A dual fa coupling device and coupling method

Abstract

This invention provides a dual-FA coupling device and method. The dual-FA coupling device includes a stage, a power-on module, a first multi-degree-of-freedom adjustment mechanism, a second multi-degree-of-freedom adjustment mechanism, a first vision mechanism, and a second vision mechanism. A PCB fixture is mounted on the stage for fixing a PCB board. The power-on module is used to power the PCB board. The first FA fixture is mounted on the first multi-degree-of-freedom adjustment mechanism, and the second FA fixture is mounted on the second multi-degree-of-freedom adjustment mechanism. The first vision mechanism is used to acquire the attitude image of the first FA material, and the second vision mechanism is used to acquire the attitude image of the second FA material. This invention can significantly shorten the coupling time and improve the efficiency of mass production.

Description

Technical Field

[0001] This invention belongs to the field of optical communication technology, specifically relating to a dual-FA coupling device and coupling method. Background Technology

[0002] The disclosed dual-FA coupling scheme involves separate coupling of the transmitter and receiver, requiring two separate coupling systems, which is inefficient and costly. Summary of the Invention

[0003] The purpose of this invention is to overcome at least one defect in the prior art and to provide a dual FA coupling device and coupling method.

[0004] The technical solution of this invention is implemented as follows: This invention provides a dual FA coupling device, comprising:

[0005] A stage, on which a PCB clamp is mounted, the PCB clamp being configured to fix a PCB board;

[0006] A power-on module, configured to power the PCB board;

[0007] A first multi-degree-of-freedom adjustment mechanism is provided, on which a first FA clamp is mounted. The first FA clamp is configured to hold a first FA material. The first multi-degree-of-freedom adjustment mechanism is electrically connected to a control unit. The first multi-degree-of-freedom adjustment mechanism is configured to drive the first FA clamp mounted thereon to move along multiple translational and rotational directions to adjust the posture of the first FA material.

[0008] The second multi-degree-of-freedom adjustment mechanism is equipped with a second FA clamp, which is configured to hold a second FA material. The second multi-degree-of-freedom adjustment mechanism is electrically connected to the control unit and is configured to drive the second FA clamp mounted thereon to move along multiple translational and rotational directions to adjust the posture of the second FA material.

[0009] A first vision mechanism is configured to acquire an attitude image of a first FA material and transmit the attitude image of the first FA material to a control unit.

[0010] The second vision mechanism is configured to acquire an attitude image of the second FA material and transmit the attitude image of the second FA material to the control unit.

[0011] In some embodiments, the first vision mechanism and / or the second vision mechanism includes a first vision module, a first reflection module, and a second reflection module. The first reflection module and the second reflection module are respectively used to reflect the XZ plane and YZ plane visual images of the first FA material to the imaging area of ​​the first vision module. The first vision module is used to receive the XZ plane and YZ plane visual images reflected by the two reflection modules, and to acquire the XY plane visual image of the first FA material. The first vision module transmits the XZ plane, YZ plane, and XY plane visual images of the first FA material to the control unit so that the control unit can calculate the attitude angle of the first FA material based on the multi-view image data of the first FA material.

[0012] In some embodiments, the first vision module is mounted on a first vision movement adjustment mechanism. The optical axis of the first vision module is perpendicular to the horizontal plane. The first vision module is fixed to a first camera mounting plate, and the first camera mounting plate is fixed to the module mounting plate.

[0013] In some embodiments, the first vision mechanism and / or the second vision mechanism includes a second vision module and a third vision module. The second vision module is used to acquire XZ-plane or YZ-plane visual images of the second FA material and transmit the XZ-plane or YZ-plane visual images to the control unit. The third vision module is used to acquire XY-plane visual images of the second FA material and transmit the XY-plane visual images to the control unit, so that the control unit can calculate the attitude angle of the second FA material based on the multi-view image data of the second FA material.

[0014] In some embodiments, the dual FA coupling device of the present invention further includes a light shield, wherein the light shield and the second vision module are located on opposite sides of the stage.

[0015] In some embodiments, the light-shielding plate is fixed on the first Z-axis linear module, the first Z-axis linear module is fixed on the first Y-axis linear module, and the light-shielding plate and the second vision module are respectively located on both sides of the stage along the X-axis direction.

[0016] In some embodiments, the first Z-axis linear module and the first Y-axis linear module are electrically connected to the control unit.

[0017] The second vision module is mounted on the second vision movement and adjustment mechanism. The third vision module is mounted on the third vision movement and adjustment mechanism.

[0018] The second vision module is mounted on the second camera mounting plate, which is in turn mounted on the second vision movement adjustment mechanism.

[0019] In some embodiments, the second vision movement adjustment mechanism can at least drive the second vision module to move along the X-axis direction.

[0020] In some embodiments, the PCB fixture includes a PCB fixture base, the PCB fixture base having a groove for mounting a PCB board, a PCB push block being provided on one side of the groove, and a limit block being detachably fixed on the other side of the groove, and the PCB fixture base also having a loading platform for placing FA materials.

[0021] In some embodiments, the stage includes a stage base and a heat dissipation device. A stage mounting base is fixed on the stage base, and a heat dissipation mounting base is fixed on the stage mounting base. A heat dissipation device is fixed inside the heat dissipation mounting base, and a driving device is fixed inside the stage mounting base. The output shaft of the driving device is connected to the heat dissipation device. The stage mounting base has a spring mounting hole for mounting a spring. A spring pin is fixed inside the spring mounting hole, and the spring is located at the upper end of the spring pin, with the upper end of the spring extending out of the upper end of the spring mounting hole. The heat dissipation device is located at the upper end of the spring. A PCB locking screw, a PCB push block, and a PCB push block bracket are fixed on the heat dissipation mounting base. The PCB push block is located between the PCB locking screw and the PCB push block bracket, and the PCB push block and the PCB push block bracket are slidably engaged. The PCB locking screw is threadedly connected to the PCB clamp base and presses against the PCB push block. The PCB clamp base covers the PCB push block, and the PCB clamp base has a first through hole for the PCB push block to pass through.

[0022] In some embodiments, the loading platform is provided with an adsorption hole, which is connected to the air nozzle seat.

[0023] In some embodiments, the heat dissipation device includes a heat dissipation mounting plate, a water cooling head is fixed on the heat dissipation mounting plate, a cooling fin is fixed on the water cooling head, a heat-conducting block is fixed on the cooling fin, and a second through hole is provided on the PCB fixture base for the heat-conducting block to pass through, the second through hole being located in the groove.

[0024] In some embodiments, the first reflection module and the second reflection module are fixed to the PCB fixture base.

[0025] In some embodiments, the limiting block is fixed to the PCB fixture base by bolts.

[0026] In some embodiments, the power-on module includes a power-on device fixed on a power-on fixture, the power-on fixture fixed on a first power-on fixture mounting plate, the first power-on fixture mounting plate fixedly connected to a first X-axis linear module, the first X-axis linear module fixed on a first slide rail mounting plate, the first slide rail mounting plate fixed on a second power-on fixture mounting plate, the second power-on fixture mounting plate fixedly connected to a second Z-axis linear module, the second Z-axis linear module fixed on a second slide rail mounting plate, and the second slide rail mounting plate fixed on a first Y-axis linear module.

[0027] In some embodiments, the power-on module is electrically connected to the control unit.

[0028] In some embodiments, the first X-axis linear module, the second Z-axis linear module, and the first Y-axis linear module are electrically connected to the control unit.

[0029] In some embodiments, the first FA fixture and the second FA fixture include a first fixture mounting plate. A first elastic element fixing plate and a first slide rail slider assembly extending in a vertical direction are fixed on the first fixture mounting plate. A first slider adapter plate is fixed on the first slide rail slider assembly. A first elastic element is provided between the first slider adapter plate and the first elastic element fixing plate. A second fixture mounting plate is fixed on the first slider adapter plate. A second elastic element fixing plate and a second slide rail slider assembly extending in a horizontal direction are fixed on the upper surface of the second fixture mounting plate. A second slider adapter plate is fixed on the second slide rail slider assembly. A claw clamp module mounting plate is fixed on the second slider adapter plate. A claw clamp module is fixed on the claw clamp module mounting plate. A second elastic element is provided between the second slider adapter plate and the second elastic element fixing plate.

[0030] In some embodiments, the gripper module includes an electric gripper with a nozzle mounting plate mounted on it. An FA nozzle is fixed on the nozzle mounting plate and is located between the two grippers of the electric gripper.

[0031] In some embodiments, a first displacement sensor is fixed on a first clamp mounting plate. The first displacement sensor is arranged vertically. A first sensing plate is fixed on the first slider adapter plate. The first sensing plate is located at the lower end of the first displacement sensor.

[0032] The first elastic element is a first spring. A first spring limiting element is fixed on the first elastic element fixing plate. The first spring is sleeved outside the first spring limiting element. One end of the first spring abuts against the first spring limiting element or the first elastic element fixing plate, and the other end of the first spring is connected to or abuts against the first slider adapter plate. A first positioning groove is provided on the first slider adapter plate for the first spring to extend into.

[0033] In some embodiments, a second displacement sensor is fixed to the second spring fixing plate. A second sensing plate is fixed to the second slider adapter plate. The second displacement sensor is arranged in a horizontal direction.

[0034] The claw module mounting plate is provided with a through hole for the second displacement sensor to pass through.

[0035] One end of the second displacement sensor passes through a hole in the claw module mounting plate and is positioned opposite to the second sensing plate at a distance. The other end of the second displacement sensor is fixed to the second spring fixing plate.

[0036] The second elastic element is a second spring. A second spring limiting element is fixed on the second elastic element fixing plate. The second spring is sleeved outside the second spring limiting element. One end of the second spring abuts against the second spring limiting element or the second elastic element fixing plate, and the other end of the first spring is connected to or abuts against the second slider adapter plate. A second positioning groove is provided on the second slider adapter plate for the second spring to extend into.

[0037] In some embodiments, the dual FA coupling device of the present invention further includes:

[0038] A dispensing mechanism is configured to dispense adhesive, thereby bonding the first FA material and the second FA material onto the PCB board.

[0039] A curing mechanism configured to automatically cure adhesive.

[0040] In some embodiments, the dispensing mechanism, the curing mechanism, and the control unit are electrically connected.

[0041] In some embodiments, the curing mechanism includes a UV lamp, which is fixed to a UV fixture. The UV fixture is fixedly mounted on a UV mounting bracket, which is fixedly mounted on a UV movement adjustment mechanism. The UV movement adjustment mechanism includes a third Z-axis linear module, and the UV mounting bracket is fixedly mounted on the third Z-axis linear module.

[0042] In some embodiments, the UV lamp and the UV movement adjustment mechanism are electrically connected to the control unit.

[0043] In some embodiments, the dispensing mechanism includes a dispensing assembly (including a dispensing needle), the dispensing assembly being fixed to a dispensing mounting bracket, and the dispensing mounting bracket being fixedly mounted on a dispensing movement adjustment mechanism. The dispensing movement adjustment mechanism includes a fourth Z-axis linear module, and the dispensing mounting bracket is fixedly mounted on the fourth Z-axis linear module.

[0044] In some embodiments, the dispensing assembly (including the dispensing needle) and the dispensing movement adjustment mechanism are electrically connected to the control unit.

[0045] In some embodiments, the dual FA coupling device of the present invention further includes a three-axis mounting base, on which an XYZ three-axis moving platform (the XYZ three-axis moving platform includes an X-axis linear module, a Y-axis linear module and a Z-axis linear module) is provided. A module mounting plate is installed on the XYZ three-axis moving platform, and the third Z-axis linear module and the fourth Z-axis linear module are respectively fixedly mounted on the module mounting plate.

[0046] The XYZ three-axis mobile platform is electrically connected to the control unit.

[0047] The triaxial mount is fixed on the optical platform.

[0048] In some embodiments, a fifth Z-axis linear module is further mounted on the module mounting plate, a third camera mounting plate is fixed on the fifth Z-axis linear module, and a third vision module is fixed on the third camera mounting plate. The optical axis of the fourth vision module is perpendicular to the horizontal plane.

[0049] Secondly, this invention discloses a dual-FA coupling method, comprising the following steps:

[0050] Control the power-on module to power the PCB board;

[0051] Control the first multi-degree-of-freedom adjustment mechanism to clamp the first FA material and transfer the first FA material to a preset first posture detection station; and control the second multi-degree-of-freedom adjustment mechanism to clamp the second FA material and transfer the second FA material to a preset second posture detection station;

[0052] Collect image information of the first FA material and the second FA material;

[0053] The attitude data of the first FA material is obtained based on the image information of the first FA material, and the attitude data of the second FA material is obtained based on the image information of the second FA material.

[0054] Based on the attitude data of the first FA material, the first multi-degree-of-freedom adjustment mechanism is controlled to rotate and adjust the first FA material so that the mounting reference surface of the first FA material is parallel to the first preset mounting plane of the PCB board, thus completing the attitude calibration of the first FA material. Based on the attitude data of the second FA material, the second multi-degree-of-freedom adjustment mechanism is controlled to rotate and adjust the second FA material so that the mounting reference surface of the second FA material is parallel to the second preset mounting plane of the PCB board, thus completing the attitude calibration of the second FA material.

[0055] The first and second multi-degree-of-freedom adjustment mechanisms are controlled to move the first FA material and the second FA material, which have been calibrated in attitude, to their respective preset coupling positions along their respective preset trajectories.

[0056] The first and second multi-degree-of-freedom adjustment mechanisms are controlled to adjust the position and orientation of the first and second FA materials to execute the coupling light-finding process. During the coupling light-finding process, the optical power detection value after the first and second FA materials are coupled is collected. When the optical power detection value is stable for a set time and within the preset optical power range, the coupling light-finding process is determined to be completed, and the first and second multi-degree-of-freedom adjustment mechanisms are controlled to lock the relative coupling orientation of the first and second FA materials.

[0057] In some embodiments, after the coupling and light-finding process is completed, the following steps are also included:

[0058] Control the dispensing mechanism to dispense adhesive, and stick the first FA material and the second FA material onto the PCB board;

[0059] The curing mechanism controls the curing of the adhesive.

[0060] In some embodiments, acquiring image information of the first FA material and / or the second FA material includes: acquiring visual images of the XZ plane, YZ plane, and XY plane of the first vision module;

[0061] When the first FA material is located at the first posture detection station, the first reflection module and the second reflection module reflect the XZ plane and YZ plane visual images of the first FA material to the imaging area of ​​the first vision module, respectively, so that the first vision module receives the XZ plane and YZ plane visual images reflected by the two reflection modules and acquires the XY plane visual images of the first FA material or / and the second FA material.

[0062] The present invention has at least the following beneficial effects:

[0063] This invention utilizes a coupling system to simultaneously and precisely adjust the position (X / Y / Z axis translation) and attitude (pitch, yaw, rotation) of the first and second FA materials, covering all the dimensional adjustment requirements for FA material coupling. This avoids the limitations of single-mechanism adjustment, and the entire process of this invention requires no manual intervention. Through mechanism collaboration and closed-loop feedback of optical power, the iterative process of "adjustment-detection-re-adjustment" can be automatically completed. Compared with manual light finding, this significantly shortens the coupling time and improves the efficiency of mass production.

[0064] This invention employs a combination of dual-reflection modules and a single camera to ensure that the mounting reference plane of the FA material is parallel to the preset mounting plane of the PCB board. This eliminates the need for a multi-camera layout, simplifies the hardware structure, and reduces costs. Furthermore, this invention simultaneously acquires attitude data and combines it with multi-axis high-precision adjustments to ensure that the parallelism error between the material and the PCB board is minimal. Attached Figure Description

[0065] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0066] Figure 1 This is a schematic diagram of the structure of a dual FA coupling device disclosed in one embodiment of the present invention;

[0067] Figure 2 This is a schematic diagram of the structure of a first vision module, a third vision module, a dispensing mechanism, and a curing mechanism disclosed in one embodiment of the present invention;

[0068] Figure 3 for Figure 2 Partial schematic diagram;

[0069] Figure 4 This is a schematic diagram of the structure of the fourth vision module disclosed in one embodiment of the present invention;

[0070] Figure 5 This is a schematic diagram of the structure of the stage and power-on module disclosed in one embodiment of the present invention;

[0071] Figure 6 This is a partial structural diagram of the stage;

[0072] Figure 7 This is a schematic diagram of the structure of a PCB fixture disclosed in one embodiment of the present invention;

[0073] Figure 8 This is a schematic diagram of the structure of a first multi-degree-of-freedom adjustment mechanism (or a second multi-degree-of-freedom adjustment mechanism) and a first FA fixture (or a second FA fixture) disclosed in an embodiment of the present invention;

[0074] Figure 9 This is a schematic diagram of the structure of a claw clamp module disclosed in one embodiment of the present invention;

[0075] Figure 10 for Figure 9 A diagram from another perspective;

[0076] Figure 11 This is a schematic diagram of the structure of a first FA fixture (or a second FA fixture) disclosed in an embodiment of the present invention;

[0077] Figure 12 for Figure 11 A diagram from another perspective;

[0078] Figure 13This is a schematic diagram of the structure of the stage, power-on module, and second vision module disclosed in one embodiment of the present invention;

[0079] Figure 14 for Figure 13 A diagram from another perspective.

[0080] In the attached diagram, 1 is the stage, 1-1 is the stage base, 1-2 is the stage mounting base, 1-3 is the heat dissipation mounting base, 1-4 is the heat dissipation mounting plate, 1-5 is the water cooling head, 1-6 is the cooling chip, 1-7 is the heat conduction block, 1-8 is the PCB locking screw, 1-9 is the heat dissipation drive device, 1-10 is the PCB clamp push block, 1-11 is the pigtail clamp base, 1-12 is the spring pin, 1-13 is the spring, 2 is the PCB clamp, 2-1 is the PCB clamp base, 2-2 is the groove, 2-3 is the PCB push block, 2-4 is the limit block, 2-5 is the loading stage, and 2-6 is the ridge. Mirror bracket, 3 is the power-on module, 3-1 is the power-on device, 3-2 is the power-on clamp, 3-3 is the first power-on clamp mounting plate, 3-4 is the first slide rail mounting plate, 3-5 is the second power-on clamp mounting plate, 3-6 is the second slide rail mounting plate, 4 is the first multi-degree-of-freedom adjustment mechanism, 5 is the first FA clamp, 5-1 is the first clamp mounting plate, 5-2 is the first elastic element fixing plate, 5-3 is the first slide rail slider assembly, 5-4 is the first slider adapter plate, 5-5 is the first spring limiting element, 5-6 is the second clamp mounting plate, 5-7 is the second elastic element fixing plate, 5-8 is the second slide rail. The components are as follows: slider assembly, 5-9 second slider adapter plate, 5-10 gripper module mounting plate, 5-11 second spring limiting component, 5-12 electric gripper, 5-13 nozzle mounting plate, 5-14 FA nozzle, 5-15 first displacement sensor, 5-16 first sensing plate, 5-17 second displacement sensor, 5-18 second sensing plate, 6 second multi-degree-of-freedom adjustment mechanism, 7 second FA fixture, 8 dispensing mechanism, 8-1 dispensing assembly, 8-2 dispensing mounting bracket, 8-3 fourth Z-axis linear module, 9 curing mechanism, and 9-1 UV lamp. 9-2 is the UV mounting bracket, 9-3 is the third Z-axis linear module, 9-4 is the UV baffle, 10 is the first vision module, 11 is the first reflection module, 12 is the second reflection module, 13 is the second vision module, 14 is the third vision module, 15 is the fourth vision module, 16 is the light shield, 17 is the first Z-axis linear module, 18 is the module mounting plate, 19 is the three-axis mounting base, 20 is the XYZ three-axis moving platform, 21 is the first camera mounting plate, 22 is the second camera mounting plate, 23 is the third camera mounting plate, 24 is the fourth camera mounting plate, and 25 is the first Y-axis linear module. Detailed Implementation

[0081] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0082] In the description of this invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0083] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of this invention, unless otherwise stated, "a plurality of" or "several" means two or more.

[0084] See Figures 1 to 14 The present invention provides a dual FA coupling device, comprising:

[0085] A stage 1 is provided, on which a PCB clamp 2 is mounted, the PCB clamp 2 being configured to fix a PCB board.

[0086] Power-on module 3, configured to power the PCB board;

[0087] The first multi-degree-of-freedom adjustment mechanism 4 is equipped with a first FA clamp 5, which is configured to clamp the first FA material. The first multi-degree-of-freedom adjustment mechanism 4 is electrically connected to the control unit and is configured to drive the first FA clamp 5 mounted thereon to move along multiple translational and rotational directions to adjust the posture of the first FA material.

[0088] The second multi-degree-of-freedom adjustment mechanism 6 is equipped with a second FA clamp 7, which is configured to clamp the second FA material. The second multi-degree-of-freedom adjustment mechanism 6 is electrically connected to the control unit and is configured to drive the second FA clamp 7 mounted thereon to move along multiple translational and rotational directions to adjust the posture of the second FA material.

[0089] A first vision mechanism is configured to acquire an attitude image of a first FA material and transmit the attitude image of the first FA material to a control unit.

[0090] The second vision mechanism is configured to acquire an attitude image of the second FA material and transmit the attitude image of the second FA material to the control unit.

[0091] The first multi-degree-of-freedom adjustment mechanism 4 and the second multi-degree-of-freedom adjustment mechanism 6 are located on both sides of the stage.

[0092] In some embodiments, both the first multi-degree-of-freedom adjustment mechanism 4 and the second multi-degree-of-freedom adjustment mechanism 6 employ a six-axis electric coupling stage. The six-axis electric coupling stage provides high-precision displacement control in six directions: x, y, z, θx, θy, and θz.

[0093] The length direction of the PCB (i.e., the direction in which the gold fingers extend) is the Y-axis. The Y-axis is perpendicular to the X-axis, and the Z-axis is perpendicular to both the Y-axis and the X-axis.

[0094] In some embodiments, the dual FA coupling device of the present invention further includes:

[0095] Dispensing mechanism 8, configured to dispense adhesive so that the first FA material and the second FA material are bonded to the PCB board;

[0096] Curing mechanism 9, which is configured to automatically cure adhesive.

[0097] In some embodiments, the first vision mechanism includes a first vision module 10, a first reflection module 11, and a second reflection module 12. The first reflection module 11 and the second reflection module 12 are respectively used to reflect the XZ plane and YZ plane visual images of the first FA material to the imaging area of ​​the first vision module 10. The first vision module 10 is used to receive the XZ plane and YZ plane visual images reflected by the two reflection modules, and to acquire the XY plane visual image of the first FA material. The first vision module 10 transmits the XZ plane, YZ plane, and XY plane visual images of the first FA material to the control unit so that the control unit can calculate the attitude angle of the first FA material based on the multi-view image data of the first FA material, including the pitch angle of the XZ plane, the roll angle of the YZ plane, and the yaw angle of the XY plane.

[0098] In some embodiments, the first reflection module 11 and the second reflection module 12 are reflectors, and the reflective surfaces of the reflectors are arranged at a 45° angle.

[0099] In some embodiments, the first vision module 10 is mounted on a first vision movement adjustment mechanism. The optical axis of the first vision module 10 is perpendicular to the horizontal plane, and is used to directly acquire images of the first FA material from a top-down perspective. The first vision module 10 is fixed on a first camera mounting plate 21, and the first camera mounting plate 21 is fixed on a module mounting plate 18. The optical axis of the first vision module is vertically downward, facing the upper surface of the PCB board.

[0100] In some embodiments, the second vision mechanism includes a second vision module 13 and a third vision module 14. The second vision module 13 is used to acquire XZ-plane or YZ-plane visual images of the second FA material and transmit the XZ-plane or YZ-plane visual images to the control unit. The third vision module 14 is used to acquire XY-plane visual images of the second FA material and transmit the XY-plane visual images to the control unit, so that the control unit can calculate the attitude angle of the second FA material based on the multi-view image data of the second FA material.

[0101] The second vision module 13 is mounted on the second vision movement adjustment mechanism. The third vision module 14 is mounted on the third vision movement adjustment mechanism. The second vision module 13 is used to acquire images of the second FA material from a side viewpoint, and the optical axis of the second vision module 13 is parallel to the horizontal plane. This invention can adjust the light-shielding plate 16, the second FA material, and the camera of the second vision module 13 to be on the same horizontal line, thereby blocking interfering light while providing a bright background.

[0102] In some embodiments, the second vision mechanism further includes a fourth vision module 15, used to acquire XY plane visual images of the second FA material and transmit the XY plane visual images to the control unit.

[0103] In some embodiments, the optical axis of the third visual module 14 is perpendicular to the horizontal plane, and the optical axis of the fourth visual module 15 is perpendicular to the horizontal plane. One of the third visual modules 14 and the fourth visual module 15 acquires an image of the second FA material from a top-down view, and the other visual module acquires an image of the second FA material from a bottom-up view.

[0104] In some embodiments, the third vision module 14 is used to acquire an image of the second FA material from a top-down perspective. The fourth vision module 15 is used to acquire an image of the second FA material from a bottom-up perspective.

[0105] In some embodiments, the third vision movement adjustment mechanism includes a fifth Z-axis linear module, the third vision movement adjustment mechanism is fixed on the module mounting plate 18, a third camera mounting plate 23 is fixed on the fifth Z-axis linear module, and a third vision module 14 is fixed on the third camera mounting plate 23.

[0106] In some embodiments, the fourth vision module 15 is mounted on the triaxial mount 19 via the fourth camera mounting plate 24.

[0107] The optical axis of the second vision module is horizontally positioned, facing the upper end of the PCB board. The optical axis of the third vision module is vertically downward. The optical axis of the fourth vision module is vertically upward.

[0108] In some embodiments, the dual FA coupling device of the present invention further includes a light shield 16, wherein the light shield 16 and the second vision module 13 are respectively located on opposite sides of the stage.

[0109] In some embodiments, the light-shielding plate 16 is mounted on a light-shielding plate 16 moving and adjusting mechanism. The light-shielding plate 16 moving and adjusting mechanism includes a first Z-axis linear module 17, the light-shielding plate 16 is fixed on the first Z-axis linear module 17, the first Z-axis linear module 17 is fixed on a first Y-axis linear module 25, and the light-shielding plate 16 and the second visual module 13 are respectively located on both sides of the stage along the X-axis direction.

[0110] In some embodiments, the first Z-axis linear module 17 and the first Y-axis linear module 25 are electrically connected to the control unit.

[0111] In some embodiments, the PCB fixture 2 includes a PCB fixture base 2-1, the PCB fixture base 2-1 is provided with a groove 2-2 for mounting a PCB board, a PCB push block 2-3 is provided on one side of the groove 2-2, and a limit block 2-4 is detachably fixed on the other side of the groove 2-2. The PCB fixture base 2-1 is also provided with a loading platform 2-5 for placing FA materials for vacuum adsorption of FA.

[0112] The PCB fixture base 2-1 is equipped with a pigtail fixture base 1-11.

[0113] In some embodiments, the first reflection module 11 and the second reflection module 12 are fixed to the PCB fixture base 2-1.

[0114] In some embodiments, the first reflection module 11 and the second reflection module 12 are fixed on the prism bracket 2-6, and the prism bracket 2-6 is fixed on the PCB fixture base 2-1.

[0115] In some embodiments, the stage includes a stage base 1-1 and a heat dissipation device. A stage mounting seat 1-2 is fixed on the stage base 1-1, and a heat dissipation mounting seat 1-3 is fixed on the stage mounting seat 1-2. A heat dissipation device is fixed inside the heat dissipation mounting seat 1-3, and a heat dissipation driving device 1-9 is fixed inside the stage mounting seat 1-2. The output shaft of the heat dissipation driving device 1-9 is connected to the heat dissipation device. The stage mounting seat 1-2 is provided with a plurality of spring mounting holes for mounting springs 1-13. A spring pin 1-12 is fixed inside the spring mounting holes, and the spring 1-13 is located at the upper end of the spring pin 1-12, with the upper end of the spring extending out of the spring pin 1-13. At the upper end of the mounting hole, the heat dissipation device is located at the upper end of the spring. The heat dissipation mounting base 1-3 is fixed with a PCB locking screw 1-8, a PCB push block 2-3 and a PCB push block 2-3 bracket. The PCB push block 2-3 is located between the PCB locking screw 1-8 and the PCB push block 2-3 bracket. The PCB push block 2-3 and the PCB push block 2-3 bracket are slidably engaged. The PCB locking screw 1-8 is threadedly connected to the PCB clamp base 2-1 and presses against the PCB push block 2-3. The PCB clamp base 2-1 covers the PCB push block 2-3. The PCB clamp base 2-1 is provided with a first through hole for the PCB push block 2-3 to pass through.

[0116] In some embodiments, the heat dissipation drive devices 1-9 are cylinders.

[0117] There are four spring mounting holes, which are arranged in a rectangular pattern.

[0118] The stage achieves the "on-demand close contact" of the heat dissipation device through "spring elasticity + structural fit".

[0119] The platform is provided with a PCB clamp 2 fixing device on the side away from the power-on module 3. The PCB clamp 2 fixing device includes PCB clamp 2 push blocks 1-10. The PCB clamp 2 push blocks 1-10 are connected to a push block driving device, which drives the push blocks to press the PCB clamp base 2-1.

[0120] The PCB clamp 2 fixing device is installed in the stage mounting base 1-2 or / and the heat dissipation mounting base 1-3.

[0121] In some embodiments, the loading platform 2-5 is provided with an adsorption hole, which is connected to the air nozzle seat.

[0122] In some embodiments, the heat dissipation device includes a heat dissipation mounting plate 1-4, a water cooling head 1-5 fixed on the heat dissipation mounting plate 1-4, a cooling chip 1-6 fixed on the water cooling head 1-5, a heat-conducting block 1-7 fixed on the cooling chip 1-6, and a second through hole for the heat-conducting block 1-7 to pass through on the PCB fixture base 2-1, the second through hole being located in the groove 2-2.

[0123] The heat dissipation mounting plate 1-4 is provided with a U-shaped groove, one side of which is open. The output shaft end of the cylinder is connected to a limit nut, which is located inside the U-shaped groove.

[0124] In some embodiments, the limiting block 2-4 is fixed to the PCB fixture base 2-1 by bolts.

[0125] In some embodiments, the power-on module 3 includes a power-on device 3-1, which is fixed on a power-on fixture 3-2. The power-on fixture 3-2 is fixed on a first power-on fixture mounting plate 3-3. The first power-on fixture mounting plate 3-3 is fixedly connected to a first X-axis linear module. The first X-axis linear module is fixed on a first slide rail mounting plate 3-4. The first slide rail mounting plate 3-4 is fixed on a second power-on fixture mounting plate 3-5. The second power-on fixture mounting plate 3-5 is fixedly connected to a second Z-axis linear module. The second Z-axis linear module is fixed on a second slide rail mounting plate 3-6. The second slide rail mounting plate 3-6 is fixed on a first Y-axis linear module 25.

[0126] The power supply device 3-1 is equipped with a power supply interface for electrical connection with the gold fingers of the PCB board. When the gold fingers of the PCB board are electrically connected to the power supply interface of the power supply device 3-1, the power supply device 3-1 supplies power to the PCB board.

[0127] In some embodiments, the power-on module 3 is electrically connected to the control unit.

[0128] In some embodiments, the first X-axis linear module, the second Z-axis linear module, and the first Y-axis linear module 25 are electrically connected to the control unit.

[0129] In some embodiments, the first FA fixture 5 and the second FA fixture 7 include a first fixture mounting plate 5-1, a first elastic element fixing plate 5-2 and a first slide rail slider assembly 5-3 extending in the vertical direction are fixed on the first fixture mounting plate 5-1, a first slider adapter plate 5-4 is fixed on the first slide rail slider assembly 5-3, a first elastic element is provided between the first slider adapter plate 5-4 and the first elastic element fixing plate 5-2, a second fixture mounting plate 5-6 is fixed on the first slider adapter plate 5-4, a second elastic element fixing plate 5-7 and a second slide rail slider assembly 5-8 extending in the horizontal direction are fixed on the upper end surface of the second fixture mounting plate 5-6, a second slider adapter plate 5-9 is fixed on the second slide rail slider assembly 5-8, a claw clamp module mounting plate 185-10 is fixed on the second slider adapter plate 5-9, a claw clamp module is fixed on the claw clamp module mounting plate 185-10, and a second elastic element is provided between the second slider adapter plate 5-9 and the second elastic element fixing plate 5-7.

[0130] The first slide rail and slider assembly 5-3 includes a first slide rail and a first slider. The first slide rail and the first slider are slidably engaged. The first slide rail is fixed on the first clamp mounting plate 5-1. The first slider is fixedly connected to the first slider adapter plate 5-4.

[0131] The second slide rail and slider assembly 5-8 includes a second slide rail and a second slider. The second slide rail and the second slider are slidably engaged. The second slide rail is fixed on the second clamp mounting plate 5-6. The second slider is fixedly connected to the second slider adapter plate 5-9.

[0132] In some embodiments, the gripper module includes an electric gripper 5-12, on which a suction nozzle mounting plate 5-13 is mounted. An FA suction nozzle 5-14 is fixed on the suction nozzle mounting plate 5-13, and the FA suction nozzle 5-14 is located between the two grippers of the electric gripper 5-12. The FA suction nozzle 5-14 is connected to a vacuum pump via a pipeline. The FA fixture can achieve integrated suction and gripping.

[0133] In some embodiments, a first displacement sensor 5-15 is fixed on the first clamp mounting plate 5-1. The first displacement sensor 5-15 is arranged vertically. A first sensing plate 5-16 is fixed on the first slider adapter plate 5-4. The first sensing plate 5-16 is located at the lower end of the first displacement sensor 5-15.

[0134] The first elastic element is a first spring. A first spring limiting element 5-5 is fixed on the first elastic element fixing plate 5-2. The first spring is sleeved on the first spring limiting element 5-5. One end of the first spring abuts against the first spring limiting element 5-5 or the first elastic element fixing plate 5-2, and the other end of the first spring is connected to or abuts against the first slider adapter plate 5-4. A first positioning groove is provided on the first slider adapter plate 5-4 for the first spring to extend into.

[0135] In some embodiments, a second displacement sensor 5-17 is fixed on the second spring fixing plate. A second sensing plate 5-18 is fixed on the second slider adapter plate 5-9. The second displacement sensor 5-17 is arranged in a horizontal direction.

[0136] The claw module mounting plate 185-10 is provided with a through hole for the second displacement sensor 5-17 to pass through.

[0137] One end of the second displacement sensor 5-17 passes through the through hole of the claw module mounting plate 185-10 and is positioned opposite to the second sensing plate 5-18 at intervals. The other end of the second displacement sensor 5-17 is fixed to the second spring fixing plate.

[0138] The second elastic element is a second spring. A second spring limiting element 5-11 is fixed on the second elastic element fixing plate 5-7. The second spring is sleeved on the second spring limiting element 5-11. One end of the second spring abuts against the second spring limiting element 5-11 or the second elastic element fixing plate 5-7, and the other end of the first spring is connected to or abuts against the second slider adapter plate 5-9. A second positioning groove is provided on the second slider adapter plate 5-9 for the second spring to extend into.

[0139] The present invention incorporates a first spring and a second spring. Due to the buffering effect of the first spring and the second spring, material damage is avoided when the gripper module clamps or collides with the material, thus reducing the risk of material damage, such as the risk of damage to FA materials and the risk of damage to reflectors.

[0140] The present invention sets sensors and sensing plates on the first FA clamp 5 and the second FA clamp 7. The control unit monitors the change in the distance between the displacement sensor and the corresponding sensing plate in real time. When the distance change reaches the set value, it controls the movement state of the first multi-degree-of-freedom adjustment mechanism 4 or the second multi-degree-of-freedom adjustment mechanism 6 (such as stopping the currently executed downward movement stroke or horizontal movement stroke) to avoid the gripper module from damaging other objects.

[0141] The power-on module 3, the dispensing mechanism 8, the curing mechanism 9 are electrically connected to the control unit.

[0142] The control unit includes an industrial computer.

[0143] In some embodiments, the curing mechanism 9 includes a UV lamp 9-1, which is fixed to a UV fixing member. The UV fixing member is fixedly mounted on a UV mounting bracket 9-2, which is fixedly mounted on a UV movement adjustment mechanism. The UV movement adjustment mechanism includes a third Z-axis linear module 9-3, and the UV mounting bracket 9-2 is fixedly mounted on the third Z-axis linear module 9-3.

[0144] In some embodiments, the dispensing mechanism 8 includes a dispensing assembly 8-1 (including a dispensing needle), which is fixed to a dispensing mounting bracket 8-2. The dispensing mounting bracket 8-2 is fixedly mounted on a dispensing movement adjustment mechanism. The dispensing movement adjustment mechanism includes a fourth Z-axis linear module 8-3, and the dispensing mounting bracket 8-2 is fixedly mounted on the fourth Z-axis linear module 8-3. A UV baffle 9-4 is provided on the outside of the dispensing assembly 8-1, and the UV baffle 9-4 is connected to the dispensing mounting bracket 8-2. The dispensing method may be, but is not limited to, automatic pneumatic dispensing.

[0145] In some embodiments, the dual FA coupling device further includes a three-axis mounting base 19, on which an XYZ three-axis moving platform 20 (the XYZ three-axis moving platform 20 includes an X-axis linear module, a Y-axis linear module and a Z-axis linear module) is provided. A module mounting plate 18 is mounted on the XYZ three-axis moving platform 20, and the third Z-axis linear module 9-3 and the fourth Z-axis linear module 8-3 are respectively fixedly mounted on the module mounting plate 18.

[0146] The triaxial mount 19 is fixed to the optical platform. The stage, the power-on module 3, the first multi-degree-of-freedom adjustment mechanism 4, and the second multi-degree-of-freedom adjustment mechanism 6 are also fixed to the optical platform. The optical platform provides a stable coupling platform.

[0147] The control flow of the coupling device of the present invention is as follows:

[0148] The PCB board is placed on the middle platform and clamped by the limiting fixture. The power module 3 clamps the PCB fixture 2 to power on the PCB board.

[0149] Place the first FA material and the second FA material on the left and right loading platforms 2-5 respectively and tighten them;

[0150] The first multi-degree-of-freedom adjustment mechanism 4, i.e., the left-hand six-axis coupling stage, moves to the first feeding position directly above the first FA material. The clamp opens to pick up the first FA material from the suction nozzle, and then closes to clamp the first FA material. The first FA material is then raised to the first posture detection station, i.e., the first recognition area. The first reflection module 11 and the second reflection module 12 reflect the XZ plane and YZ plane angles of the first FA material to the recognition area of ​​the first recognition camera. The first recognition camera recognizes the angle of the first FA material in the XY plane and rotates the first FA material to be parallel to the PCB board through the first multi-degree-of-freedom adjustment mechanism 4, i.e., the left-hand six-axis coupling stage.

[0151] Simultaneously, the second multi-degree-of-freedom adjustment mechanism 6, i.e., the right-hand six-axis coupling stage, moves to the position directly above the second FA material, i.e., the second feeding position. The clamp opens to pick up the second FA material from the suction nozzle, and then closes to clamp the second FA material. The second FA material is then raised to the second posture detection station, i.e., the second recognition area. The light shield 16 also moves to the second recognition area. The second recognition camera on the right and the third recognition camera below identify the angle of the second FA material in the XY plane. The second multi-degree-of-freedom adjustment mechanism 6, i.e., the right-hand six-axis coupling stage, rotates the second FA material to be parallel to the PCB board.

[0152] The left second multi-degree-of-freedom adjustment mechanism 6, i.e. the right-hand six-axis coupling stage, after the angle is corrected, moves the first FA material and the second FA material to the coupling position to perform coupling light search. The coupling light search is completed when the light power reaches the specified value.

[0153] The lens is attached to the PCB board by dispensing adhesive using a dispensing module;

[0154] The adhesive is cured by the curing module, thus completing the coupling of the dual FA lenses.

[0155] Based on the same inventive concept, this disclosure also provides a dual-FA coupling method. This dual-FA coupling method is based on the dual-FA coupling device provided in the previous embodiments. For a detailed description of the dual-FA coupling device, please refer to the content in the previous embodiments. The dual-FA coupling method includes the following steps:

[0156] The power supply module 3 controls the power supply to the PCB board;

[0157] Control the first multi-degree-of-freedom adjustment mechanism 4 to clamp the first FA material and transfer the first FA material to the preset first posture detection station; and control the second multi-degree-of-freedom adjustment mechanism 6 to clamp the second FA material and transfer the second FA material to the preset second posture detection station;

[0158] Collect image information of the first FA material and the second FA material;

[0159] The attitude data of the first FA material is obtained based on the image information of the first FA material, and the attitude data of the second FA material is obtained based on the image information of the second FA material.

[0160] Based on the attitude data of the first FA material, the first multi-degree-of-freedom adjustment mechanism 4 is controlled to rotate and adjust the first FA material so that the mounting reference surface of the first FA material is parallel to the first preset mounting plane of the PCB board, thus completing the attitude calibration of the first FA material. Based on the attitude data of the second FA material, the second multi-degree-of-freedom adjustment mechanism 6 is controlled to rotate and adjust the second FA material so that the mounting reference surface of the second FA material is parallel to the second preset mounting plane of the PCB board, thus completing the attitude calibration of the second FA material.

[0161] The first multi-degree-of-freedom adjustment mechanism 4 and the second multi-degree-of-freedom adjustment mechanism 6 respectively move the first FA material and the second FA material after attitude calibration to their respective preset coupling positions along their respective preset trajectories.

[0162] The first multi-degree-of-freedom adjustment mechanism 4 and the second multi-degree-of-freedom adjustment mechanism 6 are controlled to adjust the position and attitude of the first FA material and the second FA material to execute the coupling light-finding process. In the coupling light-finding process, the optical power detection value after the first FA material and the second FA material are coupled is collected. When the optical power detection value is stable for a set time and is within the preset optical power range, the coupling light-finding process is determined to be completed, and the first multi-degree-of-freedom adjustment mechanism 4 and the second multi-degree-of-freedom adjustment mechanism 6 are controlled to lock the relative coupling attitude of the first FA material and the second FA material.

[0163] In some embodiments, after the coupling and light-finding process is completed, the following steps are also included:

[0164] Control the dispensing mechanism to dispense adhesive, and stick the first FA material and the second FA material onto the PCB board;

[0165] The curing mechanism controls the curing of the adhesive.

[0166] In some embodiments, the optical fiber of the first FA material is connected to the first optical power detection module, and the optical fiber of the second FA material is connected to the second optical power detection module. A laser on the PCB emits light, which enters the first and second FA materials respectively, and is then detected by the first and second optical power detection modules. The first and second optical power detection modules are connected to a control unit, which transmits the detected optical power to the control unit. The control unit compares the detected optical power with a preset optical power value. If the deviation is within a set error range, it indicates successful optical coupling.

[0167] In some embodiments, during the coupled light-finding process, the first multi-degree-of-freedom adjustment mechanism 4 and the second multi-degree-of-freedom adjustment mechanism 6 are coupled and coupled simultaneously to find light, which can keep the first multi-degree-of-freedom adjustment mechanism 4 and the second multi-degree-of-freedom adjustment mechanism 6 in coordinated action and avoid collisions caused by excessive adjustment of a single mechanism.

[0168] In some embodiments, acquiring image information of the first FA material includes: acquiring visual images of the first vision module 10 in the XZ plane, YZ plane, and XY plane;

[0169] When the first FA material is located at the first posture detection station, the first reflection module 11 and the second reflection module 12 reflect the XZ plane and YZ plane visual images of the first FA material to the imaging area of ​​the first vision module 10, respectively, so that the first vision module 10 receives the XZ plane and YZ plane visual images reflected by the two reflection modules and acquires the XY plane visual image of the first FA material.

[0170] This invention employs a linear module to drive the object's translation and a rotary module to drive its rotation. The linear and rotary modules can be added or removed as needed for various movement adjustment mechanisms. Different drive methods can be selected for the linear and rotary modules, such as electrically controlled or manually controlled modules. For example, the linear module can be configured as an electric slide, pneumatic slide, or manually controlled linear module, etc. The linear modules are configured to drive the material along a straight line; for example, the X-axis linear module is configured to drive the material along the X-axis, the Y-axis linear module is configured to drive the material along the Y-axis, and the Z-axis linear module is configured to drive the material along the Z-axis.

[0171] The various moving adjustment mechanisms are not limited to the above embodiments and can be adjusted as needed. For example, the dispensing moving adjustment mechanism can be set according to dispensing requirements, and the UV moving adjustment mechanism can be set according to UV moving requirements.

[0172] Each vision module is connected to a control unit, and each vision module transmits the acquired images to the control unit. The control unit receives the images transmitted by the vision modules and performs image analysis to assist in automatic coupling.

[0173] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A dual-FA coupling device, characterized in that, include: A stage, on which a PCB clamp is mounted, the PCB clamp being configured to fix a PCB board; A power-on module, configured to power the PCB board; A first multi-degree-of-freedom adjustment mechanism is provided, on which a first FA clamp is mounted. The first FA clamp is configured to hold a first FA material. The first multi-degree-of-freedom adjustment mechanism is electrically connected to a control unit. The first multi-degree-of-freedom adjustment mechanism is configured to drive the first FA clamp mounted thereon to move along multiple translational and rotational directions to adjust the posture of the first FA material. The second multi-degree-of-freedom adjustment mechanism is equipped with a second FA clamp, which is configured to hold a second FA material. The second multi-degree-of-freedom adjustment mechanism is electrically connected to the control unit and is configured to drive the second FA clamp mounted thereon to move along multiple translational and rotational directions to adjust the posture of the second FA material. A first vision mechanism is configured to acquire an attitude image of a first FA material and transmit the attitude image of the first FA material to a control unit. The second vision mechanism is configured to acquire an attitude image of the second FA material and transmit the attitude image of the second FA material to the control unit.

2. The coupling device as described in claim 1, characterized in that: Also includes: A dispensing mechanism is configured to dispense adhesive, thereby bonding the first FA material and the second FA material onto the PCB board. A curing mechanism configured to automatically cure adhesive.

3. The coupling device as described in claim 1, characterized in that: The first vision mechanism and / or the second vision mechanism includes a first vision module, a first reflection module, and a second reflection module. The first reflection module and the second reflection module are respectively used to reflect the XZ plane and YZ plane visual images of the first FA material to the imaging area of ​​the first vision module. The first vision module is used to receive the XZ plane and YZ plane visual images reflected by the two reflection modules, and to acquire the XY plane visual image of the first FA material. The first vision module transmits the XZ plane, YZ plane, and XY plane visual images of the first FA material to the control unit so that the control unit can calculate the attitude angle of the first FA material based on the multi-view image data of the first FA material.

4. The coupling device as described in claim 1, characterized in that: The first vision mechanism and / or the second vision mechanism includes a second vision module and a third vision module. The second vision module is used to acquire XZ plane or YZ plane visual images of the second FA material and transmit the XZ plane or YZ plane visual images to the control unit. The third vision module is used to acquire XY plane visual images of the second FA material and transmit the XY plane visual images to the control unit, so that the control unit can calculate the attitude angle of the second FA material based on the multi-view image data of the second FA material.

5. The coupling device as described in claim 4, characterized in that: It also includes a light-shielding plate, which is located on both sides of the stage, along with the second vision module.

6. The coupling device as described in claim 1, characterized in that: The PCB fixture includes a PCB fixture base, which has a groove for mounting a PCB board. A PCB push block is provided on one side of the groove, and a limit block is detachably fixed on the other side of the groove. The PCB fixture base also has a loading platform for placing FA materials.

7. The coupling device as described in claim 1, characterized in that: The power-on module includes a power-on device fixed on a power-on fixture. The power-on fixture is fixed on a first power-on fixture mounting plate. The first power-on fixture mounting plate is fixedly connected to a first X-axis linear module. The first X-axis linear module is fixed to a first slide rail mounting plate. The first slide rail mounting plate is fixed to a second power-on fixture mounting plate. The second power-on fixture mounting plate is fixedly connected to a second Z-axis linear module. The second Z-axis linear module is fixed to a second slide rail mounting plate. The second slide rail mounting plate is fixed to a first Y-axis linear module.

8. The coupling device as described in claim 1, characterized in that: The first FA fixture and the second FA fixture include a first fixture mounting plate. A first elastic element fixing plate and a first slide rail slider assembly extending in a vertical direction are fixed on the first fixture mounting plate. A first slider adapter plate is fixed on the first slide rail slider assembly. A first elastic element is provided between the first slider adapter plate and the first elastic element fixing plate. A second fixture mounting plate is fixed on the first slider adapter plate. A second elastic element fixing plate and a second slide rail slider assembly extending in a horizontal direction are fixed on the upper surface of the second fixture mounting plate. A second slider adapter plate is fixed on the second slide rail slider assembly. A claw clamp module mounting plate is fixed on the second slider adapter plate. A claw clamp module is fixed on the claw clamp module mounting plate. A second elastic element is provided between the second slider adapter plate and the second elastic element fixing plate.

9. A dual-FA coupling method, characterized in that, Includes the following steps: Control the power-on module to power the PCB board; The first multi-degree-of-freedom adjustment mechanism is controlled to clamp the first FA material and transfer the first FA material to the preset first posture detection station; And control the second multi-degree-of-freedom adjustment mechanism to clamp the second FA material and transfer the second FA material to the preset second attitude detection station; Image information of the first FA material and the second FA material is collected. The attitude data of the first FA material is obtained based on the image information of the first FA material, and the attitude data of the second FA material is obtained based on the image information of the second FA material. Based on the attitude data of the first FA material, the first multi-degree-of-freedom adjustment mechanism is controlled to rotate and adjust the first FA material so that the mounting reference surface of the first FA material is parallel to the first preset mounting plane of the PCB board, thus completing the attitude calibration of the first FA material. Based on the attitude data of the second FA material, the second multi-degree-of-freedom adjustment mechanism is controlled to rotate and adjust the second FA material so that the mounting reference surface of the second FA material is parallel to the second preset mounting plane of the PCB board, thus completing the attitude calibration of the second FA material. The first and second multi-degree-of-freedom adjustment mechanisms are controlled to move the first FA material and the second FA material, which have been calibrated in attitude, to their respective preset coupling positions along their respective preset trajectories. The first and second multi-degree-of-freedom adjustment mechanisms are controlled to adjust the position and orientation of the first and second FA materials to execute the coupling light-finding process. During the coupling light-finding process, the optical power detection value after the first and second FA materials are coupled is collected. When the optical power detection value is stable for a set time and within the preset optical power range, the coupling light-finding process is determined to be completed, and the first and second multi-degree-of-freedom adjustment mechanisms are controlled to lock the relative coupling orientation of the first and second FA materials.

10. The coupling method as described in claim 9, characterized in that: Acquire image information of the first FA material and / or the second FA material, including: acquiring visual images of the XZ plane, YZ plane, and XY plane of the first vision module; When the first FA material is located at the first posture detection station, the first reflection module and the second reflection module reflect the XZ plane and YZ plane visual images of the first FA material to the imaging area of ​​the first vision module, respectively, so that the first vision module receives the XZ plane and YZ plane visual images reflected by the two reflection modules and acquires the XY plane visual images of the first FA material or / and the second FA material.

Images