An intelligent optimization method and system for PCB back drilling process

Abstract

This invention discloses an intelligent optimization method and system for the back drilling process of PCB boards, belonging to the field of circuit board processing technology. The invention acquires point cloud data by scanning the pad board, constructs a surface height field function using thin-plate spline interpolation, and judges the flatness of the pad board based on the grid node height values. If it is unqualified, it is replaced. A predicted thickness distribution model of the PCB board is obtained by superimposing a board surface thickness variation function fitted based on historical production data and a continuous residual distribution function generated by Kriging interpolation. This model obtains the predicted thickness at the back-drilled through-hole, thus obtaining the height coordinates of the PCB board top surface. The difference between the initial vertical height of the drill bit and the height coordinates of the PCB board top surface at the required back-drilled through-hole is used as the drill bit's downward distance when back-drilling the required through-hole. This invention effectively realizes the automatic quantitative detection of the pad board flatness, improves detection accuracy, accurately analyzes the board thickness at the back-drilling location, effectively obtains the drill bit's downward distance, and improves the quality of back drilling.

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