A chip detection device and method

Abstract

This invention discloses a chip testing device, including a base plate. A moving mechanism is installed inside the base plate, and several storage mechanisms are located at the upper end of the moving mechanism. An L-shaped plate is mounted on the upper end of the base plate, and a driving mechanism is installed inside the L-shaped plate. A picking mechanism is located at the lower end of the L-shaped plate. A rotating column is rotatably connected to the upper end of the base plate, and a power mechanism is installed on the outer surface of the rotating column. Several lifting mechanisms are located on the side of the rotating column, and rotation dampers are installed on the side of each lifting mechanism. A rotating rod is installed on the side of each rotation damper, and a placement mechanism is installed on the side of each rotating rod. This invention, with its multiple storage mechanisms and the intermittent movement of the moving mechanism, allows for alternating feeding of multiple storage cylinders, eliminating the need for frequent manual chip replenishment. Simultaneously, the driving mechanism, through the precise engagement of a mating block and a mating groove, drives the lifting plate to lift intermittently. The lifting height matches the thickness of a single chip, ensuring the chip is always in a convenient position for picking.

Description

Technical Field

[0001] This invention relates to the field of chip testing, and more specifically to a chip testing device and method. Background Technology

[0002] With the rapid development of the semiconductor industry, the application scenarios of chips are becoming increasingly widespread, ranging from consumer electronics and smart homes to aerospace and industrial control. This leads to ever-increasing demands on chip performance stability and appearance integrity. During the manufacturing process, chips are susceptible to defects such as abnormal conductivity, unstable signals, surface damage, and pin deformation due to factors such as process precision, material properties, and environmental interference. Furthermore, the performance of chips in extreme operating environments such as high and low temperatures directly determines the reliability of their subsequent applications. Therefore, comprehensive testing before chips leave the factory is a crucial step in ensuring product quality.

[0003] Currently, existing chip testing devices suffer from several shortcomings: First, the feeding method is mostly manual single-pass feeding or single storage cylinder feeding, which is inefficient; second, the testing process is fragmented, with high-temperature testing, low-temperature testing, and appearance testing often needing to be performed separately, requiring manual chip transfer, which not only increases labor costs but also easily causes secondary damage to the chips, resulting in low testing efficiency; third, the screening and classification of tested chips largely rely on manual work, with low automation and large screening errors. Therefore, those skilled in the art provide a chip testing device and method to solve the problems mentioned in the background art. Summary of the Invention

[0004] To solve the above-mentioned technical problems, the present invention provides a chip testing device, including a base plate, a moving mechanism inside the base plate, several material storage mechanisms at the upper end of the moving mechanism, an L-shaped plate mounted on the upper end of the base plate, a driving mechanism inside the L-shaped plate, a picking mechanism at the lower end of the L-shaped plate, a rotating column rotatably connected to the upper end of the base plate, a power mechanism mounted on the outer surface of the rotating column, several lifting mechanisms on the side of the rotating column, a rotation damper mounted on the side of the lifting mechanism, a rotating rod mounted on the side of the rotation damper, a placement mechanism mounted on the side of the rotating rod, two testing mechanisms at the upper end of the base plate, a fixed round rod mounted on the upper end of the base plate, a fixed block mounted on the upper end of the fixed round rod, a heating mechanism, a cooling mechanism and a camera mechanism mounted on the side of the fixed block, a flipping mechanism at the upper end of the fixed block, and a finished product frame, a waste product frame and a pushing mechanism at the upper end of the base plate.

[0005] Preferably, the storage mechanism includes a storage cylinder and a lifting plate. A lifting groove is opened at the front end of the storage cylinder. A grooved rod is installed at the position corresponding to the lifting groove at the front end of the storage cylinder. A threaded rod is rotatably connected inside the grooved rod. A threaded sleeve is fitted on the outer surface of the threaded rod. A lifting plate is installed at the rear end of the threaded sleeve and is slidably connected inside the storage cylinder. A rotating block is installed at the upper end of the threaded rod. A mating groove is opened at the upper end of the rotating block, and both ends of the mating groove penetrate the side of the rotating block.

[0006] Preferably, the driving mechanism includes a second motor and a mating block. The second motor is fixed to the upper end of the L-shaped plate, and the mating block is installed at the lower end of the second motor. The mating block passes through the L-shaped plate and corresponds to the position of the mating groove.

[0007] Preferably, the picking mechanism includes a slide groove and a threaded rod. The slide groove is opened at the lower end of the L-shaped plate. The threaded rod is rotatably connected inside the slide groove. A motor is installed on the side of the threaded rod. A slider is threadedly connected to the outer surface of the threaded rod. A cylinder is installed at the lower end of the slider. A suction cup is installed at the lower end of the cylinder, and a vacuum device is connected to the suction cup.

[0008] Preferably, the lifting mechanism includes a lifting groove and a threaded rod four. Several lifting grooves are opened on the side of the rotating column. The threaded rod four is rotatably connected inside the lifting groove. The upper end of the threaded rod four passes through the rotating column and is equipped with a gear one. The outer surface of the threaded rod four is threadedly connected to the lifting block, and the rotation damper is fixed on the side of the lifting block.

[0009] Preferably, the placement mechanism includes a placement plate and a placement groove. The placement plate is fixed to the side of the rotating rod. A placement groove is opened at the upper end of the placement plate. Copper sheets are symmetrically installed at the bottom of the placement groove. Conductive spring pins are symmetrically arranged on the side of the placement plate, and the conductive spring pins are electrically connected to the copper sheets.

[0010] Preferably, the detection mechanism includes a detector and an arc-shaped copper block. The arc-shaped copper block is installed on the upper end of the detector, and the position of the arc-shaped copper block corresponds to that of the conductive spring pin. The arc-shaped copper block is electrically connected to the detector through a connecting wire.

[0011] Preferably, the heating mechanism includes a pressure plate and a heating tube. The lower left and lower right corners of the pressure plate are both inclined surfaces. A cavity is set inside the pressure plate, and several vent holes are opened at the lower end of the cavity. The heating tube is installed at the top of the cavity. The cooling mechanism includes a pressure plate and a semiconductor cooler. The lower left and lower right corners of the pressure plate are both inclined surfaces. A cavity is set inside the pressure plate, and several vent holes are opened at the lower end of the cavity. A semiconductor cooler is installed at the upper end of the cavity. Fans are set at both ends of the semiconductor cooler, and the cooling end of the semiconductor cooler faces the inside of the cavity.

[0012] Preferably, the flipping mechanism includes two cylinders, two racks, and several gears. The two cylinders are fixed to the upper end of the fixed block, and the cylinders face the finished product frame and the scrap frame respectively. A motor is installed at the lower end of the cylinders, and a gear is installed at the lower end of the motor, with the gear corresponding to the position of the gear. The gears are fixed to the outer surface of the rotating rod, and the two racks are fixed to the upper end of the base plate, with the racks corresponding to the positions of the gears.

[0013] The technical effects and advantages of this invention are as follows: 1. This invention features several storage mechanisms, which, in conjunction with the intermittent movement of the moving mechanism, enable alternating feeding of multiple storage cylinders. This eliminates the need for frequent manual chip replenishment. Simultaneously, the drive mechanism, through the precise engagement of the mating blocks and grooves, causes the lifting plate to rise intermittently. The lifting height matches the thickness of a single chip, ensuring that the chip is always in a convenient position for handling. Combined with the suction cup adsorption and horizontal movement functions of the handling mechanism, the chip handling and placement are automated, completely replacing the manual single-time feeding or single storage cylinder feeding mode. This significantly improves the continuity and efficiency of feeding and reduces the intensity of manual labor.

[0014] 2. This invention uses the intermittent rotation of a rotating column to drive the placement mechanism through a heating mechanism, a camera mechanism, and a cooling mechanism, simultaneously completing high-temperature performance testing, appearance defect detection, and low-temperature performance testing of the chip. This eliminates the need for manual chip handling, effectively solving the problems of fragmented testing processes and secondary chip damage caused by manual handling in existing technologies. Simultaneously, the conductive spring pins and arc-shaped copper blocks of the testing and placement mechanisms precisely coordinate to ensure stable electrical signal transmission during testing, guaranteeing the accuracy of chip conductivity and signal stability test data under high and low temperature environments. The image processing unit of the camera mechanism employs edge detection and template matching algorithms to accurately identify defects such as chip appearance damage and pin deformation, enabling simultaneous multi-dimensional testing and significantly improving testing efficiency and coverage.

[0015] 3. This invention, through the coordinated operation of a flipping mechanism, a lifting mechanism, and a rack and pinion, combined with the comprehensive results of high-temperature detection, low-temperature detection, and appearance inspection, can automatically send qualified chips and unqualified chips into finished product frames and waste frames respectively, without the need for manual screening and sorting. This completely solves the problems of reliance on manual screening, low automation, and large screening errors in the prior art. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this application; Figure 2 This is a schematic diagram of the structure of the mobile mechanism of this application; Figure 3 This is a structural diagram of the organization from which this application is made; Figure 4 This is a schematic diagram of the structure of the presiding authority in this application; Figure 5 This is a structural schematic diagram of the lifting mechanism of this application; Figure 6 This is a schematic diagram of the structure of the fixed round rod in this application; Figure 7 This is a schematic diagram of the heating mechanism of this application; In the picture: 1. Base plate; 2. Moving mechanism; 3. Moving groove; 4. Threaded rod 1; 5. Motor 1; 6. Moving block; 7. Storage mechanism; 8. Storage cylinder; 9. Lifting plate; 10. Grooved rod; 11. Threaded rod II; 12. Threaded sleeve; 13. Rotating block; 14. Mating groove; 15. L-shaped plate; 16. Drive mechanism; 17. Motor II; 18. Mating block; 19. Picking mechanism; 20. Slide rail; 21. Threaded rod three; 22. Motor three; 23. Slider; 24. Cylinder one; 25. Suction cup; 26. Rotating column; 27. Power mechanism; 28. Bevel gear one; 29. ​​Bevel gear two; 30. Motor 4; 31. Lifting slot; 32. Threaded rod 4; 33. Gear 1; 34. Lifting block; 35. Rotation damper; 36. Rotating rod; 37. Placement mechanism; 38. Placement plate; 39. Placement slot; 40. Copper sheet; 41. Conductive spring pin; 42. Detection mechanism; 43. Detector; 44. Arc-shaped copper block; 45. Connecting wire; 46. Fixing rod; 47. Heating mechanism; 48. Pressure plate; 49. Cavity; 50. Vent hole; 51. Heating tube; 52. Inclined surface; 53. Refrigeration mechanism; 54. Semiconductor refrigerator; 55. Camera mechanism; 56. Tilting mechanism; 57. Cylinder 2; 58. Motor 5; 59. Gear 2; 60. Gear 3; 61. Spur rack; 62. Finished product frame; 63. Scrap product frame; 64. Push-alignment mechanism; 65. Cylinder 3; 66. Push plate. Detailed Implementation

[0017] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose.

[0018] like Figure 1 - Figure 7As shown, this embodiment provides a chip testing device, including a base plate 1. The base plate 1 is provided with a moving mechanism 2. The moving mechanism 2 includes a moving groove 3 and a threaded rod 4. The moving groove 3 is opened at the upper end of the base plate 1. The threaded rod 4 is rotatably connected inside the moving groove 3. A motor 5 is installed on the side of the threaded rod 4. A moving block 6 is threadedly connected to the outer surface of the threaded rod 4. A support plate is installed at the upper end of the moving block 6. Several storage mechanisms 7 are provided at the upper end of the moving mechanism 2. The storage mechanism 7 includes a storage cylinder 8 and a lifting plate 9. A lifting groove hole is opened at the front end of the storage cylinder 8. A grooved rod 10 is installed at the position corresponding to the lifting groove hole at the front end of the storage cylinder 8. A threaded rod 11 is rotatably connected inside the grooved rod 10. A threaded sleeve 12 is sleeved on the outer surface of the threaded rod 11. The lifting plate 9 is installed at the rear end of the threaded sleeve 12 and is slidably connected inside the storage cylinder 8. A rotating block 13 is installed at the upper end of the threaded rod 11. A mating groove 14 is opened at the upper end of the rotating block 13, and both ends of the mating groove 14 penetrate the side of the rotating block 13. An L-shaped plate 15 is installed on the upper end of the base plate 1. A drive mechanism 16 is set inside the L-shaped plate 15. The drive mechanism 16 includes a second motor 17 and a mating block 18. The second motor 17 is fixed on the upper end of the L-shaped plate 15. The mating block 18 is installed on the lower end of the second motor 17 and passes through the L-shaped plate 15. The mating block 18 corresponds to the position of the mating groove 14. A picking mechanism 19 is set at the lower end of the L-shaped plate 15. The picking mechanism 19 includes a slide groove 20 and a threaded rod 21. The slide groove 20 is opened at the lower end of the L-shaped plate 15. The threaded rod 21 is rotatably connected inside the slide groove 20. A third motor 22 is installed on the side of the threaded rod 21. A slider 23 is threadedly connected to the outer surface of the threaded rod 21. A cylinder 24 is installed at the lower end of the slider 23. A suction cup 25 is installed at the lower end of the cylinder 24 and is externally connected to a vacuum device. A rotating column 26 is rotatably connected to the upper end of the base plate 1. A power mechanism 27 is installed on the outer surface of the rotating column 26. The power mechanism 27 includes a bevel gear 28 and a bevel gear 29. The bevel gear 28 is fixed to the lower part of the outer surface of the rotating column 26. The bevel gear 28 and the bevel gear 29 mesh. A motor 30 is installed on the side of the bevel gear 29. Several lifting mechanisms are provided on the side of the rotating column 26. The lifting mechanisms include lifting grooves 31 and threaded rods 32. Several lifting grooves 31 are opened on the side of the rotating column 26. The threaded rods 32 are rotatably connected inside the lifting grooves 31. The upper end of the threaded rods 32 passes through the rotating column 26 and is installed... Gear 1 33 is installed, and the outer surface of threaded rod 4 32 is threadedly connected to lifting block 34. Rotation damper 35 is fixed to the side of lifting block 34. Rotation damper 35 is installed on the side of lifting mechanism. Rotation rod 36 is installed on the side of rotation damper 35. Placement mechanism 37 is installed on the side of rotation rod 36. Placement mechanism 37 includes placement plate 38 and placement groove 39. Placement plate 38 is fixed to the side of rotation rod 36. Placement groove 39 is opened at the upper end of placement plate 38. Copper sheet 40 is symmetrically installed at the bottom of placement groove 39. Conductive spring pin 41 is symmetrically arranged on the side of placement plate 38, and conductive spring pin 41 is electrically connected to copper sheet 40. Two detection mechanisms 42 are provided on the upper end of the base plate 1. The detection mechanism 42 corresponds to the position of the placement mechanism 37. The two detection mechanisms 42 are separated by a placement mechanism 37. The detection mechanism 42 includes a detector 43 and an arc-shaped copper block 44. The arc-shaped copper block 44 is installed on the upper end of the detector 43, and the arc-shaped copper block 44 corresponds to the position of the conductive spring pin 41. The arc-shaped copper block 44 is electrically connected to the detector 43 through a connecting wire 45. A fixed round rod 46 is installed on the upper end of the base plate 1, and the fixed round rod 46 is rotatably connected to the inside of the rotating column 26. A fixing block is installed on the upper end of the fixed round rod 46. A heating mechanism 47, a cooling mechanism 53, and a camera mechanism 55 are installed on the side of the fixing block. The heating mechanism 47 and the cooling mechanism 53 correspond to the positions of the detection mechanism 42, respectively. The camera mechanism 55 is located between the heating mechanism 47 and the cooling mechanism 53. An image processing unit is set inside the camera mechanism 55. The heating mechanism 47 includes a pressure plate 48 and a heating tube 51. The lower left and lower right corners of the pressure plate 48 are... The pressure plate 48 has a sloping surface 52 and a cavity 49 inside. Several vent holes 50 are opened at the lower end of the cavity 49. A heating tube 51 is installed at the top of the cavity 49. The cooling mechanism 53 includes a pressure plate 48 and a semiconductor cooler 54. The lower left and lower right corners of the pressure plate 48 are both sloping surfaces 52. The pressure plate 48 has a cavity 49 inside. Several vent holes 50 are opened at the lower end of the cavity 49. A semiconductor cooler 54 is installed at the upper end of the cavity 49. Fans are installed at both ends of the semiconductor cooler 54. The cooling end of the semiconductor cooler 54 faces the inside of the cavity 49. A flipping mechanism 56 is provided on the upper end of the fixed block, and a finished product frame 62 and a scrap frame 63 are provided on the upper end of the base plate 1. The finished product frame 62 and the scrap frame 63 are respectively placed by the placement mechanism 37. The flipping mechanism 56 includes two cylinders 57, two racks 61, and several gears 60. The two cylinders 57 are fixed on the upper end of the fixed block, and the cylinders 57 face the finished product frame 62 and the scrap frame 63 respectively. A motor 58 is installed at the lower end of the cylinders 57, and a gear 59 is installed at the lower end of the motor 58, with the gear 59 corresponding to the gear 1. At position 33, gear 360 is fixed to the outer surface of rotating rod 36, and two spur racks 61 are fixed to the upper end of base plate 1, with the spur racks 61 corresponding to the position of gear 360. A push-aligning mechanism 64 is installed on the upper end of base plate 1, and the push-aligning mechanism 64 faces the storage mechanism 7. The push-aligning mechanism 64 is located directly below the placement mechanism 37. The push-aligning mechanism 64 includes cylinder 365 and push plate 66. Cylinder 365 is fixed to the upper end of base plate 1 through a support platform. Push plate 66 is installed on the upper end of cylinder 365, and push plate 66 corresponds to the position of placement mechanism 37.

[0019] A chip testing method includes the following steps; Step 1: Chip loading and initial preparation Multiple chips to be tested are placed one by one into the storage cylinder 8 of the storage mechanism 7. The chips are stacked on the top of the lifting plate 9. Check that each mechanism of the device is in normal working condition. Ensure that the vacuum equipment, detector 43, heating mechanism 47, cooling mechanism 53, camera mechanism 55, motors and cylinders connected to the suction cup 25 are all started normally. The push-alignment mechanism 64 is in the initial retraction state. The finished product frame 62 and the waste product frame 63 are placed in place and correspond to the flipping trajectory of the placement mechanism 37. Step 2: Moving the storage mechanism and intermittently lifting the chip The motor 5 of the moving mechanism 2 is started. The motor 5 drives the threaded rod 4 to rotate inside the moving groove 3. The threaded rod 4 drives the moving block 6 connected to the thread on the outer surface to move horizontally and intermittently for a distance. This causes the pallet at the upper end of the moving block 6 and several storage mechanisms 7 on the pallet to move synchronously. One storage mechanism 7 is moved to the position directly below the picking mechanism 19. At the same time, the mating block 18 is inserted into the mating groove 14 to complete the positioning of the storage mechanism 7. Then, the second motor 17 of the drive mechanism 16 is started. The second motor 17 drives the mating block 18 to rotate. The mating block 18 drives the rotating block 13 and the second threaded rod 11 to rotate synchronously through the mating groove 14. The second threaded rod 11 drives the threaded sleeve 12 on the outer surface to rise intermittently along the grooved rod 10 for a certain distance. In turn, it drives the lifting plate 9 at the rear end of the threaded sleeve 12 to slide up a certain distance along the inside of the storage cylinder 8, so as to realize the intermittent lifting of the chip in the storage cylinder 8. Each lifting height is matched with the thickness of a single chip, so that the top chip is in a position that is easy to pick up. Step 3: Chip Removal and Placement Start cylinder 24, which drives suction cup 25 to descend, so that suction cup 25 is attached to the upper surface of the chip. Start vacuum equipment, suction cup 25 adsorbs and fixes the chip. Cylinder 24 retracts and drives the chip to rise. Motor 3 22 starts, and motor 3 22 drives threaded rod 3 21 to rotate inside slide groove 20. Threaded rod 3 21 drives slider 23 with threaded connection on the outer surface to move horizontally, moving cylinder 24, suction cup 25 and chip at the lower end of slider 23 to directly above the placement mechanism 37. Cylinder 24 extends again, placing the chip into the placement slot 39 of the placement mechanism 37, so that the chip contacts the copper sheet 40 at the bottom of the placement slot 39. The vacuum equipment is turned off, the suction cup 25 separates from the chip, and cylinder 24 retracts and resets, completing the picking and placing of a single chip. The above operation is repeated until each placement mechanism 37 has a chip placed in it (or all chips to be tested are picked up). Step 4: High-Temperature Environment Testing of the Chip The motor 30 of the power mechanism 27 is started. The motor 30 drives the bevel gear 29 to rotate. The bevel gear 29 meshes with the bevel gear 1 28, which in turn drives the rotating column 26 to rotate slowly and intermittently around the fixed round rod 46, so that the placement mechanism 37 containing the chip rotates with the rotating column 26 to the position of the heating mechanism 47 and the detection mechanism 42. When the placement mechanism 37 moves directly below the heating mechanism 47, the chip is pushed into the placement slot 39 by the inclined surface 52 and the lower end of the pressure plate 48, so that the copper sheet 40 and the chip are in stable contact. At the same time, the conductive spring pin 41 contacts the arc-shaped copper block 44 of the detection mechanism 42 to conduct electricity. The heating tube 51 in the cavity 49 inside the pressure plate 48 is activated. The heat generated is blown onto the chip through several vent holes 50 at the lower end of the cavity 49 to heat the chip at high temperature, simulating the high temperature working environment of the chip. The temperature is kept warm for a preset time. The conductive spring pin 41 on the side of the placement mechanism 37 contacts the arc-shaped copper block 44 of the detection mechanism 42. The arc-shaped copper block 44 transmits the electrical signal to the detector 43 through the connecting line 45. The detector 43 detects the working status of the chip in the high temperature environment (such as conductivity, signal stability, etc.) and records the detection data. Step 5: Chip imaging and image processing detection After the high-temperature test is completed, the placement mechanism 37 continues to rotate intermittently with the rotating column 26, moving to the area directly below the camera mechanism 55. The camera mechanism 55 is activated to take pictures of the chip in the placement slot 39 and obtain an image of the chip's appearance. The image processing unit inside the camera mechanism 55 is activated and uses edge detection algorithm and template matching algorithm to process and analyze the chip's appearance image, detect whether the chip has defects such as appearance damage or pin deformation, and record the image processing and detection results. Step 6: Low-temperature environment testing of the chip After image processing and detection are completed, the placement mechanism 37 continues to rotate intermittently with the rotating column 26, moving to directly below the cooling mechanism 53. The pressure plate 48 of the cooling mechanism 53 presses down on the chip. At the same time, the conductive spring pin 41 contacts the arc-shaped copper block 44 of the detection mechanism 42. The semiconductor cooler 54 of the cooling mechanism 53 is activated, with the cooling end of the semiconductor cooler 54 facing the inside of the cavity 49. The fans at both ends are activated synchronously to accelerate the circulation of cold air in the cavity 49. The cold air is blown onto the chip through the vent 50 to cool the chip at a low temperature, simulating the low-temperature working environment of the chip, and the temperature is kept warm for a preset time. At the same time, the arc-shaped copper block 44 transmits electrical signals to the detector 43 through the connecting line 45. The detector 43 detects the working status of the chip in the low-temperature environment and records the detection data. Step 7: Chip Screening and Classification Collection By combining the results of high-temperature testing, low-temperature testing, and image processing testing, we determine whether the chip is qualified. 1. If the chip is qualified: The placement mechanism 37 containing the qualified chip rotates to the top of the finished product frame 62, and the cylinder 2 57 in the flipping mechanism 56 facing the finished product frame 62 is activated. The cylinder 2 57 extends and drives the motor 58 and gear 2 59 to descend, so that gear 2 59 meshes with gear 1 33 of the corresponding lifting mechanism. The motor 58 starts and drives gear 1 33 to rotate. Gear 1 33 drives the threaded rod 4 32 to rotate inside the lifting groove 31, thereby driving the lifting block 34, the rotation damper 35, the rotating rod 36, and the placement mechanism 37 to descend synchronously. When the placement mechanism 37 descends, the gear 60 on the outer surface of the rotating rod 36 meshes with the rack 61 on the side of the finished product frame 62 at the upper end of the base plate 1, causing the rotating rod 36 to rotate around the rotation damper 35, causing the placement mechanism 37 to flip, and the qualified chip in the placement slot 39 falls into the finished product frame 62. 2. If the chip is defective: The placement mechanism 37 containing the defective chip rotates to the top of the scrap box 63, and the cylinder 57 in the flipping mechanism 56 facing the scrap box 63 is activated. The above lifting and flipping actions are repeated to flip the placement mechanism 37 and the defective chip falls into the scrap box 63. Step 8: Reset the placement mechanism After the chip falls into the corresponding frame, the placement mechanism 37 rises and flips to reset. At the same time, the cylinder 57 of the flipping mechanism 56 retracts, causing the gear 59 to separate from the gear 33. Then, the placement mechanism 37 rotates intermittently with the rotating column 26 to the top of the pushing mechanism 64, activating the cylinder 65 of the pushing mechanism 64. The cylinder 65 extends and drives the push plate 66 to rise. The push plate 66 contacts the placement plate 38 and pushes the placement plate 38 to rotate around the rotation damper 35 until the placement plate 38 is parallel to the base plate 1, completing the reset of the placement mechanism 37, which is convenient for placing the chip again in the future. Step 9: Loop Detection Repeat steps 2 to 8. The moving mechanism 2 drives the storage mechanism 7 to move continuously, the driving mechanism 16 drives the chip to lift intermittently, and the picking mechanism 19 continuously picks up the chip and places it into the reset placement mechanism 37. The high temperature detection, photographic detection, low temperature detection, screening and classification and placement mechanism 37 of all chips to be tested are completed in sequence until all chip testing is completed. Then the power of each mechanism of the device is turned off.

[0020] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A chip testing device, comprising a base plate (1), characterized in that, The base plate (1) is equipped with a moving mechanism (2) inside. Several storage mechanisms (7) are provided on the upper end of the moving mechanism (2). An L-shaped plate (15) is installed on the upper end of the base plate (1). A driving mechanism (16) is provided inside the L-shaped plate (15). A picking mechanism (19) is provided on the lower end of the L-shaped plate (15). A rotating column (26) is rotatably connected to the upper end of the base plate (1). A power mechanism (27) is installed on the outer surface of the rotating column (26). Several lifting mechanisms are provided on the side of the rotating column (26). A rotation damper (35) is installed on the side of the lifting mechanism. A rotating rod (36) is installed on the side of the damper (35), and a placement mechanism (37) is installed on the side of the rotating rod (36). Two detection mechanisms (42) are set on the upper end of the base plate (1). A fixed round rod (46) is installed on the upper end of the base plate (1). A fixed block is installed on the upper end of the fixed round rod (46). A heating mechanism (47), a cooling mechanism (53), and a camera mechanism (55) are installed on the side of the fixed block. A flipping mechanism (56) is set on the upper end of the fixed block. A finished product frame (62), a scrap frame (63), and a pushing mechanism (64) are set on the upper end of the base plate (1).

2. The chip detection device according to claim 1, characterized in that, The storage mechanism (7) includes a storage cylinder (8) and a lifting plate (9). A lifting slot is opened at the front end of the storage cylinder (8). A grooved rod (10) is installed at the front end of the storage cylinder (8) corresponding to the position of the lifting slot. A threaded rod (11) is rotatably connected inside the grooved rod (10). A threaded sleeve (12) is fitted on the outer surface of the threaded rod (11). The lifting plate (9) is installed at the rear end of the threaded sleeve (12). The lifting plate (9) is slidably connected inside the storage cylinder (8). A rotating block (13) is installed at the upper end of the threaded rod (11). A mating groove (14) is opened at the upper end of the rotating block (13). Both ends of the mating groove (14) penetrate the side of the rotating block (13).

3. The chip detection device according to claim 1, characterized in that, The driving mechanism (16) includes a second motor (17) and a mating block (18). The second motor (17) is fixed on the upper end of the L-shaped plate (15), and the mating block (18) is installed on the lower end of the second motor (17). The mating block (18) passes through the L-shaped plate (15) and corresponds to the position of the mating groove (14).

4. The chip detection device according to claim 1, characterized in that, The picking mechanism (19) includes a slide (20) and a threaded rod (21). The slide (20) is opened at the lower end of the L-shaped plate (15). The threaded rod (21) is rotatably connected inside the slide (20). A motor (22) is installed on the side of the threaded rod (21). A slider (23) is threadedly connected to the outer surface of the threaded rod (21). A cylinder (24) is installed at the lower end of the slider (23). A suction cup (25) is installed at the lower end of the cylinder (24), and a vacuum device is connected to the suction cup (25).

5. The chip detection device according to claim 1, characterized in that, The lifting mechanism includes a lifting groove (31) and a threaded rod (32). Several lifting grooves (31) are opened on the side of the rotating column (26). The threaded rod (32) is rotatably connected inside the lifting groove (31). The upper end of the threaded rod (32) passes through the rotating column (26) and is equipped with a gear (33). The outer surface of the threaded rod (32) is threadedly connected to the lifting block (34), and the rotation damper (35) is fixed on the side of the lifting block (34).

6. The chip detection device according to claim 1, characterized in that, The placement mechanism (37) includes a placement plate (38) and a placement groove (39). The placement plate (38) is fixed to the side of the rotating rod (36). The placement groove (39) is opened at the upper end of the placement plate (38). Copper sheets (40) are symmetrically installed at the bottom of the placement groove (39). Conductive spring pins (41) are symmetrically arranged on the side of the placement plate (38), and the conductive spring pins (41) are electrically connected to the copper sheets (40).

7. The chip detection device according to claim 1, characterized in that, The detection mechanism (42) includes a detector (43) and an arc-shaped copper block (44). The arc-shaped copper block (44) is installed on the upper end of the detector (43), and the arc-shaped copper block (44) corresponds to the position of the conductive spring pin (41). The arc-shaped copper block (44) is electrically connected to the detector (43) through a connecting line (45).

8. The chip detection device according to claim 1, characterized in that, The heating mechanism (47) includes a pressure plate (48) and a heating tube (51). The lower left and lower right corners of the pressure plate (48) are both inclined surfaces (52). A cavity (49) is provided inside the pressure plate (48). Several vent holes (50) are opened at the lower end of the cavity (49). The heating tube (51) is installed at the top inside the cavity (49). The cooling mechanism (53) includes a pressure plate (48) and a semiconductor cooler (54). The lower left and lower right corners of the pressure plate (48) are both inclined surfaces (52). A cavity (49) is provided inside the pressure plate (48). Several vent holes (50) are opened at the lower end of the cavity (49). The semiconductor cooler (54) is installed at the upper end of the cavity (49). Fans are provided at both ends of the semiconductor cooler (54). The cooling end of the semiconductor cooler (54) faces the inside of the cavity (49).

9. A chip testing device according to claim 1, characterized in that, The flipping mechanism (56) includes two cylinders (57), two racks (61) and several gears (60). The two cylinders (57) are fixed on the upper end of the fixed block and are facing the finished product frame (62) and the scrap frame (63) respectively. The lower end of the cylinders (57) is equipped with motor (58) and the lower end of motor (58) is equipped with gear (59). Gear (59) corresponds to the position of gear (33). Gear (60) is fixed on the outer surface of the rotating rod (36). The two racks (61) are fixed on the upper end of the base plate (1) and correspond to the position of gear (60).

10. A chip detection method, used in any one of the chip detection apparatuses according to claims 1-9, characterized in that, Includes the following steps; Step 1: Place the chip to be tested into the storage mechanism (7), check that all mechanisms and equipment of the device start normally, and place the finished product frame (62) and the waste frame (63) in place; Step 2: Start the moving mechanism (2), move a storage mechanism (7) directly below the picking mechanism (19) and position it, start the driving mechanism (16) to drive the chip to rise intermittently, so that the top chip can be easily picked up; Step 3: Cylinder 1 (24) drives the suction cup (25) to pick up the chip, move it above the placement mechanism (37) and put it down. The suction cup (25) resets and the operation is repeated until the placement mechanism (37) is full or all chips are picked up. Step 4: Start the power mechanism (27) to turn the placement mechanism (37) to the heating mechanism (47) to heat the chip to simulate a high temperature environment. The detector (43) detects the chip's working status and records the data. Step 5: The placement mechanism (37) is moved to the underside of the camera mechanism (55) to take a picture of the chip's appearance. The image processing unit detects appearance defects and records the results. Step 6: The placement mechanism (37) moves to the cooling mechanism (53) to cool the chip and simulate a low-temperature environment. The detector (43) detects the chip's working status and records the data. Step 7: Based on the test results, start the flipping mechanism (56) to make qualified chips fall into the finished product frame (62) and unqualified chips fall into the scrap frame (63). Step 8: Placement mechanism reset: After the chips are collected, the placement mechanism (37) rises and flips to reset, and is adjusted to a horizontal position by the straightening mechanism (64) for subsequent use; Step 9: Cyclic detection: Repeat steps (2) to (8). The moving mechanism (2) drives the storage mechanism (7) to move, and the driving mechanism (16) drives the chip to rise until all chips are detected. Then turn off the power of each mechanism of the device.

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