Heat dissipation assembly, motherboard module and electronic device

Abstract

This invention discloses a heat dissipation component, a motherboard module, and an electronic device. The heat dissipation component is configured to be thermally coupled to a first heat source and a second heat source with a thermal design power greater than that of the first heat source. The heat dissipation component includes a heat exchanger and a cold plate. The heat exchanger is configured to be thermally coupled to the first heat source and receive a coolant, such that the coolant absorbs heat generated by the first heat source and is heated. The cold plate is configured to be thermally coupled to the second heat source and is connected to the heat exchanger to receive coolant from the heat exchanger, such that the coolant absorbs heat generated by the second heat source and vaporizes.

Description

Technical Field

[0001] This invention relates to a heat dissipation component, a motherboard module, and an electronic device. Background Technology

[0002] Currently, two-phase cold plates use pool boiling to dissipate heat from high-wattage chips. However, when a high-wattage chip starts operating, if the coolant entering the cold plate is too cold, it must first be heated to its boiling point so that it can remove the heat generated by the chip through a phase change. This can lead to excessively high chip temperatures during the initial stages of operation. Therefore, researchers in this field are working to solve these problems. Summary of the Invention

[0003] The purpose of this invention is to provide a heat dissipation component, motherboard module, and electronic device that can prevent the chip from being unable to dissipate the heat generated by the chip in time due to the low temperature of the coolant during the initial operation.

[0004] An embodiment of the present invention discloses a heat dissipation assembly configured to be thermally coupled to a first heat source and a second heat source with a thermal design power greater than that of the first heat source. The heat dissipation assembly includes a heat exchanger and a cold plate. The heat exchanger is configured to be thermally coupled to the first heat source and receive a coolant, such that the coolant absorbs heat generated by the first heat source and is heated. The cold plate is configured to be thermally coupled to the second heat source and is connected to the heat exchanger to receive coolant from the heat exchanger, such that the coolant absorbs heat generated by the second heat source and vaporizes.

[0005] Another embodiment of the present invention discloses a motherboard module comprising a motherboard and a heat dissipation assembly. The motherboard has a first heat source and a second heat source with a thermal design power greater than that of the first heat source. The heat dissipation assembly includes a heat exchanger and a cold plate. The heat exchanger is configured to be thermally coupled to the first heat source and receive coolant, such that the coolant absorbs heat generated by the first heat source and is heated. The cold plate is configured to be thermally coupled to the second heat source and is connected to the heat exchanger to receive coolant from the heat exchanger, such that the coolant absorbs heat generated by the second heat source and vaporizes.

[0006] Another embodiment of the present invention discloses an electronic device comprising a coolant distribution device and a motherboard module. The coolant distribution device is configured to output coolant. The motherboard module includes a motherboard and a heat dissipation assembly. The motherboard has a first heat source and a second heat source with a thermal design power greater than that of the first heat source. The heat dissipation assembly includes a heat exchanger and a cold plate. The heat exchanger is configured to be thermally coupled to the first heat source and connected to the coolant distribution device, and is used to allow coolant to flow into the heat exchanger, causing the coolant flowing into the heat exchanger to absorb heat generated by the first heat source and thus heat up. The cold plate is configured to be thermally coupled to the second heat source and is connected to the heat exchanger and the coolant distribution device to receive coolant from the heat exchanger, causing the coolant to absorb heat generated by the second heat source and vaporize, and the vaporized coolant flows back to the coolant distribution device.

[0007] According to the heat dissipation assembly, motherboard module, and electronic device disclosed in the above embodiments, a configuration in which a heat exchanger is thermally coupled to a first heat source and receives coolant, and a cold plate is thermally coupled to a second heat source with a thermal design power greater than that of the first heat source and connected to the heat exchanger to receive coolant from the heat exchanger, allows the coolant to be heated by passing through the heat exchanger before flowing into the cold plate. Thus, the coolant flowing out of the heat exchanger can maintain a certain temperature (e.g., close to the boiling point), allowing for an immediate phase change after flowing into the cold plate to remove the heat generated by the second heat source. Therefore, in the initial stage of operation of the second heat source, the problem of insufficient coolant temperature preventing immediate phase change to remove the heat generated by the second heat source can be avoided.

[0008] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of an electronic device according to an embodiment of the present invention;

[0010] Figure 2 This is a schematic diagram of a motherboard module according to an embodiment of the present invention;

[0011] Figure 3 This is a schematic diagram of a motherboard module according to an embodiment of the present invention;

[0012] Figure 4 This is a schematic diagram of a heat exchanger according to an embodiment of the present invention;

[0013] Figure 5 This is a schematic diagram of a heat exchanger according to an embodiment of the present invention;

[0014] Figure 6 This is a schematic diagram of a heat exchanger according to an embodiment of the present invention.

[0015] Symbol Explanation

[0016] 1: Electronic devices

[0017] 11: Coolant distribution device

[0018] 111:Liquid storage container

[0019] 112: Pump

[0020] 113: Condenser

[0021] 12, 22, 32: Motherboard Module

[0022] 121,221: Motherboard

[0023] 1211,2211,3211: Primary heat source

[0024] 1212,2212,3212: Second heat source

[0025] 1213: First Surface

[0026] 1214, 2214: Second surface

[0027] 1215, 2215: Circuit Board

[0028] 122: Heat dissipation components

[0029] 1221,2221,3221,4221,5221,6221: Heat exchangers

[0030] 1222,2222,3222: Cold-rolled steel plate

[0031] 1223: Connecting pipe

[0032] 323: Heater

[0033] 13: Infusion tubing

[0034] 14: Gas pipeline

[0035] C: Coolant

[0036] OS: Outer Surface

[0037] OFS: External Fin Structure

[0038] C1: Two-phase fluid chamber

[0039] BS: Boiling aid structure

[0040] C4: Liquid Channel

[0041] C5, C6: Liquid chambers

[0042] IFS: Internal Fin Structure Detailed Implementation

[0043] Please see Figure 1 Figure 1 A schematic diagram of an electronic device 1 according to an embodiment of the present invention is shown.

[0044] Electronic device 1 includes a coolant distribution device 11 and a motherboard module 12. The coolant distribution device 11 is configured to output a coolant C. The motherboard module 12 includes a motherboard 121 and a heat dissipation assembly 122. The motherboard 121 includes a first heat source 1211 and a second heat source 1212 with a thermal design power greater than that of the first heat source 1211. The heat dissipation assembly 122 includes a heat exchanger 1221 and a cold plate 1222. The heat exchanger 1221 is configured to be thermally coupled to the first heat source 1211 and connected to the coolant distribution device 11. The heat exchanger 1221 is used to allow coolant C to flow in, so that the coolant C flowing into the heat exchanger 1221 absorbs the heat generated by the first heat source 1211 and is heated. The cold plate 1222 is configured to be thermally coupled to the second heat source 1212, and the cold plate 1222 is connected to the heat exchanger 1221 and the coolant distribution device 11 to receive the coolant C from the heat exchanger 1221, so that the coolant C absorbs the heat generated by the second heat source 1212 and vaporizes, and the vaporized coolant C flows back to the coolant distribution device 11.

[0045] In one embodiment, the electronic device 1 may further include a liquid delivery pipe 13 and a gas delivery pipe 14, and the coolant distribution device 11 may include a liquid storage container 111, a pump 112, and a condenser 113. The liquid storage container 111, pump 112, liquid delivery pipe 13, heat exchanger 1221, cold plate 1222, gas delivery pipe 14, and condenser 113 are sequentially connected and together form a coolant circuit, wherein the condenser 113, liquid storage container 111, and pump 112 are connected by pipe fittings.

[0046] In one embodiment, the motherboard 121 may further include a circuit board 1215, which has a first surface 1213 and a second surface 1214 facing each other. A first heat source 1211 and a second heat source 1212 are respectively disposed on the first surface 1213 and the second surface 1214 of the circuit board 1215; that is, the first heat source 1211 and the second heat source 1212 are respectively disposed on opposite sides of the circuit board 1215. In addition, the heat dissipation assembly 122 may further include a connecting pipe 1223. The connecting pipe 1223 penetrates the motherboard 121, and the cold plate 1222 of the thermally coupled second heat source 1212 is connected to the heat exchanger 1221 of the thermally coupled first heat source 1211 through the connecting pipe 1223.

[0047] It should be noted that the connecting pipe 1223 is not limited to passing through the motherboard 121. In other embodiments, the connecting pipe may bypass the motherboard. That is, the connecting pipe may extend past the edge of the motherboard to connect the heat exchanger and the cold plate.

[0048] In one embodiment, the first heat source 1211 includes at least one of a voltage regulation chip, a network communication chip, and a timer chip. The second heat source 1212 includes at least one of a central processing unit and a graphics processing unit.

[0049] In one embodiment, the heat exchanger 1221 has an outer surface OS and an outer fin structure OFS disposed on the outer surface OS. The electronic device 1 may include a fan (not shown) whose airflow can flow over the outer fin structure OFS of the heat exchanger 1221 to carry away the heat generated by the first heat source 1211.

[0050] In one embodiment, the cold plate 1222 has a two-phase fluid chamber C1 and a boiling aid structure BS, the boiling aid structure BS being located in the two-phase fluid chamber C1. The boiling aid structure BS is used to contact the coolant C. The function of the boiling aid structure BS is to increase the bubble nucleation points, thereby generating more boiling bubbles per unit time, and to increase the contact area with the coolant C. Although Figure 1 The boiling aid structure BS shown is simplified to a sheet-like structure, but in fact, the boiling aid structure BS described in this invention may include at least one of the following: a mesh metal structure, a sheet fin structure, a pin fin structure, or a sintered metal structure.

[0051] Next, the flow process of coolant C in the coolant circuit will be described. Under the operation of pump 112, coolant C is delivered to heat exchanger 1221 via delivery pipe 13 to absorb heat generated by first heat source 1211 and thus increase its temperature. Then, coolant C flows into cold plate 1222 via connecting pipe 1223 to absorb heat generated by second heat source 1212 and vaporize. The vaporized coolant C then flows to condenser 113 via gas delivery pipe 14, where it is condensed back into liquid and then returned to storage container 111.

[0052] In electronic device 1, a heat exchanger 1221 is thermally coupled to a first heat source 1211 and receives coolant C, while a cold plate 1222 is thermally coupled to a second heat source 1212 with a thermal design power greater than that of the first heat source 1211 and is connected to the heat exchanger 1221 to receive coolant C from the heat exchanger 1221. This configuration allows the coolant C to be heated by passing through the heat exchanger 1221 before flowing into the cold plate 1222. Thus, the coolant C exiting the heat exchanger 1221 can maintain a certain temperature (e.g., close to the boiling point), allowing it to undergo an instantaneous phase change upon flowing into the cold plate 1222, thereby carrying away the heat generated by the second heat source 1212. Therefore, in the initial operation of the second heat source 1212, the problem of the coolant C being too cold to undergo an instantaneous phase change and carry away the heat generated by the second heat source 1212 can be avoided.

[0053] It should be noted that the first heat source 1211 and the second heat source 1212 of the motherboard 121 are not limited to being located on the first surface 1213 and the second surface 1214 respectively.

[0054] For example, Figure 2 A schematic diagram of a motherboard module 22 according to an embodiment of the present invention is shown, and the motherboard module 22 of this embodiment is replaceable. Figure 1 The motherboard module 12 is described above. The motherboard module 22 of this embodiment is similar to the motherboard module 12 of the above embodiment. Therefore, the following mainly describes the different parts between the two, and will not repeat the same parts.

[0055] In one embodiment, both the first heat source 2211 and the second heat source 2212 are disposed on the second surface 2214 of the circuit board 2215 of the motherboard 221; that is, the first heat source 2211 and the second heat source 2212 are disposed on the same side of the circuit board 2215. The heat exchanger 2221 thermally coupled to the first heat source 2211 may, for example, be the same as... Figure 1 The heat exchanger 1221 shown, and the cold plate 2222 thermally coupled to the second heat source 2212, may be the same as... Figure 1 The cold plate 1222 is shown.

[0056] Next, please refer to Figure 3 , Figure 3 A schematic diagram of a motherboard module 32 according to an embodiment of the present invention is shown, and the motherboard module 32 of this embodiment is replaceable. Figure 1 The motherboard module 12 is described above. The motherboard module 32 in this embodiment is similar to the motherboard module 22 in the above embodiment. Therefore, the following mainly describes the differences between the two, and will not repeat the similarities.

[0057] The motherboard module 32 may also include a heater 323, which is different from the first heat source 3211 and the second heat source 3212, and the heat exchanger 3221 is thermally coupled to the heater 323.

[0058] In one embodiment, heater 323 is used to heat the coolant C flowing into heat exchanger 3221 before the coolant C reaches a preset temperature, and to stop heating the coolant C flowing into heat exchanger 3221 when the coolant C reaches the preset temperature.

[0059] For example, the controller in the electronic device detects the temperature of the coolant C flowing into the heat exchanger 3221 via a temperature sensor. If the coolant C has not reached a preset temperature, the controller instructs the heater 323 to heat the coolant C flowing into the heat exchanger 3221. Once the coolant C reaches the preset temperature, the heater 323 stops heating. This ensures that the temperature of the coolant C flowing from the heat exchanger 3221 into the cold plate 3222 is as close as possible to its boiling point, allowing the coolant C to undergo an immediate phase change upon entering the cold plate 3222, thus carrying away the heat generated by the second heat source 3212.

[0060] In one embodiment, heater 323 is used to heat the coolant C flowing into heat exchanger 3221 when the second heat source 3212 has not reached a preset temperature, and to stop heating the coolant C flowing into heat exchanger 3221 when the second heat source 3212 reaches the preset temperature.

[0061] For example, when the electronic device is powered on but the second heat source 3212 is not yet loaded, the controller indirectly determines the temperature of the coolant C in the cold plate 3222 by sensing the temperature change of the second heat source 3212 via a temperature sensor. If the temperature of the second heat source 3212 rises by 10 degrees Celsius when it is not loaded, it means that the temperature of the coolant C in the cold plate 3222 has increased the temperature of the second heat source 3212, and the temperature of the coolant C in the cold plate 3222 is high enough to allow a phase change to occur immediately after the second heat source 3212 is loaded, thus removing the heat generated by the second heat source 3212. In other words, the second heat source 3212 can start operating at this time, and the heat it generates can be effectively removed by the coolant C. Conversely, if the temperature of the second heat source 3212 does not rise by 10 degrees Celsius when it is not loaded, it means that the temperature of the coolant C in the cold plate 3222 is not high enough to allow a phase change to occur immediately after the second heat source 3212 is loaded. At this time, the controller instructs the heater 323 to heat the coolant C in the heat exchanger 3221, so that the heated coolant C flows into the cold plate 3222. Once the temperature of the second heat source 3212 rises by 10 degrees due to the heated coolant C, the controller stops the operation of the heater 323 to save energy and allows the second heat source 3212 to start working.

[0062] Next, other embodiments of heat exchangers will be described below, which can replace... Figures 1 to 3 The aforementioned heat exchanger.

[0063] Please see Figure 4 , Figure 4 A schematic diagram of a heat exchanger 4221 according to an embodiment of the present invention is shown. In one embodiment, the heat exchanger 4221 has a liquid channel C4, which is meandering to improve the heat exchange efficiency between the heat exchanger 4221 and the coolant.

[0064] It should be noted that the internal structure of the heat exchanger is not limited to a meandering flow path. In one embodiment, the heat exchanger has a liquid chamber and an inner fin structure located within the liquid chamber. For example, please refer to... Figure 5 . Figure 5 A schematic diagram of a heat exchanger 5221 according to an embodiment of the present invention is shown. The internal fin structure IFS within the liquid chamber C5 of the heat exchanger 5221 is plate-shaped. Alternatively, please refer to... Figure 6 , Figure 6 A schematic diagram of a heat exchanger 6221 according to an embodiment of the present invention is shown. The internal fin structure IFS within the liquid chamber C6 of the heat exchanger 6221 is columnar.

[0065] According to the heat dissipation assembly, motherboard module, and electronic device disclosed in the above embodiments, a configuration in which a heat exchanger is thermally coupled to a first heat source and receives coolant, and a cold plate is thermally coupled to a second heat source with a thermal design power greater than that of the first heat source and connected to the heat exchanger to receive coolant from the heat exchanger, allows the coolant to be heated by passing through the heat exchanger before flowing into the cold plate. Thus, the coolant flowing out of the heat exchanger can maintain a certain temperature (e.g., close to the boiling point), allowing for an immediate phase change after flowing into the cold plate to remove the heat generated by the second heat source. Therefore, in the initial stage of operation of the second heat source, the problem of insufficient coolant temperature preventing immediate phase change to remove the heat generated by the second heat source can be avoided.

Claims

1. A heat dissipation component configured to thermally couple to a first heat source and a second heat source having a thermal design power greater than the first heat source, the heat dissipation component comprising: A heat exchanger configured to be thermally coupled to the first heat source and receive coolant, such that the coolant absorbs heat generated by the first heat source and is heated; and A cold plate is configured to be thermally coupled to the second heat source and connected to the heat exchanger to receive the coolant from the heat exchanger, so that the coolant absorbs the heat generated by the second heat source and vaporizes.

2. The heat dissipation assembly as claimed in claim 1, wherein the cold plate has a two-phase fluid chamber and a boiling aid structure, the boiling aid structure being located in the two-phase fluid chamber.

3. The heat dissipation assembly of claim 1, wherein the heat exchanger has a liquid channel that is meandering.

4. The heat dissipation assembly as claimed in claim 1, wherein the heat exchanger has a liquid chamber and an inner fin structure, the inner fin structure being located within the liquid chamber.

5. The heat dissipation assembly as claimed in claim 4, wherein the inner fin structure is plate-shaped or columnar.

6. The heat dissipation assembly as claimed in claim 1, wherein the heat exchanger has an outer surface and an outer fin structure, the outer fin structure being disposed on the outer surface.

7. A motherboard module, comprising: The motherboard includes a first heat source and a second heat source with a thermal design power greater than that of the first heat source; and Heat dissipation components, including: A heat exchanger configured to be thermally coupled to the first heat source and receive coolant such that the coolant absorbs heat generated by the first heat source and is heated; and A cold plate is configured to be thermally coupled to the second heat source and connected to the heat exchanger to receive the coolant from the heat exchanger, so that the coolant absorbs the heat generated by the second heat source and vaporizes.

8. The motherboard module of claim 7, wherein the first heat source includes at least one of a voltage regulation chip, a network communication chip, and a timer chip, and the second heat source includes at least one of a central processing unit and a graphics processing unit.

9. The motherboard module of claim 7 further includes a heater, which is different from the first heat source and the second heat source, the heat exchanger being thermally coupled to the heater, the heater being used to heat the coolant flowing into the heat exchanger when the coolant has not reached a preset temperature, and to stop heating the coolant flowing into the heat exchanger when the coolant reaches the preset temperature.

10. The motherboard module of claim 7 further includes a heater, which is different from the first heat source and the second heat source, the heat exchanger being thermally coupled to the heater, the heater being used to heat the coolant flowing into the heat exchanger when the second heat source has not reached a preset temperature, and to stop heating the coolant flowing into the heat exchanger when the second heat source reaches the preset temperature.

11. The motherboard module of claim 7, wherein the motherboard further comprises a circuit board having opposing first and second surfaces, the first heat source and the second heat source being disposed on the second surface.

12. The motherboard module of claim 7, wherein the heat dissipation component further includes a connecting pipe, the motherboard further includes a circuit board having opposing first and second surfaces, the first heat source and the second heat source being respectively disposed on the first and second surfaces, the connecting pipe passing through or around the motherboard, and the cold plate being connected to the heat exchanger through the connecting pipe.

13. The motherboard module of claim 7, wherein the cold plate has a two-phase fluid chamber and a boiling aid structure, the boiling aid structure being located in the two-phase fluid chamber.

14. The motherboard module of claim 7, wherein the heat exchanger has a liquid channel that is meandering.

15. The motherboard module of claim 7, wherein the heat exchanger has a liquid chamber and an inner fin structure located within the liquid chamber.

16. The motherboard module of claim 15, wherein the inner fin structure is sheet-like or columnar.

17. The motherboard module of claim 7, wherein the heat exchanger has an outer surface and an outer fin structure disposed on the outer surface.

18. An electronic device comprising: Coolant distribution device, configured to output coolant; and Motherboard module, including: A host board has a first heat source and a second heat source with a thermal design power greater than the first heat source. as well as Heat dissipation components, including: A heat exchanger is configured to be thermally coupled to the first heat source and connected to the coolant distribution device. The heat exchanger is used to allow the coolant to flow in, so that the coolant flowing into the heat exchanger absorbs the heat generated by the first heat source and is heated. as well as A cold plate is configured to be thermally coupled to the second heat source, and the cold plate is connected to the heat exchanger and the coolant distribution device to receive the coolant from the heat exchanger, so that the coolant absorbs the heat generated by the second heat source and vaporizes, and the vaporized coolant flows back to the coolant distribution device.

19. The electronic device of claim 18, further comprising a liquid delivery pipe and a gas delivery pipe, the coolant distribution device comprising a liquid storage container, a pump and a condenser, the liquid storage container, the pump, the liquid delivery pipe, the heat exchanger, the cold plate, the gas delivery pipe and the condenser being sequentially connected and together forming a coolant circuit.

20. The electronic device of claim 18, wherein the first heat source comprises at least one of a voltage regulation chip, a network communication chip, and a timer chip, and the second heat source comprises at least one of a central processing unit and a graphics processing unit.

21. The electronic device of claim 18, wherein the motherboard module further includes a heater, the heater being different from the first heat source and the second heat source, the heat exchanger being thermally coupled to the heater, the heater being configured to heat the coolant flowing into the heat exchanger when the coolant has not reached a preset temperature, and to stop heating the coolant flowing into the heat exchanger when the coolant reaches the preset temperature.

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