Detection probes and methods of making the same

Abstract

A detection probe. The detection probe includes a cylindrical body shaped like a cylinder; and terminals, including a terminal body portion partially inserted into a first end of the cylindrical body, and a contact portion of a protruding terminal integrally extending from the terminal body portion to contact an object to be tested. The contact portion includes: a tip support portion, including a support body disposed on the terminal body portion and a tip base protruding in a trumpet shape from the first end of the support body; and a tip portion, which is electroplated on the outer surface of the tip base with a material having a higher hardness than the tip support portion, and is thicker at the upper part of the tip base than at the lower part.

Description

Technical Field

[0001] This disclosure relates to a detection probe for detecting the electrical properties of a test object (such as a semiconductor), and a method for manufacturing the probe. Background Technology

[0002] The test probe comprises a cylindrical body, a terminal partially inserted and fixed to a first end portion of the body, a plunger slidably inserted into a second end portion of the body, and a spring inserted between the terminal and the plunger within the body. The terminal contacts a bump terminal of the object under test, and the plunger contacts a solder pad terminal of the test circuit board. In this configuration, the terminal has a sharp tip that pierces the hemispherical bump terminal during testing. The sharp tip requires plating with a hard metal, as it will wear down after repeated tests. However, due to the high internal stress of hard metal, it is difficult to form a thick layer, while a thin plating layer has poor durability. Summary of the Invention

[0003] Technical issues

[0004] This invention provides a detection probe with excellent durability and a method for manufacturing the same.

[0005] Solution to the problem

[0006] This invention provides a detection probe with excellent durability and a method for manufacturing the same.

[0007] According to one embodiment of this disclosure, a detection probe is provided. The detection probe includes: a cylindrical body; and a terminal including a terminal body portion partially inserted into a first end of the cylindrical body, and a contact portion integrally extending from the terminal body portion to contact a protruding terminal of a test object. The contact portion includes: a tip support portion including a support body disposed on the terminal body portion and a tip base protruding in a flared shape from the first end of the support body; and a tip portion having a material with higher hardness than the tip support portion electroplated on the outer surface of the tip base, and being thicker at the upper part of the tip base than at the lower part.

[0008] The tip portion can be made of nickel boride (NiB), and the tip support portion can be made of nickel (Ni). Therefore, the tip portion of hard NiB is electroplated on the tip support portion of Ni, thereby improving durability and bonding characteristics with the tip support portion.

[0009] The terminals may be externally plated with a highly conductive material to include an external plating film. Therefore, the conductivity of the terminals is improved.

[0010] At least one uneven joint may form at the interface between the tip base and the tip portion. Therefore, the bond strength between the tip support portion and the tip portion is improved.

[0011] According to one embodiment of the present disclosure, a method for manufacturing a detection probe is provided. The method for manufacturing a detection probe includes: forming a first molding groove on a sacrificial substrate, the cross-sectional area of ​​which decreases downward; forming a tip portion by electroplating a first material inside the first molding groove, the tip portion being thicker on its lower side than on its upper side; and stacking a tip support portion on the tip portion using a second material.

[0012] The stacked tip support portion may involve stacking a dry film on a sacrificial substrate, forming a second molding groove in the dry film to surround a first molding groove and be larger than the top area of ​​the first molding groove, and filling the second molding groove with a second material having higher conductivity than the first material. This results in the fabrication of a detection probe with excellent durability.

[0013] The tip portion can be formed by electroplating. Therefore, detection probes with excellent durability can be manufactured at low cost.

[0014] Advantages of the invention

[0015] According to one embodiment of the present disclosure, the durability of the detection probe is improved by thickly electroplating a hard metal film at the apex of the contact tip that contacts the corresponding terminal. Attached Figure Description

[0016] Figure 1 This is a perspective view of the detection probe according to the first embodiment of this disclosure.

[0017] Figure 2 This is an exploded perspective view of the detection probe according to the first embodiment of this disclosure.

[0018] Figure 3 It is along Figure 1 A cross-sectional view of line AA.

[0019] Figure 4 yes Figure 1 Detailed cross-sectional view of the terminals.

[0020] Figure 5 It is a display manufacturing Figure 4 A schematic diagram of the terminal method.

[0021] Figure 6 It is a display manufacturing Figure 5 A detailed view of the method for the tip portion.

[0022] Figure 7 This is a detailed cross-sectional view of a terminal according to a second embodiment of this disclosure.

[0023] Figure 8 It is a display manufacturing Figure 7 A schematic diagram of the terminal method.

[0024] Figure 9 It is a display manufacturing Figure 8 A detailed view of the method for the tip portion.

[0025] Figure 10 This is a perspective view of the detection probe according to the third embodiment of this disclosure.

[0026] Figure 11 This is a perspective view of a terminal according to the fourth embodiment of this disclosure. Detailed Implementation

[0027] The detection probe 1 and its manufacturing method will be described in detail below with reference to the accompanying drawings.

[0028] Figure 1 This is a three-dimensional view showing the detection probe 1. Figure 2 yes Figure 1 Exploded stereo view of detection probe 1 Figure 3 It is along Figure 1 A cross-sectional view of line AA. Figure 4 yes Figure 1 Detailed cross-sectional view of terminal 4.

[0029] Reference Figures 1 to 3 The detection probe 1 includes a cylindrical body 2, a plunger 3 partially inserted into a first end portion of the cylindrical body 2, a terminal 4 partially inserted into a second end portion of the cylindrical body 2, and a spring 5 between the plunger 3 and the terminal 4 inserted into the cylindrical body 2. The plunger 3 can slide within the cylindrical body 2 while compressing and restoring the spring 5, and the terminal 4 is fixed and supported on the first end portion of the cylindrical body 2.

[0030] The cylinder body 2 is shaped into a tube and made of a conductive metal such as brass.

[0031] The cylindrical body 2 includes a tubular main body 21 and a skirt 22 separated by three slits 23, which are longitudinally cut off from the first end portion of the main body 21. The number of slits 23 is not limited to three, and may be two or four or more.

[0032] The skirt 22 includes a skirt body 221 extending longitudinally along the main body 21; and a skirt diameter reduction portion 222 that curves from the tip region of the skirt body 221, which has a reduced diameter in the axial direction of the main body 2 and has a contact end portion 222a facing the surface of the plunger 3.

[0033] The skirt body 221 can be thicker or thinner than the tube body 21. In this way, the thickness of the skirt body 221 is adjusted to control the contact force with the plunger 3.

[0034] The reduced diameter portion 222 of the skirt is thicker than the main body 221 of the skirt or the main body 21 of the barrel. In this way, the increased thickness of the reduced diameter portion 222 improves durability, expands the contact area between the plunger 3 and the contact end portion 222a, and allows the tip of the contact end portion 222a to be chamfered. Due to the chamfered tip of the contact end portion 222a, damage to the plunger 3 by the tip edge of the reduced diameter portion 222 is prevented during the sliding operation of the plunger 3.

[0035] The length of the contact end portion 222a in the axial direction is greater than the thickness of the skirt body 221. As a result, the contact area between the contact end portion 222a and the plunger 3 is increased, thereby improving the resistance characteristics during detection.

[0036] The plunger 3 includes a sliding portion 31 that is slidably housed in the barrel body 21, and a terminal contact portion 32 that extends from the sliding portion 31, the terminal contact portion 32 being exposed through the skirt 22 and in elastic contact with the skirt 22.

[0037] The sliding portion 31 has a diameter corresponding to the inner diameter of the main body 21. The diameter of the sliding portion 31 is less than or equal to the diameter of the main body 21 so as to slide within the main body 21.

[0038] The diameter of the terminal contact portion 32 is smaller than the diameter of the sliding portion 31. The diameter of the terminal contact portion 32 is large enough to pass through the tip of the skirt 22 while simultaneously contacting it. The end portion of the terminal contact portion 32 contacts the terminal (not shown) of the object under test.

[0039] Reference Figure 4 Terminal 4 includes a terminal body portion 41 that is partially inserted into the second end portion of the cylinder 2, and a contact portion 42 stacked on the terminal body portion 41, which contacts the terminal 110 of the object to be tested 100.

[0040] The terminal body portion 41 includes a cylinder insertion portion 41a that is inserted into the cylinder body 2 and has a diameter corresponding to the inner diameter of the cylinder body 2, and a cylinder support portion 41b that is recessed from the outside of the terminal body portion 41 in the circumferential direction to fix the terminal body portion 41 to the cylinder body 2.

[0041] The cylindrical insertion portion 41a is cylindrical in shape, contacts the cylindrical body 2, and has a diameter corresponding to the inner diameter of the cylindrical body 2. The diameter of the cylindrical insertion portion 41a gradually decreases in the downward direction, thus creating a diameter difference dt between its upper and lower ends.

[0042] The cylinder support portion 41b is recessed on the outer peripheral surface of the cylinder insertion portion 41a in the circumferential direction to accommodate the protrusion formed by pressing and deforming the cylinder 2 inward through indentation.

[0043] The contact portion 42 includes a tip support portion 421 and a tip portion 422 disposed at a first end of the tip support portion 421. There may be multiple tip portions 422.

[0044] The tip support portion 421 includes a flange 421a disposed on the terminal body portion 41 and having a larger diameter than the terminal body portion 41, a support body 421b disposed on the flange 421a and having a predetermined height, and a tip base 421c disposed on the support body 421b and projecting in a trumpet shape. The tip support portion 421 may be made of, for example, nickel (Ni).

[0045] The diameter of flange 421a is larger than the diameter of cylinder 2. Therefore, when terminal body portion 41 is inserted into cylinder 2, the end portion of cylinder 2 blocks and restricts the insertion of terminal body portion 41.

[0046] The shape of the support body 421b is, for example, like a square prism or a cylinder, and has a height that takes into account the height of the tip portion 422 according to the detection conditions.

[0047] The tip portion 422 may be made of a material with a higher hardness than the tip support portion 421, such as nickel boride (NiB). The tip portion 422 may be formed as an electroplated layer on the outer surface of the tip base 421c.

[0048] Terminal 4 may further include a spring support portion disposed at the lower end of terminal body portion 41 and protruding to have a smaller diameter than the cylindrical insertion portion 41a. The spring support portion is inserted. Figure 2 The first side of the middle spring 5 supports the spring 5.

[0049] Reference Figure 4 The tip portion 422 is formed of a hard metal, for example, nickel boride (NiB) is formed on the outer surface of the tip base 421c by electroplating or electroless plating. In this case, the tip portion 422 is formed such that its upper portion Ht above the tip base 421c is thicker than its lower portion Lt near the support body 421b. The upper portion Ht, including the apex of the tip portion 422, refers to the portion that typically inserts into the bump terminal and is thickly reinforced with a hard metal (e.g., nickel boride (NiB)) to improve wear resistance. The tip portion 422 can be firmly coupled to the tip base 421c through uneven bonding. Furthermore, the outer surface of the tip base 421c is not only unpolished but also rough and wavy, so the tip portion 422 can be more firmly coupled to the tip base 421c, thereby resisting peeling. In addition, the tip portion 422, made of a hard metal (i.e., nickel boride (NiB)), has excellent bonding characteristics with the tip support portion 421, made of the same type (i.e., nickel (Ni)).

[0050] Figure 5 This is a schematic diagram showing the manufacturing process. Figure 4The method of middle terminal 4, Figure 6 For a detailed view, show the manufacturing process. Figure 5 The method for the tip portion 422. Although multiple terminals 4 are simultaneously fabricated on a sacrificial substrate 61 using a microelectromechanical systems (MEMS) process, for the sake of description, Figure 5 Only one terminal 4 is shown in the image.

[0051] In operation S1, a first molding groove 61 is formed on one surface of the sacrificial substrate 60, and its shape is, for example, like a square pyramid. The first molding groove 61 with a square pyramid shape corresponds to... Figure 4 The outline of the tip portion 422 shown.

[0052] In operation S2, a conductive film 62, such as a gold (Au) film, is formed on one surface of the sacrificial substrate 60 by sputtering.

[0053] In operation S3, the first dry film 63 is stacked on the conductive film 62 of the sacrificial substrate 60, and a second molding groove 64 shaped like a cylinder is formed by pattern exposure and development to expose the first molding groove 61.

[0054] In operation S4, the inner surface of the first molded groove 61 is electroplated with the material forming the tip support portion (i.e., a metal harder than nickel (Ni), such as nickel boride (NiB)) by electroless electroplating or electroplating, forming the first layer 65 (corresponding to...). Figure 4 (tip portion 422).

[0055] exist Figure 6 In the operation S4-1 shown, the initial tip portion 65-1 is electroplated on the first molded groove 61 with an almost constant thickness at the start of electroplating.

[0056] Then, after the electroplating process has continued for a predetermined period of time, in Figure 6 In operation S4-2, the first molding groove 61 is filled starting from the lower part, which has a narrow area, so the lower part is plated thicker than the upper part. As plating continues, the plating solution in the first molding groove 61 and the second molding groove 64 lacks plating metal components, so the plating solution needs to be repeatedly stirred. In addition, the plating solution supplied by stirring is pushed into the lower part of the first molding groove 61, thereby increasing the deposition amount in the lower part of the first molding groove 61.

[0057] In operation S5, the first dry film 63 on the sacrificial substrate 60 is removed.

[0058] In operation S6, a second dry film 66 is formed on the sacrificial substrate 60, and a third molding groove 67 with a cylindrical shape is formed by additional pattern exposure and development, which has a larger cross-sectional area than the first molding groove 61.

[0059] In operation S7, the recessed portion 68 is filled (forming) by electroplating or electroless plating with a metal (e.g., nickel (Ni)) that has good bonding properties with nickel boride (NiB), high conductivity, and relatively low hardness. Figure 4 The position of the tip base 421c) and the third molding groove 67, and the metal portion protruding from the top surface of the second dry film 66 are ground to form the second layer 69 (corresponding to the position of the tip base 421c) and the third molding groove 67, and the metal portion protruding from the top surface of the second dry film 66 is ground to form the second layer 69 (corresponding to the position of the tip base 421c) and the third Figure 4 (The supporting body 421b and the tip base 421c of the tip support portion 421).

[0060] In operation S8, by stacking a third dry film 70 on the second dry film 66, a fourth molding groove 71 (with a diameter smaller than the third molding groove 67) shaped like a cylinder is formed by pattern exposure and development. Metal (e.g., nickel (Ni)) is then filled into the fourth molding groove 71 by electroplating or electroless electroplating, and the metal portion protruding from the top surface of the third dry film 70 is ground to form a third layer 72 (corresponding to…). Figure 4 Flange 421a).

[0061] In operation S9, a fifth molding groove 74 (with a smaller diameter than the fourth molding groove 71) is formed by stacking a fourth dry film 73 on the third dry film 70 through pattern exposure and development, and metal (e.g., nickel (Ni)) is filled into the fifth molding groove 74 by electroplating. The metal portion protruding from the top surface of the fourth dry film 73 is then ground to form a fourth layer 75 (corresponding to...). Figure 4 (Part of the cylinder insertion portion 41a).

[0062] In operation S10, a fifth dry film 76 is stacked on the fourth dry film 73, and a sixth molding groove 77 (with a diameter smaller than the fifth molding groove 74) shaped like a cylinder is formed by pattern exposure and development. Metal (e.g., nickel (Ni)) is filled into the sixth molding groove 77 by electroplating or electroless plating, and the metal portion protruding from the top surface of the fifth dry film 76 is ground to form a fifth layer 78 (corresponding to...). Figure 4 (41b, the cylinder support section).

[0063] In operation S11, a seventh molding groove 80 (with a diameter larger than the sixth molding groove 77) is formed by stacking a sixth dry film 79 on the fifth dry film 76 through pattern exposure and development. Metal (e.g., nickel (Ni)) is then filled into the seventh molding groove 80 by electroplating or electroless plating, and the metal portion protruding from the top surface of the sixth dry film 79 is ground to form a sixth layer 81 (corresponding to…). Figure 4 The remaining part of the middle cylinder insertion section 41a).

[0064] Alternatively, a seventh layer (corresponding to the spring support portion) can be formed by stacking a seventh dry film on a sixth dry film 79, forming an eighth molding groove (with a diameter smaller than the seventh molding groove 80) in the shape of a cylinder by pattern exposure and development, filling the eighth molding groove 80 with metal (e.g., nickel (Ni)) by electroplating or electroless electroplating, and grinding the metal portion protruding from the top surface of the seventh dry film 79.

[0065] In operation S12, the sacrificial substrate 60 and the second to sixth dry films 66, 70, 73, 76 and 79 are removed to complete terminal 4.

[0066] Finally, terminal 4 may be externally plated with a highly conductive metal, such as gold (Au).

[0067] In this way, the detection probe 1 according to the first embodiment of this disclosure improves durability by increasing the thickness of the apex around the tip portion 422 electroplated on the tip base 421c.

[0068] The method described above for manufacturing the detection probe 1 according to the first embodiment of this disclosure can be performed by electroplating or electroless electroplating alone. Alternatively, the first layer 65 corresponding to the tip portion 422 can be electroplated by electroless electroplating, while the other second to fifth layers 68, 71, 74 and 77 can be electroplated by inexpensive and fast deposition rate electroplating.

[0069] Figure 7 This is a detailed cross-sectional view of terminal 8 according to the second embodiment of this disclosure. Hereinafter, details regarding... Figure 4 The detection probe 4 of the first embodiment shown is described again.

[0070] Reference Figure 7 The tip portion 822 is applied to the top surface of the tip base 821c and the top surface of the support body 821b by electroplating or electroless electroplating (corresponding to...). Figure 8Hard metal (NiB) is formed on the overflow surface 94a). In this case, the tip portion 822 is formed such that its upper portion Ht above the tip base 821c is thicker than its lower portion Lt near the first end of the support body 821b. The upper portion Ht, including the apex portion of the tip portion 822, refers to the portion that is typically inserted into the bump terminal and is thickly reinforced with hard metal (NiB) to improve wear resistance. The tip portion 822 can be firmly coupled to the tip base 821c through uneven bonding and bonding between the end portion surface of the support body 821c and the overflow portion 822b of the tip portion 822. Furthermore, the end portion surface of the support body 821c and the outer surface of the tip base 821c are not only unpolished but also rough and wavy, so the tip portion 822 can be more firmly coupled through uneven bonding. Therefore, the tip portion 822 is firmly coupled to the tip base 821c, thereby having anti-peel properties. Furthermore, the tip portion 822, made of hard metal (i.e., nickel boride (NiB)), and the tip support portion 821, made of the same type (i.e., nickel (Ni)), have excellent bonding properties.

[0071] Figure 8 It is a display manufacturing Figure 7 A schematic diagram of the method for terminal 8, Figure 9 It is a display manufacturing Figure 8 A detailed view of the method for the tip portion 822. Although multiple terminals 8 are fabricated simultaneously on a sacrificial substrate 80 using microelectromechanical systems (MEMS) processes, for ease of description, Figure 8 Only one terminal 8 is shown in the image.

[0072] In operation S21, a first molding groove 91, for example a square pyramid shape, is formed on one surface of the sacrificial substrate 90. The first molding groove 91 having a square pyramid shape corresponds to... Figure 7 The outline of the tip portion 822 is shown.

[0073] In operation S22, a conductive film 92, such as a gold (Au) film, is formed on one surface of the sacrificial substrate 90 by sputtering.

[0074] In operation S23, the first dry film 93 is stacked on the conductive film 92 of the sacrificial substrate 90, and a cylindrical second molding groove 94 is formed by pattern exposure and development to expose the first molding groove 91 on the sacrificial substrate 90 and the overflow surface 94a surrounding the first molding groove 91.

[0075] In operation S24, a first layer 95 (corresponding to) is formed by electroless electroplating or electroplating hard metal (e.g., nickel boride (NiB)) onto the inner surface of the first molding groove 91 and the overflow surface 94a of the second molding groove 94. Figure 7 The tip portion 822). The first layer 95 includes a downwardly recessed portion 95a (i.e. forming the tip portion 822). Figure 7 (Part of the tip base 821).

[0076] exist Figure 9 In the operation S24-1 shown, at the start of electroplating, the first layer 95 is electroplated with an almost constant thickness on the inner surface 91a of the first molding groove 91 and the overflow surface 94a of the second molding groove 94.

[0077] Then, after the electroplating process has continued for a predetermined period of time, in Figure 9 In the illustrated operation S24-2, the first molding groove 91 is filled starting from the lower part, which has a narrow area, thus the lower part is plated thicker than the upper part. As plating continues, the plating solution in the first molding groove 91 and the second molding groove 94 lacks plating metal components, so the plating solution needs to be repeatedly stirred. Furthermore, the plating solution supplied by stirring is pushed into the lower part of the first molding groove 91, thereby increasing the deposition amount in the lower part of the first molding groove 91.

[0078] In operation S25, a metal (e.g., nickel (Ni)) with excellent bonding properties, high conductivity, and relatively low hardness to nickel boride (NiB) is filled into the recessed portion 95a of the first layer 95 and the second molding groove 94 of the first dry film 93 by electroplating or electroless electroplating, and the metal portion protruding from the top surface of the first dry film 63 is ground to form the second layer 96 (corresponding to Figure 7 The supporting body 821b and the tip base 821c.

[0079] In operation S26, a second dry film 97 is stacked on the first dry film 93, a cylindrical third molding groove 98 with a diameter larger than the second molding groove 94 is formed by pattern exposure and development, and metal (e.g., nickel (Ni)) is filled into the third molding groove 98 by electroplating or electroless electroplating. Then, the metal portion protruding from the top surface of the second dry film 97 is ground to form a third layer 99 (corresponding to...). Figure 7 Flange 821a).

[0080] In operation S27, a third dry film 100 is stacked on the second dry film 97, and a cylindrical fourth molding groove 101 with a diameter smaller than the third molding groove 98 is formed by pattern exposure and development. Metal (e.g., nickel (Ni)) is then filled into the fourth molding groove 101 by electroplating. The metal portion protruding from the top surface of the third dry film 100 is then ground to form a fourth layer 102 (corresponding to…). Figure 7 (Part of the cylinder insertion section 81a).

[0081] In operation S28, a fourth dry film 103 is stacked on the third dry film 100, and a cylindrical fifth molding groove 104 with a diameter smaller than the fourth molding groove 101 is formed by pattern exposure and development. Metal (e.g., nickel (Ni)) is filled into the fifth molding groove 104 by electroplating or electroless electroplating, and then the metal portion protruding from the top surface of the fourth dry film 103 is ground to form a fifth layer 105 (corresponding to...). Figure 7 (81b) of the cylinder support section.

[0082] In operation S29, a cylindrical sixth molding groove 107 with a diameter larger than that of the fifth molding groove 104 is formed by stacking a fifth dry film 106 on the fourth dry film 103 through pattern exposure and development. Metal (e.g., nickel (Ni)) is filled into the sixth molding groove 107 by electroplating or electroless electroplating. Then, the metal portion protruding from the top surface of the fifth dry film 106 is ground to form a sixth layer 108 (corresponding to...). Figure 7 The remaining part of the middle cylinder insertion section 81a).

[0083] In operation S30, the sacrificial substrate 90 and the first to fifth dry films 93, 97, 100, 103 and 106 are removed to complete terminal 8.

[0084] Alternatively, a seventh molding groove with a diameter smaller than the sixth molding groove 107 can be formed by stacking a sixth dry film on the fifth dry film 106, patterning exposure and development, filling the seventh molding groove with metal (e.g., nickel (Ni)) by electroplating or electroless plating, and then grinding the metal portion protruding from the top surface of the sixth dry film to form a seventh layer (corresponding to the spring support portion).

[0085] Finally, terminal 8 can be externally plated with a highly conductive metal, such as gold (Au).

[0086] Thus, the detection probe 1 according to the second embodiment of this disclosure improves durability by increasing the thickness of the apex around the tip portion 422 electroplated on the tip base 421c.

[0087] The method described above for manufacturing the detection probe 1 according to the second embodiment of this disclosure can be performed by electroplating or electroless electroplating alone. Alternatively, the first layer 95 corresponding to the tip portion 822 can be electroplated by electroless electroplating, while the other second to fifth layers 96, 99, 102, 105 and 108 can be electroplated by electroplating, which is less costly and has a faster deposition rate.

[0088] Figure 10 This is a perspective view of the detection probe 1 according to the third embodiment of this disclosure. Details will be omitted below. Figures 1 to 3 The description of detection probe 1 shown is repeated.

[0089] Reference Figure 10The detection probe 1 includes a cylinder 2, a plunger 3 partially inserted into the first end portion of the cylinder 2, and a terminal assembly 110 partially inserted into the second end portion of the cylinder 2.

[0090] Terminal assembly 110 includes a tubular terminal support tube 111 and a terminal 112 coupled to the terminal support tube 111. Terminal 112 has a similar shape to... Figures 1 to 3 The structure of terminal 4 shown allows it to be partially inserted into and fixed to terminal support tube 111, rather than into cylinder 2.

[0091] Figure 11 This is a perspective view of terminal 12 according to the fourth embodiment of this disclosure.

[0092] Terminal 12 includes a terminal body portion 121 that is partially inserted into the second end portion of the barrel 2, and a contact portion 122 that is stacked on the terminal body portion 121 to contact the terminal of the object to be tested.

[0093] The contact portion 122 includes a flange 122a, a support body 122b disposed on the flange 122 and in the shape of a square prism or cylinder, and a pointed portion 122c disposed on the support body 122b and in the shape of a square pyramid, a cone, or a polygonal pyramid other than a square pyramid. There may be two, three, five or more pointed portions 122c.

[0094] While several embodiments of this disclosure have been described and illustrated above, this disclosure is not limited to the specific embodiments described above. Those skilled in the art can make various modifications to the embodiments without departing from the scope of this disclosure as claimed in the claims, and these modified embodiments should not be understood separately from the technical spirit or vision of this disclosure.

Claims

1. A detection probe, comprising: The body is cylindrical in shape. as well as A terminal includes a terminal body portion and a contact portion, the terminal body portion being partially inserted into a first end of the cylindrical body, and the contact portion extending integrally from the terminal body portion to contact a protruding terminal of the object to be tested. The contact portion includes: The tip support portion includes a support body disposed on the terminal body portion, and a tip base protruding in a trumpet shape from a first end of the support body; as well as The tip portion is electroplated on the outer surface of the tip base with a material that has a higher hardness than the tip support portion, and is formed to be thicker at the upper part of the tip base than at the lower part.

2. The detection probe according to claim 1, wherein The tip portion is made of nickel boride, and The tip support portion is made of nickel.

3. The detection probe according to claim 1, wherein the terminal is externally plated with a highly conductive material to include an externally plated film.

4. The detection probe according to claim 1 further includes at least one non-uniformly joined portion formed on the interface between the tip base and the tip portion.

5. A method for manufacturing a detection probe, comprising: A first molding groove is formed on the sacrificial substrate, wherein the cross-sectional area of ​​the first molding groove decreases downward; The tip portion is formed by electroplating a first material on the inner side of the first molding groove, and the lower side of the tip base is thicker than the upper side; as well as The tip support portion is stacked on the tip portion using a second material.

6. The method of manufacturing a detection probe according to claim 5, wherein stacking the tip support portion comprises: A dry film is stacked on the sacrificial substrate, and a second molding groove is formed in the dry film to surround the first molding groove and to be larger than the top area of ​​the first molding groove. The second molding groove is filled with a second material having higher conductivity than the first material, thereby stacking the tip support portion.

7. The method of manufacturing a detection probe according to claim 5, wherein the tip portion is formed by electroplating.

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