A surface data driven CMP interbedded multiple elimination method and device

Abstract

This invention discloses a surface data-driven method and apparatus for eliminating interlayer multiples in the CMP domain. The method includes: acquiring preprocessed seismic data common centroid CMP gathers; performing gather augmentation processing on the CMP gathers to obtain a first CMP supergather and then performing noise reduction processing to obtain a second CMP supergather; performing wavefield separation on the second CMP supergather to obtain CMP gather data of wavefield below a specified depth retained by top shearing and CMP gather data of wavefield above a specified depth retained by bottom shearing; performing time-domain inversion and zero-padding on the bottom-sheared wavefield data and then performing f-k domain transformation; performing zero-padding on the top-sheared wavefield data and then performing f-k domain transformation; substituting the f-k domain data into a preset interlayer multiple prediction formula to predict interlayer multiples; and adaptively subtracting interlayer multiples from the preprocessed CMP gathers to obtain the target CMP gather.

Description

Technical Field

[0001] This invention relates to the field of computer technology, and in particular to a surface data-driven method and apparatus for eliminating interlayer multiples in the CMP domain. Background Technology

[0002] Interlayer multiples are one of the major disturbances in seismic exploration data processing. Their generation mechanism involves multiple reflections between two or more strong reflection interfaces underground, leading to false phase axes in the seismic record and posing significant challenges to subsequent velocity analysis, imaging, and geological interpretation. Therefore, effectively suppressing or eliminating interlayer multiples has always been a core challenge in the field of seismic data processing.

[0003] Existing surface data-driven layer-dependent interlayer multiple cancellation methods, based on feedback iterative models, can effectively predict and eliminate interlayer multiples associated with multiple subsurface reflection interfaces using surface data. However, this method requires shot gather data and places high demands on the signal-to-noise ratio and spatial sampling density of the seismic data. Real-world seismic data, especially onshore seismic data, is affected by complex near-surface conditions, suffers from severe noise interference, and has limited spatial sampling, making it difficult to meet computational requirements. Therefore, this method has certain limitations in practical applications. Summary of the Invention

[0004] The purpose of this invention is to provide a surface data-driven method, apparatus, and electronic device for eliminating interlayer multiples in the CMP domain, which can solve the problem of strong limitations in the prior art.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: This invention provides a surface data-driven method for CMP domain interlayer multiple cancellation, wherein the method includes: Obtain the common centroid (CMP) gather of the preprocessed seismic data; The CMP gather is subjected to gather augmentation processing to obtain the first CMP super gather, and the first CMP super gather is subjected to noise reduction processing to obtain the second CMP super gather. Wavefield separation is performed on the second CMP super gather to obtain wavefield CMP gather data below a specified depth that is retained by top cutting and wavefield CMP gather data above a specified depth that is retained by bottom cutting; The wavefield CMP gather data above the specified depth preserved by bottom cutting is time-domain inverted and zero-padded, and the wavefield CMP gather data below the specified depth preserved by top cutting is zero-padded to obtain the third CMP super gather; The zero-padding CMP gather data below the specified depth of the wavefield is transformed in the fk domain to obtain the fk domain data of the CMP gather below the specified depth of the wavefield that was cut and retained. The fk-domain transformation is performed on the undercut CMP gather data above the specified depth after zero-padding to obtain the undercut CMP gather data above the specified depth. Substituting the fk domain data of the CMP gather below the specified depth preserved by top cutting and the fk domain data of the CMP gather above the specified depth preserved by bottom cutting into the preset interlayer multiple prediction formula, interlayer multiples are predicted. The interlayer multiples are adaptively subtracted from the preprocessed CMP gather to obtain the target CMP gather.

[0006] Optionally, the steps of performing gather augmentation processing on the CMP gather to obtain a first CMP super gather, and performing noise reduction processing on the first CMP super gather to obtain a second CMP super gather, include: Merge adjacent CMP gathers to obtain the first CMP super gather; Interpolate the missing data and / or sparse data in the first CMP super set to obtain the interpolated first CMP super set; The first CMP super gather after interpolation is subjected to velocity analysis, dynamic correction and smoothing filtering to obtain the second CMP super gather.

[0007] Optionally, the step of performing wavefield separation processing on the second CMP super gather includes: The second CMP super gather is subjected to top-cutting processing to obtain the wave field below the specified interface; The second CMP super gather is undercut to obtain the wave field above the specified interface; The wavefields obtained from the top-cutting and bottom-cutting processes are subjected to reaction correction, and only the data within the first Fresnel band is retained by the cone filter to obtain the second CMP super gather after wavefield separation processing.

[0008] Optionally, the steps of zero-padding the wavefield CMP gather data below the specified depth preserved by top-cutting and performing time-domain inversion and zero-padding on the wavefield CMP gather data above the specified depth preserved by bottom-cutting to obtain the third CMP super gather include: The wavefield CMP gather data above the specified depth that is retained by undercutting is inverted in the time domain; the data after inversion in the time domain is padded with zeros in both time and space. Zero-padding is performed on the wavefield CMP gather data below the specified depth preserved by the top cut to obtain the third CMP super gather.

[0009] This invention also provides a surface data-driven CMP domain interlayer multiple cancellation device, wherein the device includes: The acquisition module is used to acquire the common centroid (CMP) gathers of preprocessed seismic data. The first processing module is used to perform gather augmentation processing on the CMP gather to obtain the first CMP super gather, and to perform noise reduction processing on the first CMP super gather to obtain the second CMP super gather. The second processing module is used to perform wavefield separation on the second CMP super gather to obtain wavefield CMP gather data below a specified depth retained by top cutting and wavefield CMP gather data above a specified depth retained by bottom cutting. The third processing module is used to perform time-domain inversion and zero-padding on the bottom-cut CMP gather data above the specified depth, and to perform zero-padding on the top-cut CMP gather data below the specified depth to obtain a third CMP super gather; the first transformation module is used to perform fk-domain transformation on the zero-padding top-cut CMP gather data below the specified depth to obtain fk-domain data of the top-cut CMP gather below the specified depth. The second transformation module is used to perform fk-domain transformation on the CMP gather data of the wavefield above the specified depth after zero-padding and undercutting to obtain the fk-domain data of the CMP gather data of the wavefield above the specified depth after undercutting. The substitution module is used to substitute the fk domain data of the CMP gather below the specified depth retained by the top cut and the fk domain data of the CMP gather above the specified depth retained by the bottom cut into a preset interlayer multiple prediction formula to predict the interlayer multiple. The target generation module is used to adaptively subtract the interlayer multiples from the preprocessed CMP gather to obtain the target CMP gather.

[0010] Optionally, the first processing module includes: The first submodule is used to merge adjacent CMP gathers to obtain the first CMP super gather; The second submodule is used to interpolate the missing data and / or sparse data in the first CMP super track set to obtain the interpolated first CMP super track set. The third submodule is used to perform velocity analysis, dynamic correction and smoothing filtering on the interpolated first CMP super gather to obtain the second CMP super gather.

[0011] Optionally, the second processing module includes: The fourth submodule is used to perform top-cutting processing on the second CMP super gather to obtain the wave field below the specified interface; The fifth submodule is used to perform undercutting on the second CMP super gather to obtain the wave field above the specified interface; The correction submodule is used to perform reaction correction on the wavefields obtained from the top-cutting and bottom-cutting processes, and to retain only the data within the first Fresnel band through conical filtering to obtain the second CMP super gather after wavefield separation processing.

[0012] Optionally, the third processing module is specifically used for: The wavefield CMP gather data above a specified depth preserved by undercutting is inverted in the time domain; The data, after being reversed in the time domain, is padded with zeros in both time and space. Zero-padding is performed on the wavefield CMP gather data below the specified depth preserved by the top cut to obtain the third CMP super gather.

[0013] This invention provides an electronic device, which includes a processor, a memory, and a program or instructions stored in the memory and executable on the processor. When the program or instructions are executed by the processor, they implement the steps of any of the above-described surface data-driven CMP domain interlayer multiple cancellation methods.

[0014] This invention provides a readable storage medium storing a program or instructions that, when executed by a processor, implement the steps of any of the above-described surface data-driven CMP domain interlayer multiple cancellation methods.

[0015] The surface data-driven CMP domain interlayer multiple elimination scheme provided in this invention extends the traditional surface data-driven, layer-dependent interlayer multiple elimination method to Common Middle Point (CMP) gathers. Multiple elimination is applied to CMP gathers to obtain target CMP supergathers. Firstly, CMP gathers are suitable for noise attenuation, offset regularization, and interpolation; for example, several adjacent CMP gathers can form a supergather with a higher signal-to-noise ratio and denser spatial sampling. Secondly, the multiple prediction process only involves data from a single CMP gather, eliminating the need for complex gather sorting and avoiding huge buffer space requirements. This not only avoids the problems of existing technologies where onshore seismic data is affected by complex near-surface conditions, resulting in severe noise interference and limited spatial sampling, making it difficult to meet computational needs, but also makes the computation process more efficient. Attached Figure Description

[0016] Figure 1 This is a flowchart illustrating the steps of a surface data-driven CMP domain interlayer multiple cancellation method according to an embodiment of this application; Figure 2 This is a flowchart illustrating the steps of another surface data-driven CMP domain interlayer multiple cancellation method according to an embodiment of this application; Figure 3This is a structural block diagram illustrating a surface data-driven CMP domain interlayer multiple cancellation device according to an embodiment of this application. Detailed Implementation

[0017] To make the technical problems, technical solutions and advantages of the present invention clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0018] The following description, in conjunction with the accompanying drawings, details the surface data-driven CMP domain interlayer multiple elimination scheme provided in this application through specific embodiments and application scenarios.

[0019] In the embodiments of this application.

[0020] As attached Figure 1 As shown, the surface data-driven CMP domain interlayer multiple cancellation method of this application includes the following steps: Step 101: Obtain the preprocessed seismic data common centroid (CMP) gather.

[0021] CMP gathers are a core data organization format in seismic data processing, and their preprocessing operations directly affect subsequent velocity analysis, dynamic correction, stacking, and imaging quality. Preprocessing operations for CMP gathers can include the following: Denoising operations: Suppress random noise, surface waves, multiple waves and other interferences through wavelet transform, FK filtering, predictive deconvolution or model-based methods (such as low-rank decomposition, sparse representation) to improve the signal-to-noise ratio.

[0022] ‌Static correction operation: Correcting time differences caused by surface elevation variations and near-surface low-velocity layers involves the following process: Reference plane selection: A two-step strategy of "floating first, then fixing" is usually adopted to reduce waveform distortion.

[0023] Near-surface modeling: using microseismic logging or first-arrival inversion to obtain the velocity and thickness of the weathering layer.

[0024] Residual static correction: After dynamic correction, iterative optimization is performed based on the continuity of the reflection phase axis to correct the residual time difference.

[0025] Dynamic calibration operation: Eliminating the normal time difference caused by the shot-receiver distance, correcting the reflected wave time-distance curve to zero shot-receiver distance time, and flattening the phase axis create conditions for superposition.

[0026] True amplitude recovery operation: Compensate for geometric diffusion and medium absorption during seismic wave propagation to restore the accuracy of amplitude.

[0027] Deconvolution operation: compresses the source wavelet, improves time resolution, and enhances the clarity of the reflection interface.

[0028] Preprocessing of CMP gathers of seismic data can include, but is not limited to, the preprocessing operations listed above. Anyone skilled in the art can choose any other appropriate preprocessing operation according to actual needs. In addition, those skilled in the art can also flexibly combine the preprocessing methods listed above.

[0029] In one optional embodiment, the CMP gather is subjected to offset regularization to ensure that the data is uniform in offset distribution.

[0030] Step 102: Perform gather augmentation processing on the CMP gather to obtain the first CMP super gather, and perform noise reduction processing on the first CMP super gather to obtain the second CMP super gather.

[0031] This step involves CMP gather enhancement, velocity analysis, and dynamic correction processing.

[0032] In an optional embodiment, the method of performing gather augmentation processing on the CMP gather to obtain a first CMP super gather, and performing noise reduction processing on the first CMP super gather to obtain a second CMP super gather may include the following sub-steps: First, adjacent CMP gathers are merged to obtain the first CMP super gather.

[0033] Merging adjacent CMP channels to construct a super-channel set and refining spatial sampling can improve the signal-to-noise ratio.

[0034] Secondly, the missing data and / or sparse data in the first CMP super set are interpolated to obtain the interpolated first CMP super set.

[0035] Interpolating missing or sparse data can improve the spatial sampling density of the data.

[0036] Finally, velocity analysis, dynamic correction, and smoothing filtering are performed on the interpolated first CMP super gather to obtain the second CMP super gather.

[0037] When performing velocity analysis, the root mean square velocity can be obtained. It should be noted that the velocity is obtained here to facilitate data over- or under-cutting operations; high velocity accuracy is not required, and velocity information is not needed in the multiple wave prediction process.

[0038] Dynamic correction and smoothing filtering can further suppress data noise.

[0039] Step 103: Perform wavefield separation on the second CMP super gather to obtain wavefield CMP gather data below the specified depth retained by top cutting and wavefield CMP gather data above the specified depth retained by bottom cutting.

[0040] In one optional embodiment, wavefield separation of the second CMP super gather may include the following sub-steps: Sub-step 1: Perform top-cutting processing on the second CMP super gather to obtain the wave field below the specified interface; Sub-step 2: Perform undercut processing on the second CMP super gather to obtain the wave field above the specified interface; Sub-step 3: Perform reaction correction on the wavefields obtained from the top-cutting and bottom-cutting processes, and retain only the data within the first Fresnel band through conical filtering to obtain the second CMP super gather after wavefield separation processing.

[0041] The wavefield shape before dynamic correction can be restored through reaction correction. Conical filtering can reduce the impact of invalid data on multiple wave prediction.

[0042] Step 104: Perform time-domain inversion and zero-padding on the wavefield CMP gather data above the specified depth retained by bottom cutting, and zero-padding on the wavefield CMP gather data below the specified depth retained by top cutting to obtain the third CMP super gather.

[0043] The third CMP super gather includes: zero-padding top cut retains wavefield CMP gather data below the specified depth, and zero-padding bottom cut retains wavefield CMP gather data above the specified depth.

[0044] In an optional embodiment, the step of performing time-domain inversion and zero-padding on the wavefield CMP gather data above the specified depth retained by bottom cutting, and zero-padding on the wavefield CMP gather data below the specified depth retained by top cutting, to obtain the third CMP super gather, may include the following sub-steps: The wavefield CMP gather data above the specified depth preserved by bottom cutting is inverted in the time domain; the data after inversion in the time domain is zero-padded in both time and space; the wavefield CMP gather data below the specified depth preserved by top cutting is zero-padded to obtain the third CMP super gather.

[0045] Padding zeros in time and space can improve the accuracy of Fourier transform and avoid aliasing of predicted multiples.

[0046] Step 105: Perform fk-domain transformation on the zero-padding, top-cut retained wavefield CMP gather data below the specified depth to obtain the fk-domain data of the top-cut retained wavefield CMP gather below the specified depth.

[0047] In this step, when performing fk-domain transformation on the wavefield CMP gather data below the specified depth preserved by top cutting, the prepared CMP gather data can be converted to the fk-domain through two-dimensional Fourier transform.

[0048] Step 106: Perform fk-domain transformation on the zero-padding bottom-cut CMP gather data above the specified depth to obtain the fk-domain data of the bottom-cut bottom-cut CMP gather above the specified depth.

[0049] In this step, when performing fk-domain transformation on the wavefield CMP gather data above the specified depth preserved by undercutting, the prepared CMP gather data can also be converted to the fk-domain through two-dimensional Fourier transform.

[0050] Step 107: Substitute the fk domain data of the CMP gather below the specified depth retained by top cutting and the fk domain data of the CMP gather above the specified depth retained by bottom cutting into the preset interlayer multiple prediction formula to predict the interlayer multiple.

[0051] The surface data-driven, layer-dependent interlayer multiple prediction process can be represented as: (1) in, For the predicted multiple waves, Represents the earth's surface. This indicates that both the excitation and receiver points are on the Earth's surface, and the entire wavefield above the specified depth has been removed. This indicates that both the excitation and receiver points are on the Earth's surface, and the primary wave field below a specified depth has been removed. (Superscript) This indicates the search for conjugate.

[0052] Under conditions of gentle subsurface structure, CMP gathers can be considered as single-shot records under horizontally layered media conditions. Therefore, in this application, the spatial convolution between different gathers in equation (1) is replaced by element-wise multiplication of CMP gather data in the frequency-wavenumber (fk) domain. This allows for multiple wave prediction for each CMP gather. The prediction process for interlayer multiple waves is calculated in the fk domain, specifically expressed as follows: (2) Formula (2) is the preset inter-layer multiple prediction formula in this application, which enables the prediction of inter-layer multiples. Wherein, Indicates wave number, Represents angular frequency. In order to be in f - k Multiple waves predicted by the domain, This indicates that the top cut retains the wavefield CMP gather below the specified depth. f - k Domain data, which we refer to here as the multiple wave response term, This indicates that the CMP gather retains the first wavefield above the specified depth after bottom cutting and time reversal. f - kDomain data. Finally, we achieved inter-layer multiple elimination by adaptively subtracting the predicted multiples from the preprocessed CMP gather.

[0053] Multiple wave prediction is performed using a preset interlayer multiple wave prediction formula, which only involves element-wise multiplication of the fk domain data, thus improving computational efficiency.

[0054] Step 108: Adaptively subtract interlayer multiples from the preprocessed CMP gather to obtain the target CMP gather.

[0055] In this step, the predicted interlayer multiples are adaptively subtracted from the original data, i.e., the preprocessed CMP gather, to obtain the multiple-eliminated CMP gather, i.e., the target CMP gather, which is used for subsequent imaging or interpretation.

[0056] The surface data-driven CMP domain interlayer multiple elimination method provided in this application extends the traditional surface data-driven layer-related interlayer multiple elimination method to CMP gathers. Applying multiple elimination to CMP gathers yields a target CMP gather. Firstly, CMP gathers are suitable for processing such as noise attenuation, offset regularization, and interpolation. For example, several adjacent CMP gathers can be combined to form a supergathering with a higher signal-to-noise ratio and denser spatial sampling. Secondly, the multiple prediction process only involves data from a single CMP gather, eliminating the need for complex gather sorting and avoiding huge buffer space requirements. This not only avoids the problems of existing technologies where onshore seismic data is affected by complex near-surface conditions, resulting in severe noise interference and limited spatial sampling, making it difficult to meet computational needs, but also makes the computation process more efficient.

[0057] The following reference Figure 2 A specific example is used to illustrate the surface data-driven CMP domain interlayer multiple elimination method provided in the embodiments of this application.

[0058] The surface data-driven CMP domain interlayer multiple elimination method includes the following process: Obtain the common centroid (CMP) gather of the preprocessed seismic data and perform offset regularization. Merge adjacent CMP gathers to construct a supergather; The super gather is sequentially subjected to data interpolation, dynamic correction, and balanced filtering. Top cut preserves the wave field below the specified interface; bottom cut preserves the wave field above the specified interface. The wavefields preserved by top and bottom shearing are subjected to reaction correction; By using a cone filter, only the data within the first Fresnel band is retained, reducing the impact of invalid data on the multiple wave prediction results; Time-reverse the data after cone filtering; Padding the data with zeros in time and space improves the accuracy of the Fourier transform and avoids the predicted multiple waves from aliasing to the wrong location; After the wavefields preserved by top and bottom shearing are processed through the above process, fk transform is performed on them respectively to obtain the transformed fk domain data; Based on formula (2), i.e. the preset inter-layer multiple prediction formula, the CMP domain multiple prediction results are obtained. The prediction results are adaptively subtracted to remove interlayer multiples, resulting in the CMP gather after multiple elimination, which is the target CMP gather.

[0059] Figure 3 The structural block diagram of the surface data-driven CMP domain interlayer multiple cancellation device is shown in the embodiment of this application.

[0060] The surface data-driven CMP domain interlayer multiple cancellation device provided in this application includes the following functional modules: Module 301 is used to acquire the common centroid (CMP) gather of preprocessed seismic data. The first processing module 302 is used to perform gather addition processing on the CMP gather to obtain a first CMP super gather, and to perform noise reduction processing on the first CMP super gather to obtain a second CMP super gather. The second processing module 303 is used to perform wavefield separation on the second CMP super gather to obtain wavefield CMP gather data below a specified depth retained by top cutting and wavefield CMP gather data above a specified depth retained by bottom cutting. The third processing module 304 is used to perform time-domain inversion and zero-padding on the wavefield CMP gather data above the specified depth that is retained by bottom cutting, and to perform zero-padding on the wavefield CMP gather data below the specified depth that is retained by top cutting, so as to obtain the third CMP super gather. The first transformation module 305 is used to perform fk-domain transformation on the zero-padding top-cut retained wavefield CMP gather data below the specified depth to obtain the fk-domain data of the top-cut retained wavefield CMP gather below the specified depth. The second transformation module 306 is used to perform fk-domain transformation on the zero-padding and undercutting CMP gather data of the wave field above the specified depth to obtain the fk-domain data of the undercutting and undercutting CMP gather data of the wave field above the specified depth. Substitution module 307 is used to substitute the fk domain data of the wavefield CMP gather below the specified depth retained by top cutting and the fk domain data of the wavefield CMP gather above the specified depth retained by bottom cutting into a preset interlayer multiple prediction formula to predict interlayer multiples. The target generation module 308 is used to adaptively subtract the interlayer multiples from the preprocessed CMP gather to obtain the target CMP gather.

[0061] Optionally, the first processing module includes: The first submodule is used to merge adjacent CMP gathers to obtain the first CMP super gather; The second submodule is used to interpolate the missing data and / or sparse data in the first CMP super track set to obtain the interpolated first CMP super track set. The third submodule is used to perform velocity analysis, dynamic correction and smoothing filtering on the interpolated first CMP super gather to obtain the second CMP super gather.

[0062] Optionally, the second processing module includes: The fourth submodule is used to perform top-cutting processing on the second CMP super gather to obtain the wave field below the specified interface; The fifth submodule is used to perform undercutting on the second CMP super gather to obtain the wave field above the specified interface; The correction submodule is used to perform reaction correction on the wavefields obtained from the top-cutting and bottom-cutting processes, and to retain only the data within the first Fresnel band through conical filtering to obtain the second CMP super gather after wavefield separation processing.

[0063] Optionally, the third processing module is specifically used for: The wavefield CMP gather data above a specified depth preserved by undercutting is inverted in the time domain; The data, after being reversed in the time domain, is padded with zeros in both time and space. Zero-padding is performed on the wavefield CMP gather data below the specified depth preserved by the top cut to obtain the third CMP super gather.

[0064] The surface data-driven CMP domain interlayer multiple elimination device provided in this application extends the traditional surface data-driven, layer-dependent interlayer multiple elimination method to CMP gathers. Applying multiple elimination to CMP gathers yields a target CMP gather. Firstly, CMP gathers are suitable for processing such as noise attenuation, offset regularization, and interpolation. For example, several adjacent CMP gathers can be combined to form a supergathering with a higher signal-to-noise ratio and denser spatial sampling. Secondly, the multiple prediction process only involves data from a single CMP gather, eliminating the need for complex gather sorting and avoiding huge buffer space requirements. This not only avoids the problems of existing technologies where onshore seismic data is affected by complex near-surface conditions, resulting in severe noise interference and limited spatial sampling, making it difficult to meet computational needs, but also makes the computation process more efficient.

[0065] In the embodiments of this application Figure 3The surface data-driven CMP domain interlayer multiple cancellation device shown can be a device with an operating system. This operating system can be any suitable computer operating system, such as Windows, and this application embodiment does not impose specific limitations.

[0066] The embodiments provided in this application Figure 3 The surface data-driven CMP domain interlayer multiple cancellation device shown can achieve Figure 1 The various processes implemented in the method implementation examples will not be described again here to avoid repetition.

[0067] Optionally, embodiments of this application also provide an electronic device, including a processor, a memory, and a program or instructions stored in the memory and executable on the processor. When the program or instructions are executed by the processor, they implement the various processes of the above-described surface data-driven CMP domain interlayer multiple wave cancellation method and achieve the same technical effect. To avoid repetition, they will not be described again here.

[0068] It should be noted that the electronic device in this application embodiment includes the server described above.

[0069] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk.

[0070] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0071] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A surface data-driven method for eliminating interlayer multiples in the CMP domain, characterized in that, The method includes: Obtain the common centroid (CMP) gather of the preprocessed seismic data; The CMP gather is subjected to gather augmentation processing to obtain the first CMP super gather, and the first CMP super gather is subjected to noise reduction processing to obtain the second CMP super gather. Wavefield separation is performed on the second CMP super gather to obtain wavefield CMP gather data below a specified depth that is retained by top cutting and wavefield CMP gather data above a specified depth that is retained by bottom cutting; The wavefield CMP gather data above the specified depth preserved by bottom cutting is time-domain inverted and zero-padded, and the wavefield CMP gather data below the specified depth preserved by top cutting is zero-padded to obtain the third CMP super gather; The zero-padding CMP gather data below the specified depth of the wavefield is transformed in the fk domain to obtain the fk domain data of the CMP gather below the specified depth of the wavefield that was cut and retained. The zero-padding CMP gather data of the wavefield above the specified depth with undercut preservation is transformed in the fk domain to obtain the fk domain data of the CMP gather data of the wavefield above the specified depth with undercut preservation. Substituting the fk domain data of the CMP gather below the specified depth preserved by top cutting and the fk domain data of the CMP gather above the specified depth preserved by bottom cutting into the preset interlayer multiple prediction formula, interlayer multiples are predicted. The interlayer multiples are adaptively subtracted from the preprocessed CMP gather to obtain the target CMP gather.

2. The method according to claim 1, characterized in that, The steps of performing gather augmentation on the CMP gather to obtain a first CMP super gather, and then performing noise reduction on the first CMP super gather to obtain a second CMP super gather, include: Merge adjacent CMP gathers to obtain the first CMP super gather; Interpolate the missing data and / or sparse data in the first CMP super set to obtain the interpolated first CMP super set; The first CMP super gather after interpolation is subjected to velocity analysis, dynamic correction and smoothing filtering to obtain the second CMP super gather.

3. The method according to claim 1, characterized in that, The steps for performing wavefield separation processing on the second CMP super gather include: The second CMP super gather is subjected to top-cutting processing to obtain the wave field below the specified interface; The second CMP super gather is undercut to obtain the wave field above the specified interface; The wavefields obtained from the top-cutting and bottom-cutting processes are subjected to reaction correction, and only the data within the first Fresnel band is retained by the cone filter to obtain the second CMP super gather after wavefield separation processing.

4. The method according to claim 1, characterized in that, The steps of zero-padding the wavefield CMP gather data below the specified depth preserved by top-cutting, and performing time-domain inversion and zero-padding on the wavefield CMP gather data above the specified depth preserved by bottom-cutting to obtain the third CMP super gather include: The wavefield CMP gather data above the specified depth that is retained by the undercut is inverted in the time domain; the data after being inverted in the time domain is padded with zeros in both time and space. Zero-padding is performed on the wavefield CMP gather data below the specified depth preserved by the top cut to obtain the third CMP super gather.

5. The method according to claim 1, characterized in that, The preset inter-layer multiple prediction formula is as follows: in, Indicates wave number, Represents angular frequency. In order to be in f - k Multiple waves predicted by the domain, This indicates that the top cut retains the wavefield CMP gather below the specified depth. f - k Domain data, which we refer to here as the multiple wave response term, This indicates that the CMP gather retains the first wavefield above the specified depth after bottom cutting and time reversal. f - k Domain data.

6. A surface data-driven CMP domain interlayer multiple cancellation device, characterized in that, The device includes: The acquisition module is used to acquire the common centroid (CMP) gathers of preprocessed seismic data. The first processing module is used to perform gather augmentation processing on the CMP gather to obtain the first CMP super gather, and to perform noise reduction processing on the first CMP super gather to obtain the second CMP super gather. The second processing module is used to perform wavefield separation on the second CMP super gather to obtain wavefield CMP gather data below a specified depth retained by top cutting and wavefield CMP gather data above a specified depth retained by bottom cutting. The third processing module is used to perform time-domain inversion and zero-padding on the bottom-cut CMP gather data above the specified depth, and to perform zero-padding on the top-cut CMP gather data below the specified depth to obtain a third CMP super gather; the first transformation module is used to perform fk-domain transformation on the zero-padding top-cut CMP gather data below the specified depth to obtain fk-domain data of the top-cut CMP gather below the specified depth. The second transformation module is used to perform fk-domain transformation on the CMP gather data of the wavefield above the specified depth after zero-padding and undercutting to obtain the fk-domain data of the CMP gather data of the wavefield above the specified depth after undercutting. The substitution module is used to substitute the fk domain data of the wavefield CMP gather below the specified depth retained by top cutting and the fk domain data of the wavefield CMP gather above the specified depth retained by bottom cutting into a preset interlayer multiple prediction formula to predict the interlayer multiple. The target generation module is used to adaptively subtract the interlayer multiples from the preprocessed CMP gather to obtain the target CMP gather.

7. The apparatus according to claim 6, characterized in that, The first processing module includes: The first submodule is used to merge adjacent CMP gathers to obtain the first CMP super gather; The second submodule is used to interpolate the missing data and / or sparse data in the first CMP super track set to obtain the interpolated first CMP super track set. The third submodule is used to perform velocity analysis, dynamic correction and smoothing filtering on the interpolated first CMP super gather to obtain the second CMP super gather.

8. The apparatus according to claim 6, characterized in that, The second processing module includes: The fourth submodule is used to perform top-cutting processing on the second CMP super gather to obtain the wave field below the specified interface; The fifth submodule is used to perform undercutting on the second CMP super gather to obtain the wave field above the specified interface; The correction submodule is used to perform reaction correction on the wavefields obtained from the top-cutting and bottom-cutting processes, and to retain only the data within the first Fresnel band through conical filtering to obtain the second CMP super gather after wavefield separation processing.

9. The apparatus according to claim 6, characterized in that, The third processing module is specifically used for: The wavefield CMP gather data above a specified depth preserved by undercutting is inverted in the time domain; The data, after being reversed in the time domain, is padded with zeros in both time and space. Zero-padding is performed on the wavefield CMP gather data below the specified depth preserved by the top cut to obtain the third CMP super gather.

10. An electronic device, characterized in that, The electronic device includes a processor, a memory, and a program or instructions stored in the memory and executable on the processor, wherein the program or instructions are executed by the processor to perform the steps of any of the surface data-driven CMP domain interlayer multiple cancellation methods of claims 1-5.

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