An integrated lens module and a manufacturing method thereof

Abstract

The application provides an integrated lens module and a manufacturing method thereof, comprising: an insert part and a lens supporting part; the insert part is made of a first plastic material, the heat-resistant temperature of the first plastic material is higher than the surface mounting welding temperature, the insert part is wrapped with a metal circuit, and the welding pad of the metal circuit is exposed on the surface of the insert part; the lens supporting part is made of a second plastic material, the forming shrinkage of the second plastic material is lower than that of the first plastic material, the lens supporting part is integrated with the insert part through secondary injection molding after the surface mounting welding process of the metal circuit is completed, and the lens supporting part is at least partially located on the inner side of the insert part or is adjacent to the insert part.

Description

Technical Field

[0001] This application relates to the field of optical element technology, and in particular to an integrated lens module and its manufacturing method. Background Technology

[0002] As smartphones and other electronic devices increasingly demand thinner, lighter designs and higher-performance camera capabilities, the integration and miniaturization of lens modules have become a focus of industry attention. Existing lens modules typically employ a design where the lens barrel and circuit board are separate. The circuit board is connected to the lens barrel via a flexible circuit board, serving to house the driver chip and provide electrical connection paths. However, this separate design suffers from the following technical drawbacks: First, the dual structure of the lens barrel and carrier wall increases the overall wall thickness, occupying valuable internal space and limiting the module's application in compact devices. Second, the introduction of flexible circuit boards increases the number of components and assembly steps; accumulated tolerances during assembly affect the stability of optical performance and reduce the system's electrical reliability. Furthermore, the separate assembly method makes it difficult to achieve a high degree of integration between circuit functions and optical positioning functions, hindering further miniaturization of the module.

[0003] To address these issues, some existing technologies attempt to employ a single-injection molding process, manufacturing the lens barrel and circuitry in a single step. However, because the overall structure must withstand the high temperatures of 220°C to 280°C during surface mount welding, the injection molding material is prone to thermal deformation under these conditions. This results in a significant decrease in the roundness and optical axis accuracy of the lens barrel, failing to meet the requirement of less than 3 micrometers for coaxiality error in high-end optical imaging. Furthermore, to ensure high-temperature resistance, material selection is limited, making it difficult to achieve the low shrinkage molding characteristics required for optical positioning. Therefore, existing technologies have room for improvement in terms of precision control, space utilization, and functional integration. Summary of the Invention

[0004] Therefore, it is necessary to provide an integrated lens module and its manufacturing method to address the problems of large lens module size, difficulty in balancing optical precision and circuit integration functions, and complex assembly processes in existing technologies.

[0005] This application provides an integrated lens module, including: an insert portion and a lens support portion; the insert portion is made of a first plastic material, the heat resistance temperature of the first plastic material is higher than the surface mount soldering temperature, the insert portion contains a metal circuit, and the solder pads of the metal circuit are exposed on the surface of the insert portion; wherein, the lens support portion is made of a second plastic material, the molding shrinkage rate of the second plastic material is lower than the molding shrinkage rate of the first plastic material, the lens support portion forms an integrated structure with the insert portion through secondary injection molding after the surface mount soldering process of the metal circuit, the lens support portion is at least partially located inside the insert portion, and the mating surface of the insert portion and the lens support portion is provided with a mechanical interlocking structure, the mechanical interlocking structure includes a protrusion provided on the insert portion and a limiting groove provided on the lens support portion that cooperates with the protrusion.

[0006] In some optional embodiments, the insert portion serves as the outer skeleton of the integrated lens module, and the insert portion extends along the optical axis toward the image side to form a motor carrier structure.

[0007] In some optional embodiments, the insert portion is located in the top region of the integrated lens module and is in the shape of a ring or frame, and the lens support portion extends along the optical axis toward the image side to form a motor carrier structure.

[0008] In some optional embodiments, the terminals of the metal circuit are exposed on the sidewall surface and top surface of the insert portion, respectively.

[0009] In some optional embodiments, a motor coil and a variable aperture are also included, wherein the motor coil is electrically connected to a terminal exposed on the sidewall surface of the insert portion, and the variable aperture is electrically connected to a terminal exposed on the top surface of the insert portion.

[0010] In some optional embodiments, the inner side of the lens support portion is provided with an annular stepped structure for mounting the lens, and the annular stepped structure is distributed in a multi-step shape along the optical axis.

[0011] In some optional embodiments, the insert portion is provided with stress relief holes, which are elongated through holes extending circumferentially along the insert portion.

[0012] In some optional embodiments, the terminals of the metal circuit are bent and extended toward the image side along the optical axis, and the bent and extended terminals are wrapped by the insert portion.

[0013] In some optional embodiments, a driver chip is also included, which is surface-mount soldered onto the pads of the metal circuit.

[0014] In some optional embodiments, the inner surface of the insert portion or the lens support portion is provided with at least one cleaving plane, the cleaving plane extending in a direction parallel to the optical axis.

[0015] This application also provides a method for manufacturing an integrated lens module, comprising: S1, placing a metal circuit into a first mold, and injection molding an insert portion using a first plastic material, wherein the heat resistance temperature of the first plastic material is higher than the surface mount soldering temperature, and the solder pads of the metal circuit are exposed on the surface of the insert portion; S2, performing surface mount soldering on the solder pads of the insert portion; S3, placing the soldered insert portion into a second mold, and injection molding a lens support portion using a second plastic material, wherein the molding shrinkage rate of the second plastic material is lower than that of the first plastic material, and the lens support portion and the insert portion form an integrated structure. In some optional embodiments, step S2a is further included between step S2 and step S3: bending and shaping the terminals of the metal circuit.

[0016] In some optional embodiments, the first plastic material used in step S1 is any one of liquid crystal polymer, polyphenylene sulfide, or polyphthalamide; the second plastic material used in step S3 is polycarbonate.

[0017] The aforementioned integrated lens module and its manufacturing method achieve a dual guarantee of high-temperature resistance and optical precision by separating the circuit-carrying function from the optical positioning function in the manufacturing process. By employing a secondary injection molding process, the insert part uses a high-temperature resistant plastic material to withstand the high temperatures of surface mount welding without deformation. The lens support part is formed after the welding process and is completely unaffected by the high welding temperatures, improving dimensional stability and roundness. This solves the problem of lens barrel deformation caused by high welding temperatures in existing integrated structures.

[0018] By embedding metal circuits directly into the insert, there is no need for external flexible circuit boards, which reduces the number of components and improves the electrical reliability of the system. At the same time, the integrated structure eliminates the redundant wall thickness in the separate assembly, reduces the module volume, and solves the problems of low space utilization and complex assembly process in the existing technology.

[0019] By incorporating a mechanical interlocking structure at the mating surface between the insert and the lens support, a physical interlock is formed, ensuring that the two parts will not separate during drops or thermal expansion and contraction, thus improving the mechanical reliability of the module. Furthermore, by setting a multi-level stepped annular structure on the inner side of the lens support, high-precision installation and positioning of multiple lenses is achieved, meeting the requirements of high-end optical imaging. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings of the embodiments will be briefly introduced below. Obviously, the drawings described below only involve some embodiments of this application and are not intended to limit this application.

[0021] Figure 1 This is a perspective view of the integrated lens module in some embodiments of this application, with the motor coil removed.

[0022] Figure 2 This is an exploded view of the integrated lens module in some embodiments of this application.

[0023] Figure 3 This is a schematic diagram of the integrated lens module in some embodiments of this application, excluding the lens support and motor coil.

[0024] Figure 4 This is a schematic diagram of the lens support portion in some embodiments of this application.

[0025] Figure 5 This is a top view of the insert portion in some other embodiments of this application.

[0026] Figure 6 This is a schematic diagram of the integrated lens module in one embodiment of this application from another perspective.

[0027] Figure 7 This is a bottom view of the lens support portion in some other embodiments of this application.

[0028] Figure 8 This is an exploded view of the integrated lens module in some other embodiments of this application.

[0029] Figure 9 This is a schematic diagram of step S1, in which the metal circuit is placed into the first mold, in some embodiments of this application.

[0030] Figure 10 This is a schematic diagram of the injection-molded insert part in step S1 of some embodiments of this application.

[0031] Figure 11 This is a schematic diagram of surface mount welding in step S2 of some embodiments of this application.

[0032] Figure 12 This is a schematic diagram of step S3, injection molding of the lens support portion, in some embodiments of this application.

[0033] In the diagram: 100, integrated lens module; 10, insert part; 11, metal circuit; 111, coil circuit; 1111, coil circuit terminal; 112, aperture circuit; 1121, aperture circuit terminal; 12, driver chip; 13, mechanical interlock structure; 131, protrusion; 132, limiting groove; 14, stress relief hole; 20, lens support part; 21, annular stepped structure; 213, injection molding reserved part; 22, motor carrier extension part; 23, chamfered surface; 24, lens clip; 312, positioning point; 32, motor coil. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings showing multiple embodiments according to this application. It should be understood that the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments described in this application without creative effort will fall within the scope of protection of this application.

[0035] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing specific embodiments only and is not intended to limit this application; the terms "comprising," "including," "having," "containing," etc., in the description, claims, and accompanying drawings of this application are open-ended terms. Therefore, "comprising," "including," or "having" refers to, for example, a method or apparatus having one or more steps or elements, but is not limited to having only these one or more elements. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0036] As mentioned above, it should be emphasized that when the term "comprising / including" is used in this specification, it is used to explicitly indicate the presence of the stated feature, integer, step, or component, but does not exclude the presence or addition of one or more other features, integers, steps, components, or groups of features, integers, steps, or components. As used in this application, the singular forms "a," "an," and "the" also include the plural forms, unless the context clearly indicates otherwise.

[0037] This embodiment provides an integrated lens module 100, such as Figure 1 as well as Figure 2 As shown. The integrated lens module 100 integrates circuitry and optical positioning functions into a single component, including an insert 10, a lens support 20, a metal circuit 11, a drive chip 12, and an assembly assembly. The assembly assembly includes a lens, a motor coil 32, and a variable aperture.

[0038] The insert portion 10 and the lens support portion 20 are integrated into a single structure through a secondary injection molding process. They are arranged adjacent to each other, jointly defining the receiving cavity for accommodating the lenses. The receiving cavity extends along the optical axis, and its inner diameter is defined by the annular stepped structure 21 of the lens support portion 20, which is used to precisely position each lens.

[0039] It should be noted that in the integrated lens module 100 of this application, its structure includes a lens support portion 20 and an insert portion 10 radially from the inside out. The inner lens support portion 20 directly supports and positions the lens; the outer insert portion 10 serves as a motor carrier portion, used to mount motor components such as a motor coil 32 and a magnet. This clear division of labor between the inner and outer structures ensures both the optical accuracy of the lens mounting and provides a stable structural foundation for the integration of the motor drive function.

[0040] The insert portion 10 is made of a first plastic material, the heat resistance of which is higher than the surface mount soldering temperature (220°C to 280°C), and can be selected from any one of liquid crystal polymer (LCP), polyphenylene sulfide (PPS), or polyphthalamide (PPA). The heat distortion temperature of the above materials is all above 280°C, which can maintain dimensional stability and prevent warping deformation during the surface mount soldering process.

[0041] The lens support portion 20 is made of a second plastic material, which has a lower molding shrinkage rate than the first plastic material. In some embodiments, the second plastic material is polycarbonate (PC), with a molding shrinkage rate of approximately 0.5% to 0.7%, which is lower than the combined shrinkage of liquid crystal polymers (approximately 0.1% to 1.5%, with significant anisotropy) and polyphenylene sulfide (approximately 0.5% to 1.0%) in the circumferential direction of the lens barrel. This ensures the sphericality of the lens support portion 20 and keeps the lens coaxiality error within 3 micrometers, meeting the requirements of high-end optical imaging.

[0042] The metal circuit 11 is a stamped metal insert made of SUS 316L 1 / 2H stainless steel, which has good elasticity and weldability. The metal circuit 11 includes two independent circuits: a coil circuit 111 and an aperture circuit 112.

[0043] The coil circuit terminal 1111 of the coil circuit 111 is exposed on the side wall surface of the insert portion 10 and is used to connect with the motor coil 32. The motor coil 32 receives the drive signal from the drive chip 12 through the coil circuit 111 and generates a drive magnetic field to achieve autofocus or optical image stabilization.

[0044] The aperture circuit terminal 1121 of the aperture circuit 112 extends outward from the side wall of the insert portion 10 and is exposed on the top surface of the insert portion 10. It is used to connect upward to the variable aperture. The variable aperture receives the control signal from the driver chip 12 through the aperture circuit and adjusts the aperture opening size to achieve the depth of field control function.

[0045] The control terminals of both the coil circuit 111 and the aperture circuit 112 are exposed on the surface of the insert portion 10 for corresponding connection with the pads of the driver chip 12. The driver chip 12 is fixed to the pads of the metal circuit 11 by surface mount soldering, thereby achieving unified control of the coil circuit 111 and the aperture circuit 112.

[0046] In some embodiments, the control terminals connecting the driver chip 12 are exposed on the bottom-facing surface of the insert portion 10; in other embodiments, the control terminals may also be exposed on the top-facing surface of the insert portion 10 to accommodate different module packaging requirements.

[0047] like Figure 3 As shown, the insert portion 10 is generally ring-shaped or frame-shaped. The metal circuit 11 is encapsulated and fixed inside the insert portion 10 by a metal insert injection molding process. Each conductive terminal and solder pad of the metal circuit 11 is exposed on the surface of the insert portion 10 at the corresponding position.

[0048] The inner surface of the insert portion 10 (i.e., the mating surface between the insert portion 10 and the lens support portion 20) is provided with a mechanical interlocking structure 13 for forming a physical engagement with the lens support portion 20. For example... Figure 3 as well as Figure 4As shown, the mechanical interlocking structure 13 includes a protrusion 131 disposed inside the insert portion 10 and a limiting groove 132 disposed on the lens support portion 20 that cooperates with the protrusion 131. The protrusions 131 are evenly spaced along the circumference of the insert portion 10, and the number is 2 to 8. When the lens support portion 20 is formed by secondary injection molding, the injection material flows into and wraps around the protrusions 131, forming a physical interlock, ensuring that the insert portion 10 and the lens support portion 20 will not separate under drop impact or thermal expansion and contraction conditions. The protrusion 131 is dovetail-shaped, and the mechanical interlocking structure 13 can also adopt a T-groove, a circular boss, or other convex-concave mating structure that can provide constraint in both radial and axial directions.

[0049] like Figure 5 As shown, in some embodiments, the insert portion 10 is provided with stress relief holes 14. The stress relief holes 14 are elongated through holes extending circumferentially along the insert portion 10, numbering from 2 to 8, distributed circumferentially, with an aspect ratio of not less than 3:1. The stress relief holes 14 are located in the optical axis direction between the pad area and the mating surface of the insert portion 10 and the lens support portion 20, to maximize the blocking of stress transmission paths while ensuring the structural strength of the insert portion 10. When the insert portion 10 is heated during the surface mount soldering process, the stress relief holes 14 cut off the transmission path of thermal stress through their hollow structure; when the lens support portion 20 is injection molded, the stress relief holes 14 can also block the injection stress generated during the injection molding process, preventing the aforementioned thermal stress and injection stress from affecting the dimensional accuracy of the lens support portion 20, and ensuring the roundness and coaxiality stability of the lens support portion 20.

[0050] like Figure 6 As shown, the lens support portion 20 is formed by secondary injection molding and is located inside or adjacent to the insert portion 10, together with the insert portion 10 defining the receiving cavity.

[0051] The inner side of the lens support portion 20 is provided with an annular stepped structure 21. The annular stepped structure 21 is distributed in a multi-step shape along the optical axis, with each step corresponding to the mounting support surface of a lens, used for high-precision axial positioning of each lens. Since the lens support portion 20 is formed by secondary injection molding after the surface mounting and welding process, it is completely unaffected by the high temperature of welding, and can maintain extremely high dimensional stability and roundness, keeping the lens coaxiality error within 3 micrometers.

[0052] In some embodiments, such as Figure 7As shown, the inner surface of the lens support portion 20 is provided with at least one chamfered plane (chamfered surface 23), which extends in a direction parallel to the optical axis. It should be noted that the lens support portion 20 can be used to mount both chamfered lenses and non-chamfered circular lenses. When mounting a chamfered lens, the chamfered plane mates with the chamfered portion of the lens, reducing the module's length and width (XY direction) dimensions while maintaining a large aperture, achieving a more compact design. In some embodiments, there are four chamfered planes, corresponding to the four directions of the receiving cavity. In some embodiments, a lens clip 24 is also provided between every two chamfered surfaces 23. The lens clip 24 is stepped and used to axially fix the chamfered lens, preventing it from dislodging during a drop impact.

[0053] like Figure 2 As shown, in this embodiment, the insert portion 10 serves as the outer frame of the integrated lens module 100, extending along the optical axis towards the image side to form the motor carrier extension portion 22, constituting the main frame of the module. The lens bearing portion 20 is located inside the insert portion 10, mainly forming the inner lens barrel portion, and together with the insert portion 10 defines the receiving cavity. Further, the outer surface of the motor carrier extension portion 22 is used to mount motor devices, such as motor coils, and the inner surface is a chamfered surface 23, used to support chamfered lenses.

[0054] like Figure 2 as well as Figure 3 As shown, the coil circuit terminals 1111 of the metal circuit 11 are directly exposed on two sidewall surfaces of the insert portion 10. The motor coil 32 is mounted in the coil bearing area of ​​the sidewall of the insert portion 10 and is electrically connected to the exposed coil circuit terminals 1111 on the sidewall surface. The aperture circuit terminal 1121 extends outward from the sidewall of the insert portion 10 and is exposed on the top surface of the insert portion 10, for electrically connecting to the variable aperture. The variable aperture is mounted on the top of the insert portion 10 and is electrically connected to the exposed aperture circuit terminal 1121 on the top surface. Compared to the solution where the aperture circuit terminal 1121 is directly exposed on the sidewall surface, this application extends the aperture circuit terminal 1121 to the top surface, so that the welding process of the variable aperture is away from the lens support portion 20, avoiding the high temperature during welding from affecting the precision of the lens barrel, and further ensuring the stability of optical performance.

[0055] In this embodiment, the insert part 10 constitutes a complete peripheral skeleton, and the module as a whole has strong rigidity, which can better resist external impact and vibration. It is suitable for application scenarios with high requirements for the overall rigidity of the module and relatively sufficient installation space, such as the rear main camera module.

[0056] like Figure 8As shown, in this embodiment, the insert portion 10 is located only in the top region of the integrated lens module 100, and is ring-shaped or frame-shaped. The lens support portion 20 extends towards the image side along the optical axis to form the motor carrier extension portion 22, and has a chamfered surface 23 on its inner surface. In this embodiment, the motor carrier structure is mainly composed of a second plastic material. Utilizing the low molding shrinkage and high molding precision of the second plastic material, a composite structure of the lens barrel and carrier is manufactured in one step.

[0057] Compared to Embodiment 1, this embodiment reduces the scope of the first plastic material used, using only one injection molding at the top circuit interface, thus reducing material costs. To accommodate this structure, after surface mount soldering, the coil circuit terminal 1111 of the metal circuit 11 is bent and formed in step S2a, extending towards the image side along the optical axis. It should be noted that a portion of this terminal is already wrapped by the first plastic material portion of the insert portion 10 during the first injection molding in step S1. After bending in step S2a, the other portion (i.e., the bent extension portion) is further wrapped by the second plastic material portion of the lens support portion 20 during the second injection molding in step S3, and finally electrically connected to the external motor coil 32, thereby forming an embedded electrical connection path wrapped by both the first and second injection molding materials.

[0058] This application also provides a method for manufacturing an integrated lens module 100, which is described below in conjunction with... Figures 9 to 12 Please provide an explanation.

[0059] Step S1: One-time injection molding of the insert part like Figure 9 As shown, the metal circuit 11 is first stamped and formed. The material of the metal circuit 11 is SUS 316L 1 / 2H stainless steel. The metal circuit 11 includes a coil circuit 111 and an aperture circuit 112. The conductive terminals of each circuit and the pads of the driver chip 12 are located in predetermined positions.

[0060] like Figure 10 As shown, the metal circuit 11 is placed in the first mold, and the insert portion 10 is injection molded using a first plastic material. The heat resistance temperature of the first plastic material is higher than the surface mount soldering temperature, and it can be selected from any one of liquid crystal polymer, polyphenylene sulfide, or polyphthalamide. After injection molding, the metal circuit 11 is encapsulated and fixed inside the insert portion 10, and each conductive terminal and solder pad is exposed on the surface of the insert portion 10 at the corresponding position. When fixing the insert portion 10, the fixing position of the first mold avoids the area where the lens support portion 20 is subsequently formed, so as to ensure that the material can be fully filled during the secondary injection molding.

[0061] Step S2: Surface Mount Soldering like Figure 11As shown, surface mount soldering is performed on the pads of the insert portion 10 to fix the driver chip 12 onto the pads of the metal circuit 11. The surface mount soldering temperature range is 220°C to 280°C. Since the insert portion 10 is made of a first plastic material with a heat resistance temperature higher than the above soldering temperature, no thermal deformation will occur during the soldering process.

[0062] Optionally, the process further includes step S2a: terminal bending and forming. In Embodiment 2, after step S2 is completed, the terminals of the metal circuit 11 are bent and shaped so that the terminals bend and extend towards the image side along the optical axis to accommodate the wrapping and fixing of the lens bearing portion 20 pairs of terminals during subsequent secondary injection molding. In Embodiment 1, the terminals do not need to be bent, and this step can be omitted.

[0063] Step S3: Secondary injection molding of the lens support part like Figure 12 As shown, the insert portion 10, after welding (and terminal bending), is placed into the second mold, and the lens support portion 20 is injection molded using a second plastic material. The molding shrinkage rate of the second plastic material is lower than that of the first plastic material, and in some embodiments it is polycarbonate.

[0064] The process parameters for step S3 are as follows: injection temperature range of 250℃ to 310℃, injection pressure range of 80MPa to 140MPa, and cooling time of no less than 15 seconds. The gate position and injection runner design of the second mold avoid the area where the driver chip 12 is located to prevent damage to the soldered components caused by the high temperature and pressure of injection molding. After injection molding, the lens support part 20 and the insert part 10 are physically engaged through the mechanical interlocking structure 13 to form an integrated structure.

[0065] Since the lens support part 20 is formed after the surface mounting and welding process, it is completely unaffected by the high temperature of welding, and can maintain extremely high dimensional stability and roundness, so that the coaxiality error of the lens is controlled within 3 micrometers.

[0066] To ensure the relative positional accuracy between the lens support portion 20 and the insert portion 10 during secondary injection molding, the insert portion 10 is provided with four injection pre-reserved portions 213 circumferentially. The secondary injection mold is equipped with a positioning part to precisely fix the position of the insert portion 10 during mold closing; the mold is also equipped with ejector pins to eject the molded product after mold opening. After injection molding, the ejector pin contact points form positioning points 312 on the surface of the lens support portion 20. The injection pre-reserved portions 213 are located on the top surface and / or inner side of the insert portion 10 to guide the flow and filling of molten plastic during secondary injection molding, thereby forming a complete lens support portion 20 structure. Through the coordinated cooperation of the positioning part and the injection pre-reserved portions 213 of the mold, the insert portion 10 can still be precisely positioned in the secondary injection mold after surface mount welding, while ensuring that the lens support portion 20 formed by secondary injection molding has stable roundness and coaxiality.

[0067] Compared with existing technologies, this application has the following advantages: Regarding accuracy: In existing technologies, the lens barrel and the insert carrier are typically two independent components, assembled separately. This not only results in redundant wall thicknesses for both the lens barrel and the carrier, but also leads to accumulated tolerances during assembly that affect the stability of optical performance. To address these issues, this application proposes integrating the lens barrel, insert, and motor carrier into a single structure. Considering that the insert needs to withstand the high-temperature environment of surface mount technology (SMT), which can cause thermal deformation of the lens barrel and affect its roundness, this application employs a two-stage injection molding process: first, the insert with integrated metal circuitry is injection molded to withstand the SMT welding process without deformation; after the SMT welding is completed, the lens support is then formed through a second injection molding process. Thus, the lens support is completely unaffected by the high welding temperatures, and the roundness and coaxiality errors can be controlled within 3 micrometers. Simultaneously, the integrated structure eliminates the separate assembly steps of the lens barrel and carrier, eliminating accumulated assembly tolerances and further improving image quality.

[0068] In terms of size and weight: The integrated structure eliminates the double redundant wall thickness of the lens barrel wall and the carrier wall in the split solution. Combined with the design of the chamfered surface 23 and the chamfered lens, the module size is further reduced in the XY direction, realizing a more compact motor-lens integrated design. At the same time, the motor load is reduced, and power consumption and response speed are optimized.

[0069] In terms of integration: The metal circuit 11 is directly embedded in the insert part 10, and the coil circuit 111 and the aperture circuit 112 are integrated at the same time. There is no need for an external flexible circuit board, which reduces the number of components, improves the electrical reliability of the system, and provides an electrical interface for installing extended components such as variable aperture.

[0070] In terms of reliability: the insert part 10 and the lens support part 20 are physically engaged through the mechanical interlocking structure 13, ensuring that the two parts will not separate under drop impact or thermal expansion and contraction conditions. The stress relief hole 14 blocks the transmission of welding thermal stress to the lens support part 20, further ensuring the long-term stability of optical performance.

[0071] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. An integrated lens module, characterized in that, include: Insert part and lens support part; The insert is made of a first plastic material, the heat resistance temperature of which is higher than the surface mount soldering temperature. The insert contains a metal circuit, and the solder pads of the metal circuit are exposed on the surface of the insert. The lens support portion is made of a second plastic material, the molding shrinkage rate of which is lower than that of the first plastic material. After the surface mounting and soldering process of the metal circuit is completed, the lens support portion is integrated with the insert portion through secondary injection molding. The lens support portion is at least partially located inside the insert portion. The mating surface between the insert portion and the lens support portion is provided with a mechanical interlocking structure. The mechanical interlocking structure includes a protrusion on the insert portion and a limiting groove on the lens support portion that cooperates with the protrusion.

2. The integrated lens module as described in claim 1, characterized in that, The insert portion serves as the outer skeleton of the integrated lens module, and extends along the optical axis toward the image side to form a motor carrier structure.

3. The integrated lens module as described in claim 1, characterized in that, The insert is located in the top region of the integrated lens module and is in the shape of a ring or frame. The lens support extends along the optical axis toward the image side to form a motor carrier structure.

4. The integrated lens module as described in claim 1, characterized in that, The terminals of the metal circuit are exposed on the side wall surface and top surface of the insert, respectively.

5. The integrated lens module as described in claim 1, characterized in that, It also includes a motor coil and a variable aperture, wherein the motor coil is electrically connected to a terminal exposed on the side wall surface of the insert portion, and the variable aperture is electrically connected to a terminal exposed on the top surface of the insert portion.

6. The integrated lens module as described in claim 1, characterized in that, The inner side of the lens support is provided with an annular stepped structure for mounting the lens, and the annular stepped structure is distributed in a multi-step shape along the optical axis.

7. The integrated lens module as described in claim 1, characterized in that, The insert portion is provided with stress relief holes, which are elongated through holes extending circumferentially along the insert portion.

8. The integrated lens module as described in claim 1, characterized in that, The terminals of the metal circuit are bent and extended toward the image side along the optical axis, and the bent and extended terminals are partially wrapped by the insert portion.

9. The integrated lens module as described in claim 1, characterized in that, It also includes a driver chip, which is surface-mount soldered onto the pads of the metal circuit.

10. The integrated lens module as described in claim 1, characterized in that, The inner surface of the lens support portion is provided with at least one tangent plane, which extends in a direction parallel to the optical axis.

11. A method for manufacturing an integrated lens module as described in any one of claims 1 to 10, characterized in that, Includes the following steps: S1. The metal circuit is placed in the first mold, and the insert part is injection molded using the first plastic material. The heat resistance temperature of the first plastic material is higher than the surface mount soldering temperature, and the solder pads of the metal circuit are exposed on the surface of the insert part. S2. Perform surface mount soldering on the pads of the insert portion; S3. Place the welded insert into the second mold, and use the second plastic material to injection mold the lens support part. The molding shrinkage rate of the second plastic material is lower than that of the first plastic material. The lens support part and the insert part form an integrated structure.

12. The manufacturing method as described in claim 11, characterized in that, Between steps S2 and S3, there is also step S2a: bending and shaping the terminals of the metal circuit.

13. The manufacturing method as described in claim 11, characterized in that, The first plastic material used in step S1 is any one of liquid crystal polymer, polyphenylene sulfide, or polyphthalamide; the second plastic material used in step S3 is polycarbonate.

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