A vitrified microsphere hybrid heat insulation polyester chip and a preparation method and application thereof

Abstract

This invention provides a glass-microsphere hybrid heat-insulating polyester chip, its preparation method, and its application. The glass-microsphere hybrid heat-insulating polyester chip is obtained by melt extrusion granulation after blending polyester chips with hollow glass microspheres. The surface coating layer of the hollow glass microspheres comprises the following raw materials in weight percentages: 30-50% fluorinated resin prepolymer, 2-8% crosslinking agent, 0.5-2% initiator, and the balance solvent. This invention introduces fluorinated resin into the coating layer on the surface of the hollow glass microspheres. Due to the excellent compatibility between the fluorosilicone or fluorocarbon segments in the fluorinated resin and the polyester matrix, and the introduction of the crosslinking agent to form a three-dimensional network structure, the interfacial bonding force between the coating layer and the polyester matrix is ​​enhanced, preventing microsphere detachment during spinning, and imparting hydrophobicity to the hollow glass microspheres, resulting in self-cleaning properties after spinning.

Description

Technical Field

[0001] This invention relates to the field of spinning polymer materials technology, specifically to a heat-insulating polyester chip with vitrified microspheres, its preparation method, and its application. Background Technology

[0002] Polyester (polyethylene terephthalate, PET) is widely used in the textile industry due to its excellent mechanical properties, chemical resistance, and thermal stability, and is an important raw material for the production of clothing and home textiles. With the increasing demand from consumers for functional textiles, the development of polyester fibers with heat insulation, heat preservation, and self-cleaning functions has become a research hotspot.

[0003] Currently, polyester fibers with thermal insulation function are mainly obtained through blending modification, finishing coating, and composite spinning. Among them, blending modification has attracted much attention due to its simple process and long-lasting function. Hollow glass microspheres, as a lightweight and low thermal conductivity inorganic filler, are introduced into the polyester matrix to reduce the thermal conductivity of the material and improve the thermal insulation performance. However, hollow glass microspheres have poor interfacial compatibility with the polyester matrix. The surface of glass microspheres is hydrophilic, while polyester is a hydrophobic polymer. Blending easily leads to microsphere aggregation and uneven dispersion, which can clog the spinneret during melt spinning, causing filament breakage and fuzzing, severely affecting spinnability and fiber mechanical properties. At the same time, the structural stability of microspheres is insufficient under high-temperature shearing conditions. The temperature of melt spinning usually reaches 280°C, and the melt is subjected to high-intensity shearing in the screw and spinneret. Unprotected peeled microspheres are prone to breakage or detachment, which not only leads to a decrease in thermal insulation performance but also damages the equipment. In addition, existing modification schemes mostly focus on improving the single thermal insulation performance, while textiles often need to take into account functions such as hydrophobicity and self-cleaning in practical applications. Currently, textiles are mainly endowed with hydrophobicity through finishing processes, but these have poor durability and poor hand feel.

[0004] Existing Chinese patent CN116444952A discloses a polyester film and its preparation method, using PMMA-coated glass microspheres as an anti-sticking agent. This solution is primarily used in the field of electronic devices to prevent silicon precipitation from contaminating circuits. However, the PMMA coating layer used in this solution has limited heat resistance and is prone to softening and failure under high-temperature spinning conditions, making it difficult to directly apply in the textile industry.

[0005] Therefore, there is an urgent need for a polyester chip with excellent thermal insulation properties and spinnability for use in the textile industry. Summary of the Invention

[0006] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a heat-insulating polyester chip with vitrified microspheres, its preparation method, and its application, thus solving the problems mentioned in the background art.

[0007] (II) Technical Solution To achieve the above objectives, the present invention is implemented through the following technical solution: According to a first aspect of the present invention, a heat-insulating polyester chip with vitrified microspheres is provided, which is obtained by melt extrusion granulation after blending polyester chips with hollow glass microspheres; The surface coating of the hollow glass microspheres is made from the following raw materials by weight percentage: 30-50% fluorinated resin prepolymer, 2-8% crosslinking agent, 0.5-2% initiator and the balance solvent.

[0008] Preferably, the hollow glass microspheres have a particle size of 5~20 μm; The thickness of the surface coating layer is 0.1~0.5μm.

[0009] Preferably, the hollow glass microspheres account for 1-4% of the mass of the polyester chips; The mass ratio of the hollow glass microspheres to the surface coating material is 100:5~15.

[0010] Preferably, the fluorinated resin prepolymer is selected from fluorosilicone resin or fluorocarbon resin.

[0011] Preferably, the crosslinking agent is selected from at least one of triethylene glycol dimethacrylate, ethylene glycol dimethacrylate, and trimethylolpropane triacrylate.

[0012] Preferably, the initiator is selected from benzoyl peroxide.

[0013] According to a second aspect of the present invention, a method for preparing a heat-insulating polyester chip with vitrified microsphere hybridization is provided, comprising the following steps: S1. Hollow glass microspheres are etched and activated in sodium hydroxide solution to obtain hydroxylated activated microspheres; S2. The hydroxylated activated microspheres, fluorinated resin prepolymer, crosslinking agent and initiator are dispersed in a solvent, and a surface grafting reaction is performed to obtain fluorinated resin modified hollow glass microspheres; S3. The polyester chips are mixed with the fluorinated resin modified hollow glass microspheres, melt-blended, extruded, cooled, and pelletized to obtain heat-insulating polyester chips with vitrified microspheres.

[0014] Preferably, in step S1, the etching activation time is 1-2 hours; In step S2, the surface grafting reaction is carried out at a temperature of 70-80°C for 8-12 hours. In step S3, the viscosity of the polyester chips is 0.65~0.75; The melt blending temperature is 250~270°C.

[0015] According to a third aspect of the present invention, a heat-insulating polyester chip with vitrified microspheres hybridized or a heat-insulating polyester chip with vitrified microspheres hybridized obtained according to the above preparation method is provided for use in textiles via spinning.

[0016] Preferably, the thermal conductivity of the textile is ≤0.06W / (m·K).

[0017] Beneficial effects This invention provides a heat-insulating polyester chip with vitrified microsphere hybridization, its preparation method, and its application. It has the following beneficial effects: (1) The present solution provides a heat-insulating polyester chip with glass microsphere hybridization, in which fluorinated resin is introduced into the coating layer on the surface of hollow glass microspheres. Due to the excellent compatibility between the fluorinated silicon or fluorinated carbon segments in the fluorinated resin and the polyester matrix, and the introduction of crosslinking agent to form a three-dimensional network structure, the interfacial bonding force between the coating layer and the polyester matrix is ​​enhanced, preventing the microspheres from falling off during spinning, and giving the hollow glass microspheres hydrophobicity, and self-cleaning properties after spinning.

[0018] (2) The heat-insulating polyester chip with vitrified microspheres provided by this solution not only increases the stability of the polyester chip during the high-temperature spinning process, but also has hydrophobicity and self-cleaning ability. Furthermore, by adding a coating layer, the microspheres are firmly bonded to the polyester matrix interface. After multiple water washings, the hydrophobicity and heat insulation performance can still be maintained at over 90%. In addition, the fiber tensile strength and elongation at break remain unchanged. Detailed Implementation

[0019] To better illustrate the content of this invention, the following description is provided in conjunction with specific embodiments.

[0020] Example 1 This embodiment provides a method for preparing microbead-hybridized heat-insulating polyester chips, including the following: Materials required: 100 kg of polyester chips with an intrinsic viscosity of 0.7, 1 kg of hollow glass microspheres with a particle size of 5-20 μm, 15 g of fluorosilicone resin, 1 g of triethylene glycol dimethacrylate, 0.25 g of benzoyl peroxide, and 33.75 g of ethanol; Preparation method: Step 1: Place hollow glass microspheres in a 10% sodium hydroxide solution for etching and activation for 1.5 hours, filter, wash, and dry to obtain hydroxylated activated microspheres; Step 2: Mix 1 kg of activated microbeads with 15 g of fluorosilicone resin, 1 g of triethylene glycol dimethacrylate, 0.25 g of benzoyl peroxide and 33.75 g of ethanol, heat to 75°C and keep reacting for 10 h, filter, and dry to obtain fluoropolymer-modified microbeads; Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.7 with fluorinated resin modified microspheres evenly, melt-blend them at 260°C using a twin-screw extruder, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0021] Example 2 Materials required: 100 kg of polyester chips with an intrinsic viscosity of 0.68, 2 kg of hollow glass microspheres with a particle size of 5-20 μm, 56 g of fluorosilicone resin, 6.4 g of ethylene glycol dimethacrylate, 1.6 g of benzoyl peroxide, and 96 g of ethanol; Preparation method: Step 1: Place hollow glass microspheres in a 10% sodium hydroxide solution for etching and activation for 1.5 hours, filter, wash, and dry to obtain hydroxylated activated microspheres; Step 2: Mix 2 kg of activated microbeads with 56 g of fluorosilicone resin, 6.4 g of ethylene glycol dimethacrylate, 1.6 g of benzoyl peroxide and 96 g of ethanol, heat to 78°C and keep reacting for 9 h, filter, and dry to obtain fluoropolymer-modified microbeads; Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.68 with fluorinated resin modified microspheres evenly, melt-blend them at 265°C using a twin-screw extruder, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0022] Example 3 Materials required: 100 kg of polyester chips with an intrinsic viscosity of 0.72, 3 kg of hollow glass microspheres with a particle size of 5-20 μm, 120 g of fluorocarbon resin, 15 g of trimethylolpropane triacrylate, 3.6 g of benzoyl peroxide, and 161.4 g of ethanol; Preparation method: Step 1: Place hollow glass microspheres in a 10% sodium hydroxide solution for etching and activation for 1.5 hours, filter, wash, and dry to obtain hydroxylated activated microspheres; Step 2: Mix 3 kg of activated microbeads with 120 g of fluorocarbon resin, 15 g of trimethylolpropane triacrylate, 3.6 g of benzoyl peroxide and 161.4 g of ethanol, heat to 72°C and keep reacting for 11 h, filter, and dry to obtain fluoropolymer-modified microbeads; Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.72 with fluorinated resin modified microspheres evenly, melt-blend them at 255°C using a twin-screw extruder, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0023] Example 4 Materials required: 100 kg of polyester chips with an intrinsic viscosity of 0.7, 4 kg of hollow glass microspheres with a particle size of 5~20 μm, 216 g of fluorocarbon resin, 28.8 g of triethylene glycol dimethacrylate, 7.2 g of benzoyl peroxide, and 228 g of ethanol; Preparation method: Step 1: Place hollow glass microspheres in a 10% sodium hydroxide solution for etching and activation for 1.5 hours, filter, wash, and dry to obtain hydroxylated activated microspheres; Step 2: Mix 4 kg of activated microbeads with 216 g of fluorocarbon resin, 28.8 g of triethylene glycol dimethacrylate, 7.2 g of benzoyl peroxide and 228 g of ethanol, heat to 80°C and keep reacting for 8 hours, filter and dry to obtain fluorinated resin modified microbeads; Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.7 with fluorinated resin modified microspheres evenly, melt-blend them at 270°C using a twin-screw extruder, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0024] Example 5 Materials: 100kg of polyester chips with an intrinsic viscosity of 0.65, 2.5kg of hollow glass microspheres with a particle size of 10~15μm, 187.5g of fluorosilicone resin, 30g of ethylene glycol dimethacrylate, 7.5g of benzoyl peroxide, and 150g of ethanol; Preparation method: Step 1: Place hollow glass microspheres in a 10% sodium hydroxide solution for etching and activation for 1.5 hours, filter, wash, and dry to obtain hydroxylated activated microspheres; Step 2: Mix 2.5 kg of activated microbeads with 15 g of fluorosilicone resin, 1 g of triethylene glycol dimethacrylate, 0.25 g of benzoyl peroxide and 33.75 g of ethanol, heat to 70°C and keep reacting for 12 h, filter, and dry to obtain fluoropolymer-modified microbeads; Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.65 with fluorinated resin modified microspheres evenly, melt-blend them at 250°C using a twin-screw extruder, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0025] Example 6 Materials: 100kg of polyester chips with an intrinsic viscosity of 0.75, 1.5kg of hollow glass microspheres with a particle size of 5~10μm, 28.8g of fluorocarbon resin, 2.7g of trimethylolpropane triacrylate, 0.72g of benzoyl peroxide, and 57.78g of ethanol; Preparation method: Step 1: Place hollow glass microspheres in a 10% sodium hydroxide solution for etching and activation for 1.5 hours, filter, wash, and dry to obtain hydroxylated activated microspheres; Step 2: Mix 1.5 kg of activated microbeads with 28.8 g of fluorocarbon resin, 2.7 g of trimethylolpropane triacrylate, 0.72 g of benzoyl peroxide, and 57.78 g of ethanol. Heat to 73°C and maintain the temperature for 10.5 h. Filter and dry to obtain fluorinated resin modified microbeads. Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.75 with fluorinated resin modified microspheres evenly, melt-blend them at 262°C using a twin-screw extruder, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0026] Example 7 Materials required: 100 kg of polyester chips with an intrinsic viscosity of 0.68, 3.5 kg of hollow glass microspheres with a particle size of 15~20 μm, 119.7 g of fluorosilicone resin, 15.75 g of triethylene glycol dimethacrylate, 3.465 g of benzoyl peroxide, and 176.085 g of ethanol; Preparation method: Step 1: Place hollow glass microspheres in a 10% sodium hydroxide solution for etching and activation for 1.5 hours, filter, wash, and dry to obtain hydroxylated activated microspheres; Step 2: Mix 3.5 kg of activated microbeads with 119.7 g of fluorosilicone resin, 15.75 g of triethylene glycol dimethacrylate, 3.465 g of benzoyl peroxide, and 176.085 g of ethanol. Heat to 76°C and maintain the temperature for 9.5 h. Filter and dry to obtain fluoropolymer-modified microbeads. Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.68 with fluorinated resin modified microspheres evenly, melt-blend them at 268°C using a twin-screw extruder, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0027] Example 8 Materials required: 100 kg of polyester chips with an intrinsic viscosity of 0.72, 2.2 kg of hollow glass microspheres with a particle size of 8-12 μm, 101.64 g of fluorosilicone resin, 12.1 g of ethylene glycol dimethacrylate, 3.146 g of benzoyl peroxide, and 125.114 g of ethanol; Preparation method: Step 1: Place hollow glass microspheres in a 10% sodium hydroxide solution for etching and activation for 1.5 hours, filter, wash, and dry to obtain hydroxylated activated microspheres; Step 2: Mix 2.2 kg of activated microbeads with 101.64 g of fluorosilicone resin, 12.1 g of ethylene glycol dimethacrylate, 3.146 g of benzoyl peroxide and 125.114 g of ethanol, heat to 74°C and keep reacting for 10 h, filter, and dry to obtain fluoropolymer-modified microbeads; Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.72 with fluorinated resin modified microspheres evenly, melt-blend them at 258°C using a twin-screw extruder, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0028] Example 9 Materials required: 100 kg of polyester chips with an intrinsic viscosity of 0.7, 3.8 kg of hollow glass microspheres with a particle size of 10~18 μm, 237.12 g of fluorosilicone resin, 34.58 g of trimethylolpropane triacrylate, 8.892 g of benzoyl peroxide, and 213.408 g of ethanol; Preparation method: Step 1: Place hollow glass microspheres in a 10% sodium hydroxide solution for etching and activation for 1.5 hours, filter, wash, and dry to obtain hydroxylated activated microspheres; Step 2: Mix 3.8 kg of activated microbeads with 237.12 g of fluorosilicone resin, 34.58 g of trimethylolpropane triacrylate, 8.892 g of benzoyl peroxide, and 213.408 g of ethanol. Heat to 79°C and maintain the temperature for 8.5 h. Filter and dry to obtain fluoropolymer-modified microbeads. Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.7 with fluorinated resin modified microspheres evenly, melt-blend them at 272°C using a twin-screw extruder, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0029] Example 10 Materials: 100 kg of polyester chips with an intrinsic viscosity of 0.73, 1.2 kg of hollow glass microspheres with a particle size of 12~16 μm, 28.56 g of fluorocarbon resin, 3.36 g of triethylene glycol dimethacrylate, 0.504 g of benzoyl peroxide, and 51.576 g of ethanol; Preparation method: Step 1: Place hollow glass microspheres in a 10% sodium hydroxide solution for etching and activation for 1.5 hours, filter, wash, and dry to obtain hydroxylated activated microspheres; Step 2: Mix 1.2 kg of activated microbeads with 28.56 g of fluorocarbon resin, 3.36 g of triethylene glycol dimethacrylate, 0.504 g of benzoyl peroxide and 51.576 g of ethanol, heat to 71°C and maintain the temperature for 11.5 h, filter, and dry to obtain fluorinated resin modified microbeads; Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.73 with fluorinated resin modified microspheres evenly, melt-blend them at 263°C using a twin-screw extruder, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0030] Comparative Example 1 Materials: 100 kg of polyester chips with an intrinsic viscosity of 0.7, and 2 kg of hollow glass microspheres with a particle size of 5~20 μm; Preparation method: After drying, polyester chips are directly mixed with unmodified hollow glass microspheres, melt-blended at 260°C using a twin-screw extruder, extruded, cooled, and pelletized to obtain polyester chips.

[0031] Comparative Example 2 Materials required: 100 kg of polyester chips with an intrinsic viscosity of 0.7, 2 kg of hollow glass microspheres with a particle size of 5~20 μm, 44.8 g of methyl methacrylate, 6.4 g of polyethylene glycol, 3.2 g of ethylene glycol methacrylate, 0.8 g of benzoyl peroxide, and 104.8 g of ethanol; Preparation method: Step 1: Hollow glass microspheres with a particle size of 5-20 μm were placed in a 10% sodium hydroxide solution and stirred for 2 hours. After filtration, washing, and drying, hydroxylated activated microspheres were obtained. Step 2: Mix 2 kg of hydroxylated activated microbeads with 44.8 g of methyl methacrylate, 6.4 g of polyethylene glycol, 3.2 g of ethylene glycol methacrylate, 0.8 g of benzoyl peroxide, and 104.8 g of ethanol. Heat to 70°C and maintain the temperature for 2 hours. Filter and dry to obtain the anti-sticking agent. Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.7 with an anti-sticking agent, melt-blend the mixture using a twin-screw extruder at 263°C, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0032] Comparative Example 3 Materials required: 100 kg of polyester chips with an intrinsic viscosity of 0.7, 6 kg of hollow glass microspheres with a particle size of 5~20 μm, 168 g of fluorosilicone resin, 19.2 g of triethylene glycol dimethacrylate, 4.8 g of benzoyl peroxide, and 294 g of ethanol; Preparation method: Step 1: Place hollow glass microspheres in a 10% sodium hydroxide solution for etching and activation for 1.5 hours, filter, wash, and dry to obtain hydroxylated activated microspheres; Step 2: Mix 6 kg of activated microbeads with 168 g of fluorosilicone resin, 19.2 g of triethylene glycol dimethacrylate, 4.8 g of benzoyl peroxide and 294 g of ethanol, heat to 75°C and keep reacting for 10 h, filter, and dry to obtain fluoropolymer-modified microbeads; Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.7 with fluorinated resin modified microspheres evenly, melt-blend them at 260°C using a twin-screw extruder, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0033] Comparative Example 4 Materials: 100kg of polyester chips with an intrinsic viscosity of 0.7, 2kg of hollow glass microspheres with a particle size of 30~50μm, 56g of fluorosilicone resin, 6.4g of ethylene glycol dimethacrylate, 1.6g of benzoyl peroxide, and 96g of ethanol; Preparation method: Step 1: Place hollow glass microspheres in a 10% sodium hydroxide solution for etching and activation for 1.5 hours, filter, wash, and dry to obtain hydroxylated activated microspheres; Step 2: Mix 2 kg of activated microbeads with 56 g of fluorosilicone resin, 6.4 g of ethylene glycol dimethacrylate, 1.6 g of benzoyl peroxide and 96 g of ethanol, heat to 75°C and keep reacting for 10 h, filter, and dry to obtain fluoropolymer-modified microbeads; Step 3: Mix 100 kg of polyester chips with an intrinsic viscosity of 0.7 with fluorinated resin modified microspheres evenly, melt-blend them at 260°C using a twin-screw extruder, extrude, cool, and pelletize to obtain heat-insulating polyester chips.

[0034] The microbead-hybrid heat-insulating polyester chips prepared in Examples 1 to 10 and Comparative Examples 1 to 4 were tested after spinning, and the test results are shown in Table 1.

[0035] Table 1 According to the data in Table 1, compared with the examples, the uncoated microspheres in Comparative Example 1 have poor compatibility with polyester, severe agglomeration, extremely high spinning breakage rate, significantly reduced fiber strength, and poor hydrophobicity and thermal insulation. Compared with the examples, Comparative Example 2 uses methyl methacrylate as the coating layer, which partially softens and falls off at high spinning temperatures, resulting in exposed microspheres and a higher breakage rate. Furthermore, while methyl methacrylate is hydrophobic, it does not enable the fibers to have self-cleaning capabilities. In Comparative Example 3, excessive addition of microspheres further reduced the thermal conductivity, but resulted in extremely poor spinnability and a severe decrease in fiber strength, failing to meet textile requirements. The microspheres used in Comparative Example 4 were too large, which would clog the spinneret during the spinning process, resulting in an extremely high breakage rate and a significant decrease in fiber strength.

[0036] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat-insulating polyester chip with vitrified microspheres, characterized in that: It is obtained by melt extrusion granulation after blending polyester chips with hollow glass microspheres; The surface coating of the hollow glass microspheres is made from the following raw materials by weight percentage: 30-50% fluorinated resin prepolymer, 2-8% crosslinking agent, 0.5-2% initiator and the balance solvent.

2. The heat-insulating polyester chip with vitrified microsphere hybridization according to claim 1, characterized in that: The hollow glass microspheres have a particle size of 5~20μm; The thickness of the surface coating layer is 0.1~0.5μm.

3. The heat-insulating polyester chip with vitrified microsphere hybridization according to claim 1, characterized in that: The hollow glass microspheres account for 1-4% of the mass of the polyester chips; The mass ratio of the hollow glass microspheres to the surface coating material is 100:5~15.

4. The heat-insulating polyester chip with vitrified microsphere hybridization according to claim 1, characterized in that: The fluorinated resin prepolymer is selected from fluorosilicone resin or fluorocarbon resin.

5. The heat-insulating polyester chip with vitrified microsphere hybridization according to claim 1, characterized in that: The crosslinking agent is selected from at least one of triethylene glycol dimethacrylate, ethylene glycol dimethacrylate, and trimethylolpropane triacrylate.

6. The heat-insulating polyester chip with vitrified microsphere hybridization according to claim 1, characterized in that: The initiator is selected from benzoyl peroxide.

7. A method for preparing a heat-insulating polyester chip with vitrified microsphere hybridization as described in any one of claims 1 to 6, characterized in that: Includes the following steps: S1. Hollow glass microspheres are etched and activated in sodium hydroxide solution to obtain hydroxylated activated microspheres; S2. The hydroxylated activated microspheres, fluorinated resin prepolymer, crosslinking agent and initiator are dispersed in a solvent and subjected to surface grafting reaction to obtain fluorinated resin modified hollow glass microspheres. S3. The polyester chips are mixed with the fluorinated resin modified hollow glass microspheres, melt-blended, extruded, cooled, and pelletized to obtain heat-insulating polyester chips with vitrified microspheres.

8. The method for preparing a heat-insulating polyester chip with vitrified microsphere hybridization according to claim 7, characterized in that: In step S1, the etching activation time is 1~2 hours; In step S2, the surface grafting reaction is carried out at a temperature of 70-80°C for 8-12 hours. In step S3, the viscosity of the polyester chips is 0.65~0.75; The melt blending temperature is 250~270℃.

9. The application of a glass-microsphere hybrid thermal insulation polyester chip according to any one of claims 1 to 6, or a glass-microsphere hybrid thermal insulation polyester chip obtained by the preparation method according to claim 7 or 8, in textiles via spinning.

10. An application according to claim 9, characterized in that: The thermal conductivity of the textile is ≤0.06W / (m·K).

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