Lightweight extensible integrated processing payload device

Abstract

The application discloses a kind of lightweight scalable integrated processing payload devices, belong to satellite communication field, including standardization function board card, flexible interconnection backplane and cable, basic structure composition. Device system internal interconnection mainly includes high-speed flexible backplane low-speed flexible backplate, flexible radio frequency interconnection cable, internal power cable, interconnection adopts HSJ2, J30J, SMA, SMA type connector, each function board card is realized using drawer cage type design, when function board card is assembled, can be freely assembled according to demand, using guide column / hole coarse positioning, limiting piece fine positioning, avoid stress concentration. In the process of implementation of the application, according to the task requirement, freely select and combine function board card, quickly build different specifications of on-board processing payload device, the application has the characteristics of lightweight and compact design, can satisfy the processing payload demand of multiple satellites.

Description

Technical Field

[0001] This invention relates to a lightweight, scalable integrated processing payload device, belonging to the field of satellite communication technology, and is particularly suitable for large-scale information processing and flexibly expandable spaceborne devices. Background Technology

[0002] Satellite processing payload products are developing towards intelligence and multi-functionality. As satellite payload functions become more complex and their integration level increases, payloads need to integrate multiple processing boards to achieve complex functions.

[0003] Currently, complex spaceborne processing payloads mostly adopt a VPX chassis-based design. This approach provides a robust, modular packaging system, but it still has some limitations in aerospace applications. Limited scalability: Once the design is complete, the number of slots in the VPX chassis is fixed. If resource expansion or reduction is needed, the chassis design must be redesigned, resulting in lengthy verification and evaluation times. Structural rigidity constraints: The VPX backplane and functional modules are rigidly interlocked, requiring extremely high machining accuracy and assembly alignment, leading to significant assembly risks. Weight limitations: Integrating various functional boards into a chassis results in a large chassis size and weight to meet heat dissipation and structural strength requirements, making weight reduction difficult. Summary of the Invention

[0004] To address the shortcomings of the aforementioned background technology, this invention provides a lightweight, flexibly expandable spaceborne integrated processing payload device, solving the problems of traditional processing payload devices in terms of expansion flexibility, structural adaptability, radio frequency signal integration, assembly reliability, and lightweight design.

[0005] The technical method of this invention is implemented as follows: A lightweight, scalable integrated processing payload device, comprising: Multiple standardized functional boards, each of which is an independent functional entity, and the multiple standardized functional boards are stacked and assembled along the stacking direction using a drawer-type structure; the standardized functional boards are provided with guide holes and stop structures for stacking expansion positioning between boards; The flexible interconnect component includes a high-speed flexible backplane, a low-speed flexible backplane, flexible radio frequency interconnect cables, and internal power cables; the high-speed flexible backplane, the low-speed flexible backplane, the flexible radio frequency interconnect cables, and the internal power cables are respectively connected to standardized functional boards to realize high-speed signal transmission, low-speed signal transmission, radio frequency signal interconnection, and power transmission between multiple standardized functional boards. The basic structural components include a guide rod and a top cover plate; the guide rod passes through the guide holes of multiple standardized functional boards to achieve lateral positioning of the multiple standardized functional boards; the top cover plate covers the top of the stacked multiple standardized functional boards to achieve longitudinal positioning. By freely selecting and combining the standardized functional boards according to task requirements, modular and flexible configuration can be achieved.

[0006] Furthermore, the standardized functional boards follow a unified mechanical size standard, and the types of the standardized functional boards include one or more of the following: control and switching boards, interface boards, power supply boards, and user boards. The control and switching board adopts a primary and backup design to realize load management, reconfiguration, routing and switching, S-UPF and security management functions. The interface board is used for external interface expansion, power processing and distribution, and clock processing and distribution. Its internal functions adopt a primary and backup design. The power supply board and user board can be installed and expanded in multiple ways as needed for the task.

[0007] Furthermore, the connectors of the high-speed flexible backplane adopt HSJ2 series micro rectangular connectors to realize high-speed signal transmission between boards; The connectors of the low-speed flexible backplane adopt the J30J series micro rectangular connectors to realize low-speed signal transmission between boards. The flexible radio frequency interconnect cable adopts an independent SMP-SMA flexible cable to realize radio frequency signal interconnection between boards; The internal power cable connectors use J30J series micro rectangular connectors for power distribution.

[0008] Furthermore, the high-speed flexible backplane is composed of a rigid circuit board, flexible materials, and connectors; the flexible radio frequency interconnect cable adopts SMP connectors and SMA connectors and has blind mating capability.

[0009] Furthermore, in the drawer-type structure, the stop structure provided on each standardized functional board includes a convex stop and a concave stop; the convex stop and the concave stop cooperate with each other to realize the stacking expansion positioning between adjacent boards; The guide hole is an elongated slotted hole. When the guide rod is inserted into the guide hole, the two can move relative to each other in the longitudinal direction and are in a clearance fit in the transverse direction to achieve precise transverse positioning and avoid stress concentration.

[0010] Furthermore, the top cover plate is provided with a crossbeam structure for binding and fixing cables; the two ends of the guide rod are provided with threads for installing nuts to fasten the stacked standardized functional boards.

[0011] Furthermore, the internal interconnection of the device adopts HSJ2, J30J, SMA and SMP type connectors, which can realize external connection by cable; each standardized function board can be used independently as a satellite payload product with discrete functions.

[0012] Furthermore, the high-speed flexible backplane and the low-speed flexible backplane are made of flexible materials, which absorb the dimensional deviations and structural deformations caused by vibration during the board assembly process; the heat dissipation of the device adopts bottom contact conduction.

[0013] Furthermore, the device is powered by a +42V DC voltage. After the power supply is connected to the interface board, it is distributed to other functional boards through internal power cables.

[0014] Furthermore, the device also includes side covers, which are mounted on the sides of the stacked standardized functional boards to form a closed or semi-closed structure.

[0015] This invention is highly flexible and scalable: it adopts a standardized functional board structure and a free combination method, which allows for the free selection and combination of functional modules according to mission requirements, and can quickly build spaceborne processing payloads of different specifications like building blocks.

[0016] This invention has excellent environmental adaptability and reliability: the flexible backplane can absorb structural deformation, the SMP / SMA RF connector has blind mating capability and vibration resistance, and the assembly mechanism eliminates installation stress.

[0017] This invention features a lightweight and compact design: it adopts a drawer-type structure, abandons rigid chassis, reduces weight and volume, and realizes a lightweight and compact complex functional satellite payload.

[0018] The internal interconnection of the device adopts HSJ2, J30J, SMA and SMP type connectors. The single board can be used independently. As a satellite payload product, it can also be quickly built into spaceborne processing payload devices of different specifications according to mission requirements to realize complex integrated processing functions. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structural composition of the present invention.

[0020] Figure 2 This is a schematic diagram of the guide rod.

[0021] Figure 3This is a schematic diagram showing the fixing of the top cover plate and the functional board.

[0022] Figure 4 This is a schematic diagram of the stacked expansion feature.

[0023] Figure 5 This is a block diagram illustrating the principle of the internal high-speed flexible interconnect and radio frequency flexible interconnect of this invention.

[0024] Figure 6 This is a block diagram illustrating the principle of low-speed flexible interconnection and power interconnection within this invention.

[0025] Figure 7 This is a schematic diagram of a high-speed flexible backplane.

[0026] Figure 8 This is a functional principle block diagram of an embodiment of the present invention.

[0027] Figure 9 This is a schematic diagram of the complete machine assembly.

[0028] Figure 10 This is a schematic diagram illustrating the implementation of the flexible expansion device a of the present invention.

[0029] Figure 11 This is a schematic diagram of the flexible expansion device b of the present invention.

[0030] Figure 12 This is a schematic diagram of the flexible expansion device c of the present invention. Detailed Implementation

[0031] The present invention will now be described in further detail with reference to the accompanying drawings.

[0032] A lightweight, scalable integrated processing payload device is invented, employing a modular, drawer-style design that allows for free combination. This device comprises standardized functional boards, a flexible interconnect backplane and cables, and a basic structure, enabling flexible resource configuration to meet the specific needs of different satellite missions through modular assembly.

[0033] Specific reference Figures 1 to 9A lightweight, scalable integrated processing payload device is mainly composed of three parts: standardized functional processing boards (including a drawer-type structure) 1, internal system interconnection 2, and basic structural components 3. The device utilizes a bottom 4 for heat dissipation via contact conduction. The bottom 4 is a heat-conducting base plate made of a high thermal conductivity metal material (such as aluminum alloy). The main heat-generating components on each standardized functional board contact the bottom 4 through a thermally conductive interface material (such as a thermal pad or thermal gel), forming a heat conduction path. The entire device is bonded to the satellite platform's thermal control system (such as a heat pipe or cold plate) via the bottom 4, efficiently conducting heat to the satellite platform for cooling. To ensure reliable thermal contact, the coplanarity of the bottom planes of each functional board is controlled through the assembly process, ensuring that the thermally conductive interface materials of all boards are tightly bonded to the bottom 4.

[0034] The basic structural component 3 mainly consists of a top cover plate 3-1, side cover plates 3-2, and mounting guide rods 3-3. The top cover plate has a crossbeam structure for binding radio frequency cables and power cables, thus achieving cable fastening.

[0035] The guide rod 3-3 has a guide section 3-3-1 in the middle, which enables precise lateral positioning when multiple functional boards are stacked. Both ends have threads 3-3-2 for installing nuts to fasten the functional boards together. To minimize the equipment envelope size and ensure reliable fastening, the length of the guide rod 3-3 is adapted according to the number of functional boards, with an appropriate amount of exposed length on one side. The preferred length is generally 7.5mm to 10.5mm. The diameter d of the guide part of the guide rod is 5.5mm.

[0036] The top cover plate 3-1 is fixed to the function boards with fasteners, which can limit the function boards in the vertical height direction to ensure the overall flatness of the bottom 4 formed by the function boards. The length of the top cover plate 3-1 is adapted according to the number of function boards configured.

[0037] The drawer-type assembly structure is the basis for the flexible configuration of this invention. The device includes multiple functional processing boards that conform to a uniform mechanical dimension standard. Each board is part of the drawer-type assembly structure and is called a drawer-type structure sub-body. The board structure includes an extension connection feature 5 for stacking and expanding the boards.

[0038] The board stacking expansion connection features include 7 guide holes 5-1, 2 raised stops 5-2, and 2 recessed stops 5-3. The dimensions are selected as follows: the height h of the raised stop 5-2 is 1.95mm and the width b is 1.8mm; the height H of the recessed stop 5-3 is 2mm and the width B is 2.1mm. These can be adapted and modified according to the actual situation.

[0039] The guide hole 5-1 is designed as a long, narrow hole with dimensions of 5.5mm × 6.5mm. When the guide rod 3-3 is inserted into the guide hole 5-1, the two can move freely 1mm longitudinally and are in a clearance fit laterally, with a clearance range of 0.02mm to 0.05mm, thereby achieving precise positioning of the multi-functional board in the lateral direction.

[0040] The dimensions described above represent a specific implementation and can be appropriately modified during the actual design process to achieve an expandable drawer-type assembly structure with various specifications and sizes.

[0041] The standardized functional boards are the core of the function implementation. Each board is an independent functional entity. Board types include control and switching boards, interface boards, power supply boards, and user boards. The functional boards (including drawer-type structures) 1 mainly include: Control and Switching Board 1-1: Adopting a primary backup design, it realizes the functions of payload management, reconfiguration, routing and switching, S-UPF, and security management of the satellite payload system. Whether to install a backup board can be determined according to reliability requirements.

[0042] Interface board 1-2: Responsible for external interface expansion, power processing and distribution, clock processing and distribution, etc. The various functions inside the interface board adopt a master-backup design.

[0043] Power supply board 1-3: Enables high-speed satellite-to-ground power supply link data communication. Multiple boards can be installed and expanded according to mission requirements to achieve business function expansion.

[0044] User boards 1-4: Implement the functions of the satellite base station, complete functions such as service beam access management and communication, and can load different software versions as needed to switch between different functions. Multiple boards can be installed and expanded according to task requirements to meet the needs of service function expansion.

[0045] The internal interconnection 2 of the system mainly includes a high-speed flexible backplane 2-1, a low-speed flexible backplane 2-2, a flexible radio frequency interconnection cable 2-3, and an internal power cable 2-4.

[0046] The control and switching board 1-1 is equipped with an FPGA (Field-Programmable Gate Array) chip and a routing and switching chip. The FPGA chip is used to implement load management and reconfiguration functions, while the routing and switching chip is used to implement data routing and switching as well as S-UPF (System-on-Flight) functionality. The security management unit uses an independent encryption / decryption chip to implement data encryption and decryption. The interface board 1-2 is equipped with a power conversion module, a clock generator, and an interface expansion chip. The power conversion module converts the input +42V DC voltage into the operating voltage required by each board, and the clock generator outputs multiple clock signals. The power supply board 1-3 is equipped with an intermediate frequency transceiver module and a modulation / demodulation module to realize data communication for the satellite-to-ground power supply link. The user board 1-4 is equipped with a baseband processing chip and a protocol processing chip. The baseband processing chip performs signal modulation and demodulation, while the protocol processing chip performs higher-layer protocol processing.

[0047] This invention utilizes flexible materials to achieve information interconnection between various circuit boards, addressing the challenges of high precision requirements and assembly difficulty associated with rigid backplanes, as well as stress issues under vibration. The flexible backplane itself possesses a certain degree of bending and torsional capacity, absorbing minor dimensional deviations during board assembly and structural deformations during vibration, thus reducing assembly difficulty and improving reliability.

[0048] Reference Figure 5 Specifically, it realizes the logical connection relationship between the high-speed flexible backplane and the radio frequency flexible interconnect.

[0049] Reference Figure 6 Specifically, it realizes the logic connection relationship between the low-speed flexible backplane and the internal power supply.

[0050] The high-speed flexible backplane 2-1 inside the device primarily enables high-speed signal transmission between boards. It consists of a rigid circuit board 2-1-1, a flexible material 2-1-2, and connectors 2-1-3. The flexible material uses polyimide (PI) as its substrate, which has excellent bending performance and resistance to high and low temperatures. The rigid circuit board and the flexible material are integrally formed using a rigid-flex PCB process, forming a rigid-flexible backplane structure. The high-speed flexible backplane employs a multi-layer wiring design, with high-speed signal layers and ground layers alternately stacked. Impedance matching (such as 50Ω or 100Ω differential impedance) is achieved by controlling the dielectric constant and line width and spacing to suppress signal reflection and crosstalk. The low-speed flexible backplane adopts a similar structure, with its number of layers and line width optimized according to the characteristics of low-speed signals.

[0051] The connectors use HSJ2 series micro rectangular connectors, and the signal type is GTH signal. Each user board and power supply board contains 2 GTH signals.

[0052] The low-speed flexible backplane 2-2 mainly realizes low-speed signal transmission between boards. The connector adopts the J30J series micro rectangular connector. The low-speed signal types include: 422 signal, LVDS signal, OE power on / off command signal, etc.

[0053] The internal radio frequency (RF) signals of the device are interconnected using flexible RF interconnect cables 2-3. Independent SMP (Push-in Miniature Coaxial)-SMA flexible cables are used for connections between boards. SMP connectors are small in size and have a high frequency, avoiding signal loss and crosstalk issues during high-frequency signal transmission in the backplane. This type of cable allows for blind mating, permitting a certain alignment tolerance and facilitating operation.

[0054] The interface board outputs multiple clock signals, one of which is a fixed-frequency clock signal with a clock frequency of 100MHz, and the other is a flexibly configurable frequency clock signal. The clock frequency can be flexibly configured according to the user's board service needs, so as to realize flexible definition of software functions.

[0055] The internal power cables 2-4 are used to directly distribute the power through the interface board. The device is powered by +42V DC voltage. After the power is connected to the interface board, it is distributed to other functional boards through the internal power cables. The connectors on the cables are J30J series micro rectangular connectors.

[0056] Reference Figure 4 The block diagram illustrating the functional principle of this invention.

[0057] The uplink service data processing is as follows: The user board's baseband processing unit receives the intermediate frequency service signal, completes the sampling, decoding, and demodulation of the service signal, and then transmits the baseband signal to the protocol processing unit. The protocol processing unit completes the higher-level protocol processing of the service signal, and finally sends the data to the control and switching board through the frame switching function. For encrypted service data, it is sent to the security management unit of the control and switching board to achieve the decryption function. After decryption, the protocol processing unit further processes the data and forwards it to the routing and switching unit of the control and switching board for further processing. The routing and switching unit processes the data according to the IP address. If encryption is required, the data is sent to the security management unit for encryption. If encryption is not required, the data proceeds directly to the next step. For grounded service data, it is directly sent to the ground gateway station through the power supply function unit or through the laser payload to achieve cross-satellite service forwarding and data processing, and then sent to the ground gateway station to access the ground core network. For non-grounded services, they are processed by the S-UPF unit and directly forwarded through intra-satellite and inter-satellite routing, bypassing the ground core network to achieve end-to-end service communication.

[0058] The downlink service data processing is the reverse of the uplink service data processing process. The routing and switching unit in the control and switching board receives the power supply service data or the cross-satellite service data of the laser payload. It performs decryption or S-UPF processing as needed, sends it to the user board through the frame switching function, performs encryption processing as needed, completes the higher-layer protocol processing, and sends it to the baseband processing unit. After modulation, it is sent to the intermediate frequency interface and then sent to the ground system equipment through the channel and antenna.

[0059] The various functional boards are implemented using a drawer-style design, allowing for free selection and combination of functional boards according to mission requirements, enabling the rapid construction of spaceborne processing payload devices of different specifications, much like building with blocks.

[0060] During load assembly, after stacking and assembling the various functional boards according to requirements: 1) Install guide rod 3-3 in guide hole 5-1, adjust the lateral accuracy, and do not tighten the nuts; 2) Install high-speed flexible backplane 2-1, low-speed flexible backplane 2-2, flexible RF interconnect cable 2-3, and internal power cable 2-4; 3) Install top cover plate 3-1, tighten the screws between top cover plate 3-1 and each functional board to the specified torque, and adjust the longitudinal accuracy; 4) To avoid stress concentration, pre-tighten the nuts on guide post 3-3 to 1 / 3 to 1 / 2 of the specified torque; 5) Loosen the screws between top cover plate 3-1 and each functional board; 6) Tighten the nuts on guide post 3-3 again to the specified torque; 7) Tighten the screws between top cover plate 3-1 and each functional board to the specified torque; 8) Install side cover plate 3-2. Rapid assembly and manufacturing of the complete load product.

[0061] After assembly, the entire device undergoes functional testing and environmental adaptability verification. Functional testing includes: continuity testing to verify the contact reliability of each connector; insulation resistance testing to ensure the insulation performance between the power supply and the housing meets aerospace standards; and signal integrity testing to verify the transmission quality of high-speed, low-speed, and radio frequency signals. Environmental adaptability verification includes: random vibration testing to simulate the mechanical environment during launch; and thermal cycling testing to simulate the alternating temperature environment during on-orbit operation. Only after passing these tests can the device be delivered for use.

[0062] Reference Figure 10 The present invention provides a schematic diagram of the flexible expansion device 1. Device 1 includes a main / backup control and switching board, an interface board, two user boards, and one power supply board.

[0063] Reference Figure 11 The diagram illustrates the implementation of the flexible expansion device 2 of this invention. Device 2 includes a main / backup control and switching board, an interface board, two user boards, and two power supply boards.

[0064] Reference Figure 12The diagram illustrates the implementation of the flexible expansion device 3 of this invention. Device 2 includes a main / backup control and switching board, an interface board, four user boards, and one power supply board.

[0065] The three flexible expansion devices mentioned above are suitable for different satellite mission requirements. For example... Figure 10 The flexible expansion device 1 shown is configured with two user boards and one power supply board, suitable for low-Earth orbit satellites with limited communication capacity requirements, such as IoT data acquisition or narrowband communication missions. Figure 11 The flexible expansion device 2 shown is configured with two user boards and two power supply boards, suitable for medium-capacity broadband communication tasks. The data transmission capacity of the satellite-to-ground link is enhanced by adding power supply boards. Figure 12 The flexible expansion device 3 shown is configured with four user boards and one power supply board, suitable for high-capacity tasks such as multi-beam broadband access or on-board data processing. More user beams can be supported by adding user boards. Based on different task requirements, the type and number of boards can be further adjusted to achieve flexible resource allocation.

[0066] Furthermore, the internal interconnection of the device adopts HSJ2, J30J, SMA, and SMP type connectors. These types of connectors can achieve external connection via cables. After adding 3-2 side covers to a single functional board, it can be used independently and can be used as a satellite payload product to achieve separate functions.

[0067] In summary, this invention achieves modular free combination through a standardized functional board cage-style stacking assembly structure, combined with the positioning design of guide rods and top cover plates. It allows for rapid selection of board types and quantities according to different satellite mission requirements, effectively solving the problem of limited VPX chassis expansion capabilities in the prior art. By employing a flexible interconnect assembly consisting of a high-speed flexible backplane, a low-speed flexible backplane, flexible RF interconnect cables, and internal power cables, the bending and torsional capabilities of flexible materials absorb assembly deviations and vibration deformation, reducing assembly precision requirements and improving reliability under vibration environments. By abandoning the rigid chassis and adopting a cage-style assembly structure, a lightweight and compact design is achieved, meeting the stringent weight and volume requirements of aerospace applications.

Claims

1. A lightweight, scalable integrated processing load device, characterized in that, include: Multiple standardized functional boards, each of which is an independent functional entity, and the multiple standardized functional boards are stacked and assembled along the stacking direction using a drawer-type structure; the standardized functional boards are provided with guide holes and stop structures for stacking expansion positioning between boards; The flexible interconnect component includes a high-speed flexible backplane, a low-speed flexible backplane, flexible radio frequency interconnect cables, and internal power cables; the high-speed flexible backplane, the low-speed flexible backplane, the flexible radio frequency interconnect cables, and the internal power cables are respectively connected to standardized functional boards to realize high-speed signal transmission, low-speed signal transmission, radio frequency signal interconnection, and power transmission between multiple standardized functional boards. The basic structural components include a guide rod and a top cover plate; the guide rod passes through the guide holes of multiple standardized functional boards to achieve lateral positioning of the multiple standardized functional boards; the top cover plate covers the top of the stacked multiple standardized functional boards to achieve longitudinal positioning. By freely selecting and combining the standardized functional boards according to task requirements, modular and flexible configuration can be achieved.

2. The lightweight, scalable integrated processing load device according to claim 1, characterized in that, The standardized functional boards follow a unified mechanical size standard, and the types of the standardized functional boards include one or more of the following: control and switching boards, interface boards, power supply boards, and user boards. The control and switching board adopts a primary and backup design to realize load management, reconfiguration, routing and switching, S-UPF and security management functions. The interface board is used for external interface expansion, power processing and distribution, and clock processing and distribution. Its internal functions adopt a primary and backup design. The power supply board and user board can be installed and expanded in multiple ways as needed for the task.

3. The lightweight, scalable integrated processing load device according to claim 1, characterized in that, The connectors of the high-speed flexible backplane adopt the HSJ2 series micro rectangular connectors to realize high-speed signal transmission between boards. The connectors of the low-speed flexible backplane adopt the J30J series micro rectangular connectors to realize low-speed signal transmission between boards. The flexible radio frequency interconnect cable adopts an independent SMP-SMA flexible cable to realize radio frequency signal interconnection between boards; The internal power cable connectors use J30J series micro rectangular connectors for power distribution.

4. The lightweight, scalable integrated processing load device according to claim 3, characterized in that, The high-speed flexible backplane is composed of a rigid circuit board, flexible materials, and connectors; the flexible radio frequency interconnect cable adopts SMP connectors and SMA connectors and has blind mating capability.

5. A lightweight, scalable integrated processing load device according to claim 1, characterized in that, In the drawer-type structure, the stop structure provided on each standardized functional board includes a convex stop and a concave stop; the convex stop and the concave stop cooperate with each other to realize the stacking expansion positioning between adjacent boards; The guide hole is an elongated slotted hole. When the guide rod is inserted into the guide hole, the two can move relative to each other in the longitudinal direction and are in a clearance fit in the transverse direction to achieve precise transverse positioning and avoid stress concentration.

6. The lightweight, scalable integrated processing load device according to claim 1, characterized in that, The top cover plate is provided with a crossbeam structure for binding and fixing cables; the two ends of the guide rod are provided with threads for installing nuts to fasten the stacked standardized functional boards.

7. The lightweight, scalable integrated processing load device according to claim 1, characterized in that, The internal interconnection of the device adopts HSJ2, J30J, SMA and SMP type connectors, which can realize external connection by cable; each standardized function board can be used independently as a satellite payload product with discrete functions.

8. The lightweight, scalable integrated processing load device according to claim 1, characterized in that, The high-speed flexible backplane and the low-speed flexible backplane are made of flexible materials, which absorb the dimensional deviations and structural deformations caused by vibration during the board assembly process; the heat dissipation of the device adopts bottom contact conduction.

9. A lightweight, scalable integrated processing load device according to claim 1, characterized in that, The device is powered by +42V DC voltage. After the power supply is connected to the interface board, it is distributed to other functional boards through internal power cables.

10. A lightweight, scalable integrated processing load device according to any one of claims 1 to 9, characterized in that, The device also includes side covers, which are installed on the sides of multiple stacked standardized functional boards to form a closed or semi-closed structure.

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