Wafer cassette cleaning apparatus

Abstract

The application relates to a wafer box cleaning device, which comprises a cleaning barrel, a cleaning barrel cover, a first positioning assembly and a second positioning assembly. The cleaning barrel cover is connected to the cleaning barrel in an openable and closable mode. When the cleaning barrel cover is closed on the cleaning barrel, the cleaning barrel cover and the cleaning barrel form a cleaning space for cleaning wafer boxes. The first positioning assembly is connected to one side of the cleaning barrel cover close to the cleaning barrel and is used for adsorbing a first cover body. The second positioning assembly is arranged staggeredly with the first positioning assembly and is used for adsorbing a second cover body. A cleaning structure is connected to the inner wall of the cleaning barrel and is used for spraying cleaning liquid towards the cleaning barrel cover to clean the first cover body or the second cover body. The wafer box cleaning device allows one device to clean different types of wafer boxes, thereby solving the problem that independent cleaning equipment needs to be used for different wafer boxes in the prior art, and the number of devices can be reduced, the purchase cost can be lowered, the clean room space can be saved, and the maintenance and operation can be simplified.

Description

Technical Field

[0001] This application relates to the field of semiconductor wafer manufacturing technology, and in particular to a wafer cassette cleaning apparatus. Background Technology

[0002] In the semiconductor wafer manufacturing process, wafer cassettes serve as critical carriers for the safe transport and storage of wafers, preventing contamination and damage. Different process stages require specific types of wafer cassettes; for example, FOUPs (front-opening wafer cassettes) are specifically designed to hold bare wafers, while frame FOUPs (front-opening frame wafer cassettes) are used to hold wafers mounted on metal frames.

[0003] Due to the differences in the physical characteristics of the objects they support, FOUPs and Frame FOUPs differ significantly in structural design and size specifications: FOUPs have a compact internal space to accommodate the thin profile of bare wafers; Frame FOUPs, on the other hand, require a larger volume to accommodate the metal frame and its additional structures. This structural difference poses a significant challenge to existing cleaning technologies.

[0004] Currently, the industry generally relies on dedicated cleaning equipment to process the two types of wafer cassettes separately. That is, FOUP requires a separate cleaning system, and Frame FOUP requires another system. As a result, due to the need to invest in multiple systems, not only does the equipment procurement cost increase significantly, but the production space occupied also increases significantly, especially in high-value areas such as cleanrooms. Summary of the Invention

[0005] In view of this, the present application provides a wafer cassette cleaning apparatus to solve at least one problem existing in the background art.

[0006] In a first aspect, embodiments of this application provide a wafer cassette cleaning apparatus, wherein the wafer cassette includes at least a first wafer cassette and a second wafer cassette, the first wafer cassette including a first cover, and the second wafer cassette including a second cover; the wafer cassette cleaning apparatus includes: Clean the tank; The cleaning bucket lid is foldable and connected to the cleaning bucket body. When the cleaning bucket lid is installed on the cleaning bucket body, the cleaning bucket lid and the cleaning bucket body constitute a cleaning space for cleaning the wafer cassette. The positioning structure includes a positioning plate connected to the side of the cleaning bucket lid near the cleaning bucket body. The positioning plate is provided with two sets of positioning components, one set of which is used to fix the first lid and the other set of which is used to fix the second lid. The two sets of positioning components are arranged alternately. The cleaning structure, connected to the cleaning tank body, is capable of spraying cleaning liquid toward the cleaning tank lid to clean the first lid or the second lid.

[0007] In conjunction with the first aspect of this application, in an optional embodiment, both the first cover and the second cover are provided with a lock hole and a fixing area; the wafer cassette cleaning device further includes an unlocking component disposed on the positioning plate; The unlocking component is used to correspond to the lock hole of the first cover or the second cover, and the two sets of positioning components are respectively used to correspond to and fix to the fixed area of ​​the first cover and the second cover.

[0008] In conjunction with the first aspect of this application, in an optional embodiment, the positioning plate includes a first mounting part and a second mounting part, wherein the first mounting part and the second mounting part have a height difference in a direction perpendicular to the plane where the cleaning bucket lid is located; The positioning component includes an adsorption structure that extends at least partially into the first cover or the second cover.

[0009] In conjunction with the first aspect of this application, in an optional embodiment, the adsorption structure includes: Ventilation ducts; A vacuum suction cup is used to adhere to the surface of the first cover or the second cover and to form a sealed space with the positioning groove of the first cover or the second cover. The nozzle has one end connected to the ventilation pipe and the other end located in the sealed space and inserted into the positioning groove. When a vacuum is formed in the sealed chamber, the vacuum suction cup adheres tightly to the surface of the first cover or the second cover under the action of negative pressure.

[0010] In conjunction with the first aspect of this application, in an optional embodiment, the positioning structure includes: A rotary drive assembly is connected to the side of the cleaning tub cover away from the cleaning tub body. The rotary drive assembly is connected to the positioning disk, and the positioning assembly is connected to the positioning disk. The first cover or the second cover rotates with the positioning disk under the action of the rotary drive assembly.

[0011] In conjunction with the first aspect of this application, in an alternative embodiment, the unlocking component includes: Unlock the drive assembly and connect it to the side of the cleaning tub cover away from the cleaning tub body; A rotary rod is connected to the unlocking drive assembly. Under the driving action of the unlocking drive assembly, the rotary rod can pass through the cleaning bucket lid and be inserted into the lock hole of the first lid or the second lid to rotate, so as to unlock or lock the first wafer box or the second wafer box.

[0012] In conjunction with the first aspect of this application, in an optional embodiment, the unlocking drive component includes: The first driving component is connected to the side of the cleaning tub cover away from the cleaning tub body; The second driving member has one end connected to the first driving member and the other end connected to the rotating rod. The rotating rod moves in a straight line and rotates under the respective driving action of the first driving member and the second driving member.

[0013] In conjunction with the first aspect of this application, in an optional embodiment, the wafer cassette cleaning apparatus further includes: Multiple limiting members are connected to the side surface of the positioning disk near the cleaning tub. The limiting members protrude from the surface of the positioning disk and are adapted to the limiting grooves of the first cover or the second cover. The limiting members are used to limit the position of the first cover or the second cover connected to the positioning disk.

[0014] In conjunction with the first aspect of this application, in an optional embodiment, the rotary drive assembly includes a rotary shaft that passes through the cleaning tub lid and is connected to the positioning plate. The rotary shaft has a conveying channel inside, and one end of the conveying channel is connected to the positioning assembly.

[0015] In conjunction with the first aspect of this application, in an optional embodiment, the wafer cassette cleaning apparatus further includes: Negative pressure structure; A pneumatic slip ring is connected between the conveying channel and the negative pressure structure.

[0016] The wafer cassette cleaning apparatus provided in this application embodiment, by setting two sets of positioning components on the positioning plate and arranging them alternately, allows one device to clean different types of wafer cassettes, thereby solving the problem in the prior art that separate cleaning equipment is needed for different wafer cassettes. This reduces the number of devices, lowers procurement costs, saves cleanroom space, and simplifies maintenance and operation.

[0017] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the structure of the wafer cassette cleaning apparatus provided in the embodiments of this application; Figure 2This is a schematic diagram of the structure of the cleaning tank cover of the wafer cassette cleaning apparatus provided in the embodiments of this application; Figure 3 This is a schematic diagram showing the state in which the first wafer cassette is adsorbed onto the first positioning component in the wafer cassette cleaning apparatus provided in this application embodiment; Figure 4 This is a schematic diagram showing the state in which the second housing is adsorbed onto the second positioning component in the wafer cassette cleaning apparatus provided in this application embodiment; Figure 5 A side view of the cover being installed on the cleaning tank cover in the wafer cassette cleaning apparatus provided in this application embodiment; Figure 6 for Figure 5 Sectional view and enlarged view at point CC; Figure 7 A side view of the cleaning tank cover in the wafer cassette cleaning apparatus provided in an embodiment of this application; Figure 8 for Figure 7 Enlarged view of point C in the middle; Figure 9 A schematic diagram of the planar structure of the cleaning tank cover in the wafer cassette cleaning apparatus provided in this application embodiment; Figure 10 for Figure 9 Sectional view at point AA; Figure 11 for Figure 9 Sectional view at point BB.

[0019] Figure label: 100. Wafer cell cleaning device; 11. First cover; 12. Second cover; 13. Positioning groove; 21. Clean the tank body; 22. Clean the tank lid; 3. Positioning structure; 30. Positioning component; 31. First positioning component; 32. Second positioning component; 33. Positioning disk; 331. First mounting part; 332. Second mounting part; 34. Adsorption structure; 341. First adsorption component; 342. Second adsorption component; 343. Vacuum suction cup; 344. Suction nozzle; 345. Ventilation pipe; 35. Rotation drive component; 351. Rotation shaft; 60. Unlocking component; 61. Unlocking drive component; 611. First drive component; 612. Second drive component; 62. Rotary lever; 70. Limiting components; 80. Pneumatic slip rings. Detailed Implementation

[0020] To make the technical solution and beneficial effects of the present invention more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.

[0021] In the description of this invention, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this invention and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. That is, they should not be construed as limiting this invention.

[0022] In this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating the relative importance of the indicated features or the number of indicated technical features. Therefore, a feature specified as "first" or "second" can explicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise explicitly specified.

[0023] In this invention, unless otherwise explicitly defined, the terms "installation," "connection," "linking," "fixing," and "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] In this invention, unless otherwise explicitly defined, the terms "above," "on top of," "over," "above," "below," "below," "below," or "below" for "first feature above second feature" can refer to the first and second features being in direct contact, or to the first and second features being in indirect contact through an intermediate medium. Furthermore, "above," "over," and "below" for "first feature above second feature" can mean the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. Similarly, "below," "below," and "below" for "first feature below second feature" can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0025] Please refer to Figure 1 The wafer cassette cleaning apparatus 100 includes a cleaning tank body 21 and a cleaning tank cover 22. The cleaning tank cover 22 is detachably connected to the cleaning tank body 21. When the wafer cassette is being cleaned, the cleaning tank cover 22 is fitted onto the cleaning tank body 21, forming a sealed cleaning space for cleaning the wafer cassette. The wafer cassette includes a box body and a cover body. The cover body is detachably connected to the box body. When the wafer cassette cleaning apparatus 100 is used to clean it, the cover body is connected to the cleaning tank cover 22, and the box body is located inside the cleaning tank body 21.

[0026] Please refer to Figures 1 to 4 This application provides a wafer cassette cleaning apparatus 100. The wafer cassette includes at least a first wafer cassette and a second wafer cassette. The first wafer cassette includes a first cover 11 and a first housing (not shown in the figure), with the first cover 11 detachably connected to the first housing. The second wafer cassette includes a second cover 12 and a second housing (not shown in the figure), with the second cover 12 detachably connected to the second housing. The first wafer cassette is a FOUP, and the second wafer cassette is a Frame FOUP, but the design is not limited to these specific types. Figure 3 The diagram shows the state of the Frame FOUP being attached to the first positioning component 31. Figure 4 The diagram shows the state of FOUP adsorbed onto the second positioning component 32.

[0027] Specifically, the wafer cell cleaning device 100 includes a cleaning tank body 21, a cleaning tank cover 22, a positioning structure 3, and a cleaning structure (not shown in the figure).

[0028] The cleaning tank 21 is a container with a specific volume, and its main structure can be made of corrosion-resistant materials, such as stainless steel or polymer. The inner wall of the cleaning tank 21 can be processed into a smooth surface to facilitate the circulation of the cleaning fluid and the discharge of dirt after cleaning.

[0029] The cleaning tank lid 22 is mechanically connected to the cleaning tank body 21 via a hinge or slide rail. When the cleaning tank lid 22 is closed and fitted onto the cleaning tank body 21, a sealed cleaning space is formed between the two. This cleaning space is used to accommodate the wafer cassette cover being cleaned and to ensure effective circulation of the cleaning fluid within it, preventing cleaning fluid spillage.

[0030] The positioning structure 3 includes a positioning plate 33 connected to the side of the cleaning bucket lid 22 near the cleaning bucket body 21. The positioning plate 33 is also provided with two sets of positioning components 30. The positioning components 30 include a first positioning component 31 and a second positioning component 32. The first positioning component 31 is connected to the side of the cleaning bucket lid 22 near the cleaning bucket body 21 and is used to adsorb and fix the first lid 11. By adsorbing and fixing the first lid 11 with the first positioning component 31, it can be ensured that the first lid 11 maintains a stable position during the cleaning process.

[0031] The second positioning component 32 is also connected to the side of the cleaning tub lid 22 closest to the cleaning tub body 21, and is used to adsorb and fix the second lid 12. The adsorption and fixation of the second lid 12 by the second positioning component 32 can ensure that the second lid 12 maintains a stable position during the cleaning process. The second positioning component 32 and the first positioning component 31 are arranged in an alternating manner, which can alternately accommodate the positioning requirements of different types of lids on the cleaning tub lid 22, and reduce the space occupied while avoiding physical interference.

[0032] A cleaning structure is connected to the inner wall of the cleaning tank 21 and is used to spray cleaning fluid into the wafer cassette. This structure can consist of multiple nozzles to ensure that the cleaning fluid can be sprayed onto the surface of the cover adhered to by the first positioning component 31 or the second positioning component 32. The cleaning fluid is sprayed through this structure to physically rinse and chemically clean the cover.

[0033] The wafer cassette cleaning device 100 described above, by integrating a first positioning component 31 and a second positioning component 32 staggered with the first positioning component 31 on the cleaning tank lid 22, can achieve universal adsorption and fixation of different types of wafer cassette lids (such as the first lid 11 and the second lid 12). Thus, a single device can handle wafer cassette lids of various specifications, effectively solving the problem of requiring dedicated cleaning equipment for each type of wafer cassette in traditional technologies. Furthermore, it can significantly reduce equipment procurement costs and greatly minimize the space occupied in high-value production areas such as cleanrooms, while simultaneously improving equipment utilization and production line flexibility.

[0034] In one alternative embodiment, please refer to Figure 2The positioning component 30 includes an adsorption component 34. Specifically, the first positioning component 31 is composed of two or more first adsorption components 341, which are adsorbed at different positions on the first cover 11; the second positioning component 32 is composed of two or more second adsorption components 342, which are adsorbed at different positions on the second cover 12; the first adsorption component 341 and the second adsorption component 342 have the same structure.

[0035] Specifically, both the first adsorption component 341 and the second adsorption component 342 are independent units capable of applying adsorption or fixing forces to the wafer cassette cover. They can firmly fix the wafer cassette cover to the positioning component to withstand the impact of the cleaning fluid during the cleaning process, ensuring that the cover does not shift or fall off under the action of the high-speed jet of cleaning fluid. This adsorption component can be a vacuum adsorption component, which uses negative pressure to adsorb and fix the cover. Specifically, it can be a suction cup with flexible sealing edges, where a pressure difference is created between the suction cup and the cover by drawing a vacuum, thereby achieving reliable adsorption. Alternatively, a mechanical clamping component can be used, which uses a mechanical structure to clamp and fix the edge or specific features of the cover. For example, a robotic arm with movable grippers can use a drive to close the grippers to hold the cover tightly. Alternatively, if the cover material is magnetic, an electromagnet or permanent magnet can be used for magnetic adsorption of the cover.

[0036] Meanwhile, "two or more first adsorption components 341 adsorb at different positions on the first cover 11" and "two or more second adsorption components 342 adsorb at different positions on the second cover 12" mean that these adsorption components have a certain spatial interval and distribution on the surface of the first cover 11 or the second cover 12, rather than being concentrated at a single point. This multi-point distribution aims to provide uniform support and multiple fixation to enhance overall stability. For example, the adsorption components can be symmetrically distributed, such as evenly distributing the adsorption components around the circumference of the cover or arranging them symmetrically with the center of the cover as the symmetrical point, forming a triangular, quadrilateral, or circular array; or, according to the structural characteristics of the first cover 11 or the second cover 12 itself, such as reinforcing ribs, positioning holes, flat areas, etc., the adsorption components can be arranged in positions that provide the best fixation effect and avoid interference.

[0037] Furthermore, the first adsorption component 341 and the second adsorption component 342 have the same structure. This can be achieved by adopting a standardized, universal adsorption component design that is compatible with the adsorption requirements of the first cover 11 and the second cover 12, without the need for customization for different cover types. This not only simplifies the manufacturing, procurement, and inventory management of components, reducing production costs, but also improves the versatility and ease of maintenance of the device. It allows the same cleaning device to efficiently and reliably handle different types of wafer cassette covers without frequent replacement or adjustment of the adsorption mechanism, thereby improving the efficiency and flexibility of the cleaning operation.

[0038] In one alternative embodiment, please refer to Figures 5 to 8 Both the first adsorption component 341 and the second adsorption component 342 include a vacuum suction cup 343, a ventilation pipe 345, and a suction nozzle 344. The vacuum suction cup 343 is used to adhere to the surface of the first cover 11 or the second cover 12, forming a sealed space with the positioning groove 13 of the first cover 11 or the second cover 12. One end of the suction nozzle 344 is connected to the ventilation pipe 345, and the other end is located within the sealed space and inserted into the positioning groove 13 of the first cover 11 or the second cover 12. When a vacuum is formed within the sealed space, the vacuum suction cup 343 adheres tightly to the surface of the first cover 11 or the second cover 12 under negative pressure.

[0039] The vacuum suction cup 343 is a device that uses the pressure difference between the inside and outside to generate adsorption force. By drawing a vacuum, a negative pressure is formed between the suction cup and the surface of the object being adsorbed. Under the action of the negative pressure, the vacuum suction cup 343 deforms and tightly adheres to the surface of the object, thus firmly adsorbing the object. The suction nozzle 344 is a mechanical structure used to precisely align and fix the position of the object being adsorbed. It restricts the planar movement and rotation of the object being adsorbed by cooperating with a specific structure (such as a positioning groove) on the object being adsorbed. The suction nozzle 344 is connected to the ventilation pipe 345 of the vacuum suction cup 343 and extends out of the adsorption surface of the vacuum suction cup 343, ensuring that the suction nozzle 344 can be accurately inserted into the positioning groove 13 on the cover during the adsorption operation, without affecting the sealing and adsorption effect of the vacuum suction cup 343. The suction nozzle 344 can be a pin-type suction nozzle, using a cylindrical or conical pin; or a bump-type suction nozzle, using a bump with a specific shape (such as rectangular or circular) to cooperate with the corresponding groove on the cover.

[0040] In this embodiment, when the wafer cassette cover is placed onto the first adsorption assembly 341 or the second adsorption assembly 342, the suction nozzle 344 is first inserted into the positioning groove 13 on the cover to achieve initial mechanical alignment and constraint. Subsequently, the vacuum suction cup 343 is activated, generating adsorption force through vacuuming to firmly adsorb the cover onto the adsorption assembly. Since the suction nozzle 344 is connected to the ventilation pipe 345 of the vacuum suction cup 343, its structural design ensures that the insertion of the suction nozzle 344 does not affect the sealing and adsorption effect of the vacuum suction cup 343. The mechanical limiting effect of the suction nozzle 344 and the adsorption force of the vacuum suction cup 343 work together to ensure the precise position and stability of the cover during the cleaning process.

[0041] The first adsorption component 341 and the second adsorption component 342 provided in this application embodiment can greatly reduce the possibility of displacement, shaking, or even detachment of the cover under the action of high-speed rotation or high-pressure jet cleaning fluid, thereby ensuring the uniformity and thoroughness of the cleaning effect and greatly reducing the risk of equipment failure. By combining the dual mechanisms of vacuum adsorption and mechanical positioning, this solution greatly improves the reliability and safety of the cleaning process while ensuring efficient cleaning.

[0042] In one alternative embodiment, please refer to Figures 9 to 11 The positioning structure 3 also includes a rotary drive assembly 35, which is connected to the side of the cleaning tank cover 22 away from the cleaning tank body 21. As a power source, the rotary drive assembly 35 converts electrical energy or other forms of energy into mechanical rotational motion and transmits it to the positioning disk 33. For example, the rotary drive assembly 35 can be a servo motor, which precisely controls its speed and angle to achieve precise control of the positioning disk 33; it can also be a stepper motor, which controls its step angle through pulse signals to achieve step-by-step or continuous rotation; or it can be a pneumatic motor, driven by compressed air, suitable for environments with high requirements for explosion-proof or cleanliness. This assembly is connected to the side of the cleaning tank cover 22 away from the cleaning tank body 21. This location is chosen to place the drive component outside the cleaning space, avoiding corrosion or contamination by the cleaning fluid, facilitating maintenance and repair, and not occupying cleaning space, ensuring smooth cleaning operations.

[0043] The positioning disk 33 is connected to the rotary drive assembly 35, and both the first positioning assembly 31 and the second positioning assembly 32 are connected to the positioning disk 33. The positioning disk 33 serves as a support component, used to mount the first positioning assembly 31 and the second positioning assembly 32, thereby adsorbing the first cover 11 or the second cover 12. The positioning disk 33 rotates under the action of the rotary drive assembly 35, thereby driving the cover to rotate. The positioning disk 33 can be a circular or polygonal flat plate with holes or mounting seats for mounting the positioning components; it can also be designed as a support structure with a specific shape to better adapt to the installation and fixation of different types of covers. The positioning disk 33 is connected to the rotary drive assembly 35 via mechanical connections (such as shafts, couplings, gears, etc.) to ensure that power can be reliably transmitted from the drive assembly to the positioning disk 33. Since both the first positioning assembly 31 and the second positioning assembly 32 are connected to the positioning disk 33, when the positioning disk 33 rotates, the first cover 11 or the second cover 12 adsorbed on these positioning components will rotate synchronously, thereby achieving full exposure of the cover during the cleaning process. This improves the uniformity and thoroughness of cleaning the wafer cassette cover, and further enhances cleaning efficiency and effectiveness.

[0044] In one alternative embodiment, please refer to Figure 2 Both the first cover 11 and the second cover 12 are provided with lock holes and fixing areas (not shown in the figure). The wafer cassette cleaning device 100 also includes an unlocking component 60 disposed on the positioning disk 33. The unlocking component 60 is used to correspond to the lock holes of the first cover 11 or the second cover 12, and two sets of positioning components 30 (the first positioning component 31 and the second positioning component 32) are respectively used to correspond to and fix to the fixing areas of the first cover 11 and the second cover 12.

[0045] This can be understood as follows: the positioning disc 33 has one and only one set of unlocking components 60, corresponding to two sets of positioning components 30. Both the first cover 11 and the second cover 12 can be locked or unlocked using the unlocking components 60. It can also be understood as follows: the relative positions of the pair of lock holes on the first cover 11 and the second cover 12 are consistent. Please refer to [reference needed]. Figure 2 The positioning disk 33 is provided with a pair of unlocking components 60 at a certain distance to lock or unlock the first cover 11 or the second cover 12.

[0046] In one alternative embodiment, please refer to Figures 2 to 4 The positioning plate 33 is provided with a first mounting part 331 and a second mounting part 332, and the first mounting part 331 and the second mounting part 332 form a height difference along the plane perpendicular to the washing tub cover 22. The first positioning component 31 and the second positioning component 32 are respectively located on the first mounting part 331 and the second mounting part 332.

[0047] It can be understood that when fixing the first cover 11 or the second cover 12, there is a situation where the first positioning component 31 or the second positioning component 32 interferes with the fixing of the second cover 12 or the first cover 11.

[0048] Please refer to Figure 4 , Figure 4 The diagram shows the second cover 12 fixed to the second positioning component 32, covering the first positioning component 31. In the plane from the cleaning bucket lid 22 toward the cleaning bucket body 21 and perpendicular to the plane where the cleaning bucket lid 22 is located, the second mounting part 332 is higher than the first mounting part 331. That is, when the second cover 12 is fixed to the second positioning component 32, the first positioning component 31 located on the first mounting part 331 will not interfere with the fixing of the second cover 12.

[0049] This embodiment of the application provides a first mounting part 331 and a second mounting part 332 to the positioning disk 33, with a height difference between them, thereby avoiding interference when positioning the first cover 11 or the second cover 12. Furthermore, by providing the positioning disk 33 with the first mounting part 331 and the second mounting part 332 having a height difference, the structure is simple and ensures the stability of wafer cell operation.

[0050] In one alternative embodiment, please refer to Figures 8 to 10 The unlocking component 60 includes an unlocking drive component 61 and a rotary rod 62. The unlocking drive component 61 is connected to the side of the cleaning tank cover 22 away from the cleaning tank body 21; the rotary rod 62 is connected to the unlocking drive component 61, and under the driving action of the unlocking drive component 61, the rotary rod 62 can pass through the cleaning tank cover 22 and be inserted into the lock hole of the first cover body 11 or the second cover body 12 to rotate, so as to unlock or lock the first wafer cassette or the second wafer cassette.

[0051] Specifically, the unlocking drive assembly 61 is an actuator that provides power to the rotary lever 62 to perform unlocking or locking operations. This drive assembly can be an electric motor, a pneumatic cylinder, or a hydraulic cylinder. The rotary lever 62 is the component in the unlocking assembly 60 that directly interacts with the locking hole of the wafer cassette cover. The end of the rotary lever 62 is adapted to the locking hole structure on the first cover 11 or the second cover 12 to ensure accurate insertion and effective rotational movement.

[0052] The unlocking component 60 in this embodiment enables automatic unlocking and locking of the wafer cassette cover and the cassette body. Before or after wafer cassette cleaning, it can automatically release or apply the lock to the cover without manual intervention, improving the automation level and operational efficiency of the cleaning process. Therefore, this cleaning device can continuously and efficiently perform wafer cassette cover cleaning operations, significantly improving cleaning efficiency and automation while reducing the intensity of manual operation.

[0053] For further information, please continue to refer to [link / reference]. Figures 9 to 11 The unlocking drive assembly 61 includes a first drive member 611 and a second drive member 612. The first drive member 611 is connected to the side of the cleaning tub cover 22 away from the cleaning tub body 21. One end of the second drive member 612 is connected to the first drive member 611, and the other end is connected to the rotary rod 62. The rotary rod 62 moves in a straight line and rotates under the respective driving action of the first drive member 611 and the second drive member 612.

[0054] Specifically, the first driving element 611 is a power source or transmission mechanism capable of providing linear motion to the rotary rod 62. The first driving element 611 can be a linear drive mechanism, for example, it can be a cylinder or hydraulic cylinder, which controls the air pressure or hydraulic pressure to push the piston rod to achieve the linear reciprocating motion of the rotary rod 62; or it can be a linear motor, which directly drives the rotary rod 62 to move in a linear direction through electromagnetic force. Linear motors have fast response speed and high positioning accuracy.

[0055] The second driving component 612 is a power source or transmission mechanism that provides rotational motion to the rotating rod 62. The second driving component 612 can be a rotary drive mechanism, for example, a stepper motor or servo motor can be used to directly drive the rotating rod 62 to perform precise angular rotation; alternatively, a gear transmission mechanism can be used to transmit the rotational motion of the input shaft to the rotating rod 62 through gear meshing, and can achieve deceleration or acceleration. Furthermore, the second driving component 612 can also be a belt drive mechanism, connecting the drive wheel and the driven wheel via a belt, thereby driving the rotating rod 62 to rotate. One end of the second driving component 612 is connected to the first driving component 611, and the other end is connected to the rotating rod 62, thus effectively transmitting the power of the first driving component 611 to the rotating rod 62, achieving power distribution and conversion.

[0056] In this embodiment, the first driving member 611 provides precise linear displacement of the rotating rod 62, ensuring that the rotating rod 62 can be accurately inserted into or pulled out of the lock hole of the first cover 11 or the second cover 12. Simultaneously, the second driving member 612 drives the rotating rod 62 to perform precise rotational movement to complete the unlocking or locking operation. This separate driving mechanism avoids motion conflicts, improves the accuracy and reliability of motion control, and makes the unlocking or locking process smoother and more efficient.

[0057] In one alternative embodiment, please refer to Figure 1 and Figure 2 The wafer cassette cleaning device 100 also includes a plurality of limiting members 70, which are connected to the side surface of the positioning disk 33 near the cleaning tank 21. The limiting members 70 protrude from the surface of the positioning disk 33 and are adapted to the limiting grooves of the first cover 11 or the second cover 12. The limiting members 70 are used to limit the position of the first cover 11 or the second cover 12 connected to the positioning disk 33.

[0058] Specifically, the multiple limiting elements 70 are structures used to physically constrain the movement of the first cover 11 or the second cover 12. The limiting elements 70 can be manifested as protrusions, pins, or guide posts fixed to the positioning disk 33. The limiting elements 70 protrude from the surface of the positioning disk 33, forming a physical barrier to prevent radial or tangential displacement of the first cover 11 or the second cover 12 during rotation. The limiting elements 70 are adapted to the limiting grooves of the first cover 11 or the second cover 12 to ensure a precise fit between the limiting elements 70 and the first cover 11 or the second cover 12, achieving reliable positioning.

[0059] In this embodiment, the limiting member 70 can be precisely inserted into the corresponding limiting groove, forming a reliable mechanical interlock. This physical constraint mechanism can effectively prevent the first cover 11 or the second cover 12 from shifting or loosening in the radial, tangential, or rotational direction due to centrifugal force or other dynamic loads during high-speed rotation cleaning under the action of the rotary drive assembly 35. This significantly improves the positioning accuracy and fixing stability of the first cover 11 or the second cover 12 on the positioning plate 33, ensuring that the first cover 11 or the second cover 12 remains in the optimal cleaning position throughout the cleaning process. This ensures that the cleaning fluid can act evenly and fully on all surfaces of the first cover 11 or the second cover 12 to be cleaned, guaranteeing the cleaning effect.

[0060] In one alternative embodiment, please refer to Figure 8 and Figure 9 The rotary drive assembly 35 also includes a rotary shaft 351, which passes through the cleaning tank cover 22 and is connected to the positioning plate 33. The rotary shaft 351 has a conveying channel inside, and one end of the conveying channel is connected to the first positioning assembly 31 and the second positioning assembly 32. The wafer cassette cleaning device 100 also includes a negative pressure structure and a pneumatic slip ring 80, which is connected between the conveying channel and the negative pressure structure.

[0061] The conveying channel is a pipe located inside the rotating shaft 351. Its main function is to provide a stable medium transmission path for the vacuum adsorption system, unaffected by rotation. By integrating the conveying channel inside the rotating shaft 351, problems such as entanglement, twisting, or breakage of the external hose during rotation can be effectively avoided, thus ensuring the continuity and stability of vacuum adsorption.

[0062] The negative pressure structure is the core power source providing vacuum adsorption force. It generates and maintains an environment below atmospheric pressure, allowing the first positioning component 31 and the second positioning component 32 to firmly adsorb the wafer cassette cover via the vacuum suction cup 343. A stable negative pressure supply is crucial to ensuring the wafer cassette cover does not detach during the cleaning process. The negative pressure structure can be a vacuum pump, such as a rotary vane vacuum pump, a diaphragm vacuum pump, or a turbomolecular pump. It can also be a vacuum generator using the Venturi effect, producing negative pressure through compressed air.

[0063] A pneumatic slip ring 80 is a device that allows continuous transfer of gas or fluid between rotating and stationary components. In this embodiment, the pneumatic slip ring 80 connects a rotating delivery channel to a fixed negative pressure structure, ensuring that the negative pressure structure continuously provides a vacuum to the delivery channel while the rotating shaft 351 continues to rotate, and preventing the gas pipe from becoming entangled.

[0064] This embodiment of the application, by integrating the conveying channel inside the rotating shaft 351 and introducing a pneumatic slip ring 80, effectively avoids the possibility of pipe entanglement or connection interruption in the vacuum adsorption system due to rotation during the wafer cassette cover rotation cleaning process. Furthermore, it not only ensures the secure fixing of the wafer cassette cover during cleaning, preventing it from falling off or shifting, but also ensures the continuity and efficiency of the cleaning process, while significantly improving the reliability and automation level of the wafer cassette cleaning device 100.

[0065] It should be understood that the above embodiments are exemplary and not intended to encompass all possible implementations. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. A wafer cell cleaning device, characterized in that, The wafer cassette includes at least a first wafer cassette and a second wafer cassette, the first wafer cassette including a first cover (11) and the second wafer cassette including a second cover (12); the wafer cassette cleaning device (100) includes: Clean the tank (21); The cleaning bucket lid (22) is openable and closable and connected to the cleaning bucket body (21). When the cleaning bucket lid (22) is installed on the cleaning bucket body (21), the cleaning bucket lid (22) and the cleaning bucket body (21) constitute a cleaning space for cleaning the wafer cassette. The positioning structure (3) includes a positioning plate (33) connected to the side of the cleaning bucket cover (22) near the cleaning bucket body (21). The positioning plate (33) is provided with two sets of positioning components (30). One set of positioning components (30) is used to fix the first cover (11); the other set of positioning components (30) is used to fix the second cover (12). The two sets of positioning components (30) are staggered. The cleaning structure is connected inside the cleaning tank (21) and can spray cleaning liquid toward the cleaning tank cover (22) to clean the first cover (11) or the second cover (12). Both the first cover (11) and the second cover (12) are provided with lock holes and fixing areas; the wafer cassette cleaning device (100) also includes an unlocking component (60) provided on the positioning plate (33). The unlocking component (60) is used to correspond to the lock hole of the first cover (11) or the second cover (12), and the two sets of positioning components (30) are respectively used to correspond to and fix the fixed areas of the first cover (11) and the second cover (12); The positioning plate (33) includes a first mounting part (331) and a second mounting part (332), and there is a height difference between the first mounting part (331) and the second mounting part (332) in a plane direction perpendicular to the cleaning bucket cover (22); The positioning component (30) includes an adsorption structure (34) that extends at least partially into the first cover (11) or the second cover (12). The adsorption structure (34) includes: Ventilation duct (345); A vacuum suction cup (343) is used to adhere to the surface of the first cover (11) or the second cover (12) and form a sealed space with the positioning groove of the first cover (11) or the second cover (12); The nozzle (344) has one end connected to the ventilation pipe (345) and the other end located in the sealed space and inserted into the positioning groove; When a vacuum is formed in the sealed space, the vacuum suction cup (343) adheres tightly to the surface of the first cover (11) or the second cover (12) under the action of negative pressure.

2. The wafer cassette cleaning apparatus according to claim 1, characterized in that, The positioning structure (3) includes: A rotary drive assembly (35) is connected to the side of the cleaning tub cover (22) away from the cleaning tub body (21). The rotary drive assembly (35) is connected to the positioning disk (33) in a transmission connection, and the positioning assembly (30) is connected to the positioning disk (33). The first cover (11) or the second cover (12) rotates with the positioning disk (33) under the action of the rotary drive assembly (35).

3. The wafer cassette cleaning apparatus according to claim 1, characterized in that, The unlocking component (60) includes: Unlock the drive assembly (61), which is connected to the side of the cleaning tub cover (22) away from the cleaning tub body (21); A rotary rod (62) is connected to the unlocking drive assembly (61). Under the driving action of the unlocking drive assembly (61), the rotary rod (62) can pass through the cleaning bucket cover (22) and be inserted into the lock hole of the first cover (11) or the second cover (12) to rotate, so as to unlock or lock the first wafer box or the second wafer box.

4. The wafer cassette cleaning apparatus according to claim 3, characterized in that, The unlocking driver component (61) includes: The first driving component (611) is connected to the side of the cleaning tub cover (22) away from the cleaning tub body (21); The second driving member (612) has one end connected to the first driving member (611) and the other end connected to the rotating rod (62). The rotating rod (62) moves in a straight line and rotates under the driving action of the first driving member (611) and the second driving member (612) respectively.

5. The wafer cassette cleaning apparatus according to claim 1, characterized in that, The wafer cell cleaning apparatus (100) further includes: Multiple limiting members (70) are connected to the side surface of the positioning disk (33) near the cleaning tub (21). The limiting members (70) protrude from the surface of the positioning disk (33) and are adapted to the limiting groove of the first cover (11) or the second cover (12). The limiting members (70) are used to limit the position of the first cover (11) or the second cover (12) connected to the positioning disk (33).

6. The wafer cassette cleaning apparatus according to claim 2, characterized in that, The rotary drive assembly (35) includes a rotary shaft (351), which passes through the cleaning bucket cover (22) and is connected to the positioning plate (33). The rotary shaft (351) has a conveying channel inside, and one end of the conveying channel is connected to the positioning assembly (30).

7. The wafer cassette cleaning apparatus according to claim 6, characterized in that, The wafer cell cleaning apparatus (100) further includes: Negative pressure structure; A pneumatic slip ring (80) is connected between the conveying channel and the negative pressure structure.

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