A sub-pixel size based defect detection method

By obtaining sub-pixel level width and height values ​​of square holes in mask detection, and using difference and threshold judgment, the problem of false defects caused by brightness non-uniformity is solved, and high-precision defect detection is achieved.

CN122289170APending Publication Date: 2026-06-26CHANGZHOU WEIPU SEMICONDUCTOR EQUIPMENT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHANGZHOU WEIPU SEMICONDUCTOR EQUIPMENT CO LTD
Filing Date
2026-03-24
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

In existing technologies, when detecting square hole defects in the CNT through-hole layer of a mask, uneven brightness leads to false defects, making it difficult to accurately detect changes in square hole size and corner defects.

Method used

By acquiring the subpixel width and height values ​​of square holes in the mask image acquired by the camera, setting thresholds for difference and number of defects, using an edge detection operator to calculate the gradient information matrix, performing subpixel level difference comparison, marking suspicious defects and determining defective square holes.

Benefits of technology

It reduces false defects caused by brightness variations, improves detection precision and accuracy, and can accurately detect changes in square hole size and corner defects even under conditions of uneven brightness.

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Abstract

This invention discloses a defect detection method based on sub-pixel size. The method includes the following steps: S01: acquiring the sub-pixel width value in the corresponding pixel row and the sub-pixel height value in the corresponding pixel column of each square hole in the corresponding image; the image includes a design file generated image and a mask image; S02: setting a difference threshold and a defect number threshold, and comparing the sub-pixel width value in the corresponding pixel row and the sub-pixel height value in the corresponding pixel column of each square hole in the design file generated image and the mask image. If any difference exceeds the difference threshold, it is recorded as a suspicious defect mark. When the number of suspicious defect marks in a square hole exceeds the defect number threshold, the square hole is marked as a defective square hole. This method can detect defects of the square hole contour variation type even when the brightness uniformity of the CNT square holes in the mask image acquired by the camera is poor.
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