An adjusting mechanism of an image sensor chip packaging mold

By introducing a motor-driven bidirectional threaded rod and adjustment plate structure into the image sensor chip packaging mold, the problem of uneven flow during the dispensing process is solved, achieving precise adjustment and uniformity of dispensing, and improving packaging quality and efficiency.

CN122275243APending Publication Date: 2026-06-26SHENZHEN YIHAO PRECISION SEMICON EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN YIHAO PRECISION SEMICON EQUIP CO LTD
Filing Date
2026-03-31
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing image sensor chip packaging molds lack real-time, precise, and stable control of adhesive flow during the encapsulation process, leading to packaging quality defects such as non-dense encapsulation adhesive, air bubbles, voids, and adhesive overflow, making it difficult to meet the requirements of high-precision and high-consistency chip packaging.

Method used

An adjustment mechanism for an image sensor chip packaging mold is adopted. A motor drives a bidirectional threaded rod to move an adjustment plate inside a guide tube. Combined with an S-shaped guide groove and a movable ball, it enables flexible and precise adjustment of the glue injection flow rate. In conjunction with the guide plate and extrusion assembly, it ensures uniform glue injection and sealing.

Benefits of technology

It enables flexible and precise adjustment of the glue flow rate during the encapsulation process, improving the encapsulation quality and efficiency of image sensor chips, avoiding defects such as glue accumulation and insufficient glue, and improving the encapsulation yield and sealing reliability.

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Abstract

This invention relates to the field of semiconductor chip packaging mold technology, and discloses an adjustment mechanism for an image sensor chip packaging mold. The mechanism includes a base plate, a top plate fixedly connected to the top of the base plate, a driving assembly on the top of the top plate, an upper mold fixedly connected to the bottom of the driving assembly, a lower mold fixedly connected to the top of the base plate, a guide tube fixedly connected to the outside of the lower mold, a fixed frame fixedly connected to the outside of the guide tube, a power assembly inside the fixed frame, a movable ball fixedly connected to one end of the power assembly, and an adjustment plate movably connected to the outside of the movable ball. In this invention, the glue injection flow rate is adjusted by changing the spacing between the adjustment plates to adjust the cross-section of the glue injection channel. Simultaneously, the flow rate adjustment is further refined and the glue injection uniformity is improved by utilizing the S-shaped guide groove on the adjustment plate, the angle adjustment of the guide plate driven by the movable ball, and the guide holes on the movable shaft, thus avoiding defects such as glue accumulation and insufficient glue.
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