Lidar sensor system comprising a specific optical design

Abstract

A light detection and ranging (LIDAR) sensor system for a vehicle includes a light source that emits a light beam, a first optical component that directs the light beam emitted by the light source, an optical isolator that allows the light beam directed by the first optical component to pass in a first direction through the optical isolator and prevents light from reflecting back into the light source in a second direction through the optical isolator, a second optical component that directs the light beam after the light beam has passed through the optical isolator, an optical chip assembly that includes a plurality of chips that receive the light beam after the light beam has been directed by the second optical component and emit the light beam toward an object in an environment of the vehicle, and a receiver that receives a reflected light beam from the object.

Description

Background Technology

[0001] Light Detection and Ranging (LIDAR) systems use lasers to create a three-dimensional representation of the surrounding environment. A LIDAR system includes at least one transmitter paired with a receiver to form channels, although channel arrays can be used to expand the field of view of the LIDAR system. During operation, each channel emits a laser beam into the environment. The laser beams are reflected from objects within the environment, and the reflected beams are detected by the receiver. A single channel provides ranging information for a single point. Overall, multiple channels are combined to create a point cloud corresponding to a three-dimensional representation of the surrounding environment. Summary of the Invention

[0002] Various aspects and advantages of embodiments of this disclosure will be set forth in part in the description which follows, or may be learned from the description, or may be learned by practice of the embodiments.

[0003] Exemplary aspects of this disclosure relate to LIDAR systems. As further described herein, LIDAR systems can be used by various devices and platforms (e.g., robotic platforms, etc.) to enhance their ability to perceive their environment and perform functions in response to it (e.g., autonomous navigation within the environment).

[0004] This disclosure relates to a LIDAR system for, for example, a vehicle. In some embodiments, the LIDAR system may include a LIDAR module comprising a light source (e.g., a transmitter) configured to emit a beam of light (e.g., a laser beam). The LIDAR module may include optical elements configured to split the beam into multiple beams. The LIDAR module may also include an array of optical amplifiers configured to amplify the multiple beams to generate multiple amplified beams. For example, in some embodiments, the optical power of the amplified beams may range from 10 dB greater than the optical power of the multiple beams to 30 dB greater than the optical power of the multiple beams. The LIDAR module may also include a transceiver configured to facilitate the emission of the multiple amplified beams into the surrounding environment. The transceiver is also configured to receive return beams from the surrounding environment, which may be combined to generate point cloud data representing objects in the surrounding environment.

[0005] An integrated LIDAR system may include complex circuitry of photonic elements, which may comprise various types of semiconductor materials. Optical signals (e.g., light signals) typically propagate through the LIDAR system in a single direction via one or more waveguides, such as from a laser source to an optical element and / or from an optical element to a signal converter.

[0006] According to examples of this disclosure, the number of components constituting these circuits, the interfaces between semiconductor materials, and other components of the LIDAR system can be changed or reduced to achieve a compact size for the LIDAR system.

[0007] This disclosure provides examples of specific optical designs that can be implemented in a LIDAR system. In one exemplary embodiment, the micro-optical element assembly includes: a light source configured to emit a light beam; at least one first optical component (e.g., a collimating lens) configured to guide the light beam emitted by the light source; at least one optical isolator configured to allow the light beam guided by the at least one first optical component to pass through at least one optical isolator in a first direction and to prevent light from passing through the at least one optical isolator in a second direction and being reflected back into the light source; at least one second optical component (e.g., a collimating lens) configured to guide the light beam after it has passed through the at least one optical isolator; and an optical chip assembly configured to receive the light beam after it has been guided by the at least one second optical component.

[0008] In some implementations, the optical chip assembly includes a first chip (e.g., a semiconductor optical amplifier (SOA) chip), a second chip (e.g., a U-turn chip), and a third chip (e.g., an optical circuit chip such as a PIC chip or a PLC chip). The optical chip assembly can be configured to amplify a light beam to generate an amplified beam, split the amplified beam into multiple distributed beams, and direct the multiple distributed beams toward objects in the vehicle's environment. The SOA chip, U-turn chip, and optical circuit chip can be stacked sequentially relative to each other, with the U-turn chip located upstream and the optical circuit chip located downstream.

[0009] In some implementations, a LIDAR system may include a receiver configured to receive a reflected beam of light from an object.

[0010] Micro-optical element assemblies can include additional components based on desired functionality or space constraints. In some embodiments, a micro-optical element assembly can include one or more optical elements (e.g., prisms) configured to reflect a light beam that has passed through at least one optical isolator toward at least one second optical element at a specific angle. For example, the optical elements can be adjustable to change the specific angle at which the light beam is reflected toward at least one second optical element (e.g., the specific angle can be adjusted between 0 and 30 degrees, between 15 and 25 degrees, etc.). In some embodiments, multiple prisms can be provided. Prisms can be separate from each other or can be glued together (e.g., adhesive).

[0011] In some embodiments, the micro-optical element assembly can include a further optical circuit chip (e.g., a PIC chip or a PLC chip) disposed between at least one second optical component and the optical chip assembly. The further optical circuit chip can be configured to encode signals and split the signals into two data streams (two beams).

[0012] In some embodiments, the micro-optical element assembly can include one or more third optical components (e.g., multiple lens arrays) disposed between a further optical circuit chip and an optical chip assembly. The one or more third optical components (e.g., multiple lens arrays) can be formed of a different material than the first and second optical components. For example, the one or more third optical components can be formed of silicon, while the first and second optical components can be formed of glass. The one or more third optical components can be configured to guide the light beam after it has passed through the further optical circuit chip to focus the beam onto the optical chip assembly (e.g., a U-shaped bend chip). In some embodiments, the micro-optical element assembly can include at least one further optical isolator disposed between the further optical circuit chip and the optical chip assembly.

[0013] Micro-optical component assemblies may be disposed within or contained within a housing (e.g., at least partially formed of gold). In some embodiments, multiple first components can be provided at a first portion within the housing. The multiple first components can include a light source, at least one first optical component, at least one optical isolator, at least one second optical component, a further optical circuit chip, and at least one further optical isolator. The first portion of the housing can include a conventional ceramic or thermoelectric cooler (TEC). In some examples, the first portion of the housing can have dimensions of about 20 mm by about 10 mm. The housing may also include: (i) a machined CuW (copper-tungsten) base with notches, through holes, and laser-etched reference marks; (ii) a three-sided CuW wall with notches for electrical feedthrough; and (iii) an AlN (aluminum nitride) electrical feedthrough for DC and RF electrical signals.

[0014] In some embodiments, a plurality of second components can be provided at a first portion within the housing as an alternative. The plurality of second components can include a light source, at least one first optical component, at least one optical isolator, and at least one second optical component.

[0015] In some embodiments, a plurality of third components can be provided at a first portion within the housing as an alternative. These third components can include a light source, at least one first optical component, at least one optical isolator, and at least one second optical component, as well as a further optical circuit chip. In some embodiments, the light beam can be directed to the optical chip assembly at the same angle (e.g., about 20 degrees) as the angle at which the beam is directed to the further optical circuit chip. In some embodiments, the light beam can be directed to the optical chip assembly at a different angle (e.g., about 0 degrees) than the angle at which the beam is directed to the further optical circuit chip (e.g., about 20 degrees).

[0016] The exemplary aspects of this disclosure can provide a variety of technical effects and benefits. As an example, the exemplary aspects of this disclosure can improve the robustness of the LIDAR system and / or LIDAR system components by reducing the number of components contained in the housing. This simplifies the design of the micro-optics assembly / LIDAR system, reduces costs, and achieves similar functionality to conventional micro-optics assembly / LIDAR systems with more components. Furthermore, the disclosed micro-optics assembly can have a smaller, more compact size, thereby saving space and reducing weight.

[0017] For example, in one aspect, this disclosure provides a Light Detection and Ranging (LIDAR) sensor system for a vehicle. For instance, the LIDAR sensor system includes: a light source configured to emit a light beam; at least one first optical component configured to guide the light beam emitted by the light source; at least one optical isolator configured to allow the light beam guided by the at least one first optical component to pass through at least one optical isolator in a first direction and to prevent the light from being reflected back into the light source after passing through the at least one optical isolator in a second direction; at least one second optical component configured to guide the light beam after it has passed through the at least one optical isolator; an optical chip assembly including a plurality of chips configured to receive the light beam after it has been guided by the at least one second optical component and to direct the light beam toward an object in the vehicle's environment; and a receiver configured to receive a reflected light beam from the object.

[0018] In some embodiments, at least one first optical component includes a collimating lens.

[0019] In some embodiments, at least one second optical component includes a collimating lens.

[0020] In some embodiments, at least one second optical component is offset from at least one first optical component in a direction perpendicular to the direction in which the light beam is emitted from the light source.

[0021] In some embodiments, the LIDAR sensor system further includes at least one third optical element configured to reflect a beam of light that has passed through at least one optical isolator toward at least one second optical element at a specific angle.

[0022] In some embodiments, at least one third optical component includes at least one prism.

[0023] In some implementations, at least one third optical component is adjustable to change the specific angle at which the light beam is reflected toward at least one second optical component.

[0024] In some embodiments, the LIDAR sensor system further includes an optical circuit chip disposed between at least one second optical component and an optical chip assembly.

[0025] In some embodiments, the LIDAR sensor system further includes at least one third optical component disposed between the optical circuit chip and the optical chip assembly.

[0026] In some embodiments, at least one third optical component includes a plurality of lens arrays.

[0027] In some embodiments, the LIDAR sensor system further includes at least one additional optical isolator disposed between the optical circuit chip and the optical chip assembly.

[0028] In some implementations, the optical chip assembly is configured to amplify the light beam to generate an amplified light beam, split the amplified light beam into multiple distributed beams, and emit the multiple distributed beams toward an object.

[0029] For example, in one aspect, this disclosure provides an autonomous vehicle (AV) control system for a vehicle. For example, the AV control system includes: one or more processors; a light source configured to emit a light beam; at least one first optical component configured to guide the light beam emitted by the light source; at least one optical isolator configured to allow the light beam guided by the at least one first optical component to pass through at least one optical isolator in a first direction and to prevent the light from passing through the at least one optical isolator in a second direction and reflecting back into the light source; at least one second optical component configured to guide the light beam after it has passed through the at least one optical isolator; and an optical chip assembly comprising a plurality of chips configured to receive the light beam after it has been guided by the at least one second optical component.

[0030] In some implementations, the optical chip assembly is configured to amplify the light beam to generate an amplified light beam, split the amplified light beam into multiple distributed beams, and direct the multiple distributed beams toward objects in the vehicle's environment.

[0031] In some embodiments, at least one first optical component includes a collimating lens, and at least one second optical component includes a collimating lens.

[0032] In some embodiments, the AV control system further includes at least one third optical component configured to reflect a beam of light that has passed through at least one optical isolator toward at least one second optical component at a specific angle.

[0033] In some embodiments, the AV control system further includes an optical circuit chip disposed between at least one second optical component and an optical chip assembly.

[0034] For example, in one aspect, this disclosure provides an autonomous vehicle. For example, the autonomous vehicle includes: an autonomous vehicle control system, the autonomous vehicle control system including one or more processors and a LIDAR sensor system, the LIDAR sensor system including: a micro-optical element assembly including: a light source configured to emit a light beam; at least one first optical component configured to guide the light beam emitted by the light source; at least one optical isolator configured to allow the light beam guided by the at least one first optical component to pass through at least one optical isolator in a first direction and prevent the light from being reflected back into the light source in a second direction; at least one second optical component configured to guide the light beam after it has passed through the at least one optical isolator; an optical chip assembly including a plurality of chips configured to receive the light beam after it has been guided by the at least one second optical component and to emit the light beam toward an object in the vehicle's environment; and an autonomous vehicle controller configured to receive a reflected light beam from an object and determine an object detection associated with the object; and an autonomous vehicle controller configured to control the autonomous vehicle based on the object detection associated with the object.

[0035] In some implementations, the optical chip assembly is configured to amplify the light beam to generate an amplified light beam, split the amplified light beam into multiple distributed beams, and emit the multiple distributed beams toward an object.

[0036] In some embodiments, the micro-optical element assembly includes an optical circuit chip disposed between at least one second optical component and an optical chip assembly.

[0037] For example, in one aspect, this disclosure provides a Light Detection and Ranging (LIDAR) sensor system for a vehicle. For example, the LIDAR sensor system includes: a housing defining a cavity having a length defined along a first axis and a width defined along a second axis different from the first axis; a first mounting base located at a first portion of the housing within the cavity; a second mounting base located at a second portion of the housing within the cavity; and a micro-optical element assembly including a first portion disposed on the first mounting base and a second portion disposed on the second mounting base, wherein: the first portion of the micro-optical element assembly includes: a light source configured to emit a light beam; at least one first optical component configured to guide the light beam emitted by the light source; at least one optical isolator configured to allow the light beam guided by the at least one first optical component to pass through at least one optical isolator in a first direction and prevent light from being reflected back into the light source after passing through the at least one optical isolator in a second direction; and at least one second optical component configured to guide the light beam after it has passed through the at least one optical isolator; and the second portion of the micro-optical element assembly includes: an optical chip assembly comprising a plurality of chips configured to receive the light beam after it has been guided by the at least one second optical component.

[0038] In some implementations, the length of the first mounting base is greater than the width of the first mounting base.

[0039] In some embodiments, the length of the first mounting base ranges from about 15 mm to about 30 mm.

[0040] In some embodiments, the width of the first mounting base ranges from about 5 mm to about 10 mm.

[0041] In some embodiments, the first mounting base includes a ceramic substrate or a thermoelectric cooler substrate.

[0042] In some embodiments, the first portion of the micro-optical element assembly further includes at least one third optical element configured to reflect a light beam that has passed through at least one optical isolator toward at least one second optical element at a specific angle.

[0043] In some embodiments, at least one third optical component includes a 90-degree prism having two vertical surfaces forming a 90-degree angle.

[0044] In some implementations, at least one third optical component is adjustable to change the specific angle at which the light beam is reflected toward at least one second optical component.

[0045] In some implementations, at least one third optical component is adjustable to change a specific angle between about 0 degrees and about 30 degrees.

[0046] In some embodiments, the first portion of the micro-optical element assembly further includes: an optical circuit chip disposed between at least one second optical component and the optical chip assembly; and at least one fourth optical component disposed between the optical circuit chip and the optical chip assembly.

[0047] In some embodiments, the optical circuit chip includes a photonic integrated circuit chip or a programmable logic controller, and at least one fourth optical component includes a lens array.

[0048] In some embodiments, the first portion of the micro-optical element assembly further includes: an optical circuit chip disposed between at least one second optical component and an optical chip assembly; and at least one third optical component disposed between the optical circuit chip and the optical chip assembly.

[0049] In some embodiments, the optical circuit chip includes a photonic integrated circuit chip or a programmable logic controller, and at least one third optical component includes a lens array.

[0050] In some embodiments, the optical circuit chip is configured to receive the light beam after the light beam has been guided by at least one second optical component, and is further configured to split the light beam into multiple beams, with the axis along which the light beams are emitted from the light source deviating from the respective axes along which the multiple beams are emitted from the optical circuit chip.

[0051] In some embodiments, the second mounting base is wider than the first mounting base, and the length of the first mounting base is greater than that of the second mounting base.

[0052] In some embodiments, the first mounting base is spaced about 2 mm to about 4 mm from the second mounting base along the length direction of the first mounting base.

[0053] In some embodiments, the second portion of the micro-optical element assembly further includes at least one third optical element disposed between at least one second optical element and the optical chip assembly, wherein at least one first optical element and at least one second optical element both include collimating lenses formed of a first material, and at least one third optical element includes a lens array formed of a second material different from the first material.

[0054] In some implementations, the optical chip assembly is configured to amplify the light beam to generate an amplified light beam, split the amplified light beam into multiple distributed beams, and emit the multiple distributed beams toward an object.

[0055] For example, in one aspect, this disclosure provides an autonomous vehicle control system for a vehicle. For example, an autonomous vehicle control system includes: one or more processors; and a Light Detection and Ranging (LIDAR) system, the LIDAR system including: a housing defining a cavity having a length defined along a first axis and a width defined along a second axis different from the first axis; a first mounting base located at a first portion of the housing within the cavity; a second mounting base located at a second portion of the housing within the cavity; and a micro-optical element assembly including a first portion of the micro-optical element assembly disposed on the first mounting base and a second portion of the micro-optical element assembly disposed on the second mounting base, wherein: the first portion of the micro-optical element assembly includes: a light source configured to emit a light beam; at least one first optical component configured to guide the light beam emitted by the light source; at least one optical isolator configured to allow the light beam guided by the at least one first optical component to pass through at least one optical isolator in a first direction and prevent the light from being reflected back into the light source through the at least one optical isolator in a second direction; and at least one second optical component configured to guide the light beam after the light beam has passed through the at least one optical isolator; and the second portion of the micro-optical element assembly includes: an optical chip assembly including a plurality of chips configured to receive the light beam after the light beam has been guided by the at least one second optical component.

[0056] For example, in one aspect, this disclosure provides an autonomous vehicle. For example, the autonomous vehicle includes: an autonomous vehicle control system, the autonomous vehicle control system including one or more processors and a Light Detection and Ranging (LIDAR) system, the LIDAR system including: a housing defining a cavity having a length defined along a first axis and a width defined along a second axis different from the first axis; a first mounting seat located at a first portion of the housing within the cavity; a second mounting seat located at a second portion of the housing within the cavity; and a micro-optical element assembly, the micro-optical element assembly including a first portion of the micro-optical element assembly disposed on the first mounting seat and a second portion of the micro-optical element assembly disposed on the second mounting seat, wherein: the micro-optical element assembly The first part includes: a light source configured to emit a light beam; at least one first optical component configured to guide the light beam emitted by the light source; at least one optical isolator configured to allow the light beam guided by the at least one first optical component to pass through at least one optical isolator in a first direction and to prevent the light from passing through the at least one optical isolator in a second direction and being reflected back into the light source; and at least one second optical component configured to guide the light beam after it has passed through the at least one optical isolator. The second part of the micro-optical element assembly includes: an optical chip assembly comprising a plurality of chips configured to receive the light beam after it has been guided by the at least one second optical component.

[0057] Other exemplary aspects of this disclosure relate to other systems, methods, vehicles, apparatuses, tangible non-transitory computer-readable media, and devices for motion prediction and / or operation of LIDAR systems including LIDAR modules having exemplary aspects of this disclosure.

[0058] These and other features, aspects, and advantages of the various embodiments of this disclosure will become better understood with reference to the following description and the appended claims. The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the disclosure and, together with the specification, serve to explain the relevant principles. Attached Figure Description

[0059] Figure 1 A block diagram of an exemplary system according to some embodiments of the present disclosure is described.

[0060] Figure 2 A block diagram of an exemplary LIDAR system according to some embodiments of the present disclosure is described.

[0061] Figures 3A to 3C Exemplary micro-optical element assemblies for a LIDAR system are depicted according to some embodiments of the present disclosure.

[0062] Figures 4A to 4E Exemplary structural configurations of micro-optical element assemblies according to some embodiments of the present disclosure are depicted.

[0063] Figure 5A An exemplary plan view of a housing for a micro-optical element assembly according to some embodiments of the present disclosure is depicted.

[0064] Figure 5B An exemplary perspective view of a housing for a micro-optical element assembly according to some embodiments of the present disclosure is depicted.

[0065] Figure 6A Exemplary optical components of micro-optical element assemblies that can be mounted in a housing according to some embodiments of the present disclosure are depicted.

[0066] Figure 6B A perspective view of an optical component of a micro-optical element assembly capable of being mounted in a housing, according to some embodiments of the present disclosure, is depicted.

[0067] Figures 7A to 7C Exemplary optical components of a micro-optical element assembly disposed in a housing according to some embodiments of the present disclosure are depicted. Detailed Implementation

[0068] The techniques disclosed herein are described below for illustrative purposes only in the context of autonomous vehicles. As described herein, the techniques are not limited to autonomous vehicles and can be implemented in other robots and computing systems as well as various devices. For example, the LIDAR system and methods disclosed herein can be implemented in various ways, including but not limited to computer-implemented methods, autonomous vehicle systems, autonomous vehicle control systems, robot platform systems, general-purpose robot equipment control systems, computing devices, etc.

[0069] Reference Figures 1 to 7C Exemplary embodiments of this disclosure will be discussed in further detail. Figure 1 A block diagram of an example autonomous vehicle control system 100 according to some embodiments of the present disclosure is depicted. The autonomous vehicle control system 100 can be implemented by the autonomous vehicle's computing system. The autonomous vehicle control system 100 can include one or more sub-control systems 101 that operate to acquire input from sensors 102 or other input devices of the autonomous vehicle control system 100. In some embodiments, the sub-control system 101 can additionally acquire platform data 108 (e.g., map data 110) from local or remote memory. The sub-control system 101 can generate control outputs for controlling the autonomous vehicle (e.g., via platform control device 112, etc.) based on sensor data 104, map data 110, or other data. The sub-control system 101 can include different subsystems to perform various autonomous operations. These subsystems can include a positioning system 130, a perception system 140, a planning system 150, and a control system 160. The positioning system 130 determines the location of the autonomous vehicle in its environment; the perception system 140 detects, classifies, and tracks objects and participants in the environment; the planning system 150 determines the trajectory of the autonomous vehicle; and the control system 160 converts the trajectory into vehicle controls for controlling the autonomous vehicle. The sub-control system 101 can be implemented by one or more onboard computing systems. Each subsystem can include one or more processors and one or more storage devices. The one or more storage devices can store instructions executable by the one or more processors to cause the one or more processors to perform operations or functions associated with the subsystem. The computing resources of the sub-control system 101 can be shared among its subsystems, or each subsystem can have a dedicated set of computing resources.

[0070] In some embodiments, the autonomous vehicle control system 100 can be implemented for or by an autonomous vehicle (e.g., a ground-based autonomous vehicle). The autonomous vehicle control system 100 is capable of performing various processing techniques on inputs (e.g., sensor data 104, map data 110) to perceive and understand the vehicle's surroundings and generate a set of appropriate control outputs to execute a vehicle motion plan (e.g., including one or more trajectories) for traversing the vehicle's surroundings. In some embodiments, the autonomous vehicle implementing the autonomous vehicle control system 100 is able to drive, navigate, operate, etc., with little or no human operator (e.g., driver, pilot, etc.) interaction.

[0071] In some implementations, the autonomous vehicle can be configured to operate in multiple operating modes. For example, the autonomous vehicle can be configured to operate in a fully automatic (e.g., driverless, etc.) operating mode, in which the autonomous platform can be controlled without user input (e.g., driving and navigation without input from a human operator present in or remotely operating the autonomous vehicle). The autonomous vehicle can operate in a semi-automatic operating mode, in which it can operate with some input from a human operator present in or remotely operating the autonomous platform. In some implementations, the autonomous vehicle can enter a manual operating mode, in which the autonomous vehicle is entirely controlled by a human operator (e.g., a human driver, etc.) and autonomous navigation (e.g., autonomous, etc.) may be prohibited or disabled (e.g., temporarily, permanently, etc.). The autonomous vehicle can be configured to operate in other modes, such as parking or sleep modes (e.g., between tasks such as waiting for a trip / service, charging, etc.). In some implementations, the autonomous vehicle can implement vehicle operation assistance technologies (e.g., collision mitigation systems, power-assisted steering, etc.), for example, to assist the human operator of the autonomous platform (e.g., during manual mode, etc.).

[0072] The autonomous vehicle control system 100 can be located on (e.g., on or inside) an autonomous vehicle and can be configured to operate the autonomous vehicle in various environments. The environment can be a real-world environment or a simulated environment. In some embodiments, one or more simulation computing devices can simulate one or more of the following: sensor 102, sensor data 104, communication interface 106, platform data 108, or platform control device 112, for simulating the operation of the autonomous vehicle control system 100.

[0073] In some embodiments, the sub-control system 101 is capable of communicating with one or more networks or other systems having a communication interface 106. The communication interface 106 may include any suitable component for interfacing with one or more networks, including, for example, a transmitter, receiver, port, controller, antenna, or other suitable component that can help facilitate communication. In some embodiments, the communication interface 106 may include multiple components (e.g., antenna, transmitter, or receiver, etc.) that allow it to implement and utilize various communication technologies (e.g., multiple-input multiple-output (MIMO) technology, etc.).

[0074] In some implementations, the sub-control system 101 can communicate with one or more computing devices remote from the autonomous vehicle via one or more networks using the communication interface 106. For example, in some examples, one or more inputs, data, or functions of the sub-control system 101 can be supplemented or replaced by a remote system communicating via the communication interface 106. For example, in some implementations, map data 110 can be downloaded to a remote system via a network using the communication interface 106. In some examples, one or more of the positioning system 130, sensing system 140, planning system 150, or control system 160 can be updated, influenced, prompted, communicated, etc., by the remote system for assistance, maintenance, situational response coverage, management, etc.

[0075] Sensor 102 can be located on an autonomous platform. In some embodiments, sensor 102 can include one or more types of sensors. For example, one or more sensors can include image capture devices (e.g., visible spectrum cameras, infrared cameras, etc.). Additionally or alternatively, sensor 102 can include one or more depth capture devices. For example, sensor 102 can include one or more LiDAR sensors or Radio Sounding and Ranging (RADAR) sensors. Sensor 102 can be configured to generate point data describing at least a portion of a 360-degree view of the surrounding environment. The point data can be point cloud data (e.g., 3D LiDAR point cloud data, RADAR point cloud data). In some embodiments, one or more sensors 102 for capturing depth information can be fixed to a rotating device to rotate the sensor 102 about an axis. While rotating about this axis, sensor 102 can capture data in the form of spaced sector packets describing different portions of a 360-degree view of the environment surrounding the autonomous platform. In some embodiments, one or more sensors 102 for capturing depth information can be solid-state.

[0076] Sensor 102 can be configured to capture sensor data 104 that indicates or otherwise correlates with at least a portion of the autonomous vehicle's environment. Sensor data 104 can include image data (e.g., 2D camera data, video data, etc.), RADAR data, LIDAR data (e.g., 3D point cloud data, etc.), audio data, or other types of data. In some embodiments, sub-control system 101 can acquire input from other types of sensors, such as inertial measurement units (IMUs), altimeters, inclinometers, odometers, position or positioning devices (e.g., GPS, compasses), wheel encoders, or other types of sensors. In some embodiments, sub-control system 101 can acquire sensor data 104 associated with specific components or systems of the autonomous vehicle. Sensor data 104 can indicate, for example, wheel speed, component temperature, steering angle, cargo or passenger status, etc. In some embodiments, sub-control system 101 can acquire sensor data 104 associated with environmental conditions (such as natural environment or weather conditions). In some embodiments, sensor data 104 can include multimodal sensor data. Multimodal sensor data can be acquired by at least two different types of sensors (e.g., sensor 102) and can indicate static and / or dynamic objects or participants within the autonomous vehicle's environment. The multimodal sensor data can include at least two types of sensor data (e.g., camera and LiDAR data). In some embodiments, the autonomous vehicle can utilize sensor data 104 from sensors located remotely (e.g., outside the vehicle). This can include, for example, sensor data 104 captured by different autonomous vehicles.

[0077] The sub-control system 101 is capable of acquiring map data 110 associated with the environment in which the autonomous vehicle has been, is, or will be located. Map data 110 can provide information about the environment or geographic area. For example, map data 110 can provide information about the identification and location of different access roads (e.g., roads), access road segments (e.g., road sections), buildings or other items or objects (e.g., lampposts, crosswalks, curbs, etc.); the location and direction of boundaries or boundary markers (e.g., traffic lanes, parking lanes, turning lanes, bicycle lanes, other lanes, etc.); traffic control data (e.g., the location and indication of signs, traffic lights, other traffic control equipment, etc.); obstacle information (e.g., temporary or permanent closures, etc.); event data (e.g., road closures / traffic rule changes due to parades, concerts, sporting events, etc.); nominal vehicle path data (e.g., indicating an ideal vehicle path, such as along the center of a lane, etc.); or any other map data that provides information that helps the autonomous vehicle understand its surrounding environment and its relationships. In some embodiments, map data 110 can include high-precision map information. Additionally or alternatively, map data 110 may include sparse map data (e.g., lane maps). In some implementations, sensor data 104 may be fused with map data 110 or used to update map data 110 in real time.

[0078] The sub-control system 101 may include a positioning system 130, which provides the autonomous vehicle with an understanding of its position and orientation in the environment. In some examples, the positioning system 130 may support one or more other subsystems of the sub-control system 101, such as by providing a unified local reference frame for performing operations such as sensing, planning, or control.

[0079] In some implementations, positioning system 130 is capable of determining the current location of the autonomous vehicle. The current location can include a global location (e.g., relative to a geographic reference anchor) or a relative location (e.g., relative to objects in the environment). Positioning system 130 can typically include, or interface with, any device or circuitry used to analyze the autonomous vehicle's location or changes in location. For example, positioning system 130 can determine location using one or more of the following: inertial sensors (e.g., inertial measurement units, etc.), satellite positioning systems, radio receivers, network devices (e.g., based on IP addresses, etc.), triangulation or proximity to network access points or other network components (e.g., cell towers, Wi-Fi access points, etc.), or other suitable technologies. The autonomous vehicle's location can be used by various subsystems of subcontrol system 101 or provided to a remote computing system (e.g., using communication interface 106).

[0080] In some implementations, the positioning system 130 is capable of registering the relative positions of environmental elements surrounding the autonomous vehicle with positions recorded in map data 110. For example, the positioning system 130 can process sensor data 104 (e.g., LiDAR data, RADAR data, camera data, etc.) to align or otherwise register to a map of the surrounding environment (e.g., from map data 110) to understand the autonomous vehicle's position within that environment. Therefore, in some implementations, the autonomous vehicle can identify its position in the surrounding environment (e.g., across six axes, etc.) based on a search of map data 110. In some implementations, given an initial position, the positioning system 130 can update the autonomous vehicle's position through incremental realignment based on a recorded or estimated deviation from the initial position. In some implementations, the position can be directly registered in map data 110.

[0081] In some implementations, map data 110 can include a large amount of data subdivided into geographic tiles, enabling the reconstruction of a desired area of ​​a map stored in map data 110 from one or more tiles. For example, multiple tiles selected from map data 110 can be stitched together by sub-control system 101 based on a location obtained by positioning system 130 (e.g., a number of tiles selected near the location).

[0082] In some implementations, the positioning system 130 is capable of determining the location (e.g., relative or absolute) of one or more attachments or accessories to the autonomous vehicle. For example, the autonomous vehicle may be associated with a cargo platform, and the positioning system 130 may provide the location of one or more points on the cargo platform. For example, the cargo platform may include trailers or other equipment towed or otherwise attached to or manipulated by the autonomous vehicle, and the positioning system 130 may provide data describing the location (e.g., absolute, relative, etc.) of the autonomous vehicle and the cargo platform. Other autonomous systems may acquire such information to assist in operating the autonomous vehicle.

[0083] The sub-control system 101 may include a sensing system 140 that allows the autonomous platform to detect, classify, and track objects and participants in its environment. The environmental features or objects sensed in the environment may be those located within the field of view of sensor 102, or those predicted to be occluded by sensor 102. This may include objects that are not moving or are predicted not to move (static objects) or objects that are moving or are predicted to be moving (dynamic objects / participants).

[0084] The perception system 140 is capable of determining one or more states (e.g., current or past states, etc.) of one or more objects in the environment surrounding the autonomous vehicle. For example, a state can describe (e.g., for a given time, time period, etc.) an estimate of the object's current or past location (also called localization); current or past speed / rate; current or past acceleration; current or past heading; current or past orientation; size / footprint (e.g., represented by boundary shape, object highlighting, etc.); classification (e.g., pedestrian category vs. vehicle category vs. bicycle category, etc.); associated uncertainties; or other state information. In some embodiments, the perception system 140 is capable of using one or more algorithms or machine learning models configured to identify / classify objects based on input from sensor 102 to determine the state. The perception system is capable of using sensor data 104 in different modes to generate a representation of the environment for processing by one or more algorithms or machine learning models. In some embodiments, as the autonomous vehicle continues to perceive or interact with these objects (e.g., maneuvering with or around them, yielding, etc.), the state of one or more identified or unidentified objects can be maintained and updated over time. In this way, the perception system 140 is able to provide an understanding of the current state of the environment (e.g., including objects therein) based on previous state records of the environment (e.g., including the movement history of objects therein). This information is helpful when the autonomous vehicle plans its movement in the environment.

[0085] The sub-control system 101 may include a planning system 150, which can be configured to determine how the autonomous platform interacts with and moves within its environment. The planning system 150 can determine one or more motion plans for the autonomous platform. The motion plan may include one or more trajectories (e.g., motion trajectories) indicating the path the autonomous vehicle should follow. The trajectory may have a certain length or time range. The length or time range may be defined by a calculated planning horizon of the planning system 150. The motion trajectory may be defined by one or more waypoints (with associated coordinates). Waypoints may be the future locations of the autonomous platform. The motion plan can be continuously generated, updated, and considered by the planning system 150.

[0086] The planning system 150 is capable of determining the strategy of the autonomous platform. The strategy can be a set of discrete decisions made by the autonomous platform (e.g., yielding to a participant, yielding to a participant in reverse, merging, changing lanes). The strategy can be selected from multiple potential strategies. The selected strategy can be the lowest-cost strategy, as determined by one or more cost functions. The cost function can, for example, evaluate the probability of a collision with another participant or object.

[0087] Planning system 150 is capable of determining the desired trajectory for executing a strategy. For example, planning system 150 can obtain one or more trajectories for executing one or more strategies. Planning system 150 can evaluate trajectories or strategies (e.g., using scores, costs, rewards, constraints, etc.) and rank them. For example, planning system 150 can inform the evaluation of candidate trajectories or strategies for the autonomous platform using predicted outputs indicating interactions between the autonomous platform's trajectory and one or more objects (e.g., proximity, intersection, etc.). In some implementations, planning system 150 can evaluate the autonomous platform's trajectory using static costs (e.g., "avoiding lane boundaries," "minimizing sprints," etc.). Additionally or alternatively, planning system 150 can evaluate the autonomous platform's trajectory or strategy using dynamic costs based on predictions of the current operating scenario (e.g., predicted trajectories or strategies leading to interactions between participants, predicted trajectories or strategies leading to interactions between participants and the autonomous platform, etc.). Planning system 150 can rank trajectories based on one or more static costs, one or more dynamic costs, or a combination thereof. The planning system 150 is able to select a motion plan (and corresponding trajectory) based on the ranking of multiple candidate trajectories. In some implementations, the planning system 150 is able to select the highest-ranked candidate, or the highest-ranked feasible candidate.

[0088] The planning system 150 can then validate the selected trajectory against one or more constraints before the trajectory is executed by the autonomous platform.

[0089] To assist its motion planning decisions, the planning system 150 can be configured to perform predictive functions. The planning system 150 can predict the future state of the environment. This can include predicting the future states of other participants in the environment. In some embodiments, the planning system 150 can predict the future state based on the current or past state (e.g., the state in which the perception system 140 was developed or maintained). In some embodiments, the future state can be a predicted trajectory (e.g., position over time) of an object in the environment (such as other participants) or include that predicted trajectory. In some embodiments, one or more future states can include one or more probabilities associated with them (e.g., marginal probabilities, conditional probabilities). For example, one or more probabilities can include one or more probabilities conditioned on the strategies or trajectory options available to the autonomous vehicle. Additionally or alternatively, probabilities can include probabilities conditioned on the trajectory options available to one or more other participants.

[0090] To execute the selected motion plan, the sub-control system 101 may include a control system 160 (e.g., a vehicle control system). Typically, the control system 160 provides an interface between the sub-control system 101 and the platform control device 112 to implement the strategies and motion plans generated by the planning system 150. For example, the control system 160 can implement the selected motion plan / trajectory to control the movement of the autonomous platform in its environment by following the selected trajectory (e.g., waypoints included). The control system 160 can, for example, translate the motion plan into instructions (e.g., acceleration control, braking control, steering control, etc.) for the corresponding platform control device 112. For instance, the control system 160 can translate the selected motion plan into instructions to adjust steering components (e.g., steering angle) by a certain degree, apply a certain amount of braking force, increase / decrease speed, etc. In some embodiments, the control system 160 can communicate with the platform control device 112 via a communication channel, which may include, for example, one or more data buses (e.g., Controller Area Network (CAN), on-board diagnostic connectors (e.g., OBD-II), or a combination of wired / wireless communication links. The platform control device 112 can send or receive data, messages, signals, etc. to or from the sub-control system 101 via a communication channel (and vice versa).

[0091] The sub-control system 101 can receive auxiliary signals from the remote assistance system 170 via communication interface 106. The remote assistance system 170 can communicate with the sub-control system 101 via a network. In some embodiments, the sub-control system 101 can initiate a communication session with the remote assistance system 170. For example, the sub-control system 101 can initiate a session based on or in response to a trigger. In some embodiments, the trigger can be an alarm, error signal, map feature, request, location, traffic conditions, road conditions, etc.

[0092] After initiating a session, the sub-control system 101 can provide context data to the remote assistance system 170. Context data can include sensor data 104 and state data of the autonomous vehicle. For example, context data can include real-time camera feedback from the autonomous vehicle's cameras and the current speed of the autonomous vehicle. The operator of the remote assistance system 170 (e.g., a human operator) can use the context data to select assistance signals. Assistance signals can provide the sub-control system 101 with values ​​or adjustments to various operating parameters or characteristics. For example, assistance signals can include waypoints (e.g., paths around obstacles, lane changes, etc.), speed or acceleration profiles (e.g., speed limits, etc.), relative motion commands (e.g., platooning, etc.), operating characteristics (e.g., using assistance systems, energy-saving processing modes, etc.), or other signals assisting the sub-control system 101.

[0093] The sub-control system 101 can use auxiliary signals as input to one or more autonomous subsystems performing autonomous functions. For example, the planning system 150 can receive auxiliary signals as input for generating a motion plan. For example, the auxiliary signals can include constraints for generating the motion plan. Additionally or alternatively, the auxiliary signals can include cost or reward adjustments that affect the motion planning of the planning system 150. Additionally or alternatively, the auxiliary signals can be considered by the sub-control system 101 as suggestive inputs to be considered together with other received data (e.g., sensor inputs, etc.).

[0094] The sub-control system 101 can be platform-independent, and the control system 160 can provide control commands to the platform control device 112 for various autonomous mobile platforms (e.g., multiple different autonomous platforms equipped with autonomous control systems). This can include various types of autonomous vehicles from different manufacturers / developers (e.g., cars, vans, SUVs, trucks, electric vehicles, gasoline vehicles, etc.), which operate in various environments and, in some implementations, perform one or more vehicle services.

[0095] Figure 2 This is a block diagram of an example environment for a LiDAR sensor system for autonomous vehicles according to some embodiments. The environment includes a LiDAR sensor system 200, which includes a transmit (Tx) path and a receive (Rx) path. The Tx path includes one or more Tx input / output ports, while the Rx path includes one or more Rx input / output ports. In some embodiments, a semiconductor substrate and / or semiconductor package may include the Tx path and the Rx path. In some embodiments, the semiconductor substrate and / or semiconductor package can include at least one of silicon photonics circuitry, a programmable logic controller (PLC), or a group III-V semiconductor circuit.

[0096] In some implementations, the first semiconductor substrate and / or the first semiconductor package may include a Tx path, while the second semiconductor substrate and / or the second semiconductor package may be able to include an Rx path. In some arrangements, Rx input / output ports and / or Tx input / output ports may appear (or be formed / set / positioned / placed) on one or more edges of one or more semiconductor substrates and / or semiconductor packages.

[0097] The LIDAR sensor system 200 includes one or more transmitters 220 and one or more receivers 222. The LIDAR sensor system 200 further includes one or more optical elements 210 (e.g., oscillating scanners, unidirectional scanners, Risley prisms, circulator optics, and / or beam collimators, etc.) coupled to the LIDAR sensor system 200 (e.g., transmitters 220 and / or receivers 222). In some embodiments, one or more optical elements 210 may be coupled to a Tx path via one or more Tx input / output ports. In some embodiments, one or more optical elements 210 may be coupled to an Rx path via one or more Rx input / output ports.

[0098] The LIDAR sensor system 200 can be coupled to one or more sub-control systems 101 (e.g., Figure 1 (Sub-control system 101 in the system). In some embodiments, sub-control system 101 may be coupled to the Rx path via one or more Rx input / output ports. For example, sub-control system 101 may be able to receive LIDAR output from LIDAR sensor system 200. Sub-control system 101 may be able to control the vehicle (e.g., autonomous vehicle) based on the LIDAR output.

[0099] The Tx path may include a light source 202, modulator 204A, modulator 204B, amplifier 206, and one or more transmitters 220. The Rx path may include one or more receivers 222, mixer 208, detector 212, transimpedance amplifier (TIA) 214, and one or more analog-to-digital converters (ADCs). Although Figure 2 Only a specific number of components and a single input / output channel are shown, but the LIDAR sensor system 200 can contain any number of components and / or input / output channels (in any combination) interconnected in any configuration to facilitate the integration of multiple functions of the LIDAR system to support vehicle operation.

[0100] The light source 202 can be configured to generate an optical signal (or beam) originating from (or associated with) a local oscillator (LO) signal. In some embodiments, the optical signal may have an operating wavelength equal to or substantially equal to 1550 nanometers. In some embodiments, the optical signal may have an operating wavelength between 1400 nanometers and 1440 nanometers.

[0101] Light source 202 can be configured to provide an optical signal to modulator 204A, which is configured to modulate the phase and / or frequency of the optical signal based on a first radio frequency (RF) signal (e.g., "RF1" signal) to generate a modulated optical signal, such as by continuous wave (CW) modulation or quasi-CW modulation. Modulator 204A can be configured to send the modulated optical signal to amplifier 206. Amplifier 206 can be configured to amplify the modulated optical signal to generate an amplified optical signal to be provided to optical element 210 via one or more transmitters 220. One or more transmitters 220 may include one or more optical waveguides or antennas. In some embodiments, the bandwidth of modulator 204A and / or modulator 204B may be between 400 MHz and 1000 MHz.

[0102] Optical element 210 can be configured to redirect the amplified optical signal received from the Tx path toward the object 218 within a given field of view, receive the return signal reflected from the object 218, and provide the return signal to mixer 208 of the Rx path via one or more receivers 222. The one or more receivers 222 may include one or more optical waveguides or antennas. In some arrangements, transmitter 220 and receiver 222 may together constitute one or more transceivers. In some arrangements, the one or more transceivers may include single-base transceivers or dual-base transceivers.

[0103] Light source 202 can be configured to provide an LO signal to modulator 204B, which is configured to modulate the phase and / or frequency of the LO signal based on a second RF signal (e.g., the "RF2" signal) to generate a modulated LO signal (e.g., using continuous wave (CW) modulation or quasi-CW modulation), and send the modulated LO signal to mixer 208 in the Rx path. Mixer 208 can be configured to mix the modulated LO signal with a return signal (e.g., combine, multiply, etc.) to generate a down-converted signal and send it to detector 212.

[0104] In some arrangements, mixer 208 may be configured to send a modulated LO signal to detector 212. Detector 212 may be configured to generate an electrical signal based on the down-converted signal and send the electrical signal to TIA 214. In some arrangements, detector 212 may be configured to generate an electrical signal based on the down-converted signal and the modulated signal. TIA 214 may be configured to amplify the electrical signal and send the amplified electrical signal to sub-control system 101 via one or more ADCs 224. In some embodiments, TIA 214 may have a peak noise equivalent power (NEP) of less than 5 picowatts per square root hertz (i.e., 5 x 10⁻¹² watts per square root hertz). In some embodiments, the gain of TIA 214 may be between 4 kiloohms and 25 kiloohms. In some embodiments, the 3 dB bandwidth of detector 212 and / or TIA 214 may be between 80 kilohertz (kHz) and 450 megahertz (MHz).

[0105] The sub-control system 101 can be configured to determine the distance to the object 218 and / or measure the speed of the object 218 based on one or more electrical signals received from the TIA via one or more ADCs 224.

[0106] Figures 3A to 3C Exemplary micro-optical element assemblies for a LIDAR system are depicted according to some embodiments of the present disclosure.

[0107] Figure 3A Exemplary micro-optical element assemblies for a LIDAR system are depicted according to exemplary embodiments of the present disclosure. Figure 3A In this context, the micro-optical element assembly 300 includes a light source 310, a first optical component 320, an optical isolator 330, a second optical component 340, and an optical chip assembly 350. The micro-optical element assembly 300 can be implemented in a LiDAR system and may include... Figure 2 Various components within.

[0108] For example, light source 310 may correspond to light source 202. Light source 310 may be configured to generate an optical signal (or beam) derived from (or associated with) a local oscillator (LO) signal. In some embodiments, the operating wavelength of the optical signal may be equal to or approximately equal to about 1550 nanometers. In some embodiments, the operating wavelength of the optical signal may be between about 1400 nanometers and about 1600 nanometers. Light source 310 may be configured to emit a beam comprising multiple rays.

[0109] The first optical component 320 may be configured to receive a light beam emitted from the light source 310. The first optical component 320 may include a lens, such as a collimating lens. In some embodiments, the first optical component may include one or more optical components, including an oscillating scanner, a one-way scanner, a Risley prism, a circulating optical element, and / or a beam collimator, etc.

[0110] The first optical component 320 can be configured to guide a light beam received from the light source 310. For example, the shape and positioning of the first optical component 320 can cause it to refract (bend) the incident light beam in a specific manner. The first optical component 320 can be configured to guide the light rays within the light beam to be parallel to each other.

[0111] Optical isolator 330 can be configured to receive a guided light beam output (transmitted) to optical isolator 330 by first optical component 320. Optical isolator 330 can be configured to allow the light beam guided by first optical component 320 to pass through optical isolator 330 in a first direction and prevent the light from passing through optical isolator 330 in a second direction (e.g., opposite to the first direction) and being reflected back into light source 310.

[0112] Optical isolator 330 may include one or more tunable or active components, such as, for example, phase modulators, frequency modulators, etc. Optical isolator 330 may be controlled by one or more control signals (e.g., via control signal lines) to modify the signal propagating through optical isolator 330.

[0113] The second optical component 340 can be configured to guide the light beam after it has passed through the optical isolator 330. Similar to the first optical component 320, the second optical component 340 may include a lens, such as a collimating lens. In some embodiments, the first optical component may include one or more optical components, including an oscillating scanner, a one-way scanner, a Risley prism, a circulating optics element, and / or a beam collimator, etc.

[0114] In some embodiments, the second optical element 340 may be configured to guide the light beam received from the optical isolator 330. For example, the shape and positioning of the second optical element 340 may cause it to refract (bend) the incident light beam in a particular manner. The second optical element 340 may be configured to guide the light rays within the light beam to be parallel to each other.

[0115] The optical chip assembly 350 can be configured to receive a guided light beam output (transmitted) to the optical chip assembly 350 by the second optical component 340. In some embodiments, the optical chip assembly 350 includes a plurality of chips configured to receive the light beam after it has been guided by the second optical component 340. In some embodiments, the optical chip assembly 350 can be configured to direct the light beam toward objects in the vehicle's environment (e.g., Figure 2 The object 218 in the middle) is emitted. For example, the receiver (e.g., Figure 2 The receiver 222 in the middle can be configured to receive a reflected beam of light from the object.

[0116] In some embodiments, the plurality of chips included in the optical chip assembly 350 may include two or more chips (e.g., three chips) stacked together in a sequential arrangement. For example, the optical chip assembly may include a semiconductor optical amplifier (SOA) chip, a U-turn chip, an optical circuit chip (e.g., a photonic integrated circuit chip or a programmable logic controller), etc. In some embodiments, one or more chips in the optical chip assembly (e.g., U-turn chip 352 and second optical circuit chip 356) may be or include silicon photonic dies. Other chips (e.g., SOA chip 354) may be or include III-V semiconductor dies. III-V semiconductor dies may include III-V semiconductor materials, such as indium phosphide (InP), gallium arsenide (GaAs), indium arsenide (InAs), gallium nitride (GaN), or indium antimonide (InSb). III-V semiconductors are based on elements in groups III and V of the periodic table. The possibility of growing III-V alloy thin films with different proportions of constituent elements allows for precise engineering design of optical properties. Furthermore, since many III-V compounds are direct bandgap semiconductors, they may be suitable for developing photonic devices and integrated circuits for optical systems such as LiDAR systems. These exemplary chips will be described in more detail herein. In some embodiments, the optical chip assembly 350 may be configured to amplify a light beam to generate an amplified beam, split the amplified beam into multiple distributed beams, and direct the multiple distributed beams toward an object.

[0117] Figure 3B Exemplary micro-optical element assemblies for a LIDAR system are depicted according to exemplary embodiments of the present disclosure. Figure 3B In this configuration, the micro-optical element assembly 300' includes a light source 310, a first optical component 320, an optical isolator 330, a third optical component 360, a second optical component 340, and an optical chip assembly 350. The micro-optical element assembly 300' can be implemented in a LiDAR system and may include, for example, […]. Figure 2 Various components within.

[0118] The light source 310, the first optical component 320, the optical isolator 330, the second optical component 340, and the optical chip assembly 350 have already been described herein and will not be repeated for the sake of brevity. Figure 3A Unlike other optical components, the third optical component 360 can be positioned between the optical isolator 330 and the second optical component 340.

[0119] Optical isolator 330 can be configured to receive a guided light beam output (transmitted) to optical isolator 330 by first optical component 320. Optical isolator 330 can be configured to allow the light beam guided by first optical component 320 to pass through optical isolator 330 in a first direction and prevent the light from passing through optical isolator 330 in a second direction (e.g., opposite to the first direction) and being reflected back into light source 310.

[0120] exist Figure 3B In this embodiment, the third optical component 360 can be configured to receive a light beam that has passed through the optical isolator 330 and reflect the beam toward the second optical component 340 at a specific angle. In some embodiments, the third optical component 360 may include one or more prisms, mirrors (e.g., rotating mirrors, dichroic reflectors, polygonal mirrors, etc.), beam splitters, deflectors, etc. For example, the third optical component 360 may be configured to be adjustable to change the specific angle at which the light beam is reflected toward the second optical component 340. In some embodiments, the specific angle may be adjustable between 0 and 30 degrees, between 15 and 25 degrees, etc. In some embodiments, the third optical component 360 may include multiple optical elements or components. For example, the third optical component 360 may include multiple prisms. For example, multiple prisms may be separate from each other or may be glued or bonded together. In some embodiments, multiple prisms may include a 90-degree prism (right-angle prism) with two vertical faces forming a 90-degree angle. Other types of prisms may also be implemented to guide the light beam (e.g., wedge prisms).

[0121] The second optical element 340 can be configured to guide the light beam after it has been reflected by the third optical element 360. In some embodiments, the second optical element 340 can be configured to guide the light beam received from the third optical element 360. For example, the shape and positioning of the second optical element 340 can cause it to refract (bend) the incident light beam in a particular manner.

[0122] Figure 3C Exemplary micro-optical element assemblies for a LIDAR system are depicted according to exemplary embodiments of the present disclosure. Figure 3CIn this context, the micro-optical element assembly 300'' includes a light source 310, a first optical component 320, an optical isolator 330, a third optical component 360, a second optical component 340, a first optical circuit chip 370, a fourth optical component 380, and an optical chip assembly 350. The micro-optical element assembly 300'' can be implemented in a LiDAR system and may include, for example, […]. Figure 2 Various components within.

[0123] The light source 310, the first optical component 320, the optical isolator 330, the second optical component 340, the third optical component 360, and the optical chip assembly 350 have already been described herein and will not be repeated for the sake of brevity. Figure 3A and 3B Unlike other optical components, the first optical circuit chip 370 and the fourth optical component 380 can be disposed between the second optical component 340 and the optical chip assembly 350.

[0124] exist Figure 3C In this embodiment, the second optical element 340 can be configured to guide the light beam after it has been reflected by the third optical element 360. In some embodiments, the second optical element 340 can be configured to guide the light beam received from the third optical element 360 and guide (transmit) the guided light beam to the first optical circuit chip 370. For example, the shape and positioning of the second optical element 340 can cause it to refract (bend) the incident light beam to the first optical circuit chip 370 in a specific manner.

[0125] For example, the first optical circuit chip 370 may include a photonic integrated circuit chip or a programmable logic controller. In some embodiments, the first optical circuit chip 370 may be configured to function as a modulator, such as a modulator waveguide. In some embodiments, the first optical circuit chip 370 may be configured to encode signals onto a light beam and form multiple data streams (multiple light beams).

[0126] In some embodiments, a fourth optical component 380 is disposed between the first optical circuit chip 370 and the optical chip assembly 350. The fourth optical component 380 may be configured to guide the light beam after it has passed through a further optical circuit chip to focus the light beam onto the optical chip assembly 350.

[0127] In some embodiments, the fourth optical component 380 may include a plurality of lens arrays. For example, the lens arrays may be configured to shape and collimate the light beam before it is transmitted to the optical chip assembly 350. In some embodiments, the fourth optical component 380 (e.g., a plurality of lens arrays) may be formed of a different material than the first optical component 320 and / or the second optical component 340. For example, the fourth optical component 380 may be formed of silicon, while the first optical component 320 and / or the second optical component 340 may be formed of glass. In some embodiments, the fourth optical component 380 may be configured to guide the light beam after it has passed through the first optical circuit chip 370 to focus the beam onto the U-shaped bend chip 352.

[0128] Despite Figure 3C Not shown, but in some embodiments, the micro-optical element assembly 300'' may further include at least one further optical isolator disposed between the first optical circuit chip 370 and the optical chip assembly 350. For example, similar to optical isolator 330 disposed between the first optical component 320 and the second optical component 340, the further optical isolator may be disposed between the first lens array and the second lens array constituting the fourth optical component 380. The further optical isolator may be configured to allow a light beam guided by the first lens array to pass through the further optical isolator in a first direction and to prevent light from passing through the further optical isolator and being reflected back in a second direction (e.g., opposite to the first direction). The second lens array may be configured to guide the light beam after it has passed through the further optical isolator.

[0129] exist Figure 3C In this embodiment, the optical chip assembly 350 can be configured to receive a guided light beam output (transmitted) to the optical chip assembly 350 by the fourth optical component 380. In some embodiments, the optical chip assembly 350 includes a plurality of chips configured to receive the light beam after it has been guided by the second optical component 340. In some embodiments, the optical chip assembly 350 can be configured to direct the light beam toward objects in the vehicle's environment (e.g., Figure 2 The object 218 in the middle) is emitted. For example, the receiver (e.g., Figure 2 The receiver 222 in the middle can be configured to receive a reflected beam of light from the object.

[0130] like Figure 3C As shown, the multiple chips included in the optical chip assembly 350 may include a U-shaped bend chip 352, a semiconductor optical amplifier (SOA) chip 354, and a second optical circuit chip 356 (e.g., a photonic integrated circuit chip or a programmable logic controller).

[0131] Figures 4A to 4EAn exemplary structural configuration of a micro-optical element assembly according to an exemplary embodiment of the present disclosure is depicted.

[0132] Figure 4A An exemplary structural configuration of a micro-optical element assembly according to an exemplary embodiment of the present disclosure is depicted from a plan view. Figure 4B An exemplary structural configuration of a micro-optical element assembly according to an exemplary embodiment of the present disclosure is depicted from a side view. Figures 4C-4D An exemplary structural configuration of an optical component according to an exemplary embodiment of the present disclosure is depicted. Figure 4E An exemplary structural configuration of a third optical component according to an exemplary embodiment of the present disclosure is depicted.

[0133] Reference Figure 4A and 4B The micro-optical element assembly 400 has a width extending in the width direction X, a length extending in the longitudinal direction Y, and a depth or height in the direction Z.

[0134] like Figure 4A and 4B As shown, the micro-optical element assembly 400 includes a light source 410, a first optical component 420, an optical isolator 430, a second optical component 440, a third optical component 460, a first optical circuit chip 470, a fourth optical component 480, and an optical chip assembly 450. The light source 410, first optical component 420, optical isolator 430, second optical component 440, third optical component 460, first optical circuit chip 470, fourth optical component 480, and optical chip assembly 450 respectively correspond to... Figure 3C The light source 310, the first optical component 320, the optical isolator 330, the second optical component 340, the third optical component 360, the first optical circuit chip 370, the fourth optical component 380, and the optical chip assembly 350 shown will not be described again for the sake of brevity.

[0135] In some implementations, such as Figure 4A The total length L1 of the micro-optical element assembly 400 shown can be approximately 27 mm, or approximately 24 mm to 30 mm. In some embodiments where various components are omitted (e.g., see reference...), the overall length L1 can be approximately 27 mm, or approximately 24 mm to 30 mm. Figure 3A and 3B As described, the overall length of the micro-optical element assembly may be shorter. For example, when the first optical circuit chip 470 and the fourth optical component 480 are omitted (similar to...), Figure 3B (In this configuration), the total length of the micro-optical element assembly can be approximately 19 mm, or approximately 16 mm to 22 mm. For example, when the third optical component 460, the first optical circuit chip 470, and the fourth optical component 480 are omitted (similar to...) Figure 3A(In the configuration), the total length of the micro-optical element assembly can be approximately 15 mm, or approximately 12 mm to 18 mm.

[0136] The optical chip assembly 450 may include two or more chips stacked together in a specific arrangement. For example, as Figure 4A As shown, the optical chip assembly may include a first chip corresponding to the U-shaped bend chip 452, a second chip corresponding to the SOA chip 454, and a third chip corresponding to the second optical circuit chip 456. In some embodiments, such as Figure 4A As shown, the optical chip assembly 450 can have the widest width compared to other components of the micro-optical element assembly 400. For example, the width of the second optical circuit chip 456 can be about 16 mm, or about 13 mm to 19 mm; the width of the U-shaped bend chip 452 can be about 6 mm, or about 4 mm to 8 mm; and the width of the SOA chip 454 can be about 8 mm, or about 6 mm to 10 mm. In some embodiments, the U-shaped bend chip 452, the SOA chip 454 (e.g., a photonic integrated circuit chip or a programmable logic controller), and the second optical circuit chip 456 can be stacked sequentially relative to each other to form a "chip sandwich". For example, the first side of the U-shaped bend chip 452 faces toward the second optical component 440 and the fourth optical component 480, and the second side of the U-shaped bend chip 452 faces toward the first side of the SOA chip 454 and the first side of the second optical circuit chip 456. The second side of the SOA chip 454 faces the first side of the second optical circuit chip 456.

[0137] like Figure 4A As depicted, the light source 410 can emit a light beam along axis A1 in the longitudinal direction Y. In some embodiments employing a third optical component 460, the light beam can be deflected in multiple directions via multiple optical elements or components (e.g., a first prism 460a and a second prism 460b). For example, the light beam can be emitted to the second optical component 440 along an axis A2 that is transverse or oblique to axis A1. As described herein, a first optical circuit chip 470 can be configured to split the light beam into multiple beams, and the multiple beams can be emitted to the optical chip assembly 450 via a fourth optical component 480 along multiple axes (e.g., axes A3 and A4) in the longitudinal direction Y (parallel to axis A1). For example, the multiple axes can be offset from axis A1 in the width direction X (e.g., offset by about 0.5 mm to 1.5 mm, for example, offset by 0.66 mm).

[0138] Figures 4C-4D Exemplary structural configurations of optical components according to exemplary embodiments of the present disclosure are depicted. For example, in Figure 4CIn this embodiment, the third optical component 460 includes multiple optical elements or components (e.g., a first prism 460a and a second prism 460b) bonded together. For example, the first prism 460a and the second prism 460b may be glued together. In some embodiments employing the third optical component 460, a light beam 490 passing through the first optical component 420 along axis A1 may be deflected multiple times in multiple directions via multiple optical elements or components (e.g., the first prism 460a and the second prism 460b). For example, the light beam 490 may be emitted at a specific angle θ along an axis A2 that is transverse or oblique to axis A1 to the second optical component 440. In some embodiments, the specific angle θ may be about 25 degrees, for example, between about 15 degrees and about 35 degrees. For example, the third optical component 460 may be configured to be adjustable to change the specific angle at which the light beam is reflected toward the second optical component 440. In some embodiments, the light beam 490 may be reflected such that the light beam 490 is parallel to the axis of the beam emitted by the light source (e.g., a specific angle may be about 0 degrees, or may be adjusted between about 0 degrees and about 35 degrees). In some embodiments, the distance d1 along the length direction Y between the entry side of the first optical component 420 and the exit side of the second optical component 440 may be about 7 mm, or between about 5 mm and about 9 mm.

[0139] For example, in Figure 4D In this embodiment, optical component 460' includes a plurality of optical elements or components (e.g., a first prism 460a' and a second prism 460b') that are separated from each other. For example, the first prism 460a' and the second prism 460b' may be separated from each other by a predetermined distance in the width direction X. In some embodiments employing optical component 460', a light beam passing through the first optical component 420 along an axis (e.g., axis A1) may be deflected multiple times in multiple directions via the plurality of optical elements or components (e.g., the first prism 460a' and the second prism 460b'). For example, the light beam may be emitted to the second optical component 440 at a specific angle along an axis that is transverse or oblique to the axis from which the light beam is emitted from the light source (e.g., axis A1). In some embodiments, the specific angle may be about 25 degrees, for example, between about 15 degrees and about 35 degrees. For example, the third optical component 460 may be configured to be adjustable to change the specific angle at which the light beam is reflected toward the second optical component 440. In some embodiments, the light beam can be reflected such that it is parallel to the axis from which it is emitted by the light source (e.g., a specific angle may be about 0 degrees, or may be adjustable between about 0 degrees and about 35 degrees). In some embodiments, the distance d1 along the length direction Y between the entry side of the first optical component 420 and the exit side of the second optical component 440 may be about 7 millimeters, or between about 5 millimeters and about 9 millimeters.

[0140] Figure 4EAn exemplary structural configuration of a third optical component according to an exemplary embodiment of the present disclosure is depicted. Figure 4E In this configuration, a fourth optical component 480 is disposed between the first optical circuit chip 470 and the optical chip assembly 450 (e.g., a U-shaped bend chip 452). The fourth optical component 480 can be configured to guide the light beam emitted by the first optical circuit chip 470 to focus the light beam onto the U-shaped bend chip 452.

[0141] In some embodiments, the fourth optical component 380 may include multiple lens arrays. For example, the lens arrays may be configured to shape and collimate the light beam before it is transmitted to the U-shaped bend chip 452. In some embodiments, the fourth optical component 380 (e.g., multiple lens arrays including the first lens array 480a and the second lens array 480b) may be formed of a different material than the first optical component 420 and / or the second optical component 440. For example, the fourth optical component 480 may be formed of silicon, while the first optical component 420 and / or the second optical component 440 may be formed of glass.

[0142] Reference Figure 4E In some embodiments, multiple light beams are emitted from the first optical circuit chip 470 to the U-shaped bend chip 452 via a fourth optical component 480. For example, Figure 4E A first light beam 490a is depicted, emitted along axis A6 from a first output port 472a of a first optical circuit chip 470, guided by a first lens array 480a and a second lens array 480b, and received at a first input port 452a of a U-shaped bend chip 452. A second light beam 490b is also emitted along axis A7 from a second output port 472b of the first optical circuit chip 470, guided by the first lens array 480a and the second lens array 480b, and received at a second input port 452b of the U-shaped bend chip 452. In some embodiments, axis A6 may be separated from the centerline axis A5 of the fourth optical component 480 by a specific angle α. For example, the specific angle α may be about 7 degrees, for example, between about 5 degrees and about 9 degrees. In some embodiments, the distance d2 along the length direction Y between the entry side of the first lens array 480a and the exit side of the second lens array 480b may be about 3 mm, or between about 2 mm and about 4 mm.

[0143] Figure 5A An exemplary plan view of a housing for a micro-optical element assembly according to an example of this disclosure is depicted. Figure 5B An exemplary perspective view of a housing for a micro-optical element assembly according to an example of this disclosure is depicted.

[0144] According to examples of this disclosure, at least some optical components of a micro-optical element assembly for a LIDAR system can be disposed within a housing 510. The number of elements constituting the micro-optical element assembly can be varied or reduced to achieve a streamlined arrangement with a compact size that can be accommodated within the housing 510. Examples of micro-optical element assemblies that can be at least partially disposed within the housing 510 are described herein (e.g., see reference 1). Figures 3A to 4E In an exemplary embodiment, the housing 510 includes a cavity 520, wherein the housing 510 has a length L defined along the length direction Y. h and the width W defined along the width direction X, which is perpendicular to the length direction Y. h For example, a first mounting base 530 (e.g., a first mounting base region) may be positioned at a first portion 532 of the housing 510 within the cavity 520, and a second mounting base 540 (e.g., a second mounting base region) may be positioned at a second portion 542 of the housing 510 within the cavity 520. For example, the first mounting base 530 may be formed of common ceramic or thermoelectric cooler (TEC). For example, the first portion 532 of the housing may have an area dimension of about 18 mm x about 7 mm or about 20 mm x about 10 mm. The housing 510 may also include: (i) a machined CuW (copper-tungsten) base with notches, through holes, and laser-etched reference marks; (ii) three-sided CuW walls (e.g., multiple walls 550) with notches for electrical interfaces 560 (e.g., feedthroughs); and (iii) AlN (aluminum nitride) electrical feedthroughs for DC and RF electrical signals. For example, in some embodiments, the cavity 520 may have internal dimensions of about 37 mm wide, about 43 mm long and about 6 mm high, or about 35 mm to about 40 mm wide, about 40 mm to about 45 mm long and about 4 mm to about 8 mm high.

[0145] The housing 510 may include a plurality of walls 550 that at least partially enclose the optical components within the housing 510. For example, at least some portions of the housing 510 may be formed of gold. The housing 510 may be configured to provide a protective environment to shield the optical components of the LIDAR system from environmental factors such as dust, moisture, temperature fluctuations, physical damage, etc. The housing 510 may be formed of a material (e.g., gold or a gold-plated surface) to help reflect stray light and minimize interference. The housing 510 may be completely or partially enclosed by the plurality of walls 550. The housing 510 (or the plurality of walls 550) may be hermetically sealed or at least partially hermetically sealed. The housing 510 (or the plurality of walls 550) may include one or more transparent windows or optical ports to allow light beams to be emitted to the outside of the housing 510 and to receive returned light beams. The housing 510 (or the plurality of walls 550) may include electrical interfaces 560 (e.g., ports, connectors, feedthroughs, etc.) to allow electrical connections for power, data transmission, and control signals to the various optical components within the housing 510.

[0146] According to examples of this disclosure, a micro-optical element assembly may include a first portion disposed on a first mounting base 530 and a second portion disposed on a second mounting base 540. In some embodiments, the first mounting base 530 (on which the first portion of the micro-optical element assembly is disposed) may have a length greater than its width. For example, the length of the first mounting base 530 may range from about 15 mm to about 25 mm (e.g., from about 16 mm to about 20 mm), while the width of the first mounting base 530 may range from about 5 mm to about 15 mm (e.g., from about 6 mm to about 10 mm). In some embodiments, the first mounting base 530 includes a ceramic substrate or a thermoelectric cooler substrate.

[0147] In some embodiments, the second mounting base 540 (on which a second portion of the micro-optical element assembly is disposed) is wider than the first mounting base 530, and the length of the first mounting base 530 is greater than that of the second mounting base 540. For example, the length of the second mounting base 540 may range from about 8 mm to about 12 mm, while the width of the second mounting base 540 may range from about 8 mm to about 20 mm (e.g., from about 8 mm to about 17 mm). In some embodiments, the second mounting base 540 includes a ceramic substrate or a thermoelectric cooler substrate. For example, the first mounting base 530 may be spaced from the second mounting base 540 by about 2 mm to about 4 mm in the longitudinal direction Y.

[0148] In some embodiments, the thickness of the plurality of walls 550 can be from about 1.5 mm to about 3 mm, for example from about 2 mm to about 2.5 mm.

[0149] Figure 6AAn exemplary optical component is depicted according to an example of a micro-optical element assembly that can be mounted in a housing, as described in this disclosure. Figure 6B A perspective view depicting an optical component of a micro-optical element assembly capable of being mounted in a housing, according to an example of this disclosure.

[0150] like Figure 6A and 6B As shown, the depicted micro-optical element assembly can include a light source 610, a first optical component 620, an optical isolator 630, a second optical component 640, a third optical component 660, a first optical circuit chip 670, a fourth optical component 680, and an optical chip assembly 650. The light source 610, first optical component 620, optical isolator 630, second optical component 640, third optical component 660, first optical circuit chip 670, fourth optical component 680, and optical chip assembly 650 respectively correspond to... Figure 3C The light source 310, the first optical component 320, the optical isolator 330, the second optical component 340, the third optical component 360, the first optical circuit chip 370, the fourth optical component 380, and the optical chip assembly 350 shown are described separately for the sake of brevity.

[0151] As described above, a micro-optical element assembly may include a first portion disposed (arranged) on a first mounting base and a second portion disposed (arranged) on a second mounting base. Figure 6A In the micro-optical element assembly 600, there are a first portion 602 mounted on a first mounting base 604 and a second portion 606 mounted on a second mounting base 608.

[0152] exist Figure 6AIn this embodiment, the first portion 602 of the micro-optical element assembly includes: a light source 610 configured to emit a light beam; a first optical component 620 (e.g., a collimating lens) configured to guide the light beam emitted by the light source 610; an optical isolator 630 configured to allow the light beam guided by the first optical component 620 to pass through an optical isolator 630 in a first direction (e.g., the +Y direction) and to prevent light from passing through the optical isolator 630 in a second direction (e.g., the -Y direction) and being reflected back into the light source 610; and a second optical component 640 (e.g., a collimating lens) configured to guide the light beam after it has passed through the optical isolator 630. In some embodiments, the first portion 602 may further include a first optical circuit chip 670 disposed between the second optical component 640 and the second portion 606. In some embodiments, the micro-optical element assembly 600 may further include a fourth optical component 680, wherein a portion (e.g., a first microlens array 680a) is disposed at a first portion 602 between the first optical circuit chip 670 and the second portion 606, and another portion (e.g., a second microlens array 680b) is disposed at a second portion 606 between the U-shaped bend chip 652 and the first portion 602. Figure 6B As shown, in some embodiments, the first portion 602' of the micro-optical element assembly may include a portion similar to... Figure 6A The optical components are configured and further include a third optical component 660 disposed between a second optical component 640, which is mounted to a first mounting base 604' and an optical isolator 630.

[0153] The second portion 606 of the micro-optical element assembly 600 may include an optical chip assembly 650 for receiving the light beam after it has been guided by the second optical element 640 (or after it has been guided by the fourth optical element 680). In some embodiments, the optical chip assembly 650 includes a U-turn chip 652, a semiconductor optical amplifier (SOA) chip 654, and a second optical circuit chip 656 (e.g., a PIC chip or a PLC chip). The U-turn chip 652, SOA chip 654, and second optical circuit chip 656 may be stacked sequentially on top of each other along the Y direction, with the U-turn chip 652 at the upstream end (closest to the light source 610) and the second optical circuit chip 656 at the downstream end. The optical chip assembly 650 can be configured to amplify the light beam to produce an amplified beam, split the amplified beam into multiple distributed beams, and direct the multiple distributed beams toward an object (e.g., an object in the environment of a vehicle).

[0154] In some embodiments, the first portion 602 may be spaced from the second portion 606 by about 3 mm, or between about 2 mm and about 4 mm. In some embodiments, the first portion 602 may be positioned at a first height based on the orientation and location of the first mounting base 604, while the second portion 606 may be positioned at a second height based on the orientation and location of the second mounting base 608. For example, the second height of the second portion 606 may differ from the first height, for example, by about 1.5 mm or between about 1 mm and about 3 mm.

[0155] Figures 7A to 7C An exemplary optical component is depicted as an example of a micro-optical element assembly disposed in a housing according to an example of this disclosure.

[0156] like Figures 7A to 7C As shown, the depicted micro-optical element assembly includes at least some of the following: a light source 710, a first optical component 720, an optical isolator 730, a second optical component 740, a first optical circuit chip 770, a third optical component 780, and an optical chip assembly 750. The light source 710, the first optical component 720, the optical isolator 730, the second optical component 740, the first optical circuit chip 770, the third optical component 780, and the optical chip assembly 750 respectively correspond to... Figure 3C The light source 310, first optical component 320, optical isolator 330, second optical component 340, first optical circuit chip 370, fourth optical component 380, and optical chip assembly 350 shown are described herein, and for the sake of brevity, their descriptions will not be repeated. Figures 7A to 7C As shown, the optical components of the micro-optical element assemblies, housings, mounting bases, etc., depicted can have characteristics relative to those described herein. Figures 3A to 6B The optical components of the described micro-optical element assembly, housing, and mounting are similar in size and dimensions to those of the optical parts. For example, the first part 702 and the first mounting 704 may have similar dimensions to... Figure 5A The first part 532 and the first mounting base 530 are similar in size and dimensions.

[0157] exist Figure 7A In the first configuration 700, the housing 701 includes a first portion 702 on which a first mounting base 704 is disposed. The first mounting base 704 includes a first plurality of optical components for a micro-optical element assembly. For example, in Figure 7A In this embodiment, the first mounting base 704 includes a light source 710, a first optical component 720, an optical isolator 730, a second optical component 740, and a first optical circuit chip 770. In some embodiments, the first mounting base 704 may further include an optical component disposed between the first optical component 720 and the second optical component 740, similar to the optical component described herein with respect to... Figure 4AThe third optical component 460 is described in the micro-optical element assembly. In some embodiments, the first mounting base 704 may also include a portion of the third optical component (e.g., a microlens array) disposed between the first optical circuit chip 770 and the optical chip assembly 750, similar to the description herein relative to... Figure 4A The fourth optical component 480 (e.g., the first lens array 480a) is described in the micro-optical element assembly.

[0158] exist Figure 7A In the first configuration 700, the housing 701 further includes a second portion 706 on which a second mounting base 708 is disposed. The second mounting base 708 includes a second plurality of optical components for a micro-optical element assembly. For example, in Figure 7A In this embodiment, the second mounting base 708 includes an optical chip assembly 750. In some implementations, the optical chip assembly 750 may include a U-shaped bend chip, a second optical circuit chip (e.g., a PIC chip or a PLC chip), and a semiconductor optical amplifier (SOA) chip, similar to those described herein with respect to... Figure 4A The micro-optical element assembly 750 describes a U-shaped bend chip 452, an SOA chip 454, and a second optical circuit chip 456. In some embodiments, the optical chip assembly 750 may include a U-shaped bend chip, while the second optical circuit chip and the SOA chip are provided externally to the housing 701. In some embodiments, the optical chip assembly 750 may include a U-shaped bend chip and a second optical circuit chip, while the SOA chip is provided externally to the housing 701.

[0159] In some embodiments, the second mounting base 708 may also include a portion of a third optical component (e.g., a microlens array) disposed between the first optical circuit chip 770 and the optical chip assembly 750, similar to the description herein relative to... Figure 4A The fourth optical component 480 (e.g., the second lens array 480b) is described in the micro-optical element assembly.

[0160] like Figure 7A As shown, the light beam 790 emitted by the light source 710 can be emitted at a first specific angle, and the light beam 790' emitted from the first optical circuit chip 770 can be emitted at a second specific angle different from the first specific angle. For example, the first specific angle can be about ±20 degrees (e.g., about ±15 degrees to about ±25 degrees relative to an axis parallel to the Y direction), and the second specific angle can be about 0 degrees (e.g., about ±5 degrees relative to an axis parallel to the Y direction).

[0161] exist Figure 7BIn the second configuration 700', the housing 701 includes a first portion 702 on which a first mounting base 704 is disposed. The first mounting base 704 includes a first plurality of optical components for a micro-optical element assembly. For example, in Figure 7B In this embodiment, the first mounting base 704 includes a light source 710, a first optical component 720, an optical isolator 730, a second optical component 740, a first optical circuit chip 770, a portion of a third optical component 780 (e.g., a microlens array 780a), and a further optical isolator 730'. The further optical isolator 730' may be similar to the optical isolator 730. In some embodiments, the first mounting base 704 may also include an optical component disposed between the first optical component 720 and the second optical component 740, similar to the optical component described herein with respect to... Figure 4A The third optical component 460 is described in the micro-optical element assembly.

[0162] exist Figure 7B In the second configuration 700', the housing 701 further includes a second portion 706 on which a second mounting base 708 is disposed. The second mounting base 708 includes a second plurality of optical components for a micro-optical element assembly. For example, in Figure 7B In this embodiment, the second mounting base 708 includes a portion of an optical chip assembly 750 and a third optical component 780 (e.g., a microlens array 780b). In some implementations, the optical chip assembly 750 may include a U-shaped bend chip, a second optical circuit chip (e.g., a PIC chip or a PLC chip), and a semiconductor optical amplifier (SOA) chip, similar to those described herein with respect to... Figure 4A The micro-optical element assembly 750 describes a U-shaped bend chip 452, an SOA chip 454, and a second optical circuit chip 456. In some embodiments, the optical chip assembly 750 may include a U-shaped bend chip, while the second optical circuit chip and the SOA chip are provided externally to the housing 701. In some embodiments, the optical chip assembly 750 may include a U-shaped bend chip and a second optical circuit chip, while the SOA chip is provided externally to the housing 701.

[0163] In some embodiments, the second mounting base 708 may also include a portion of a third optical component (e.g., a microlens array) disposed between the first optical circuit chip 770 and the optical chip assembly 750, similar to the description herein relative to... Figure 4A The fourth optical component 480 (e.g., the second lens array 480b) is described in the micro-optical element assembly.

[0164] like Figure 7BAs shown, the light beam 790 emitted by the light source 710 can be emitted at a first specific angle, and the light beam 790'' emitted from the first optical circuit chip 770 is also emitted at the first specific angle. For example, the first specific angle can be about ±20 degrees (e.g., about ±15 degrees to about ±25 degrees relative to an axis parallel to the Y direction).

[0165] exist Figure 7C In the third configuration 700'', the housing 701 includes a first portion 702 on which a first mounting base 704 is disposed. The first mounting base 704 includes a first plurality of optical components for a micro-optical element assembly. For example, in Figure 7C In this embodiment, the first mounting base 704 includes a light source 710, a first optical component 720, and an optical isolator 730. In some embodiments, the first mounting base 704 may further include an optical component disposed between the first optical component 720 and the second optical component 740, similar to the optical component described herein with respect to... Figure 4A The third optical component 460 is described in the micro-optical element assembly.

[0166] exist Figure 7C In the third configuration 700'', the housing 701 further includes a second portion 706 on which a second mounting base 708 is disposed. The second mounting base 708 includes a second plurality of optical components for a micro-optical element assembly. For example, in Figure 7C In this embodiment, the second mounting base 708 includes an optical chip assembly 750 and a second optical component 740. In some embodiments, the optical chip assembly 750 may include a U-shaped bend chip, a second optical circuit chip (e.g., a PIC chip or a PLC chip), and a semiconductor optical amplifier (SOA) chip, similar to those described herein with respect to... Figure 4A The micro-optical element assembly 750 describes a U-shaped bend chip 452, an SOA chip 454, and a second optical circuit chip 456. In some embodiments, the optical chip assembly 750 may include a U-shaped bend chip, while the second optical circuit chip and the SOA chip are provided externally to the housing 701. In some embodiments, the optical chip assembly 750 may include a U-shaped bend chip and a second optical circuit chip, while the SOA chip is provided externally to the housing 701.

[0167] like Figure 7C As shown, the light beam 790 emitted by the light source 710 can be emitted at a specific angle. For example, the specific angle can be about ±20 degrees (e.g., about ±15 degrees to about ±25 degrees relative to an axis parallel to the Y direction). In some embodiments, the specific angle can be about 0 degrees (e.g., about ±5 degrees relative to an axis parallel to the Y direction).

[0168] The foregoing description of the disclosed examples is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these examples will be apparent to those skilled in the art, and the general principles defined herein may be applied to other examples without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples shown herein, but should be given the widest scope consistent with the appended claims and the principles and novel features disclosed herein.

[0169] The terminology used herein is for describing exemplary embodiments and is not intended to limit and / or constrain this disclosure. The singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. In this disclosure, terms such as “comprising,” “having,” and “including” are used to specify features, numbers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more features, elements, steps, operations, components, or combinations thereof.

[0170] It should be understood that although terms such as first, second, third, etc., may be used herein to describe various elements, these elements are not limited by these terms. Rather, these terms are used to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element, and a second element may be referred to as a first element.

[0171] It should be understood that when an element is referred to as being “connected” to another element, the statement includes examples of direct connection or direct coupling, as well as examples of connection or coupling that involves the insertion of one or more other elements.

[0172] The term “and / or” includes a combination of multiple related listed items or any item among multiple related listed items. For example, the expression or phrase “A and / or B” encompasses item “A”, item “B”, and combinations of items “A and B”.

[0173] Furthermore, the scope of the expression or phrase “at least one of A or B” is intended to include all of the following: (1) at least one of A, (2) at least one of B, and (3) at least one of A and at least one of B. Similarly, the scope of the expression or phrase “at least one of A, B or C” is intended to include all of the following: (1) at least one of A, (2) at least one of B, (3) at least one of C, (4) at least one of A and at least one of B, (5) at least one of A and at least one of C, (6) at least one of B and at least one of C, and (7) at least one of A, at least one of B and at least one of C.

[0174] The numerical ranges and parameters described herein are approximate, while the numerical values ​​described in specific, non-limiting examples are provided as examples. The term “approximately” is used to indicate a wider range centered on a given value, meaning a wider range around the least significant bit unless the context otherwise indicates; for example, “approximately 1.1” means a range from 1.0 to 1.2. If the least significant bit is unclear, the term “approximately” means twice the coefficient; for example, “approximately X” means a value in the range of 0.5X to 2X, and for example, “approximately 100” means a value in the range of 50 to 200. Furthermore, all ranges disclosed herein should be understood to encompass any and all subranges thereof. For example, for parameters that are positive only, the range “less than 10” can include any and all subranges between the minimum value of zero and the maximum value of 10; that is, any and all subranges with a minimum value equal to or greater than zero and a maximum value equal to or less than 10 (e.g., 1 to 4).

[0175] The techniques disclosed herein are described for illustrative purposes only in the context of a LIDAR system and an autonomous vehicle. As stated herein, the techniques described are not limited to autonomous vehicles and can be implemented or implemented in other systems, autonomous platforms, and other computing systems.

Claims

1. A light detection and ranging (LIDAR) sensor system for a vehicle, comprising: A light source, configured to emit a light beam; At least one first optical component, the at least one first optical component being configured to guide the light beam emitted by the light source; At least one optical isolator, the at least one optical isolator being configured to allow the light beam guided by the at least one first optical component to pass through the at least one optical isolator in a first direction, and to prevent the light passing through the at least one optical isolator in a second direction from being reflected back into the light source; At least one second optical component is configured to guide the light beam after it has passed through the at least one optical isolator; An optical chip assembly comprising multiple chips configured to receive the light beam after it has been guided by the at least one second optical component, and to direct the light beam toward an object in the environment of the vehicle; as well as A receiver configured to receive a reflected light beam from the object.

2. The LIDAR sensor system according to claim 1, wherein, The at least one first optical component includes a collimating lens.

3. The LIDAR sensor system according to claim 1 or claim 2, wherein, The at least one second optical component includes a collimating lens.

4. The LIDAR sensor system according to any one of claims 1 to 3, wherein, The at least one second optical component is offset from the at least one first optical component in a direction perpendicular to the direction along which the light beam is emitted from the light source.

5. The LIDAR sensor system according to any one of claims 1 to 4, further comprising: At least one third optical component is configured to reflect the light beam that has passed through the at least one optical isolator toward the at least one second optical component at a specific angle.

6. The LIDAR sensor system according to claim 5, wherein, The at least one third optical component includes at least one prism.

7. The LIDAR sensor system according to claim 5, wherein, The at least one third optical component is adjustable to change the specific angle used to reflect the light beam toward the at least one second optical component.

8. The LIDAR sensor system according to any one of claims 1 to 4, further comprising: An optical circuit chip is disposed between the at least one second optical component and the optical chip assembly.

9. The LIDAR sensor system according to claim 8, further comprising: At least one third optical component is disposed between the optical circuit chip and the optical chip assembly.

10. The LIDAR sensor system according to claim 9, wherein, The at least one third optical component includes a plurality of lens arrays.

11. The LIDAR sensor system according to claim 10, further comprising: At least one additional optical isolator is disposed between the optical circuit chip and the optical chip assembly.

12. The LIDAR sensor system according to any one of claims 1 to 11, wherein, The optical chip assembly is configured to amplify the light beam to generate an amplified light beam, split the amplified light beam into multiple distributed light beams, and emit the multiple distributed light beams toward the object.

13. An autonomous vehicle (AV) control system for a vehicle, comprising: One or more processors; A light source, configured to emit a light beam; At least one first optical component, the at least one first optical component being configured to guide the light beam emitted by the light source; At least one optical isolator, the at least one optical isolator being configured to allow the light beam guided by the at least one first optical component to pass through the at least one optical isolator in a first direction, and to prevent the light passing through the at least one optical isolator in a second direction from being reflected back into the light source; At least one second optical component, the at least one second optical component being configured to guide the light beam after the light beam has passed through the at least one optical isolator; and An optical chip assembly comprising multiple chips configured to receive the light beam after the light beam has been guided by the at least one second optical component.

14. The AV control system according to claim 13, wherein, The optical chip assembly is configured to amplify the light beam to generate an amplified light beam, split the amplified light beam into multiple distributed light beams, and direct the multiple distributed light beams toward objects in the environment of the vehicle.

15. An autonomous vehicle, comprising: An autonomous vehicle control system, comprising one or more processors and a light detection and ranging (LIDAR) sensor system, the LIDAR sensor system comprising: Micro-optical element assemblies, including: A light source, configured to emit a light beam; At least one first optical component, the at least one first optical component being configured to guide the light beam emitted by the light source; At least one optical isolator, the at least one optical isolator being configured to allow the light beam guided by the at least one first optical component to pass through the at least one optical isolator in a first direction, and to prevent the light passing through the at least one optical isolator in a second direction from being reflected back into the light source; At least one second optical component, the at least one second optical component being configured to guide the light beam after the light beam has passed through the at least one optical isolator; and An optical chip assembly comprising multiple chips configured to receive the light beam after it has been guided by the at least one second optical component, and to direct the light beam toward an object in the environment of the autonomous vehicle; and A receiver configured to receive a reflected light beam from the object and determine object detection associated with the object; and An autonomous vehicle controller configured to control the autonomous vehicle based on object detection associated with the object.

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