Diode forward surge testing device, system

Abstract

The application relates to the technical field of laser marking machines, in particular to a diode forward surge testing device and system capable of automatic measurement, wherein the diode forward surge testing device capable of automatic measurement comprises a testing device body, which is used for carrying out forward surge testing of a diode; a testing support, which is connected with the testing device body through wires, connects the diode to a circuit through the testing support, and is provided with anode conductive holes and cathode conductive holes, and one anode conductive hole and one cathode conductive hole form a group; and the application also relates to a testing system, which comprises a central controller module, a communication module, a testing module, a control module and an analysis module; after the diode is placed on a diode insulation support table, the central controller module controls the electric telescopic rod to drive the diode insulation support table to move downwards and connect the diode to the circuit through the control module.

Description

Technical Field

[0001] This invention relates to the field of laser marking machine technology, specifically to a diode forward surge test device and system capable of automatic measurement. Background Technology

[0002] In practical use, diodes will withstand surge overload currents of a certain magnitude. Therefore, diodes need to undergo forward surge testing during production to ensure they are qualified products and can be used normally. During the forward surge test of diodes, due to the large current, in order to avoid the risk of electric shock to personnel due to accidents during the connection of diodes to the circuit, clamps are generally used to connect the diodes to the circuit. However, existing test clamps are not convenient to operate when connecting diodes to the circuit. They require manual operation and cannot simultaneously clamp and fix multiple diodes, resulting in low testing efficiency and inconvenience. Summary of the Invention

[0003] The purpose of this invention is to provide a diode forward surge test device and system that can automatically measure the surge, so as to solve the problem that the existing diode test fixtures mentioned in the background art are not convenient to operate.

[0004] To achieve the above objectives, the present invention provides the following technical solution: A diode forward surge test device capable of automatic measurement includes: a test device body, the test device body being used to perform forward surge testing on diodes; The test platform is connected to the test device body via a wire. The diode is connected to the circuit through the test platform. The test platform is provided with an anode conductive hole and a cathode conductive hole, and one anode conductive hole and one cathode conductive hole form a group. A diode support and fixing assembly is mounted on a test platform for supporting and fixing the diode. A circuit connection assembly is mounted on a diode support and fixing assembly, and the diode is connected to a circuit for testing via the circuit connection assembly. A sealing assembly is installed on the test platform and connected to the diode support and fixing assembly. The sealing assembly seals the anode conductive hole and the cathode conductive hole.

[0005] Furthermore, the diode support and fixing assembly includes: an electric telescopic rod, which is fixedly installed on the test platform; A diode insulating support platform is fixedly mounted on an electric telescopic rod. The electric telescopic rod drives the diode insulating support platform to move up and down, and the diode insulating support platform supports the diode. A driving test strip is movably mounted on a diode insulating support platform; A connecting strip is movably connected to a drive test strip; The second limiting bracket is movably connected to the connecting strip, and the limiting strip drives the second limiting bracket to move.

[0006] Furthermore, a first limiting support is fixedly provided on the drive test bar, and a first limiting top plate is fixedly provided on the first limiting support. A limiting mating groove is provided on the first limiting top plate.

[0007] Furthermore, the connecting strip is movably mounted on the diode insulating support platform, and when the driving test strip moves relative to the diode insulating support platform, it drives the connecting strip to move as well.

[0008] Furthermore, the second limiting bracket is also movably mounted on the diode insulating support platform; A second limiting top plate is fixedly installed on the second limiting support, and a limiting mating groove is also provided on the second limiting top plate.

[0009] Furthermore, when the connecting strip moves relative to the diode insulating support platform, it drives the second limiting bracket to move as well; The second limiting top plate and the first limiting top plate cooperate to fix the diode.

[0010] Furthermore, the circuit connection assembly includes: an insulating support plate frame, wherein two insulating support plates are fixedly mounted on the diode insulating support platform; The L-shaped insulating strip is movably mounted on the insulating support plate frame.

[0011] Furthermore, a first conductive plate is inserted and fixed on the insulating support plate frame. The first conductive plate cooperates with the diode pins, and a conductive post is fixedly provided at the lower end of the first conductive plate. Two conductive posts on a set of insulating support plates are respectively inserted into the anode conductive hole and the cathode conductive hole; The L-shaped insulating strip is moved by the driving test strip to clamp the diode pins.

[0012] Furthermore, the sealing assembly is a movable platform, which is movably connected to the connecting strip, and the connecting strip drives its movement.

[0013] A testing system includes a central controller module, a communication module, a testing module, a control module, and an analysis module. After a diode is placed on a diode insulating support platform, the central controller module controls an electric telescopic rod via the control module to move the diode insulating support platform downwards to connect the diode to the circuit. The central controller module communicates with the test module, control module, and analysis module through the communication module. The diode is tested by the test module, and then the analysis module analyzes the test results and feeds them back to the central controller module to complete the diode test.

[0014] Compared with the prior art, the beneficial effects of the present invention are: the present invention has a reasonable structural design and strong functionality, and has the following advantages: 1. Place multiple diodes on the diode insulating support platform, and use an electric telescopic rod to move the diode insulating support platform downward to automatically clamp and fix the diodes. At the same time, multiple diodes can be connected to the circuit for testing. The operation is simple, convenient and quick.

[0015] 2. When the diode insulating support platform moves downward, it will drive the test strip to move. Under the action of the test strip, the connecting plate and the second limiting bracket can be moved, which can clamp and fix the diode. At the same time, it will also drive the L-shaped insulating strip to press the diode pins tightly into the conductive groove, ensuring the tightness of the connection and thus ensuring the smooth progress of the test.

[0016] 3. In addition, when the connecting strip moves, it will also drive the moving platform to move, so that the dust cover no longer covers the anode and cathode conductive holes. As the diode insulating support platform continues to move down, the corresponding conductive posts can be inserted into the anode and cathode conductive holes to realize the circuit connection. When no test is being conducted, the dust cover can play a role in dust prevention and avoid poor contact when the conductive posts are connected. Attached Figure Description

[0017] Figure 1 A first-view schematic diagram of the assembly of the test device body.

[0018] Figure 2 A second-view schematic diagram of the assembly of the test device body.

[0019] Figure 3 A first-person view diagram of the test platform assembly.

[0020] Figure 4 A second-view schematic diagram for testing the assembly of the bearing platform.

[0021] Figure 5This is a schematic diagram of the assembly of the test platform and the diode insulation support platform.

[0022] Figure 6 A first-view schematic diagram of the assembly of a diode insulating support platform.

[0023] Figure 7 A second-view schematic diagram of the diode insulating support assembly.

[0024] Figure 8 This is a schematic diagram showing the interaction between the diode insulating support and the diode.

[0025] Figure 9 A first-view schematic diagram showing the connection between the drive test strip, connecting strip, second limit support frame, and moving platform.

[0026] Figure 10 A second-view schematic diagram showing the connection between the drive test strip, connecting strip, second limit support frame, and moving platform.

[0027] Figure 11 This is a schematic diagram showing the connection between the insulating support plate and the diode.

[0028] Figure 12 A first-view schematic diagram of the assembly of the insulating support plate frame and the L-shaped insulating strip.

[0029] Figure 13 A second-view schematic diagram of the assembly of the insulating support plate frame and the L-shaped insulating strip.

[0030] Figure 14 This is a schematic diagram of the test system modules.

[0031] In the diagram: 1. Test device body; 2. Test platform; 21. Mounting base plate; 22. Guide column; 23. Mating strip column; 24. Z-shaped displacement channel; 25. Anode conductive hole; 26. Cathode conductive hole; 27. First test support rod; 3. Electric telescopic rod; 31. Diode insulating support platform; 32. Pin channel; 33. Protruding strip; 34. Support cavity; 35. Protruding support block; 36. Guide channel; 37. Second test support rod; 38. Mating support block; 381. Limiting support rod; 4. Drive test strip; 41. Auxiliary support strip; 42. Mating support plate; 43. Channel mating column; 44. Support rod; 45. First limiting support frame; 46. First limiting top plate 47. Limiting groove; 48. Swing linkage rod; 49. Double-sloped convex strip; 5. Connecting strip; 51. Through hole; 52. Protruding bottom block; 53. Rectangular insert; 6. Second limiting support frame; 61. Limiting through hole; 62. Second limiting top plate; 7. Insulating support plate frame; 71. Mounting movable hole; 72. First conductive plate; 73. Second conductive plate; 74. Conductive groove; 75. Conductive column; 8. L-shaped insulating strip; 81. Matching movable plate; 82. Insulating support rod; 83. Insulating ring frame; 84. Tightening groove; 85. Return spring; 9. Moving platform; 91. Movable insertion hole; 92. Top protrusion; 93. Insertion channel; 94. Support strip; 95. Dustproof cover. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] This invention provides a technical solution: like Figure 1 , Figure 2 and Figure 5As shown, a diode forward surge test device capable of automatic measurement includes: a test device body 1, a test platform 2, a diode support and fixing assembly, a circuit connection assembly, and a sealing assembly. The test device body 1 is used for forward surge testing of diodes. The test platform 2 is connected to the test device body 1 by wires, and the diode is connected to the circuit through the test platform 2. The test platform 2 has an anode conductive hole 25 and a cathode conductive hole 26, and one anode conductive hole 25 and one cathode conductive hole 26 form a group. The diode support and fixing assembly is installed on the test platform 2 to support and fix the diode, ensuring the stability and firmness of the diode during the test. The circuit connection assembly is installed on the diode support and fixing assembly, and the diode is connected to the circuit for testing through the circuit connection assembly. The sealing assembly is installed on the test platform 2 and connected to the diode support and fixing assembly. The sealing assembly covers the anode conductive hole 25 and the cathode conductive hole 26 to prevent dust and foreign objects from falling into the anode conductive hole 25 and the cathode conductive hole 26 when the test device body 1 is not in use, which could lead to poor contact.

[0034] like Figure 4 and Figure 5 As shown, the test platform 2 has symmetrically integrally formed mounting base plates 21 at both ends. Guide rods 22 are symmetrically welded and fixed on both sides of the mounting base plates 21 by welding process. A mating strip column 23 is welded and fixed on one of the mounting base plates 21 by welding process. A Z-shaped displacement channel 24 is opened on the mating strip column 23. The inner wall of the Z-shaped displacement channel 24 is smooth and burr-free. A first test support rod 27 is also welded and fixed on the side of the test platform 2 near the test device body 1 by welding process.

[0035] like Figure 3 , Figure 5 , Figure 6 , Figure 7 , Figure 9 and Figure 10 As shown, the diode support and fixing assembly includes: an electric telescopic rod 3, a diode insulating support platform 31, a drive test strip 4, a connecting strip 5, and a second limiting bracket 6. The electric telescopic rod 3 is fixedly installed on the mounting base plate 21 with a mating strip 23 on the test platform 2 by bolts.

[0036] The diode insulating support platform 31 is fixedly mounted on the electric telescopic rod 3 by bolts. The electric telescopic rod 3 drives the diode insulating support platform 31 to move up and down, and the diode insulating support platform 31 supports the diode. Specifically, the diode insulating support platform 31 has a pin channel 32 for inserting the diode pins. The diode insulating support platform 31 has symmetrically integrally formed protruding strips 33 at both ends. The protruding strip 33 near the mating post 23 has a support cavity 34. In addition, the protruding support blocks 35 are symmetrically integrally formed on both sides of the protruding strips 33 at both ends of the diode insulating support platform 31. The protruding support blocks 35 have guide channels 36. The guide rods 22 are inserted into the guide channels 36. The cooperation between the guide rods 22 and the guide channels 36 further guides and limits the diode insulating support platform 31.

[0037] A second test support rod 37 is welded and fixed on the side of the diode insulating support platform 31 near the test device body 1 by welding process, and a mating support block 38 is welded and fixed on the upper end of the side of the diode insulating support platform 31 away from the test device body 1 by welding process, and a limit support rod 381 is welded and fixed on the mating support block 38 by welding process.

[0038] The drive test strip 4 is movably mounted on the diode insulating support platform 31. Specifically, an auxiliary support strip 41 is integrally formed and fixed at one end of the drive test strip 4. A support rod 44 is welded and fixed on the auxiliary support strip 41 by welding. The support rod 44 is inserted into the support cavity 34. The drive test strip 4 is movably mounted on the diode insulating support platform 31 by the cooperation between the support rod 44 and the support cavity 34. A mating support plate 42 is symmetrically welded and fixed on the auxiliary support strip 41 by welding. A channel mating post 43 is welded and fixed between the mating support plates 42 by welding. The channel mating post 43 is inserted into the Z-shaped displacement channel 24 and contacts the inner wall of the Z-shaped displacement channel 24. In addition, the surface of the channel mating post 43 is smooth and burr-free.

[0039] A first limiting support 45 is welded and fixed on the drive test strip 4 by welding process. A first limiting top plate 46 is integrally formed and fixed on the first limiting support 45. A limiting mating groove 47 is opened on the first limiting top plate 46. A double inclined protrusion 49 is integrally formed and fixed on the side of the drive test strip 4 away from the test device body 1.

[0040] The connecting strip 5 is movably connected to the driving test strip 4, and the connecting strip 5 is movably mounted on the diode insulating support platform 31. When the driving test strip 4 moves relative to the diode insulating support platform 31, it drives the connecting strip 5 to move. Specifically, the connecting strip 5 is symmetrically hinged with a swing linkage rod 48, and the other end of one of the swing linkage rods 48 is hinged to the first limiting bracket 45. The movable connection between the connecting strip 5 and the driving test strip 4 is realized through the swing linkage rod 48 at one end of the connecting strip 5. In addition, a mating through hole 51 is opened at the lower end of the connecting strip 5. A second test support rod 37 is inserted into the mating through hole 51. The connecting strip 5 is movably mounted on the diode insulating support platform 31 through the mating of the second test support rod 37 and the mating through hole 51. Furthermore, protruding bottom blocks 52 are symmetrically integrally formed and fixed at both ends of the lower side of the connecting strip 5. Rectangular inserts 53 are welded and fixed on the protruding bottom blocks 52 by welding process.

[0041] The second limiting support 6 is movably connected to the connecting strip 5. The limiting strip 5 drives the second limiting support 6 to move. The second limiting support 6 is also movably mounted on the diode insulating support platform 31. Specifically, the second limiting support 6 is hinged to the swing linkage rod 48 at the other end of the connecting strip 5. The swing linkage rod 48 at this end realizes the movable connection between the connecting strip 5 and the second limiting support 6. A limiting through hole 61 is opened on the second limiting support 6. A limiting support rod 381 is inserted into the limiting through hole 61. The second limiting support 6 is movably mounted on the diode insulating support platform 31 through the cooperation of the limiting through hole 61 and the limiting support rod 381.

[0042] The second limiting support 6 is integrally formed and fixedly provided with a second limiting top plate 62. The second limiting top plate 62 is also provided with a limiting mating groove 47. When the connecting strip 5 moves relative to the diode insulating support 31, it drives the second limiting support 6 to move under the action of the swing linkage rod 48. The second limiting top plate 62 and the first limiting top plate 46 cooperate to fix the diode. That is, at this time, the diode is inserted into the limiting mating groove 47 and contacts the inner wall of the limiting mating groove 47.

[0043] like Figure 5 , Figure 8 , Figure 11 , Figure 12 and Figure 13 As shown, the circuit connection assembly includes: an insulating support plate 7 and an L-shaped insulating strip 8. Two insulating support plates 7 are welded and fixedly installed on the diode insulating support platform 31, and an installation hole 71 is provided on the insulating support plate 7.

[0044] L-shaped insulating strip 8 is movably mounted on insulating support plate frame 7. Specifically, a matching movable plate 81 is integrally formed and fixed on L-shaped insulating strip 8. The matching movable plate 81 is in contact with double-beveled protrusion strip 49. Insulating support rod 82 is welded and fixed on L-shaped insulating strip 8 by welding process. Insulating support rod 82 is inserted into the mounting movable hole 71. Insulating ring frame 83 is welded and fixed on insulating support rod 82 by welding process. Insulating ring frame 83 has a tightening groove 84. In addition, a return spring 85 is sleeved on insulating support rod 82. One end of return spring 85 is fixed on insulating support plate frame 7, and the other end is fixed on insulating ring frame 83.

[0045] A first conductive plate 72 is inserted and fixed on the insulating support frame 7. A second conductive plate 73 is fixedly installed on the upper end of the first conductive plate 72. A conductive groove 74 is opened on the second conductive plate 73. The conductive groove 74 cooperates with the diode pin. A conductive post 75 is fixedly installed on the lower end of the first conductive plate 72. Two conductive posts 75 on a set of insulating support frames 7 are respectively inserted into the anode conductive hole 25 and the cathode conductive hole 26 to realize the circuit connection of the diode.

[0046] The L-shaped insulating strip 8 is moved by the driving test strip 4 to clamp the diode pins. That is, when the diode insulating support platform 31 moves downward, it drives the L-shaped insulating strip 8 to move in cooperation with the moving plate 81 and the double inclined convex strip 49.

[0047] like Figure 3 , Figure 4 , Figure 9 and Figure 10 As shown, the sealing assembly is a movable platform 9, which is movably connected to the connecting strip 5. The connecting strip 5 drives the platform to move. Specifically, the upper end of the movable platform 9 is symmetrically and integrally formed with an upper protrusion 92. An insertion channel 93 is provided on the upper protrusion 92, and a rectangular insert 53 is movably inserted into the insertion channel 93. The movable platform 9 also has a movable insertion hole 91, into which a first test support rod 27 is inserted. In addition, a support strip 94 is welded and fixed on the movable platform 9 by welding. A dust cover 95 is integrally formed and fixed on the support strip 94, which covers the anode conductive hole 25 and the cathode conductive hole 26.

[0048] like Figure 14 As shown, a testing system includes a central controller module, a communication module, a testing module, a control module, and an analysis module. After the diode is placed on the diode insulating support platform 31, the central controller module controls the electric telescopic rod 3 through the control module to move the diode insulating support platform 31 downward to connect the diode to the circuit.

[0049] The central controller module communicates with the test module, control module, and analysis module through the communication module. The test module tests the diode, and then the analysis module analyzes the test results and feeds them back to the central controller module to complete the diode test.

[0050] When testing a diode, the diode's pins are inserted into the pin channel 32, and the diode is supported by the diode insulating support platform 31. At this time, the diode's pins will be inserted into the conductive groove 74. After all the diodes to be tested are placed, the electric telescopic rod 3 can be started to move the diode insulating support platform 31 downward.

[0051] As the diode insulating support platform 31 moves downward, it will drive the channel mating column 43 to move along the Z-shaped displacement channel 24. Under the action of the Z-shaped displacement channel 24, the auxiliary support bar 41 will move towards the diode insulating support platform 31, thereby causing the drive test bar 4 to move. As the drive test bar 4 moves, it will drive the first limiting support 45 to move towards its corresponding diode. As the first limiting support 45 moves, under the action of the swing linkage rod 48, it will drive the connecting plate 5 to move away from the test platform 2. As the connecting plate 5 moves, it will drive the moving platform 9 to move synchronously, thereby causing the dust cover 95 to no longer cover the anode conductive hole 25 and the cathode conductive hole 26.

[0052] In addition, as the connecting strip 5 moves, the second limiting bracket 6 will move towards its corresponding secondary tube under the action of another swing linkage rod 48. In this way, the secondary tube can be fixed under the combined action of the first limiting bracket 45 and the second limiting bracket 6, so that the secondary tube is inserted into the limiting mating groove 47.

[0053] When the drive test strip 4 moves, the double-sloping convex strip 49, in cooperation with the moving plate 81, will drive the L-shaped insulating strip 8 to move away from the diode insulating support platform 31. This will put the reset spring 85 in a compressed state, and at the same time, it will make the clamping groove 84 contact the diode pin. Under the action of the clamping groove 84, the diode pin will be clamped and made to contact the inner wall of the conductive groove 74 tightly, ensuring the firmness and stability of the connection.

[0054] Then, as the diode insulating support platform 31 continues to move downward, the drive test strip 4 will no longer move under the restriction of the Z-shaped displacement channel 24. This will allow the conductive post 75 below the first conductive plate 72 to be inserted into the anode conductive hole 25 and the cathode conductive hole 26 respectively, thereby connecting the diode to the circuit and performing diode testing.

[0055] After the test is completed, the electric telescopic rod 3 moves the diode insulating support platform 31 upward, causing the conductive post 75 to separate from the anode conductive hole 25 and the cathode conductive hole 26 respectively. After the diode insulating support platform 31 is reset, the diode is also released, and the diode can be removed. The operation is simple, convenient and quick. In addition, the dust cover 95 covering the cathode conductive hole 26 and the anode conductive hole 25 prevents external debris and dust from entering the holes, avoiding poor contact.

[0056] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A diode forward surge test device capable of automatic measurement, characterized in that: include: The test device body is used to perform forward surge testing on diodes; The test platform is connected to the test device body via a wire. The diode is connected to the circuit through the test platform. The test platform is provided with an anode conductive hole and a cathode conductive hole, and one anode conductive hole and one cathode conductive hole form a group. A diode support and fixing assembly is mounted on a test platform for supporting and fixing the diode. A circuit connection assembly is mounted on a diode support and fixing assembly, and the diode is connected to a circuit for testing via the circuit connection assembly. A sealing assembly is installed on the test platform and connected to the diode support and fixing assembly. The sealing assembly seals the anode conductive hole and the cathode conductive hole.

2. The diode forward surge testing device capable of automatic measurement according to claim 1, characterized in that: The diode support and fixing assembly includes: an electric telescopic rod, which is fixedly installed on the test platform; A diode insulating support platform is fixedly mounted on an electric telescopic rod. The electric telescopic rod drives the diode insulating support platform to move up and down, and the diode insulating support platform supports the diode. A driving test strip is movably mounted on a diode insulating support platform; A connecting strip is movably connected to a drive test strip; The second limiting bracket is movably connected to the connecting strip, and the limiting strip drives the second limiting bracket to move.

3. The diode forward surge test device capable of automatic measurement according to claim 2, characterized in that: A first limiting support is fixedly installed on the drive test bar, and a first limiting top plate is fixedly installed on the first limiting support. A limiting mating groove is provided on the first limiting top plate.

4. The diode forward surge test device capable of automatic measurement according to claim 3, characterized in that: The connecting strip is movably mounted on the diode insulating support platform. When the driving test strip moves relative to the diode insulating support platform, it causes the connecting strip to move as well.

5. The diode forward surge test device capable of automatic measurement according to claim 4, characterized in that: The second limiting bracket is also movably mounted on the diode insulating support platform; A second limiting top plate is fixedly installed on the second limiting support, and a limiting mating groove is also provided on the second limiting top plate.

6. The diode forward surge testing device capable of automatic measurement according to claim 5, characterized in that: When the connecting strip moves relative to the diode insulating support platform, it drives the second limiting bracket to move. The second limiting top plate and the first limiting top plate cooperate to fix the diode.

7. The diode forward surge testing device capable of automatic measurement according to claim 6, characterized in that: The circuit connection assembly includes: an insulating support plate frame, wherein two insulating support plates are fixedly installed on the diode insulating support platform; The L-shaped insulating strip is movably mounted on the insulating support plate frame.

8. The diode forward surge test device capable of automatic measurement according to claim 7, characterized in that: A first conductive plate is inserted and fixed on the insulating support plate frame. The first conductive plate cooperates with the diode pins, and a conductive post is fixedly provided at the lower end of the first conductive plate. Two conductive posts on a set of insulating support plates are respectively inserted into the anode conductive hole and the cathode conductive hole; The L-shaped insulating strip is moved by the driving test strip to clamp the diode pins.

9. The diode forward surge test device capable of automatic measurement according to claim 8, characterized in that: The sealing assembly is a movable platform, which is movably connected to a connecting strip, and the platform is moved by the connecting strip.

10. A testing system, characterized in that: The test system is applicable to the diode forward surge test device as described in claim 9, including a central controller module, a communication module, a test module, a control module, and an analysis module. After the diode is placed on the diode insulating support platform, the central controller module controls the electric telescopic rod through the control module to move the diode insulating support platform downward to connect the diode to the circuit. The central controller module communicates with the test module, control module, and analysis module through the communication module. The diode is tested by the test module, and then the analysis module analyzes the test results and feeds them back to the central controller module to complete the diode test.

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