Curable silicone pressure sensitive adhesive compositions and uses thereof

By adding fluorinated silicone additives to curable silicone pressure-sensitive adhesives and combining them with a hydrosilylation reaction, the problem of low peel force of PSA on release liner was solved, resulting in a pressure-sensitive adhesive layer with low modulus and low peel force, suitable for the assembly of flexible electronic devices.

CN122249524APending Publication Date: 2026-06-19DOW SILICONES CORP +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DOW SILICONES CORP
Filing Date
2023-12-06
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing technologies have failed to effectively address the low peel force of PSA on the release liner, leading to damage and loss of transparency of OCA during film processing, which cannot meet the assembly requirements of flexible electronic devices.

Method used

By adding fluorinated silicone additives to a curable silicone pressure-sensitive adhesive composition and combining it with a hydrosilylation reaction, the peel strength on both the wet and dry sides is reduced, forming a pressure-sensitive adhesive layer with low modulus and low peel strength.

Benefits of technology

It achieves a wet/dry side peel force of less than 15 gf/inch for the PSA layer at a peel rate of 0.3 m/min, suitable for the assembly of foldable displays and automotive displays.

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Abstract

A curable silicone pressure-sensitive adhesive (PSA) composition is provided, comprising: (A) an organopolysiloxane having an average of more than one alkenyl group per molecule; (B) a branched organopolysiloxane resin having a very low content of OH / hydrolyzable groups; (C) an organohydrosiloxane having at least two Si-H bonds in its molecule; (D) a fluoro-organosilicon polymer not having alkenyl or SiH functional groups; and (E) a hydrosilylation reaction catalyst, wherein the mass ratio of component (B) to component (A) is in the range of 0.5 to 3.5, and the amount of component (D) is from 0.1 parts by mass to 7.0 parts by mass on a solid basis, based on the combined weight of components (A) to (C). The PSA composition can form a pressure-sensitive adhesive layer, which, for a PSA having a dynamic storage modulus of less than 1 MPa at -20°C and a thickness of 50 μm, exhibits a wet / dry side peel force of less than 15 gf / inch at a peel rate of 0.3 m / min.
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