Packaging substrate with components included in cavity of glass core
By using a single laser-induced etching process to manufacture through-glass vias and cavities in the glass core packaging substrate, the negative impact of multiple etching processes on the glass core in existing technologies has been resolved. This has enabled efficient and stable manufacturing of various opening structures, improving mechanical and electrical performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- INTEL CORP
- Filing Date
- 2025-11-17
- Publication Date
- 2026-06-19
AI Technical Summary
Existing technologies make it difficult to simultaneously manufacture different types of cavities, holes, and openings in a single laser-induced etching process when using glass core packaging substrates, and multiple etching processes have a negative impact on the structural integrity of the glass core.
A single laser-induced etching process is used to simultaneously create through-glass vias and larger cavities within the glass core, avoiding the negative impact of multiple etching processes on the glass core. The cavity is then filled with a dielectric material to prevent conductive materials from entering.
It enables the efficient manufacture of various opening structures without affecting the integrity of the glass core structure, improving mechanical support and electrical performance, and reducing signal loss and overall thickness variation.