Matrix nozzle module for semiconductor chip testing

Abstract

This invention provides a matrix-type suction nozzle module for semiconductor chip testing, including an air path fixing block, two air path adapter blocks, a power cylinder fixing layer, a micro cylinder, a vacuum layer fixing block, and several vacuum nozzles arranged in a matrix. The two air path adapter blocks are symmetrically arranged on both sides of the air path fixing block, and the air path adapter blocks are respectively connected to the power cylinder fixing layer and the vacuum layer fixing block to achieve air path communication. The power cylinder fixing layer is located at the bottom of the air path fixing block and is connected to the air path of the air path fixing block. The vacuum nozzles are installed on the side of the vacuum layer fixing block facing the chip to be picked up. The micro cylinders are arranged on the power cylinder fixing layer and are arranged one-to-one with the vacuum nozzles. The micro cylinders are drivenly connected to the corresponding vacuum nozzles to achieve individual extension and retraction control of the vacuum nozzles. The suction nozzle module of this invention adopts a matrix-arranged vacuum nozzle design, which can pick up multiple chips at once, thereby increasing the number of chips picked up during semiconductor chip testing.

Description

Technical Field

[0001] This invention belongs to the technical field of semiconductor chip testing, and in particular relates to a matrix nozzle module for semiconductor chip testing. Background Technology

[0002] The development of China's semiconductor industry has driven a continuous increase in demand for chip testing, making multi-chip simultaneous testing an inevitable trend. As a core component for chip pick-up and transfer during testing, the chip nozzle module's structural design directly impacts production efficiency. Existing chip nozzle modules mostly employ a side-by-side design, which results in low space utilization and a large overall module size, limiting the number of chips that can be picked up at a time and failing to meet the industry's cycle time requirements. Furthermore, traditional nozzle modules lack separate designs for power transmission and negative pressure vacuum, and the nozzle control method is relatively simple, failing to achieve independent extension and vacuum control of individual nozzles. This further restricts the module's adaptability and efficiency, making it difficult to meet the actual production needs of simultaneous testing of multiple semiconductor chips. Summary of the Invention

[0003] The main objective of this invention is to provide a matrix-type nozzle module for semiconductor chip testing, addressing the shortcomings of existing technologies.

[0004] To achieve the above objectives, the present invention provides the following technical solution: A matrix-type suction nozzle module for semiconductor chip testing includes an air path fixing block, two air path adapter blocks, a power cylinder fixing layer, a micro cylinder, a vacuum layer fixing block, and several vacuum nozzles arranged in a matrix. The two air path adapter blocks are symmetrically arranged on both sides of the air path fixing block. The air path adapter blocks are connected to the power cylinder fixing layer and the vacuum layer fixing block respectively to achieve air path communication. The power cylinder fixing layer is located at the bottom of the air path fixing block and is connected to the air path of the air path fixing block. The vacuum nozzles are installed on the side of the vacuum layer fixing block facing the chip to be suctioned. The micro cylinders are arranged on the power cylinder fixing layer and are arranged one-to-one with the vacuum nozzles. The output end of the micro cylinder is drivenly connected to the corresponding vacuum nozzle to realize the individual extension and retraction control of the vacuum nozzle.

[0005] Preferably, the air circuit adapter block is provided with a cylinder power air pipe connector and a vacuum air pipe connector, the cylinder power air pipe connector is connected to the internal air circuit of the power cylinder fixing layer, and the vacuum air pipe connector is connected to the internal air circuit of the vacuum layer fixing block.

[0006] Preferably, the cylinder power air pipe connector and the vacuum air pipe connector are arranged in an alternating array on the air passage adapter block.

[0007] Preferably, a compression spring is provided between the miniature cylinder and the vacuum nozzle, and the compression spring is sleeved on the outside of the connection between the output end of the miniature cylinder and the vacuum nozzle.

[0008] Preferably, the air passage fixing block and the power cylinder fixing layer, and the power cylinder fixing layer and the vacuum layer fixing block are both positioned and connected by locating pins.

[0009] Preferably, the air passage fixing block, the power cylinder fixing layer, and the vacuum layer fixing block are all provided with a plurality of positioning holes, and each positioning pin is adapted to and cooperates with the corresponding positioning hole.

[0010] Preferably, the power cylinder fixing layer is an independently set power layer structure, and the vacuum layer fixing block is an independently set negative pressure vacuum layer structure. The power layer structure and the negative pressure vacuum layer structure are designed to be separate from each other.

[0011] Preferably, the outer wall of the air path adapter block is provided with splicing holes, and multiple matrix nozzle modules can be spliced ​​together through the splicing holes to form an extended matrix nozzle module.

[0012] Preferably, the vacuum nozzles are arranged in an N×M matrix, where N and M are both positive integers greater than or equal to 2.

[0013] Preferably, the bottom of the vacuum nozzle is provided with a flexible nozzle head, and the end face of the flexible nozzle head that contacts the chip has an annular vacuum groove.

[0014] Compared with the prior art, the present invention will have at least the following beneficial effects: The matrix suction nozzle module for semiconductor chip testing of the present invention adopts a matrix arrangement of vacuum nozzles, and with the one-to-one correspondence between the micro cylinder and the vacuum nozzle, it realizes the individual extension and retraction control of each vacuum nozzle. At the same time, combined with an independent vacuum control branch, it can individually control the suction and vacuum breaking operation of each chip.

[0015] The power layer and negative pressure vacuum layer of the matrix nozzle module for semiconductor chip testing of the present invention adopt a separate structural design. With the air pipe connectors distributed in an alternating array, the air path transmission is more orderly. Each component is precisely assembled through the matching and cooperation of positioning pins and positioning holes. The whole is an integrated design, which greatly reduces the space occupation and makes the module structure lighter.

[0016] The matrix nozzle module for semiconductor chip testing of the present invention can be expanded by splicing multiple modules through the splicing holes on the outside of the air path adapter block, so as to pick up more chips at one time, effectively increasing the number of chips picked up in the semiconductor chip testing process, meeting the industry's need for simultaneous testing of multiple chips, and improving the production efficiency of the chip testing process. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely exemplary embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort, wherein: Figure 1 This is a schematic diagram of the structure of the matrix nozzle module for semiconductor chip testing according to the present invention; Figure 2 This is a top view of the matrix nozzle module for semiconductor chip testing according to the present invention; Figure 3 for Figure 2 Enlarged view of point A in the image; Figure 4 This is a cross-sectional view of the matrix nozzle module for semiconductor chip testing according to the present invention; Figure 5 for Figure 4 Enlarged view of point B in the image; Figure 6 This is a bottom view of the matrix nozzle module for semiconductor chip testing according to the present invention; Figure 7 This is a schematic diagram of the matrix nozzle module for semiconductor chip testing according to the present invention from another perspective.

[0018] The reference numerals in the figures include: 1. Air path fixing block; 2. Air path adapter block; 3. Power cylinder fixing layer; 4. Miniature cylinder; 5. Vacuum layer fixing block; 6. Vacuum nozzle; 7. Cylinder power air pipe connector; 8. Vacuum air pipe connector; 9. Compression spring; 10. Positioning pin; 11. Positioning hole; 12. Splicing hole; 13. Flexible nozzle head; 14. Vacuum groove. Detailed Implementation

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely exemplary embodiments of the present invention, and not the only embodiments.

[0020] like Figures 1 to 7As shown, the matrix nozzle module for semiconductor chip testing mainly includes an air path fixing block 1, two air path adapter blocks 2, a power cylinder fixing layer 3, a miniature cylinder 4, a vacuum layer fixing block 5, and several vacuum nozzles 6 arranged in a matrix.

[0021] The vacuum nozzles 6 are arranged in an N×M matrix, where N and M are both positive integers greater than or equal to 2. In this embodiment, there are 64 vacuum nozzles 6, which are evenly arranged in a matrix on the vacuum layer fixing block 5 to achieve synchronous pick-up of 64 chips.

[0022] Two air path adapter blocks 2 are symmetrically arranged on both sides of the air path fixing block 1. The two ends of the air path adapter blocks 2 are fixedly connected to the power cylinder fixing layer 3 and the vacuum layer fixing block 5 respectively, and the air paths are connected. The power cylinder fixing layer 3 is located at the bottom of the air path fixing block 1, and the internal air path of the power cylinder fixing layer 3 is connected to the internal air path of the air path fixing block 1. The vacuum nozzle 6 is installed on the side of the vacuum layer fixing block 5 facing the chip to be picked up. The micro cylinders 4 are evenly distributed on the power cylinder fixing layer 3, and the micro cylinders 4 and the vacuum nozzles 6 are arranged in a one-to-one correspondence. The output end of the micro cylinder 4 is connected to the corresponding vacuum nozzle 6 through transmission. The extension and retraction of the micro cylinder 4 drives the vacuum nozzle 6 to complete the extension and retraction, realizing the individual extension and retraction control of each vacuum nozzle 6.

[0023] The outer wall of the air path adapter block 2 is provided with splicing holes 12. Multiple matrix nozzle modules can be spliced ​​together through splicing holes 12 to form an expanded matrix nozzle module. In actual testing operations, two or more modules can be spliced ​​together according to the number of chip testing stations required, so that the overall nozzle array can be further expanded, thereby picking up more chips at one time, significantly improving the overall throughput and work efficiency of chip testing. After splicing, each module still maintains independent control and collaborative work, without affecting the independent action and vacuum on / off control of a single nozzle.

[0024] The air circuit adapter block 2 is equipped with a cylinder power air pipe connector 7 and a vacuum air pipe connector 8. The air outlet of the cylinder power air pipe connector 7 is connected to the internal air circuit of the power cylinder fixing layer 3 to provide a power air source for the action of the micro cylinder 4. The air outlet of the vacuum air pipe connector 8 is connected to the internal air circuit of the vacuum layer fixing block 5 to provide negative pressure vacuum suction for the vacuum nozzle 6 to pick up the chip.

[0025] The cylinder power air pipe connector 7 and the vacuum air pipe connector 8 are arranged in an alternating array on the air circuit adapter block 2. This arrangement makes the layout of the power air circuit and the vacuum air circuit more regular, avoids air circuit cross-interference, improves the stability of air circuit transmission, and facilitates the quick connection and arrangement of external air pipes, reducing the risk of incorrect air circuit connection and air leakage.

[0026] A compression spring 9 is provided between the miniature cylinder 4 and the vacuum nozzle 6. The compression spring 9 is sleeved on the outside of the connection between the output end of the miniature cylinder 4 and the vacuum nozzle 6. During the process of the miniature cylinder 4 driving the vacuum nozzle 6 to extend and retract, the compression spring 9 can provide elastic support to realize the extension and retraction reset of the vacuum nozzle 6, making the movement of the vacuum nozzle 6 more stable. At the same time, it plays a buffering role when the nozzle contacts the chip, avoiding damage to the chip caused by rigid contact.

[0027] The air passage fixing block 1 and the power cylinder fixing layer 3, as well as the power cylinder fixing layer 3 and the vacuum layer fixing block 5, are both positioned and connected by locating pins 10. It should be noted that... Figure 7 Only two positioning pins 10 are shown in the figure, which cannot be limited to the fact that there are only two positioning pins 10 in this embodiment. The number of positioning pins 10 used is determined according to the actual situation.

[0028] Several positioning holes 11 are provided through the air passage fixing block 1, the power cylinder fixing layer 3, and the vacuum layer fixing block 5. The position and number of positioning holes 11 are adapted to the overall structure of the module. Each positioning pin 10 is adapted to and cooperates with the corresponding positioning hole 11. The precise assembly of each component is achieved through the cooperation of the positioning pin 10 and the positioning hole 11, ensuring the coaxiality and assembly accuracy of the overall structure of the module, and ensuring smooth air passage and accurate nozzle positioning.

[0029] The power cylinder fixing layer 3 is an independently set power layer structure, and the vacuum layer fixing block 5 is an independently set negative pressure vacuum layer structure. The power layer structure and the negative pressure vacuum layer structure are designed to be separate from each other, so that the power transmission and negative pressure vacuum air paths are completely independent, avoiding mutual interference between the two types of air paths. At the same time, it makes the structure design of the nozzle module more refined, which is convenient for subsequent maintenance and repair. When a single air path or component fails, it can be troubleshooted and handled in a targeted manner without affecting the other functions of the overall module.

[0030] The bottom of the vacuum nozzle 6 is provided with a flexible nozzle head 13. The end face of the flexible nozzle head 13 that contacts the chip has an annular vacuum groove 14. The flexible nozzle head 13 can adapt to the surface shape of the chip and improve the adsorption fit. The annular vacuum groove 14 can enhance the uniformity and sealing of the vacuum suction, making the chip more stable during the suction and transfer process and less prone to displacement or falling off. At the same time, it further reduces the possibility of the chip surface being scratched or crushed.

[0031] The matrix-type suction nozzle module for semiconductor chip testing in this embodiment features an integrated structural design. It integrates the air path fixing block 1, air path adapter block 2, power cylinder fixing layer 3, vacuum layer fixing block 5, and various functional components into a single unit. This significantly reduces space occupancy while maintaining performance, making the overall structure of the nozzle module more compact and adaptable to the installation requirements of a wider range of semiconductor chip testing equipment. Each vacuum nozzle 6 is equipped with an independent vacuum control branch, allowing for individual control of suction and vacuum breaking of a single vacuum nozzle 6. This enhances the adaptability of the nozzle module, meeting the suction requirements of different numbers of chips. When encountering a defective chip, the corresponding nozzle can be individually controlled not to perform a suction action, improving the flexibility of the testing process.

[0032] The working principle of the matrix nozzle module for semiconductor chip testing in this embodiment is as follows: After the cylinder power air pipe connector 7 is connected to the power air source, the air source enters the air path fixing block 1 through the air path adapter block 2, and then is delivered by the air path fixing block 1 to the internal air path of the power cylinder fixing layer 3 to provide power to each micro cylinder 4. The micro cylinder 4 performs extension and retraction actions according to the control command, and its output end drives the corresponding vacuum nozzle 6 to complete the extension and retraction, realizing the individual control of the vacuum nozzle 6 extending to the chip picking position or retracting. After the vacuum air pipe connector 8 is connected to the negative pressure vacuum source, the vacuum source is delivered to the internal air path of the vacuum layer fixing block 5 through the air path adapter block 2 to provide negative pressure vacuum suction to each vacuum nozzle 6. After the vacuum nozzle 6 extends to the designated position, it completes the chip picking action under the action of negative pressure. When it is necessary to release the chip, the vacuum branch of the corresponding vacuum nozzle 6 breaks the vacuum, and the chip can be detached from the vacuum nozzle 6.

[0033] During the extension and retraction of the vacuum nozzle 6 driven by the micro cylinder 4, the compression spring 9 undergoes elastic deformation along with the movement of the vacuum nozzle 6, providing elastic support for the extension and retraction of the vacuum nozzle 6 and ensuring the smoothness of the extension and retraction and the accuracy of its reset. The matching fit between the positioning pin 10 and the positioning hole 11 ensures the assembly accuracy between the air path fixing block 1, the power cylinder fixing layer 3, and the vacuum layer fixing block 5, avoiding relative misalignment of components that could lead to air path connection failure or nozzle positioning deviation, thus ensuring the stability of power transmission and vacuum adsorption. The separate design of the power cylinder fixing layer 3 and the vacuum layer fixing block 5 allows the power air path and the vacuum air path to be completely independent, avoiding mutual interference between the two types of air paths and ensuring the respective working efficiency of power transmission and vacuum adsorption. The matrix-arranged 64 vacuum nozzles 6 can simultaneously complete the suction or release action, realizing the synchronous pick-up and transfer of multiple chips. After multi-module splicing expansion through the splicing hole 12, the overall module can maintain a consistent action logic and air path control method, stably realizing the synchronous pick-up and transfer of larger-scale chips, meeting the chip testing needs of higher production capacity.

[0034] The above description is merely a preferred embodiment of the present invention, and the scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A matrix nozzle module for semiconductor chip testing, characterized in that, The device includes an air path fixing block (1), two air path adapter blocks (2), a power cylinder fixing layer (3), a micro cylinder (4), a vacuum layer fixing block (5), and several vacuum nozzles (6) arranged in a matrix. The two air path adapter blocks (2) are symmetrically arranged on both sides of the air path fixing block (1). The air path adapter blocks (2) are connected to the power cylinder fixing layer (3) and the vacuum layer fixing block (5) respectively to achieve air path communication. The power cylinder fixing layer (3) is located at the bottom of the air path fixing block (1) and is connected to the air path of the air path fixing block (1). The vacuum nozzles (6) are installed on the side of the vacuum layer fixing block (5) facing the chip to be sucked. The micro cylinders (4) are arranged on the power cylinder fixing layer (3) and are arranged one-to-one with the vacuum nozzles (6). The output end of the micro cylinder (4) is connected to the corresponding vacuum nozzle (6) to realize the individual extension and retraction control of the vacuum nozzle (6).

2. The matrix nozzle module for semiconductor chip testing according to claim 1, characterized in that, The air circuit adapter block (2) is provided with a cylinder power air pipe connector (7) and a vacuum air pipe connector (8). The cylinder power air pipe connector (7) is connected to the internal air circuit of the power cylinder fixing layer (3), and the vacuum air pipe connector (8) is connected to the internal air circuit of the vacuum layer fixing block (5).

3. The matrix nozzle module for semiconductor chip testing according to claim 2, characterized in that, The cylinder power air pipe connector (7) and the vacuum air pipe connector (8) are arranged in an alternating array on the air circuit adapter block (2).

4. The matrix nozzle module for semiconductor chip testing according to claim 1, characterized in that, A compression spring (9) is provided between the miniature cylinder (4) and the vacuum nozzle (6). The compression spring (9) is sleeved on the outside of the connection between the output end of the miniature cylinder (4) and the vacuum nozzle (6).

5. The matrix nozzle module for semiconductor chip testing according to claim 1, characterized in that, The air passage fixing block (1) and the power cylinder fixing layer (3), and the power cylinder fixing layer (3) and the vacuum layer fixing block (5) are all positioned and connected by positioning pins (10).

6. The matrix nozzle module for semiconductor chip testing according to claim 5, characterized in that, The air passage fixing block (1), the power cylinder fixing layer (3) and the vacuum layer fixing block (5) are all provided with a number of positioning holes (11), and each positioning pin (10) is adapted to and cooperates with the corresponding positioning hole (11).

7. The matrix nozzle module for semiconductor chip testing according to claim 1, characterized in that, The power cylinder fixing layer (3) is an independently set power layer structure, and the vacuum layer fixing block (5) is an independently set negative pressure vacuum layer structure. The power layer structure and the negative pressure vacuum layer structure are designed to be separated from each other.

8. The matrix nozzle module for semiconductor chip testing according to claim 1, characterized in that, The outer wall of the air path adapter block (2) is provided with splicing holes (12), and multiple matrix nozzle modules can be spliced ​​together through the splicing holes (12) to form an extended matrix nozzle module.

9. The matrix nozzle module for semiconductor chip testing according to claim 1, characterized in that, The vacuum nozzle (6) is arranged in an N×M matrix, where N and M are both positive integers greater than or equal to 2.

10. The matrix nozzle module for semiconductor chip testing according to claim 1, characterized in that, The bottom of the vacuum nozzle (6) is provided with a flexible nozzle head (13), and the end face of the flexible nozzle head (13) that contacts the chip is provided with an annular vacuum groove (14).

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