Photosensitive resin film and use thereof

Abstract

This invention provides a photosensitive resin film having a thickness T in micrometers. When the photosensitive resin film is measured using ultraviolet-visible spectroscopy, the obtained spectrum shows an absorbance A at 355 nanometers. 355 And 0.003 355 / T≦0.03. The spectrum has at least one point within the first wavelength range where the first derivative is equal to 0 and the second derivative is less than 0, each point independently possessing an A w1 / T value, where w1 represents the wavelength corresponding to that point, A w1 This represents the corresponding absorbance, and 0.003 ≤ A. w1 / T. The first wavelength range is greater than 450 nanometers to 780 nanometers, and the thickness T is 20 micrometers to 200 micrometers.​

Description

Technical Field

[0001] This invention relates to a photosensitive resin film, and more particularly to a photosensitive resin film having specific light absorption properties. The photosensitive resin film of this invention can be used to form the packaging structure of semiconductor devices. Background Technology

[0002] Photosensitive resin films are resin films that undergo chemical changes upon exposure to light. Based on their changes after exposure and development, they can be divided into positive and negative photosensitive resin films. In positive photosensitive resin films, the areas exposed to light dissolve during development, leaving the pattern of the unexposed areas. In negative photosensitive resin films, the unexposed areas dissolve during development, leaving the pattern of the exposed areas. Due to their ease of pattern formation, photosensitive resin films are widely used in the packaging of semiconductor devices, including CMOS (Complementary Metal-Oxide-Semiconductor) image sensors.

[0003] A CMOS image sensor is a semiconductor device used to capture digital images. Its advantages in high resolution, high speed, and low light make it widely used in various fields that require image capture, such as smartphones, digital cameras, webcams, automotive surround view systems, and advanced driver assistance systems (ADAS).

[0004] Generally, the packaging structure of a CMOS image sensor involves placing a patterned structure, formed by photopolymerizing a glass plate with a photosensitive resin layer, onto the sensor chip, with the patterned structure surrounding the photosensitive area of ​​the sensor chip. However, light passing through the glass plate may be partially reflected by the patterned structure, affecting the photosensitive area and causing glare. This poses a serious safety hazard in automotive applications such as surround-view systems and advanced driver assistance systems. Furthermore, as CMOS image sensors trend towards miniaturization, the packaging structure must also be miniaturized accordingly, thus creating a pressing need for a packaging material that can achieve high aspect ratio, high adhesion, and high pattern precision. Summary of the Invention

[0005] In view of the above-mentioned technical problems, the present invention aims to provide a photosensitive resin film that can meet the requirements of low light transmittance, anti-glare and high pattern accuracy, and the photosensitive resin film can further have high adhesion.

[0006] Specifically, one object of the present invention is to provide a photosensitive resin film having a thickness T in micrometers, wherein when the photosensitive resin film is measured by ultraviolet-visible spectroscopy, the obtained spectrum has an absorbance A at 355 nanometers. 355 And 0.003 355 / T≦0.03;

[0007] The spectrum contains at least one point within the first wavelength range where the first derivative is equal to 0 and the second derivative is less than 0, and each of these points independently possesses an A. w1 / T value, where w1 represents the wavelength corresponding to that point, A w1 This represents the corresponding absorbance, and 0.003 ≤ A. w1 / T, preferably 0.003≦A w1 / T≦0.08, more specifically 0.003≦A w1 / T≦0.03; and

[0008] The first wavelength range is greater than 450 nanometers to 780 nanometers, more specifically greater than 480 nanometers to 730 nanometers; the thickness T is 20 micrometers to 200 micrometers.

[0009] In one embodiment of the present invention, the ultraviolet-visible spectroscopy is performed using an ultraviolet-visible spectrophotometer under the following conditions: the photosensitive resin film is placed perpendicular to the incident light source; a diffraction grating is configured as a spectrometer; the test temperature is 25°C; the test pressure is 1 atm; the analysis mode is absorbance; the scanning wavelength range is 190 nm to 1100 nm; the blank sample is air; the scanning speed is 2200 nm / min; the lamp source switching wavelength from deuterium lamp to tungsten filament lamp is 340.8 nm; the sampling interval is 0.2 nm; and the slit width is 2.0 nm.

[0010] In one embodiment of the present invention, the absorbance of the spectrum at 450 nm is A. 450 And 0≦A 450 / T≦0.003.

[0011] In one embodiment of the present invention, the absorbance of the spectrum in the second wavelength range satisfies the following condition: the absorbance at each wavelength is independently A. w2 w2 represents the wavelength corresponding to this absorbance value, and 0 ≦ A. w2 / T≦0.003, where the second wavelength ranges from 440 nm to 470 nm.

[0012] In one embodiment of the present invention, the photosensitive resin film is a negative dry film. ​

[0013] In one embodiment of the present invention, the photosensitive resin film comprises an epoxy resin.

[0014] Another object of the present invention is to provide a composite film comprising the photosensitive resin film as described above, and a protective film located on at least one surface of the photosensitive resin film.

[0015] Another object of the present invention is to provide a packaging structure comprising: a substrate, a semiconductor element electrically connected to the substrate, and a package for packaging the semiconductor element, wherein the material of the package comprises a cured product of the photosensitive resin film as described above.

[0016] In one embodiment of the present invention, the semiconductor element is an image sensing chip, and the image sensing chip includes a photosensitive region; and the material of the package includes a first portion formed of a cured photosensitive resin film as described above, and a second portion formed of a transparent material, wherein the first portion sideways surrounds the image sensing chip, and the second portion is located above the photosensitive region. Detailed Implementation

[0017] The following describes some specific embodiments of the present invention; however, the present invention can be practiced in many different forms and should not be construed as limited to those set forth in the specification.

[0018] Unless otherwise stated, the terms “a,” “the,” and similar terms used in this specification and claims shall be understood to include both singular and plural forms.

[0019] Unless otherwise stated, the terms “first,” “second,” and similar terms used in this specification and claims are used only to distinguish the described elements or components and have no special meaning in themselves, nor are they used to indicate a sequence.

[0020] The advantages of this invention compared to the prior art lie particularly in that, by controlling the absorbance of the photosensitive resin film to light of a specific wavelength, it provides a photosensitive resin film that is anti-glare, has low light transmittance, and high pattern accuracy (the cross-sectional outline of the pattern formed after exposure is good). Furthermore, the photosensitive resin film may also possess high adhesion. The following provides a detailed description of the photosensitive resin film of this invention and its applications.

[0021] 1. Photosensitive resin film

[0022] The photosensitive resin film of the present invention refers to a film comprising a photosensitive resin composition, and can be a positive photosensitive resin film or a negative photosensitive resin film. In one embodiment of the present invention, the photosensitive resin film is a negative photosensitive resin film, that is, after exposure, the unexposed parts of the photosensitive resin film will dissolve during development, leaving the pattern of the exposed parts after development.

[0023] Before use, photosensitive resin films are typically coated with a protective film to provide protection and support, forming a composite film structure. This facilitates storage of the photosensitive resin film and prevents foreign matter from adhering to or damaging it. In this document, unless otherwise stated, properties such as "thickness" and "absorbency" refer to the photosensitive resin film itself and do not include other components such as the protective film used in conjunction with it.

[0024] In one embodiment of the present invention, the photosensitive resin film is a dry film, i.e., a photosensitive resin film with low solvent content. The low solvent content means that the solvent content is 10% by weight or less, specifically 5% by weight or less, and more specifically 0.1% to 4% by weight, based on the total weight of the photosensitive resin film. Compared to ink-like or liquid wet films, dry films, due to their low solvent content, are less prone to flow or deformation, and can be adhered to a substrate without additional coating or drying processes, thus offering advantages such as ease of control and good operability.

[0025] The thickness of the photosensitive resin film of the present invention can be adjusted as needed. In one embodiment of the present invention, the photosensitive resin film has a high thickness. Specifically, the thickness of the photosensitive resin film can be from 20 micrometers to 200 micrometers, for example 20 micrometers, 30 micrometers, 40 micrometers, 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, 100 micrometers, 110 micrometers, 120 micrometers, 130 micrometers, 140 micrometers, 150 micrometers, 160 micrometers, 170 micrometers, 180 micrometers, 190 micrometers, or 200 micrometers, or within a range consisting of any two of the above values.

[0026] The photosensitive resin film of the present invention can be formed from a single layer of photosensitive resin or from stacking two or more layers of photosensitive resin. For example, the photosensitive resin film of the present invention can be formed by stacking two, three or four layers of photosensitive resin, but the present invention is not limited thereto.

[0027] 1.1. Light absorption properties of photosensitive resin films

[0028] [A 355 / T]

[0029] The photosensitive resin film of this invention possesses specific light absorption properties. Specifically, when the photosensitive resin film of this invention is measured using ultraviolet-visible spectroscopy, the obtained spectrum exhibits an absorbance A at 355 nm. 355 And absorbance A 355 The relationship between the thickness T (unit: micrometers) and the thickness T satisfies 0.003. 355 / T≦0.03. For example, A 355 The value of / T can be 0.0035, 0.004, 0.0045, 0.005, 0.0055, 0.006, 0.0065, 0.007, 0.0075, 0.008, 0.0085, 0.009, 0.0095, 0.01, 0.0105, 0.011, 0.0115, 0.012, 0.0125, 0.013, 0.0135, 0.014, 0.0145, 0.015, 0.0155, 0.016, 0.0165, or 0.017. 0.0175, 0.018, 0.0185, 0.019, 0.0195, 0.02, 0.0205, 0.021, 0.0215, 0.022, 0.0225, 0.023, 0.0235, 0.024, 0.0245, 0.025, 0.0255, 0.026, 0.0265, 0.027, 0.0275, 0.028, 0.0285, 0.029, 0.0295, or 0.03, or a range consisting of any two of the above values. If A 355 When the value of / T is below the aforementioned range, the photosensitive resin film lacks sufficient reactivity after exposure, resulting in incomplete photocuring. If A 355 When the / T value is higher than the aforementioned range, the photosensitive resin film cannot form a high-precision pattern after exposure and development, resulting in poor cross-sectional contours.

[0030] [A w1 / T]

[0031] Furthermore, when the photosensitive resin film of the present invention is measured using ultraviolet-visible spectroscopy, it satisfies 0.003... 355 Except for the condition / T≦0.03, the obtained spectrum has at least one point in the first wavelength range where the first derivative is equal to 0 and the second derivative is less than 0; that is, the obtained spectrum has at least one absorption peak in the first wavelength range. Each of these points independently has an A w1 / T value, where w1 represents the wavelength corresponding to that point, A w1 This indicates the corresponding absorbance. The first wavelength range is greater than 450 nm to 780 nm, more specifically greater than 480 nm to 730 nm. In this invention, A w1 The relationship with thickness T (unit: micrometers) satisfies 0.003≦A​​w1 / T, preferably satisfying 0.003≦A w1 / T≦0.08, better satisfying 0.003≦A w1 / T≦0.03. For example, A w1 The value of / T can be 0.003, 0.004, 0.005, 0.006, 0.007, 0.008, 0.009, 0.01, 0.011, 0.012, 0.013, 0.014, 0.015, 0.016, 0.017, 0.018, 0.019, 0.02, 0.021, 0.022, 0.023, 0.024, 0.025, 0.026, 0.027, 0.028, 0.029, or 0.03, or fall within a range consisting of any two of the above values. If A w1 / T falling within the aforementioned range provides the effects of low glare and low light transmittance. Furthermore, within the aforementioned preferred range, the effects of low glare and low light transmittance can be achieved simultaneously while reducing the impact on the adhesion and pattern accuracy of the photosensitive resin film.

[0032] [A 450 / T]

[0033] In a preferred embodiment of the present invention, when the photosensitive resin film is measured by ultraviolet-visible spectroscopy, in addition to satisfying 0.003... 355 / T≦0.03 and 0.003≦A w1 Except under the conditions specified by / T, the photosensitive resin film exhibits no light absorption, substantially no light absorption, or only a small amount of light absorption at 450 nm. Specifically, when measured by ultraviolet-visible spectroscopy, the absorbance of the obtained spectrum at 450 nm is A. 450 The relationship between thickness T (unit: micrometers) and A satisfies 0≦A 450 / T≦0.003, preferably 0≦A 450 / T≦0.0025. For example, A 450 / T can be 0, 0.0005, 0.001, 0.0015, 0.002, or 0.0025, or a range consisting of any two of the above values. Within the above preferred range, the photosensitive resin film can exhibit both superior pattern accuracy and adhesion.

[0034] [A w2 / T]

[0035] In a preferred embodiment of the present invention, when the photosensitive resin film is measured by ultraviolet-visible spectroscopy, in addition to satisfying 0.003... 355 Apart from the condition / T≦0.03, the spectrum exhibits the aforementioned 0.003≦A in the first wavelength range greater than 480 nm to 730 nm. w1 ​​The technical characteristics of / T, and having no light absorption, substantially no light absorption, or only a small amount of light absorption in the second wavelength range. The second wavelength range is 440 nm to 470 nm. Specifically, when the photosensitive resin film is measured by ultraviolet-visible spectroscopy, the absorbance of the obtained spectrum in the second wavelength range satisfies the following condition: the absorbance at each wavelength is independently A. w2 w2 represents the wavelength corresponding to this absorbance value, and 0 ≦ A. w2 / T≦0.003. For example, A w2 / T can be independently 0, 0.0005, 0.001, 0.0015, 0.002, 0.0025, or 0.003, or a range consisting of any two of the above values. Within the above preferred range, the photosensitive resin film can have better pattern accuracy and adhesion.

[0036] In this invention, the above-mentioned ultraviolet-visible spectroscopy is performed using an ultraviolet-visible spectrophotometer under the following conditions: the photosensitive resin film is placed perpendicular to the direction of the incident light source; a diffraction grating is configured as a spectrometer; the test temperature is 25°C; the test pressure is 1 atm; the analysis mode is absorbance; the scanning wavelength range is 190 nm to 1100 nm; the blank sample is air; the scanning speed is 2200 nm / min; the lamp source switching wavelength from deuterium lamp to tungsten filament lamp is 340.8 nm; the sampling interval is 0.2 nm; and the slit width is 2.0 nm. Under the aforementioned test conditions, the photosensitive resin film samples used for analysis were obtained by cutting the photosensitive resin film into 5 cm × 3 cm pieces at any position along the transverse (TD) and machine (MD) directions, or by cutting a composite film containing the photosensitive resin film and protective films on both sides of the photosensitive resin film into 5 cm × 3 cm pieces at any position along the transverse and machine directions, and then removing the protective films on both sides of the cut photosensitive resin film. The photosensitive resin film must be placed perpendicular to the incident light source direction for accurate measurement of its absorbance. The wavelength of the tungsten filament lamp used as the incident light source is 340.8 nm. Furthermore, "sampling interval" refers to taking a data point every 0.2 nm within the scanning wavelength range of 190 nm to 1100 nm and recording its value.

[0037] The light absorption properties of the photosensitive resin film of the present invention can be adjusted by modifying the composition or processing conditions of the photosensitive resin film. For example, the composition of the photosensitive resin film can be adjusted by selecting the type and content of additives, including but not limited to photopolymerization initiators, light absorbers, and dyes. The processing conditions of the photosensitive resin film include, for example, drying conditions. Those skilled in the art, based on the teachings of this specification and particularly the specific examples, can implement a photosensitive resin film possessing the aforementioned light absorption properties.

[0038] 1.2. Other properties of photosensitive resin films

[0039] In A 355 / T and A w1 Provided that the foregoing range is met, other properties of the photosensitive resin film of the present invention can be adapted to the required application.

[0040] For example, the photosensitive resin film can be adjusted to have appropriate lamination tensile strength. Lamination tensile strength refers to the adhesion between the photosensitive resin film and the protective film covering it, expressed as the force required to vertically tear a protective film of a specific size from the photosensitive resin film, which can be a PET or PE protective film. Generally, the lower the lamination tensile strength, the harder and more elastic the photosensitive resin film; the higher the lamination tensile strength, the softer and more adhesive the photosensitive resin film. The lamination tensile strength is measured as follows: a protective film is laminated onto the surface of the photosensitive resin film to form a composite film; the composite film is cut into 10 cm × 10 cm pieces, and then the protective film is cut 50 mm wide along the transverse (TD) direction. The composite film is then fixed on the platform of a push-pull tester. Peel off the 50 mm wide protective film that has been cut, and attach tape to the inside of the protective film (i.e., the side facing the photosensitive resin film) and fix it to the tension shaft of the push-pull tester, with the tension direction perpendicular to the stage. Move the stage at a speed of 70 mm / min in a transverse direction towards the inside of the peeled protective film, and measure the tension after the protective film has been torn 2 cm transversely (TD). The unit of film-coating tension is grams per 50 mm.

[0041] In one embodiment of the present invention, the coating tensile strength of the photosensitive resin film is 2 g / 50 mm or more, more specifically, from 2 g / 50 mm to 1000 g / 50 mm, thus exhibiting excellent adhesion. For example, the coating tensile strength of the photosensitive resin film may be 2 g / 50 mm, 5 g / 50 mm, 10 g / 50 mm, 50 g / 50 mm, 100 g / 50 mm, 200 g / 50 mm, 300 g / 50 mm, 400 g / 50 mm, 500 g / 50 mm, 600 g / 50 mm, 700 g / 50 mm, 800 g / 50 mm, 900 g / 50 mm, or 1000 g / 50 mm, or a range consisting of any two of the above values.

[0042] 1.3. Composition of photosensitive resin film

[0043] In A 355 / T and A w1 Provided that the aforementioned range is met, the composition of the photosensitive resin film can be adjusted as needed. In one embodiment of the present invention, the photosensitive resin film is an epoxy resin-based photosensitive resin film, which contains epoxy resin and may contain ethylene unsaturated compounds, photopolymerization initiators, and other additives as needed.

[0044] 1.3.1. Epoxy Resin

[0045] Examples of epoxy resins include, but are not limited to, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S type epoxy resin, bisphenol A phenolic epoxy resin, phenolic epoxy resin, alkylphenolic epoxy resin, phenolic epoxy resin, cresol phenolic epoxy resin, cycloaliphatic epoxy resin, biphenyl type epoxy resin, aralkyl type epoxy resin, naphthyl ring type epoxy resin, naphthol type epoxy resin, biphenyl aralkyl type epoxy resin, fluorene type epoxy resin, xaton type epoxy resin, dicyclopentadiene type epoxy resin, triglycidyl polyisocyanate, and oxetane type epoxy resin. The aforementioned epoxy resins can be used alone or in combination. In one embodiment of the present invention, bisphenol A epoxy resin, bisphenol A phenolic epoxy resin, phenolic epoxy resin, cresol phenolic epoxy resin, cycloaliphatic epoxy resin, or oxetane epoxy resin is used.

[0046] In the photosensitive resin film of the present invention, the epoxy resin content, based on the total weight of the photosensitive resin film, can be from 50% to 99% by weight, more specifically from 55% to 98% by weight, and even more specifically from 60% to 95% by weight. For example, the epoxy resin content, based on the total weight of the photosensitive resin film, can be 50% by weight, 51% by weight, 52% by weight, 53% by weight, 54% by weight, 55% by weight, 56% by weight, 57% by weight, 58% by weight, 59% by weight, 60% by weight, 61% by weight, 62% by weight, 63% by weight, 64% by weight, 65% by weight, 66% by weight, 67% by weight, 68% by weight, 69% by weight, 70% by weight, 71% by weight, 72% by weight, 73% by weight, 74% by weight, etc. 75% by weight, 76% by weight, 77% by weight, 78% by weight, 79% by weight, 80% by weight, 81% by weight, 82% by weight, 83% by weight, 84% by weight, 85% by weight, 86% by weight, 87% by weight, 88% by weight, 89% by weight, 90% by weight, 91% by weight, 92% by weight, 93% by weight, 94% by weight, 95% by weight, 96% by weight, 97% by weight, 98% by weight, or 99% by weight, or a range consisting of any two of the above values.

[0047] 1.3.2. Ethylene-unsaturated compounds

[0048] Ethylene unsaturated compounds refer to compounds having at least one reactive ethylene functional group, such as bifunctional compounds having two reactive ethylene functional groups. Examples of ethylene unsaturated compounds include, but are not limited to, ethoxylated trimethylolpropane triacrylate, ethoxylated bisphenol A diacrylate, ethoxylated bisphenol A dimethacrylate, tripropylene glycol diacrylate, 1,6-hexanediol diacrylate, polypropylene glycol diacrylate, tris((meth)acryloyloxyisocyanate)hexamethylene isocyanate, ethoxylated urate di(meth)acrylate, propoxylated urate di(meth)acrylate, ethoxylated / propoxylated urate di(meth)acrylate, ethoxylated tris(methacryloyloxyisocyanate)hexamethylene isocyanate, acrylated tris(methacryloyloxyisocyanate)hexamethylene isocyanate, and ethoxylated / propoxylated tris(methacryloyloxyisocyanate)hexamethylene isocyanate. The aforementioned ethylene unsaturated compounds can be used alone or in combination. In one embodiment of the present invention, ethoxylated trimethylolpropane triacrylate is used.

[0049] In the photosensitive resin film of the present invention, the content of the vinyl unsaturated compound can be from 0% to 70% by weight based on the total weight of the photosensitive resin film. For example, the content of the vinyl unsaturated double bond compound can be 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, or 70% by weight based on the total weight of the photoresist film, or within a range consisting of any two of the above values.

[0050] 1.3.3. Photopolymerization initiator

[0051] Examples of photopolymerization initiators include, but are not limited to, imidazole compounds, ketone compounds, quinone compounds, benzoin or benzoin ether compounds, polyhalogenated compounds, triazine compounds, organic peroxides, and onium salt compounds. The aforementioned photopolymerization initiators can be used alone or in combination. In one embodiment of the invention, onium salt compounds are used. Examples of the aforementioned onium salt compounds include, but are not limited to, diaryliodoiodon and triarylsulfonium salts obtained by combining biphenyliodonium, 4,4'-dichlorobiphenyliodonium, 4,4'-dimethoxybiphenyliodonium, 4,4'-di-tri-butylbiphenyliodonium, 4-methyl-4'-isopropyl-biphenyliodonium, or 3,3'-dinitrobiphenyliodonium with chlorides, bromides, tetrafluoroborates, hexafluorophosphates, hexafluoroarsenates, hexafluoroantimonates, and tetra(pentafluorophenyl)borates or trifluoromethanesulfonic acid.

[0052] In the photosensitive resin film of the present invention, the content of the photopolymerization initiator, based on the total weight of the photosensitive resin film, can be from 0.5% by weight to 10% by weight, more specifically from 1% by weight to 5% by weight. For example, relative to the total weight of the photosensitive resin film, the content of the photopolymerization initiator can be 0.5% by weight, 1% by weight, 1.5% by weight, 2% by weight, 2.5% by weight, 3% by weight, 3.5% by weight, 4% by weight, 4.5% by weight, 5% by weight, 5.5% by weight, 6% by weight, 6.5% by weight, 7% by weight, 7.5% by weight, 8% by weight, 8.5% by weight, 9% by weight, 9.5% by weight, or 10% by weight, or within a range consisting of any two of the above values.

[0053] 1.3.4. Additives

[0054] In accordance with A 355 / T and A w1 Subject to the foregoing scope, the photosensitive resin film of the present invention may further comprise additives to specifically improve the properties of the photosensitive resin film. Examples of such additives include, but are not limited to, light absorbers, dyes, pigments, free radical inhibitors, surfactants, toughening agents, and plasticizers. Each of these additives may be used alone or in any combination. In one embodiment of the present invention, the photosensitive resin film further comprises a silane coupling agent, a light absorber, and a dye.

[0055] In the photosensitive resin film of the present invention, the content of the additive, based on the total weight of the photosensitive resin film, is preferably less than 20% by weight. For example, relative to the total weight of the photosensitive resin film, the content of the additive may be 1% by weight, 2% by weight, 3% by weight, 4% by weight, 5% by weight, 6% by weight, 7% by weight, 8% by weight, 9% by weight, 10% by weight, 11% by weight, 12% by weight, 13% by weight, 14% by weight, 15% by weight, 16% by weight, 17% by weight, 18% by weight, or 19% by weight, or within a range consisting of any two of the above values.

[0056] 1.4. Preparation of photosensitive resin film

[0057] The preparation method of the photosensitive resin film of the present invention is not particularly limited. Based on the disclosure of this specification, those skilled in the art can prepare the photosensitive resin film. For example, the components of the photosensitive resin film can be uniformly mixed and dissolved or dispersed in a solvent using a stirrer to form a resin composition. The resulting resin composition is then coated onto a substrate and dried to obtain the photosensitive resin film.

[0058] There are no particular limitations on the coating method of the resin composition. Any coating method known in the technical field to which this invention pertains can be used, including but not limited to gravure coating, reverse roll coating, die coating, air blade coating, doctor blade coating, rod coating, doctor bar coating, curtain coating, knife coating, transfer roll coating, extrusion coating, impregnation coating, coincidence coating, spray coating, calendar coating, and extrusion coating.

[0059] For a detailed description of the preparation method of the photosensitive resin film of the present invention, please refer to the following embodiments, which will not be repeated here.

[0060] 2. Composite membrane

[0061] Generally, before use, a protective film is applied to both surfaces of the photosensitive resin film to provide protection and support, facilitating storage and preventing foreign matter from adhering to or damaging the film. Therefore, this invention further provides a composite film comprising the photosensitive resin film of this invention as described above, and a protective film formed on at least one surface of the photosensitive resin film. In a preferred embodiment of this invention, the protective film is formed on both surfaces of the photosensitive resin film, and the materials of the protective films formed on the two surfaces of the photosensitive resin film may be the same or different.

[0062] There are no particular limitations on the type of protective film, and various materials existing in the technical field to which this invention pertains can be used. For example, the protective film that can be used in this invention may be selected from the following group: polyethylene terephthalate film (PET film), polyolefin film, and the aforementioned composites. Examples of the polyolefin film include, but are not limited to, polyethylene film (PE film) and polypropylene film (PP film), such as oriented polypropylene film, and the composite may be a composite of polyethylene terephthalate film and polyolefin film, or a composite of different polyolefin films. In a preferred embodiment of the invention, the composite film comprises PET film respectively formed on two surfaces of a photosensitive resin film, or the composite film comprises PET film formed on one surface of a photosensitive resin film and PE film formed on the other surface of a photosensitive resin film.

[0063] The preparation method of the composite film of the present invention is not particularly limited, and existing methods in the field to which this invention pertains can be used. For example, a protective film can be laminated on two surfaces of a photosensitive resin film to provide a laminate, and the laminate can be pressurized to obtain a composite film. Alternatively, a resin composition for forming a photosensitive resin film can be first coated on a first protective film and dried to form a photosensitive resin film on the first protective film, and then a second protective film can be attached to the surface of the photosensitive resin film that is not in contact with the first protective film, thereby obtaining a composite film. Alternatively, a resin composition for forming a photosensitive resin film can be extruded between two protective films having a fixed spacing, and then dried to form a photosensitive resin film between the two protective films.

[0064] 3. Packaging Structure

[0065] The cured photosensitive resin film of the present invention can be used as a material for forming a package to prepare a package structure for a semiconductor device. Therefore, the present invention further provides a package structure comprising: a substrate, a semiconductor device electrically connected to the substrate, and a package for encapsulating the semiconductor device, wherein the material of the package comprises the cured photosensitive resin film as described above.

[0066] There are no particular limitations on the type or function of the aforementioned semiconductor element. In one embodiment of the present invention, the semiconductor element may be an image sensing chip, and the image sensing chip may include a photosensitive region. When the semiconductor element is an image sensing chip, the package material may, for example, include a first portion formed of a cured photosensitive resin film as described above, and a second portion formed of a transparent material, wherein the first portion surrounds the image sensing chip on its sides, and the second portion is located above the photosensitive region. The first portion may be directly connected to the second portion, or connected to the second portion through an intermediary, to form the package. Furthermore, the first portion may be directly connected to the substrate, or connected to the substrate through an intermediary; or, the first portion may be directly connected to the non-photosensitive region of the image sensing chip, or connected to the non-photosensitive region of the image sensing chip through an intermediary.

[0067] 4. Example

[0068] 4.1 Measurement Method

[0069] [Thickness of the photosensitive resin film]

[0070] The composite film containing the photosensitive resin film was cut into 5 cm × 3 cm pieces, and the protective films on both sides of the photosensitive resin film were removed. The photosensitive resin film was placed on the base (MS-11C base) of a film thickness gauge (model: Nikon Digimicro MFC-101+MS-11C, purchased from Nikon Corporation). The MFC-101 measuring instrument was used to measure the thickness at 140 g / L, and the average value was taken.

[0071] [Absorbance of photosensitive resin film]

[0072] The composite film containing the photosensitive resin film was cut into 5 cm × 3 cm pieces, and the protective films on both sides of the photosensitive resin film were removed. The photosensitive resin film was measured using a UV-Vis spectrophotometer (model: Shimadzu UV-1601, purchased from Shimadzu Corporation) as follows: The photosensitive resin film was placed perpendicular to the incident light source using a fixture, and the absorbance spectrum was obtained under the following conditions: a diffraction grating was used as the spectrometer; the test temperature was 25°C; the test pressure was 1 atm; the analysis mode was absorbance; the scanning wavelength range was 190 nm to 1100 nm; the blank sample was air; the scanning speed was 2200 nm / min; the lamp source switching wavelength from deuterium lamp to tungsten filament lamp was 340.8 nm; the sampling interval was 0.2 nm; the slit width was 2.0 nm; and Shimadzu UVProbe V1.11 software was used.

[0073] [Lamination Tensile Strength]

[0074] Cut the composite film containing the photosensitive resin film into 10 cm x 10 cm pieces, then cut a 50 mm wide strip of PET protective film transversely (TD). Secure the composite film to the stage of a push-pull press (model: FM-50N, purchased from YOTEC) with double-sided tape. Peel off the 50 mm wide strip of PET protective film, attach tape to the inside of the PET protective film (i.e., the side facing the photosensitive resin film), and secure it to the tension shaft of the push-pull press, ensuring the tension direction is perpendicular to the stage. Move the stage transversely towards the inside of the peeled PET protective film at a speed of 70 mm / min, and measure the tension after the PET protective film has been torn 2 cm. The unit of lamination tension is grams per 50 mm.

[0075] [Cross-sectional shape of the photoresist pattern]

[0076] Take a 2 mm thick low-alkali glass sample and preheat it in a batch oven at 80°C for 10 minutes, maintaining the surface temperature of the low-alkali glass at 50°C before lamination. Place the photosensitive resin film on the low-alkali glass and apply pressure using a laminator (model: CSL-M25E, purchased from Zhisheng Industrial). The laminator temperature is 80°C, the pressure is 3 kg / cm², and the lamination speed is 2.0 m / min. After lamination, remove the excess film and allow it to stand for 15 minutes to cool the resulting photosensitive resin film sample to room temperature.

[0077] The photosensitive resin film was exposed using an exposure machine (Model: Contact Aligner, purchased from Deyang Optoelectronics) with an exposure light source wavelength of 365 nm (i-line). Exposure was continued until the exposure energy reached 300 mJ / cm². The predetermined aspect ratio of the photoresist pattern was 2.0, and the graphic scale of the linear spatial width to the photoresist width was 1:1. After exposure, the exposed photosensitive resin film was baked at 70°C for 5 minutes.

[0078] Then, the exposed photosensitive resin film is developed using propylene glycol methyl ether acetate (PGMEA) as the developer, with the liquid temperature set at 24°C to 26°C, and the film is immersed and developed for 5 minutes to obtain the developed photosensitive resin film.

[0079] Using a glass cutter, the developed photosensitive resin film, along with a low-alkali glass shard, was placed along the outer edge of a linear space. The cross-sectional shape of the photoresist pattern was observed using a scanning electron microscope, with the sample tilted at 75° and the magnification at 200x. A photoresist cross-section was randomly selected, and the width of the photoresist was measured at 1 / 25, 2 / 25, 3 / 25, 4 / 25, and 5 / 25 of the total thickness of the photoresist, starting from the upper edge of the photoresist (the side away from the low-alkali glass). The average of these five width values ​​was taken as the upper width. Similarly, the width of the photoresist was measured at 1 / 25, 2 / 25, 3 / 25, 4 / 25, and 5 / 25 of the total thickness of the photoresist, starting from the lower edge of the photoresist (the side in contact with the low-alkali glass). The average of these five width values ​​was taken as the lower width. If the value of "|(top width - bottom width)| / thickness" is less than 0.04, it is recorded as "rectangular", indicating that the cross-sectional shape of the photoresist pattern is good; if the value of "|(top width - bottom width)| / thickness" is greater than or equal to 0.04, it is recorded as "trapezoidal", indicating that the cross-sectional shape of the photoresist pattern is poor. "|(top width - bottom width)|" in the formula represents the absolute value.

[0080] [Footing length of the photoresist pattern]

[0081] The developed photosensitive resin film was prepared in the same manner as described above for the [cross-sectional shape of the photoresist pattern]. Then, using a glass cutter, the developed photosensitive resin film, along with a low-alkali glass shard, was placed at the outer edge of a linear space. The cross-sectional shape of the photoresist pattern was observed using a scanning electron microscope, with the shard tilted at 75° and the magnification at 5000x. A photoresist cross-section was randomly selected, and the side with the largest protrusion into the linear space was chosen for calculating the base length. The calculation method was as follows: using the photoresist sidewall position, where the thickness is 1 / 5 of the total photoresist thickness along the lower edge of the photoresist, as a reference point, a reference line perpendicular to the low-alkali glass surface was extended downwards from the reference point. The length from the intersection of the reference line and the low-alkali glass surface to the intersection of the photoresist sidewall and the low-alkali glass surface was the base length.

[0082] [Light transmittance]

[0083] The composite film containing the photosensitive resin film was cut into 5 cm × 3 cm pieces, and the protective films on both sides of the photosensitive resin film were removed. The photosensitive resin film was measured using a UV-Vis spectrophotometer (model: Shimadzu UV-1601, purchased from Shimadzu Corporation) as follows: The photosensitive resin film was placed upright on the analytical stage using a fixture, perpendicular to the incident light source, and the light transmittance T at a wavelength of 550 nm was measured under the following conditions. 550nmThe analysis mode was transmittance; the scanning wavelength range was 190 nm to 1100 nm; the blank sample was air; the scanning speed was 2200 nm / min; the lamp source switching wavelength from deuterium lamp to tungsten filament lamp was 340.8 nm; and the sampling interval was 0.2 nm.

[0084] [Silicon Adhesion Test]

[0085] Take a 2 mm thick low-alkali glass sample and preheat it in a batch oven at 80°C for 10 minutes, maintaining the surface temperature of the low-alkali glass at 50°C before lamination. Place the photosensitive resin film on the low-alkali glass and apply pressure using a laminator (model: CSL-M25E, purchased from Zhisheng Industrial). The laminator temperature is 80°C, the pressure is 3 kg / cm², and the lamination speed is 2.0 m / min. After lamination, remove the excess film and allow it to stand for 15 minutes to allow the resulting photosensitive resin film sample to cool to room temperature.

[0086] The photosensitive resin film was exposed using an exposure machine (Model: Contact Aligner, purchased from Deyang Optoelectronics) with an exposure light source wavelength of 365 nm (i-line) and exposure continued until the exposure energy reached 300 mJ / cm². After exposure, the exposed photosensitive resin film was baked at 70°C for 5 minutes.

[0087] Then, the exposed photosensitive resin film is developed using propylene glycol methyl ether acetate (PGMEA) as the developer, with the liquid temperature set at 24°C to 26°C. The film is immersed and developed for 5 minutes to obtain a developed, patternless photosensitive resin film.

[0088] A 3-square-millimeter bare silicon substrate was placed on the side of the photosensitive resin film that was not in contact with the low-alkali glass, and bonded at 130°C with a pressure of 3 kgf / cm² for 5 minutes. Afterward, the force required to tear the bare silicon substrate was tested using a push-pull tester. During the test, the force was applied parallel to the bonding surface between the bare silicon substrate and the photosensitive resin film. The force acted directly on the bare silicon substrate, specifically at the mid-height position of a side surface perpendicular to the photosensitive resin film. The unit of force is kgf / 3 mm².

[0089] 4.2. Preparation of photosensitive resin film

[0090] Information on the raw materials used in the following embodiments and comparative examples is shown in Table 1 below.

[0091] Table 1

[0092]

[0093] [Example 1]

[0094] 90 parts by weight of BNE200 epoxy resin, 10 parts by weight of BE507 epoxy resin, 25 parts by weight of acetone, 2 parts by weight of triphenylsulfonium hexafluoroantimonate, 5 parts by weight of KBE-403 silane coupling agent, 0.2 parts by weight of solvent blue, and 12 parts by weight of tetrahydrofuran were mixed and stirred for 5 hours to obtain the resin composition of Example 1.

[0095] The resin composition of Example 1 was coated onto a PET film as a protective film using a Kodaira bar coating. The coated resin composition was then dried in an oven. Finally, a PE film as a protective film was applied to the surface of the dried resin composition to obtain the photosensitive resin film (i.e., composite film) of Example 1 with a protective film coating. The coating and drying conditions were as follows: coating thickness of 160 micrometers, drying temperature of 100°C, drying time of 20 minutes, and a thickness of 120 micrometers after drying.

[0096] [Example 2]

[0097] 20 parts by weight of BNE200 epoxy resin, 60 parts by weight of BE507 epoxy resin, 20 parts by weight of CNE200ELA epoxy resin, 30 parts by weight of acetone, 1.8 parts by weight of triphenylsulfonium (pentafluorophenyl) borate, 5 parts by weight of KBE-403 silane coupling agent, 1.2 parts by weight of oil blue, and 12 parts by weight of tetrahydrofuran were mixed and stirred for 5 hours to obtain the resin composition of Example 2.

[0098] The resin composition of Example 2 was coated onto a PET film as a protective film using a Kodaira bar coating. The coated resin composition was then dried in an oven. Finally, a PE film as a protective film was applied to the surface of the dried resin composition to obtain the photosensitive resin film (i.e., composite film) of Example 2 with a protective film coating. The coating and drying conditions were as follows: coating thickness of 25 micrometers, drying temperature of 100°C, drying time of 15 minutes, and a thickness of 20 micrometers after drying.

[0099] [Example 3]

[0100] 30 parts by weight of BNE200 epoxy resin, 20 parts by weight of BE507 epoxy resin, 50 parts by weight of PNE177 epoxy resin, 35 parts by weight of acetone, 4 parts by weight of triphenylsulfonium (pentafluorophenyl) borate, 5 parts by weight of KBE-403 silane coupling agent, 0.5 parts by weight of solvent blue, and 12 parts by weight of tetrahydrofuran were mixed and stirred for 5 hours to obtain the resin composition of Example 3.

[0101] The resin composition of Example 3 was coated onto a PET film as a protective film using a Kodaira bar coating. The coated resin composition was then dried in an oven. Finally, a PE film as a protective film was applied to the surface of the dried resin composition to obtain the photosensitive resin film (i.e., composite film) of Example 3 with a protective film coating. The coating and drying conditions were as follows: coating thickness of 85 micrometers, drying temperature of 90°C, drying time of 19 minutes, and a thickness of 60 micrometers after drying.

[0102] [Example 4]

[0103] 75 parts by weight of BNE200 epoxy resin, 10 parts by weight of BE507 epoxy resin, 5 parts by weight of BNE220 epoxy resin, 10 parts by weight of 3EO TMPTA (vinyl unsaturated compound), 25 parts by weight of acetone, 4 parts by weight of triarylsulfonium (pentafluorophenyl) borate, 5 parts by weight of KBE-403 silane coupling agent, 0.5 parts by weight of oil blue, and 15 parts by weight of tetrahydrofuran were mixed and stirred for 5 hours to obtain the resin composition of Example 4.

[0104] The resin composition of Example 4 was coated onto a PET film as a protective film using a Kodaira bar coating. The coated resin composition was then dried in an oven. Finally, a PE film as a protective film was applied to the surface of the dried resin composition to obtain the photosensitive resin film (i.e., composite film) of Example 4 with a protective film coating. The coating and drying conditions were as follows: coating thickness of 275 micrometers, drying temperature of 95°C, drying time of 30 minutes, and a thickness of 200 micrometers after drying.

[0105] [Example 5]

[0106] 20 parts by weight of BNE200 epoxy resin, 20 parts by weight of BE507 epoxy resin, 20 parts by weight of PNE177 epoxy resin, 20 parts by weight of BNE220 epoxy resin, 10 parts by weight of Celloxide 2021P epoxy resin, 10 parts by weight of TCM201 epoxy resin, 25 parts by weight of acetone, 2 parts by weight of triphenylsulfonium hexafluoroantimonate, 5 parts by weight of KBE-403 silane coupling agent, 0.2 parts by weight of solvent blue, and 12 parts by weight of tetrahydrofuran were mixed and stirred for 5 hours to obtain the resin composition of Example 5.

[0107] The resin composition of Example 5 was coated onto a PET film as a protective film using a Kodaira bar coating. The coated resin composition was then dried in an oven. Finally, a PE film as a protective film was applied to the surface of the dried resin composition to obtain the photosensitive resin film (i.e., composite film) of Example 5 with a protective film coating. The coating and drying conditions were as follows: coating thickness of 130 micrometers, drying temperature of 100°C, drying time of 20 minutes, and a thickness of 100 micrometers after drying.

[0108] [Example 6]

[0109] 50 parts by weight of BNE200 epoxy resin, 40 parts by weight of BE507 epoxy resin, 10 parts by weight of BNE220 epoxy resin, 25 parts by weight of acetone, 1.5 parts by weight of triphenylsulfonium hexafluoroantimonate, 0.5 parts by weight of triarylsulfonium (pentafluorophenyl)borate, 4 parts by weight of KBE-403 silane coupling agent, 0.3 parts by weight of solvent blue, 0.05 parts by weight of solvent yellow, and 12 parts by weight of tetrahydrofuran were mixed and stirred for 5 hours to obtain the resin composition of Example 6.

[0110] The resin composition of Example 6 was coated onto a PET film as a protective film using a Kodaira bar coating. The coated resin composition was then dried in an oven. Finally, a PE film as a protective film was applied to the surface of the dried resin composition to obtain the photosensitive resin film (i.e., composite film) of Example 6 with a protective film coating. The coating and drying conditions were as follows: coating thickness of 130 micrometers, drying temperature of 90°C, drying time of 25 minutes, and a thickness of 100 micrometers after drying.

[0111] [Example 7]

[0112] 20 parts by weight of BNE200 epoxy resin, 60 parts by weight of BE507 epoxy resin, 20 parts by weight of PNE177 epoxy resin, 25 parts by weight of acetone, 2 parts by weight of triphenylsulfonium hexafluoroantimonate, 5 parts by weight of KBE-403 silane coupling agent, 0.2 parts by weight of solvent blue, and 12 parts by weight of tetrahydrofuran were mixed and stirred for 5 hours to obtain the resin composition of Example 7.

[0113] The resin composition of Example 7 was coated onto a PET film as a protective film using a Kodaira bar coating. The coated resin composition was then dried in an oven. Finally, a PE film as a protective film was applied to the surface of the dried resin composition to obtain the photosensitive resin film (i.e., composite film) of Example 7 with a protective film coating. The coating and drying conditions were as follows: coating thickness of 130 micrometers, drying temperature of 100°C, drying time of 20 minutes, and a thickness of 100 micrometers after drying.

[0114] [Comparative Example 1]

[0115] 100 parts by weight of Celloxide 2021P epoxy resin, 25 parts by weight of acetone, 0.3 parts by weight of triphenylsulfonium hexafluoroantimonate, 2 parts by weight of SI-45, 5 parts by weight of KBE-403 silane coupling agent, 0.3 parts by weight of solvent blue, and 12 parts by weight of tetrahydrofuran were mixed and stirred for 5 hours to obtain the resin composition of Comparative Example 1.

[0116] The resin composition of Comparative Example 1 was coated onto a PET film as a protective film using a Kodaira bar. The coated resin composition was then dried in an oven. A PE film as a protective film was then applied to the surface of the dried resin composition to obtain the photosensitive resin film (i.e., composite film) of Comparative Example 1 coated with a protective film. The coating and drying conditions were as follows: coating thickness of 130 micrometers, drying temperature of 100°C, drying time of 20 minutes, and a thickness of 100 micrometers after drying.

[0117] [Comparative Example 2]

[0118] 90 parts by weight of BNE220 epoxy resin, 10 parts by weight of TCM201 epoxy resin, 25 parts by weight of acetone, 1 part by weight of triphenylsulfonium (pentafluorophenyl) borate, 4 parts by weight of triarylsulfonium (pentafluorophenyl) borate, 5 parts by weight of KBE-403 silane coupling agent, and 12 parts by weight of tetrahydrofuran were mixed and stirred for 5 hours to obtain the resin composition of Comparative Example 2.

[0119] The resin composition of Comparative Example 2 was coated onto a PET film as a protective film using a Kodaira bar coating. The coated resin composition was then dried in an oven. Finally, a PE film as a protective film was applied to the surface of the dried resin composition to obtain the photosensitive resin film (i.e., composite film) of Comparative Example 2 coated with a protective film. The coating and drying conditions were as follows: coating thickness of 85 micrometers, drying temperature of 90°C, drying time of 19 minutes, and a thickness of 60 micrometers after drying.

[0120] [Comparative Example 3]

[0121] 20 parts by weight of BNE200 epoxy resin, 60 parts by weight of BE507 epoxy resin, 20 parts by weight of CNE200ELA epoxy resin, 30 parts by weight of acetone, 4 parts by weight of triphenylsulfonium (pentafluorophenyl) borate, 5 parts by weight of KBE-403 silane coupling agent, 0.06 parts by weight of solvent black, and 15 parts by weight of tetrahydrofuran were mixed and stirred for 5 hours to obtain the resin composition of Comparative Example 3.

[0122] The resin composition of Comparative Example 3 was coated onto a PET film as a protective film using a Kodaira bar coating. The coated resin composition was then dried in an oven. A PE film as a protective film was then applied to the surface of the dried resin composition to obtain the photosensitive resin film (i.e., composite film) of Comparative Example 3 coated with a protective film. The coating and drying conditions were as follows: coating thickness of 160 micrometers, drying temperature of 100°C, drying time of 15 minutes, and a thickness of 120 micrometers after drying.

[0123] [Comparative Example 4]

[0124] 30 parts by weight of BNE200 epoxy resin, 20 parts by weight of BE507 epoxy resin, 50 parts by weight of PNE177 epoxy resin, 25 parts by weight of acetone, 2 parts by weight of triphenylsulfonium hexafluoroantimonate, 0.3 parts by weight of diphenyliodo(pentafluorophenyl)borate, 5 parts by weight of KBE-403 silane coupling agent, 0.05 parts by weight of solvent blue, and 12 parts by weight of tetrahydrofuran were mixed and stirred for 5 hours to obtain the resin composition of Comparative Example 4.

[0125] The resin composition of Comparative Example 4 was coated onto a PET film as a protective film using a Kodaira bar coating. The coated resin composition was then dried in an oven. A PE film as a protective film was then applied to the surface of the dried resin composition to obtain the photosensitive resin film (i.e., composite film) of Comparative Example 4 coated with a protective film. The coating and drying conditions were as follows: coating thickness of 160 micrometers, drying temperature of 100°C, drying time of 20 minutes, and a thickness of 120 micrometers after drying.

[0126] [Comparative Example 5]

[0127] 20 parts by weight of BNE200 epoxy resin, 60 parts by weight of BE507 epoxy resin, 20 parts by weight of CNE200ELA epoxy resin, 25 parts by weight of acetone, 2 parts by weight of triphenylsulfonium hexafluoroantimonate, 5 parts by weight of KBE-403 silane coupling agent, 0.2 parts by weight of reactive yellow, 0.01 parts by weight of solvent black, and 15 parts by weight of tetrahydrofuran were mixed and stirred for 5 hours to obtain the resin composition of Comparative Example 5.

[0128] The resin composition of Comparative Example 5 was coated onto a PET film as a protective film using a Kodaira bar coating. The coated resin composition was then dried in an oven. A PE film as a protective film was then applied to the surface of the dried resin composition to obtain the photosensitive resin film (i.e., composite film) of Comparative Example 5 coated with a protective film. The coating and drying conditions were as follows: coating thickness of 140 micrometers, drying temperature of 95°C, drying time of 20 minutes, and a thickness of 100 micrometers after drying.

[0129] 4.3. Testing of Photosensitive Resin Films

[0130] The properties of the photosensitive resin films of Examples 1 to 7 and Comparative Examples 1 to 5 were measured according to the measurement methods described above, and the results are recorded in Tables 2-1 and 2-2 below.

[0131] Table 2-1

[0132]

[0133] Table 2-2

[0134]

[0135] As shown in Tables 2-1 and 2-2, the photoresist patterns formed by the photosensitive resin films of Examples 1 to 7 of the present invention after exposure and development have excellent cross-sectional profiles (rectangular cross-section, short base length) and low light transmittance (550 nm wavelength). Examples 1 to 7 further show that if the coating tensile strength of the photosensitive resin film is greater than 2, the silicone adhesion of the photosensitive resin film can be further improved.

[0136] In contrast, the photosensitive resin films of Comparative Examples 1 to 5 cannot simultaneously possess both a good photoresist pattern cross-sectional profile and low light transmittance. Comparative Examples 1 and 3 show that if A 355 If / T is below or above the range specified in this invention, the cross-sectional profile of the photoresist pattern is poor. Comparative Examples 2 and 4 show that if the spectrum does not have at least one point in the first wavelength range where the first derivative is equal to 0 and the second derivative is less than 0, or if A in the first wavelength range is... w1 If the absorbance ( / T) is below the range specified in this invention, the cross-sectional profile of the photoresist pattern is poor, and the light transmittance is high. This will cause glare problems when applied to the packaging of image sensing chips. Comparative Example 5 shows that if the spectrum does not have at least one point in the first wavelength range where the first derivative is equal to 0 and the second derivative is less than 0, and the absorbance in the second wavelength range does not meet A... w2 If / T≦0.003, the cross-sectional profile of the photoresist pattern is poor and the light transmittance is high, which will cause glare problems when applied to the packaging of image sensing chips.

[0137] The above embodiments are merely illustrative of the principles and effects of the present invention and to illustrate its technical features, and are not intended to limit the scope of protection of the present invention. Any changes or arrangements that can be easily made by those skilled in the art without departing from the technical principles of the present invention are within the scope of the present invention. Therefore, the scope of protection of the present invention is as set forth in the claims.

Claims

1. A photosensitive resin film, characterized in that, It has a thickness T in micrometers. When the photosensitive resin film is measured using ultraviolet-visible spectroscopy, the obtained spectrum shows an absorbance A at 355 nm. 355 And 0.003 355 / T≦0.03;​ The spectrum contains at least one point within the first wavelength range where the first derivative is equal to 0 and the second derivative is less than 0, and each of these points independently possesses an A. w1 / T value, where w1 represents the wavelength corresponding to that point, A w1 This represents the corresponding absorbance, and 0.003 ≤ A. w1 / T; and The first wavelength range is greater than 450 nanometers to 780 nanometers, and the thickness T is 20 micrometers to 200 micrometers.

2. The photosensitive resin film as described in claim 1, characterized in that, 0.003≦A w1 / T≦0.08。 3. The photosensitive resin film as described in claim 1, characterized in that, This ultraviolet-visible spectroscopy was performed using an ultraviolet-visible spectrophotometer under the following conditions: the photosensitive resin film was placed perpendicular to the incident light source; a diffraction grating was used as the spectrometer; the test temperature was 25°C; the test pressure was 1 atm; the analysis mode was absorbance; the scanning wavelength range was 190 nm to 1100 nm; the blank sample was air; the scanning speed was 2200 nm / min; the lamp source switching wavelength from deuterium lamp to tungsten filament lamp was 340.8 nm; the sampling interval was 0.2 nm; and the slit width was 2.0 nm.

4. The photosensitive resin film as described in claim 1, characterized in that, The absorbance of this spectrum at 450 nm is A. 450 And 0≦A 450 / T≦0.

003.

5. The photosensitive resin film as described in claim 1, characterized in that, The first wavelength range is greater than 480 nanometers to 730 nanometers.

6. The photosensitive resin film as described in claim 5, characterized in that, The absorbance of this spectrum in the second wavelength range satisfies the following condition: the absorbance at each wavelength is independently A. w2 w2 represents the wavelength corresponding to this absorbance value, and 0 ≦ A. w2 / T≦0.003, where the second wavelength ranges from 440 nm to 470 nm.

7. The photosensitive resin film according to any one of claims 1 to 6, characterized in that, It is a negative dry film.

8. The photosensitive resin film according to any one of claims 1 to 6, characterized in that, It contains epoxy resin.

9. A composite membrane, characterized in that, Include: The photosensitive resin film as described in any one of claims 1 to 8; and A protective film is located on at least one surface of the photosensitive resin film.

10. A packaging structure, characterized in that, Include: substrate; Semiconductor elements electrically connected to the substrate; and Package, used to encapsulate the semiconductor element. The material of the encapsulation comprises a cured product of the photosensitive resin film as described in any one of claims 1 to 8.

11. The packaging structure as described in claim 10, characterized in that, The semiconductor device is an image sensing chip, and the image sensing chip includes a photosensitive area; and The package material comprises a first portion formed of a cured photosensitive resin film as described in any one of claims 1 to 8, and a second portion formed of a transparent material, wherein the first portion sides surround the image sensing chip, and the second portion is located above the photosensitive area.

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