow guide fins 24, and the liquid mounting cavity 15 is filled with antifreeze. The S-shaped flow guide fins 23 and the spiral flow guide 16 enhance the flow path effect to achieve heat dissipation optimization.

[0027] Preferred options are shown in the appendix. Figure 1 To be continued Figure 8 The flow channel housing assembly 1 includes a flow channel housing 11. An inlet 12 and an outlet 13 are fixedly connected to the outside of the flow channel housing 11. An inlet guide shroud 17 and an outlet guide shroud 18 are installed inside the inlet 12 and the outlet 13, respectively. The inlet guide shroud 17 can evenly disperse and guide the antifreeze entering the flow channel, avoiding the phenomenon of water flow concentrating and impacting one side area, causing flow deviation and uneven flow, and ensuring that the rotating impeller 163 starts more stably and rotates more smoothly. The outlet guide shroud 18 can effectively reduce the flow resistance at the outlet end, so that the antifreeze that has completed heat exchange can be discharged quickly and smoothly, maintaining the internal pressure of the flow channel and avoiding excessive local pressure that affects the circulation efficiency.

[0028] Preferred options are shown in the appendix. Figure 1 To be continued Figure 8 The bottom of the flow channel housing 11 is provided with several sets of small grooves 14, and the interior of the flow channel housing 11 is provided with a liquid mounting cavity 15. Several sets of spiral guide components 16 are fixedly installed inside the liquid mounting cavity 15. The spiral guide components 16 correspond to the small grooves 14. The small grooves 14 can accurately position and limit the spiral guide components 16, improve assembly consistency and structural robustness, prevent the guide components from shaking, shifting or loosening due to long-term impact of high-speed water flow, and improve the overall structural stability and the consistency of water flow disturbance effect.

[0029] Preferred options are shown in the appendix. Figure 1 To be continued Figure 8 The heat-conducting component 2 includes a heat-conducting shell 21, which is made of aluminum die-casting. The heat-conducting shell 21 has a downwardly protruding boss 22, and the boss 22 has several sets of S-shaped guide fins 23. Each pair of S-shaped guide fins 23 has an auxiliary guide plate 24 on the inner wall of the opposite side. Each pair of auxiliary guide plates 24 are arranged in an alternating manner. The upper opening of the heat-conducting shell 21 is provided with a rubber strip mounting groove 27. The S-shaped guide fins 23 can significantly extend the effective heat exchange path of the water flow and significantly increase the heat exchange contact area. The alternating auxiliary guide plates 24 can further disperse the water flow, eliminate dead zones and heat exchange blind spots, so that the antifreeze can fully and evenly contact the heat-conducting surface, and improve the overall heat exchange uniformity and heat exchange intensity.

[0030] Preferred options are shown in the appendix. Figure 1 To be continued Figure 8The auxiliary guide vane 24 and the S-shaped guide fin 23 form a swirling angle of 30 degrees. The 30-degree swirling angle enables the local water flow to form a controllable swirling stagnation state, avoiding the antifreeze from flowing through too quickly and causing insufficient heat exchange. It effectively prolongs the effective contact time between the antifreeze and the high-temperature heat-conducting surface, allowing the antifreeze to fully absorb heat and significantly improving the heat absorption efficiency of a single cycle.

[0031] Preferred options are shown in the appendix. Figure 1 To be continued Figure 8 The S-shaped guide fin 23 has a rectangular protrusion 25 on its left side. The height of the rectangular protrusion 25 is the same as the height of the S-shaped guide fin 23. The rectangular protrusion 25 has several sets of rectangular grooves 26 on the side close to the S-shaped guide fin 23. The rectangular protrusion 25 and the rectangular grooves 26 cooperate with each other to regulate and guide the flow of antifreeze, suppress the generation of local eddies and stagnant areas, ensure uniform flow velocity distribution and balanced temperature transfer inside the flow channel, and avoid local overheating or insufficient local heat exchange.

[0032] Preferred options are shown in the appendix. Figure 1 To be continued Figure 8 The upper end of the rectangular protrusion 25 is provided with a power tube placement groove 28, which is located on the outside of the equipment mounting groove 29. The equipment mounting groove 29 is installed from top to bottom with a heat insulation layer 3, a thick film heater 4, and an inorganic heat-conducting layer 5. The heat insulation layer 3 is made of two-component potting silicone, which can effectively prevent the heat generated by the thick film heater from dissipating upwards, so that the heat is concentrated and conducted downwards to the antifreeze, thereby improving the thermal energy utilization rate. The inorganic heat-conducting layer 5 is made of high-temperature resistant and high-thermal-conductivity inorganic material (silicon carbide), with a thickness of 0.1mm to 0.3mm, a thermal conductivity of 15W / m·K or higher, and a high temperature resistance of 500℃ or higher. It can realize seamless and efficient heat transfer between the thick film heater and the heat-conducting shell, ensuring heating response speed and heating efficiency.

[0033] Preferred options are shown in the appendix. Figure 8 To be continued Figure 11 The spiral guide component 16 includes a fixed column 161, with a water flow channel 162 in the middle of the fixed column 161. The opening of the water flow channel 162 gradually decreases in size from the outlet to enhance the drainage effect. A small bearing is fixedly installed at the upper end of the fixed column 161, and a rotating impeller 163 is rotatably installed on the small bearing. The tapering structure of the water flow channel 162 can contract and accelerate the water flow, increasing the water flow velocity and impact force. The high-speed water flow impact drives the rotating impeller 163 to rotate continuously. The rotating impeller can break the boundary layer on the surface of the antifreeze, forming a dynamic forced turbulence. This, together with the upper S-shaped guide fins 23 and auxiliary guide fins 24, achieves a multi-stage enhanced heat exchange effect, significantly improving the overall heat dissipation and heating efficiency.

[0034] Preferred options are shown in the appendix. Figure 8 To be continued Figure 12 The thick film heater 4 uses an alumina substrate thick film heating plate, including a printed insulating layer 42 and an alumina substrate 45; a printed resistive heating layer 43 is provided between the printed insulating layer 42 and the alumina substrate 45; a printed electrode layer 44 and a chip thermistor 46 are fixedly connected to the front end of the alumina substrate 45; a copper strip electrode assembly 41 is electrically connected between the printed insulating layer 42, the printed resistive heating layer 43 and the alumina substrate 45; the alumina substrate has high insulation and withstand voltage, fast thermal conductivity, and strong high temperature resistance, and does not come into direct contact with antifreeze, fundamentally avoiding corrosion, pollution, crystallization, scaling and vibration noise problems. The thick film heater is made through multiple printing and sintering processes. The chip thermistor 46 can monitor the temperature accurately in real time, realize rapid temperature protection and overheat control, and improve the stability and safety of the device operation.

[0035] Preferred options are shown in the appendix. Figure 8 To be continued Figure 12 The thick film heater 4 is an alumina substrate thick film heating plate, using a 95 or 96 ceramic alumina substrate, which is formed into a conductive layer, a heating resistance layer and an insulating layer through multiple printing and sintering processes.

[0036] Specific usage of this invention: During operation, the thick-film heater 4 serves as the core heating component. Through the printed resistive heating layer 43, electrical energy is efficiently converted into heat energy. The heat is then rapidly conducted through the alumina substrate 45 and the inorganic thermally conductive layer 5 to the thermally conductive housing 21 and boss 22 of the flow channel thermally conductive assembly 2, achieving directional heat transfer to the antifreeze within the liquid mounting cavity 15. The inorganic thermally conductive layer 5 possesses high thermal conductivity and high-temperature resistance, ensuring lossless, rapid, and stable heat transfer to the thermally conductive housing 21. This prevents heat accumulation that could overheat and damage the thick-film heater 4. Simultaneously, the alumina substrate 45 does not directly contact the antifreeze, fundamentally eliminating corrosion, scaling, vibration, and abnormal noise problems.

[0037] The antifreeze inside the liquid mounting cavity 15 enters through the inlet 12 under the action of an external water pump. After being uniformly guided by the inlet guide shroud 17, it fills the entire flow channel cavity. The water flow first contacts the spiral guide 16. The water flow groove 162 in the middle of the fixed column 161 has a gradually narrowing structure, which allows the water flow to accelerate rapidly and impact the rotating impeller 163, driving the impeller to rotate and forming dynamic turbulence, breaking the antifreeze boundary layer and improving the local heat exchange efficiency. The radial turbulence water flow generated by the rotation of the rotating impeller 163 can directly act on the... The S-shaped guide fins 23 and auxiliary guide fins 24 at the top push the high-speed water flow evenly to various areas of the heat-conducting surface. Together with the S-shaped guide fins 23 and auxiliary guide fins 24, they form multi-level turbulence, allowing the water flow to fully contact the high-temperature heat-conducting surface. At the same time, the small grooves 14 at the bottom of the flow channel shell 11 correspond to the fixed column 161, providing stable support for the spiral guide 16, preventing loosening and displacement under the impact of high-speed water flow, further enhancing water flow disturbance and structural stability, and avoiding water flow stagnation that could form a heat exchange dead zone.

[0038] The accelerated antifreeze enters the flow channel area formed by the S-shaped guide fins 23. The S-shaped guide fins 23 significantly extend the effective heat exchange path and increase the overall heat exchange area, allowing the water flow to contact the heat-conducting surface for a longer period of time. The auxiliary guide fins 24 further divide, guide, and accelerate the water flow between the S-shaped guide fins 23, filling the flow blind areas between the fins and preventing water flow stratification and short-circuiting. The auxiliary guide fins 24, which are staggered between the fins, form a 30° swirling angle with the S-shaped guide fins 23, providing secondary guidance and acceleration to the water flow, ensuring that the antifreeze adheres tightly to the boss 22 and the heat-conducting shell. The surface flow of body 21 enhances heat exchange; the 30° swirling angle allows the local water flow to form a controllable swirling and stagnant state, allowing the antifreeze that has not fully absorbed heat to stay briefly and continue to absorb heat. Compared with the traditional flow channel mode where the water flows through and quickly carries away heat, this structure can significantly extend the effective heat exchange time, improve the heat absorption efficiency of a single cycle, and avoid the problems of insufficient heat exchange and low heating efficiency; the rectangular protrusion 25 and the rectangular groove 26 cooperate to further divide the water flow, eliminate local eddies, balance the pressure and velocity distribution in the flow channel, ensure heat exchange uniformity, and prevent local overheating or insufficient local heat exchange.

[0039] After sufficient heat exchange within the S-shaped flow channel, the water is guided by the outlet guide shroud 18 and smoothly discharged from the outlet 13, forming a continuous circulating heat exchange loop to continuously provide a stable heat source for the thermal management system of new energy vehicles. The insulation layer 3 in the equipment installation tank 29 prevents heat loss upwards, allowing heat to be concentrated and conducted downwards to the antifreeze, improving overall heating and heat dissipation efficiency and reducing energy loss. The thick film heater 4 is equipped with a surface-mount thermistor 46 that monitors the temperature accurately in real time. Combined with the high insulation, high thermal conductivity, and high temperature resistance of the alumina substrate 45, it ensures that the device can start up quickly and operate stably under low temperature conditions of -40℃ to -10℃ and low voltage conditions of 100V to 280V. There is no corrosion, no scaling, no vibration or abnormal noise, and no risk of overheating or temperature loss throughout the process, achieving efficient, safe, and continuous heat exchange operation.

[0040] The heat dissipation device of the thick film high-pressure heater of the present invention, through the matching arrangement of the thick film heater 4 and the inorganic heat-conducting layer 5, allows the thick film heater 4 to be completely placed inside the equipment mounting groove 29, forming a physical isolation state from the antifreeze in the liquid mounting cavity 15, so that it will not directly contact the liquid, effectively avoiding damage such as corrosion, erosion and scaling of the heating body caused by the antifreeze; at the same time, it eliminates the potential for vibration and abnormal noise caused by the substrate directly contacting the liquid, ensuring that the heater body is in a stable and reliable working state for a long time, thereby achieving the beneficial effects of extending the overall service life of the device and improving the operational stability.

[0041] The heat dissipation device of the thick film high-pressure heater of the present invention forms a multi-level disturbance and long-distance flow guiding structure inside the liquid mounting cavity 15 through the sequential linkage of the spiral guide 16, the S-shaped guide fins 23 and the auxiliary guide fins 24. This causes the antifreeze to be continuously disturbed, dispersed and guided during the flow process, effectively breaking the boundary layer formed during the liquid flow process. This significantly extends the contact path and contact time between the antifreeze and the heat-conducting shell 21 and the heat-conducting surfaces such as the boss 22, avoiding water flow short circuits and heat exchange blind spots. This achieves the beneficial effects of enhancing heat exchange efficiency, improving overall heat exchange uniformity, and ensuring a more thorough heating and heat dissipation process.

[0042] The heat dissipation device of the thick film high-pressure heater of the present invention, through the structural cooperation of the heat insulation layer 3 and the heat conduction component 2 of the flow channel, effectively collects and directionally conducts the heat energy generated by the thick film heater 4, prevents the heat from being disorderly lost to the upper space, and makes the heat energy more concentratedly transferred to the antifreeze in the liquid mounting cavity 15, making full use of heat energy resources and reducing energy loss; at the same time, with the high thermal conductivity and high insulation characteristics of the alumina substrate 45, it ensures efficient and stable heat transfer, avoids the risk of local overheating, and thus achieves the beneficial effects of improving heat energy utilization, reducing device energy consumption, and ensuring stable and safe operation of the device in complex environments.

[0043] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A heat dissipating device of a thick-film high-pressure heater, comprising a flow channel shell assembly (1), a flow channel heat conduction assembly (2) is fixedly installed above the flow channel shell assembly (1), characterized in that: A liquid mounting cavity (15) is provided between the flow channel housing assembly (1) and the flow channel heat conduction assembly (2), and an equipment mounting groove (29) is provided inside the flow channel heat conduction assembly (2). The equipment mounting slot (29) is fixedly installed with a heat insulation layer (3), a thick film heater (4) and an inorganic heat-conducting layer (5); the flow channel heat-conducting assembly (2) is provided with several sets of S-shaped flow guide fins (23), and the flow channel shell assembly (1) is provided with a spiral flow guide (16). The S-shaped guide fin (23) is provided with an auxiliary guide fin (24), and the liquid mounting cavity (15) is filled with antifreeze. The bottom of the flow channel housing (11) is provided with several sets of small grooves (14), and the inside of the flow channel housing (11) is provided with a liquid mounting cavity (15). Several sets of spiral guides (16) are fixedly installed inside the liquid mounting cavity (15), and the spiral guides (16) correspond to the small grooves (14). The heat conduction assembly (2) includes a heat conduction shell (21), the heat conduction shell (21) is provided with a downward protruding boss (22), the boss (22) is provided with a number of S-shaped guide fins (23), and auxiliary guide fins (24) are provided on the inner wall of each pair of S-shaped guide fins (23) on opposite sides. Each pair of auxiliary guide fins (24) are arranged in an alternating manner. The upper opening of the heat conduction shell (21) is provided with a rubber strip mounting groove (27). The auxiliary guide vane (24) and the S-shaped guide fin (23) form a swirling angle, the swirling angle being 30 degrees; The left side of the S-shaped guide fin (23) is provided with a rectangular protrusion (25), the height of the rectangular protrusion (25) is the same as the height of the S-shaped guide fin (23), and the rectangular protrusion (25) is provided with several sets of rectangular grooves (26) on the side of the rectangular protrusion (25) close to the S-shaped guide fin (23). The upper end of the rectangular protrusion (25) is provided with a power tube placement groove (28), which is located on the outside of the equipment mounting groove (29). The equipment mounting groove (29) is provided with a heat insulation layer (3), a thick film heater (4) and an inorganic heat-conducting layer (5) installed from top to bottom inside. The spiral guide (16) includes a fixed column (161), and a turbulent channel (162) is provided in the middle of the fixed column (161). The opening of the turbulent channel (162) decreases from large to small at the outlet to enhance the drainage effect. A small bearing is fixedly installed at the upper end of the fixed column (161), and a turbulent impeller (163) is rotatably installed on the small bearing.

2. A heat sink for a thick-film high-voltage heater according to claim 1, characterized in that: The flow channel housing assembly (1) includes a flow channel housing (11), with an inlet (12) and an outlet (13) fixedly connected to the outside of the flow channel housing (11). The inlet (12) and the outlet (13) are respectively equipped with an inlet guide hood (17) and an outlet guide hood (18).

3. The heat dissipation device for a thick-film high-pressure heater according to claim 1, characterized in that: The thick film heater (4) includes a printed insulating layer (42) and an alumina substrate (45). A printed resistive heating layer (43) is provided between the printed insulating layer (42) and the alumina substrate (45). A printed electrode layer (44) and a chip thermistor (46) are fixedly connected to the front end of the alumina substrate (45). A copper strip electrode assembly (41) is electrically connected between the printed insulating layer (42), the printed resistive heating layer (43) and the alumina substrate (45).

4. A heat sink for a thick-film high-voltage heater according to claim 3, characterized in that: The thick film heater (4) is an alumina substrate thick film heating plate, using a 95 or 96 ceramic alumina substrate, which is formed by multiple printing and sintering to create a conductive layer, a heating resistance layer and an insulating layer.

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