A cutting device for processing a circuit board substrate

Abstract

This invention discloses a cutting device for processing circuit board substrates, belonging to the field of circuit board cutting technology. To address the problem of laser beams emitted by laser cutting heads easily scattering and exhibiting poor focusing, leading to outward spillage and burns on uncut areas of the circuit board substrate by scattered excess light, the invention includes a laser cutting machine. The laser cutting machine contains a moving component and a clamping component. A laser cutting head is mounted on one side of the moving component, and a driving component is mounted on one side of the laser cutting head. A circumferential rotating component is located at one end of the driving component, and a detection component is installed within the circumferential rotating component. This invention can adaptively retract a shielding plate and reduce the aperture when abnormal laser beam scattering is detected, dynamically correcting the beam focusing state without requiring machine stoppage for calibration. This effectively prevents scattered light from burning the substrate and causing carbonization damage to the board surface.

Description

Technical Field

[0001] This invention relates to the field of circuit board cutting technology, specifically to a cutting device for processing circuit board substrates. Background Technology

[0002] Circuit board substrate cutting equipment is a specialized processing equipment for shaping, dividing, and cutting circuit board substrates of various materials. It is used for circuit board forming and cutting, edge trimming, slot cutting and other processing processes. By placing the circuit board substrate to be cut on the processing station, the substrate is clamped and limited by the clamping seat to ensure the stability of the board position during the processing. Then, the laser cutting head is adjusted to the standard working distance, and the equipment is started to emit a high-energy laser beam according to the preset processing trajectory. The substrate cutting operation is completed by relying on the high temperature ablation of the laser. With the characteristics of high precision and fast processing speed, laser cutting is widely used in the mass production of small and medium-sized circuit boards.

[0003] Current circuit board substrate processing cutting equipment, when performing long-term continuous high-frequency cutting operations, makes the laser beam emitted by the laser cutting head prone to scattering and poor focusing. This causes the laser beam to spill outwards, and the scattered excess light can easily burn the uncut areas of the circuit board substrate, causing the substrate surface to be eroded, the circuit to be damaged, and affecting the product processing quality.

[0004] To address the above problems, a cutting device for processing circuit board substrates is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a cutting device for processing circuit board substrates. By using this invention, the problem of laser beams emitted by laser cutting heads easily scattering and losing focus, causing the laser beams to spill outwards and burn the uncut areas of the circuit board substrate with the scattered excess light, is solved.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A cutting device for processing circuit board substrates includes a laser cutting machine. The laser cutting machine has a moving component and a clamping component installed inside. A laser cutting head is installed on one side of the moving component, and a driving component is installed on one side of the laser cutting head. A circumferential rotation component is installed at one end of the driving component, and a detection component is installed inside the circumferential rotation component. A dynamic shielding component is installed at the other end of the driving component. A heat conduction component is installed on one side of the driving component, and an emergency deformation component is installed inside the driving component. The heat conduction component is connected to the emergency deformation component.

[0007] Furthermore, the moving component includes a longitudinal electric slide rail fixedly connected inside the laser cutting machine, a transverse electric slide rail slidably connected to the top of the longitudinal electric slide rail, and the laser cutting head fixedly connected to the transverse electric slide rail.

[0008] Furthermore, the clamping assembly includes a clamping seat fixedly connected inside the laser cutting machine. A limiting groove is formed on the top of the clamping seat, and a limiting plate is rotatably connected to the top of the clamping seat. A screw is threadedly connected to the top of the limiting plate, and the screw is threadedly connected to the clamping seat.

[0009] Furthermore, the drive assembly includes a heat-conducting ring fixedly connected to the outer wall of the laser cutting head, a U-shaped support plate fixedly connected to the outer wall of the heat-conducting ring, a dual-axis motor installed inside the U-shaped support plate, and a first rotating shaft and a second rotating shaft fixedly connected to the lower output end and the upper output end of the dual-axis motor, respectively. The first rotating shaft is rotatably connected to the U-shaped support plate.

[0010] Furthermore, the circumferential rotating assembly includes a first gear fixedly connected to the outer wall of the first rotating shaft, and a first gear ring rotatably connected to the bottom of the U-shaped support plate, the first gear ring meshing with the first gear.

[0011] Furthermore, the detection component includes a support base fixedly connected to the inner wall of the first gear ring, and a vision sensor is installed on one side of the support base.

[0012] Furthermore, the dynamic shielding assembly includes a rotating ring rotatably connected to one side of the U-shaped support plate. The top of the rotating ring is fixedly provided with several inclined grooves, and shielding plates are slidably connected in each of the several inclined grooves. Guide rods are fixedly connected to the top of each of the several shielding plates. A second gear is fixedly connected to the outer wall of the second rotating shaft. A second gear ring is meshed with the outer wall of the second gear. A guide plate is fixedly connected in the second gear ring. Several arc-shaped guide grooves are opened through the guide plate. Several guide rods are slidably connected to the several arc-shaped guide grooves respectively.

[0013] Furthermore, the heat-conducting component includes a first heat-conducting plate fixedly connected to the outer wall of the heat-conducting ring, and a second heat-conducting plate fixedly connected to the bottom of the first heat-conducting plate.

[0014] Furthermore, the emergency deformation component includes a shape memory alloy fixedly connected to one side of the second heat-conducting plate, and a push block is fixedly connected to the other end of the shape memory alloy, with the push block being fixedly connected to the rotating ring.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: By coordinating the circumferential rotating component and the detection component, the vision sensor can acquire laser spot images from all directions in 360°, completely eliminating the blind spots of traditional fixed-view detection, tracking changes in beam conditions in real time, and identifying subtle anomalies such as laser scattering and deviation.

[0016] By coordinating the drive components and the dynamic shielding components, when abnormal laser beam scattering is detected, the shielding plate can be adaptively retracted and the light-transmitting aperture can be reduced to dynamically correct the beam convergence state without stopping the machine for calibration, effectively preventing scattered light from burning the substrate and causing carbonization damage to the board surface.

[0017] Through the cooperation between the heat conduction component and the emergency deformation component, the heat accumulated during laser cutting head operation can be quickly conducted. When the temperature exceeds the limit, the shape memory alloy is triggered to deform, which pushes the shielding component to block the optical path. Combined with the power-off of the electronic control, a double protection is formed, eliminating the time difference of electronic control response and avoiding damage to the workpiece by high temperature laser. Attached Figure Description

[0018] Figure 1 This is a partial top view of the structure of the present invention; Figure 2 This is a schematic diagram of the overall structure of the present invention; Figure 3 This is a schematic diagram illustrating the connection structure between the clamping assembly and the laser cutting head of the present invention; Figure 4 This is a schematic diagram of the clamping component structure of the present invention; Figure 5 This is a schematic diagram showing the connection relationship between the laser cutting head, driving assembly, circumferential rotation assembly, dynamic shielding assembly and heat conduction assembly of the present invention. Figure 6 This is a schematic diagram showing the connection relationship between the driving component, the circumferential rotation component, the detection component, and the dynamic occlusion component of the present invention. Figure 7 This is a schematic diagram of the connection structure between the circumferential rotation component and the detection component of the present invention; Figure 8 This is a cross-sectional structural diagram showing the connection relationship between the drive component, circumferential rotation component, dynamic shielding component and emergency deformation component of the present invention. Figure 9 This is a cross-sectional structural diagram showing the connection relationship between the drive component, the heat conduction component, and the emergency deformation component of the present invention. Figure 10 This is a schematic diagram of the dynamic occlusion component structure of the present invention.

[0019] In the diagram: 1. Laser cutting machine; 2. Moving assembly; 21. Longitudinal electric slide rail; 22. Transverse electric slide rail; 3. Clamping assembly; 31. Clamping seat; 32. Limiting groove; 33. Limiting plate; 34. Screw; 4. Laser cutting head; 5. Drive assembly; 51. Heat-conducting ring; 52. U-shaped support plate; 53. Dual-axis motor; 54. First rotating shaft; 55. Second rotating shaft; 6. Circumferential rotation assembly; 61. First gear; 62. 7. First gear ring; 8. Detection component; 9. Support base; 10. Vision sensor; 11. Dynamic shielding component; 12. Second gear; 13. Second gear ring; 14. Rotating ring; 15. Inclined groove; 16. Shielding plate; 17. Guide rod; 18. Guide plate; 19. Arc-shaped guide groove; 20. Heat conduction component; 21. First heat conduction plate; 32. Second heat conduction plate; 43. Emergency deformation component; 54. Shape memory alloy; 65. Push block. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] To address the current technical problem of difficulty in fixing and positioning circuit board substrates, such as... Figures 1-4 As shown, the following preferred technical solutions are provided: like Figure 1 and Figure 2 As shown, a cutting device for processing circuit board substrates includes a laser cutting machine 1. The laser cutting machine 1 can realize automated laser cutting processing of circuit board substrates, adapting to the needs of high-precision cutting production. A controller is installed on one side of the laser cutting machine 1, which can control various electrical components. The controller is existing technology and is not shown in the figure. A moving component 2 is installed inside the laser cutting machine 1, and a clamping component 3 is provided inside the laser cutting machine 1. The clamping component 3 can clamp and limit the circuit board substrate to prevent the substrate from shifting and shaking during the cutting process, ensuring cutting accuracy. A laser cutting head 4 is installed on one side of the moving component 2. The moving component 2 can drive the laser cutting head 4 to move according to a preset cutting trajectory to complete the cutting operation of the circuit board substrate at multiple positions. The laser cutting head 4 can emit a high-energy focused laser beam and use the high-temperature ablation principle to cut the fixed circuit board substrate.

[0022] In use, the circuit board substrate to be cut is placed in the clamping component 3 and fixed. Then, the controller drives the moving component 2 to drive the laser cutting head 4 to cut the circuit board substrate, which can realize automated and precise cutting operations and effectively ensure the cutting size accuracy and cut flatness.

[0023] A drive assembly 5 is provided on one side of the laser cutting head 4. A circumferential rotation assembly 6 is provided at one end of the drive assembly 5. A detection assembly 7 is installed inside the circumferential rotation assembly 6. The detection assembly 7 can rotate synchronously with the circumferential rotation assembly 6 to collect the spot image from all directions in 360° and detect whether the laser beam has any abnormal scattering in real time. A dynamic shielding assembly 8 is provided at the other end of the drive assembly 5. The dynamic shielding assembly 8 can adaptively reduce the aperture of the light transmission and shield the scattered stray light when the laser beam scatters. When the temperature exceeds the threshold, it can completely block the laser beam path to achieve graded protection. A heat conduction assembly 9 is provided on one side of the drive assembly 5. An emergency deformation assembly 10 is provided inside the drive assembly 5. The heat conduction assembly 9 is connected to the emergency deformation assembly 10.

[0024] During the cutting process, the controller drives one end of the drive component 5 to rotate the circumferential rotating component 6, causing the detection component 7 to rotate synchronously. This enables 360° real-time image detection and analysis of the laser beam spot shape and beam convergence state of the laser cutting head 4. It can detect scattering and deviation anomalies in all directions of the laser beam, while avoiding detection blind spots. Compared to existing technologies with fixed-viewpoint single-point detection, easy omission of scattering anomalies, and severe detection lag, this technology can dynamically track changes in beam conditions in real time and accurately identify minor scattering hazards. When the detection component 7 detects laser beam divergence, blurred spot edges, or the presence of scattered stray light, the controller then drives the other end of the drive component 5 to dynamically block the beam. Component 8 blocks and gathers excess scattered stray light from the periphery of the laser beam, adaptively reducing the aperture until the detection component 7 detects that the light spot has returned to a regular shape and the beam convergence is normal. This effectively gathers the laser beam, preventing scattered light from burning uncut areas of the circuit board substrate and avoiding problems such as board carbonization and circuit damage. Compared to existing technologies that cannot actively intervene in the scattering problem and can only stop the machine for calibration, affecting production efficiency, this technology can achieve dynamic scattering correction and repair the beam state without stopping the machine, balancing processing accuracy and production continuity. When the detection component 7 detects laser beam divergence, blurred light spot edges, or scattered stray light exceeding the processing range, an alarm is triggered to remind the user to perform maintenance.

[0025] When the laser cutting head 4 cuts for a long time, causing the temperature to approach the safe operating threshold of the equipment and posing a risk of overheating and heat accumulation, the heat conduction component 9 quickly conducts the high-temperature heat generated by the laser cutting head 4 to the emergency deformation component 10. When the emergency deformation component 10 reaches the preset thermal deformation critical temperature, it quickly deforms, pushing the dynamic shielding component 8 to completely block the light output path of the laser cutting head 4. Through the controller, the laser cutting head 4 is powered off. This first physically blocks the laser leakage and prevents damage, and then combines it with the electrical power-off to achieve dual safety protection. Compared with the existing technology that only cuts off the power to the laser cutting head 4, this eliminates the signal response time difference of the electrical power-off, prevents high-temperature scattered laser from damaging the workpiece in advance, and avoids the laser from continuously generating heat under no-load conditions and damaging the internal optical lenses, thereby improving equipment stability and workpiece yield.

[0026] like Figure 1 As shown, the moving component 2 includes a longitudinal electric slide rail 21 fixedly connected to the laser cutting machine 1, a transverse electric slide rail 22 slidably connected to the top of the longitudinal electric slide rail 21, and the laser cutting head 4 fixedly connected to the transverse electric slide rail 22.

[0027] like Figure 3 and Figure 4 As shown, the clamping assembly 3 includes a clamping seat 31 fixedly connected to the laser cutting machine 1. A limiting groove 32 is provided on the top of the clamping seat 31. A limiting plate 33 is rotatably connected to the top of the clamping seat 31. A screw 34 is threadedly connected to the top of the limiting plate 33. The screw 34 is threadedly connected to the clamping seat 31.

[0028] In use, the circuit board substrate to be cut is placed in the limiting groove 32. Then, by rotating the limiting plate 33, the bottom of the limiting plate 33 is made to fit with the top of the clamping seat 31. Then, by rotating the screw 34, the screw 34 is threadedly fixed to the clamping seat 31, thereby fixing the circuit board substrate to be cut. Then, by the controller, the longitudinal electric slide rail 21 and the transverse electric slide rail 22 drive the laser cutting head 4 to move longitudinally and transversely, respectively. The laser cutting head 4 cuts the circuit board substrate to be cut, which can realize automated and precise cutting operations and effectively ensure the cutting size accuracy and cut flatness.

[0029] To address the problem of laser beam scattering and poor focusing emitted by the laser cutting head 4, which causes the laser beam to scatter outwards and burn uncut areas of the circuit board substrate with scattered excess light, such as... Figures 5-10 As shown, the following preferred technical solutions are provided: like Figure 6 , Figure 8 and Figure 9As shown, the drive assembly 5 includes a heat-conducting ring 51 fixedly connected to the outer wall of the laser cutting head 4. The heat-conducting ring 51 can closely fit the outer wall of the laser cutting head 4, efficiently adsorb and accumulate working heat, and quickly complete the concentrated heat conduction. A U-shaped support plate 52 is fixedly connected to the outer wall of the heat-conducting ring 51. A dual-axis motor 53 is installed inside the U-shaped support plate 52. The dual-axis motor 53 is an independent dual-output shaft micro drive motor, which can independently control the forward and reverse rotation of the two output shafts. The dual-axis motor 53 has a self-locking function. The lower output end and the upper output end of the dual-axis motor 53 are respectively fixedly connected to a first rotating shaft 54 ​​and a second rotating shaft 55. The first rotating shaft 54 ​​is rotatably connected to the U-shaped support plate 52.

[0030] like Figure 6 and Figure 7 As shown, the circumferential rotating assembly 6 includes a first gear 61 fixedly connected to the outer wall of the first rotating shaft 54, and a first gear ring 62 rotatably connected to the bottom of the U-shaped support plate 52, the first gear ring 62 meshing with the first gear 61.

[0031] like Figure 7 As shown, the detection component 7 includes a support base 71 fixedly connected to the inner wall of the first gear ring 62. A vision sensor 72 is installed on one side of the support base 71. A battery is installed inside the support base 71 and is electrically connected to the vision sensor 72. The battery can independently power the vision sensor 72 under rotating conditions, avoiding the problem of wire entanglement and ensuring continuous and stable operation of the detection work. The battery is existing technology and is not shown in the figure. The vision sensor 72 can collect laser spot images in 360° and accurately identify abnormal working conditions such as beam scattering and deflection. At the same time, it has high-definition imaging performance that is dustproof and resistant to strong environmental light interference, avoiding interference from cutting smoke and external stray light, which may cause detection omissions or misjudgments.

[0032] like Figure 6 , Figure 8 and Figure 10 As shown, the dynamic shielding component 8 includes a rotating ring 83 rotatably connected to one side of the U-shaped support plate 52. Several inclined grooves 84 are fixedly opened on the top of the rotating ring 83. Shielding plates 85 are slidably connected in each of the inclined grooves 84. The shielding plates 85 are made of high-temperature resistant, carbonization-resistant, and high-hardness optical alloy material, which can withstand the high-temperature residual heat and thermal radiation of the laser, is not easily deformed or oxidized, stably blocks scattered stray light, and ensures the optical path adjustment accuracy and service life. Guide rods 86 are fixedly connected to the top of each of the shielding plates 85. A second gear 81 is fixedly connected to the outer wall of the second rotating shaft 55. A second gear ring 82 is meshed with the outer wall of the second gear 81. A guide plate 87 is fixedly connected inside the second gear ring 82. Several arc-shaped guide grooves 88 are opened through the guide plate 87. Several guide rods 86 are slidably connected to several arc-shaped guide grooves 88 respectively.

[0033] like Figure 9As shown, the heat-conducting component 9 includes a first heat-conducting plate 91 fixedly connected to the outer wall of the heat-conducting ring 51, and a second heat-conducting plate 92 fixedly connected to the bottom of the first heat-conducting plate 91.

[0034] like Figure 9 As shown, the emergency deformation assembly 10 includes a shape memory alloy 101 fixedly connected to one side of the second heat-conducting plate 92. The shape memory alloy 101 is a thermo-deformable shape memory alloy 101 component that can be repeatedly deformed. It can be rapidly deformed when the preset temperature safety threshold is reached and reset when the temperature drops. A push block 102 is fixedly connected to the other end of the shape memory alloy 101. The push block 102 is fixedly connected to the rotating ring 83.

[0035] During the cutting process, the controller causes the dual-axis motor 53 to drive the first rotating shaft 54 ​​and the first gear 61 to rotate synchronously. Through the meshing of the first gear ring 62 and the first gear 61, the first gear ring 62, the support base 71, and the vision sensor 72 rotate synchronously. This enables 360° real-time image detection and analysis of the laser beam spot shape and beam convergence state of the laser cutting head 4. It can detect scattering and deviation anomalies in all directions of the laser beam, while avoiding detection blind spots. Compared to existing technologies with fixed-viewpoint single-point detection, easy omission of scattering anomalies, and severe detection lag, this technology can dynamically track changes in beam conditions in real time and accurately identify minor scattering hazards. When the vision sensor 72 detects laser beam divergence, blurred spot edges, or the presence of scattered stray light, the controller causes the dual-axis motor 53 to drive the second rotating shaft 55 and the second gear 81 to rotate clockwise. Through the meshing of the second gear ring 82 and the second gear 81, the second gear ring 62, the support base 71, and the vision sensor 72 rotate synchronously. The ring 82 and guide plate 87 rotate clockwise synchronously, causing several guide rods 86 to slide in several arc-shaped guide grooves 88, which in turn drive several shielding plates 85 to slide synchronously in several inclined grooves 84. This causes the shielding plates 85 to converge with each other, blocking and gathering excess scattered stray light from the periphery of the beam, adaptively reducing the light-transmitting aperture until the vision sensor 72 detects that the light spot has returned to a regular shape and the beam convergence state is normal. This effectively gathers the laser beam, preventing scattered light from burning the uncut areas of the circuit board substrate, avoiding problems such as board surface carbonization and circuit damage. Compared with existing technologies that cannot actively intervene in the scattering problem and can only stop the machine for calibration, affecting production efficiency, this technology can achieve dynamic scattering correction, repairing the beam state without stopping the machine, balancing processing accuracy and production continuity. When the vision sensor 72 detects that the laser beam is diverging, the edge of the light spot is blurred, or there is scattered stray light exceeding the processing range, an alarm is triggered to remind the user to perform maintenance.

[0036] When the laser cutting head 4 cuts for a long time, causing the temperature to approach the safe operating threshold of the equipment and posing a risk of overheating and heat accumulation, the heat-conducting ring 51, together with the first heat-conducting plate 91 and the second heat-conducting plate 92, quickly conducts the high-temperature heat generated by the laser cutting head 4 to the shape memory alloy 101. The shape memory alloy 101 reaches the preset thermal deformation critical temperature. At this time, the shape memory alloy 101 deforms rapidly, pushing the pusher block 102 to move, causing the rotating ring 83 to rotate counterclockwise synchronously. This causes several shielding plates 85 to completely converge, blocking the light path of the laser cutting head 4. Through the controller, the laser cutting head 4 is powered off. This can first block the laser leakage and prevent damage by physically blocking it, and then achieve dual safety protection by combining it with electrical power-off. Compared with the existing technology of simply powering off the laser cutting head 4, this can eliminate the signal response time difference of electrical power-off, prevent high-temperature scattered laser from damaging the workpiece in advance, and avoid the laser from continuously generating heat under no-load and damaging the internal optical lenses, thereby improving equipment stability and workpiece yield.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0038] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cutting device for processing a circuit board substrate, comprising a laser cutting machine (1), characterized by: The laser cutting machine (1) is provided with a moving assembly (2), a clamping assembly (3), a laser cutting head (4), a driving assembly (5), a circumferential rotating assembly (6), a detection assembly (7), a dynamic shielding assembly (8), a heat conduction assembly (9) and an emergency deformation assembly (10).

2. The cutting apparatus for processing a circuit board substrate according to Claim 1, wherein: The moving assembly (2) comprises a longitudinal electric sliding rail (21) fixedly connected in the laser cutting machine (1), and the longitudinal electric sliding rail (21) is slidably connected with a transverse electric sliding rail (22) at the top.

3. The cutting apparatus for processing a circuit board substrate according to Claim 1, wherein: The clamping assembly (3) comprises a clamping seat (31) fixedly connected in the laser cutting machine (1), and the clamping seat (31) is provided with a limiting groove (32) at the top.

4. The cutting apparatus for processing a circuit board substrate according to Claim 1, wherein: The driving assembly (5) comprises a heat conduction ring (51) fixedly connected to the outer wall of the laser cutting head (4), and the heat conduction ring (51) is fixedly connected with a U-shaped support plate (52).

5. The cutting apparatus for processing a circuit board substrate according to Claim 4, wherein: The circumferential rotating assembly (6) comprises a first gear (61) fixedly connected to the outer wall of the first rotating shaft (54), and the U-shaped support plate (52) is rotatably connected with a first gear ring (62) at the bottom.

6. The cutting apparatus for processing a circuit board substrate according to Claim 5, wherein: The detection assembly (7) comprises a support seat (71) fixedly connected to the inner wall of the first gear ring (62), and the support seat (71) is provided with a visual sensor (72) on one side.

7. The cutting apparatus for processing a circuit board substrate according to Claim 4, wherein: The dynamic shielding assembly (8) comprises a rotating ring (83) rotatably connected to one side of the U-shaped support plate (52), and the rotating ring (83) is fixedly provided with a plurality of inclined grooves (84) at the top.

8. The cutting apparatus for processing a circuit board substrate according to Claim 7, wherein: The heat-conducting assembly (9) comprises a first heat-conducting plate (91) fixedly connected to the outer wall of the heat-conducting ring (51), and the bottom of the first heat-conducting plate (91) is fixedly connected with a second heat-conducting plate (92).

9. The cutting apparatus for processing a circuit board substrate according to Claim 8, wherein: The emergency deformation assembly (10) comprises a memory alloy (101) fixedly connected to one side of the second heat-conducting plate (92), and the other end of the memory alloy (101) is fixedly connected with a push block (102), and the push block (102) is fixedly connected with the rotating ring (83).

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