Adjustable airflow spray plate and airflow regulation method

Abstract

This invention provides an adjustable airflow spray plate and an airflow regulation method, relating to the field of semiconductor processing technology. The adjustable airflow spray plate includes a spray plate body and a plug. The spray plate body has multiple spray holes spaced apart. The plug is detachably mounted on the spray plate body and inserted into at least one spray hole to seal the spray hole, facilitating adjustment of the gas flow distribution through the spray plate body. The airflow regulation method includes the following steps: determining a sealing area on the spray plate body; determining the number of sealed holes within the sealing area; determining the position of the sealed holes within the sealing area; and inserting the plug into the sealed hole to determine the specific installation position of the plug on the spray plate body. This invention improves the uniformity of the film on the substrate.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more specifically, to an adjustable airflow spray plate and an airflow regulation method. Background Technology

[0002] LPCVD is a chemical vapor deposition technique that introduces reactive gases into a reaction chamber under low pressure. By using methods such as heating and plasma excitation, the reactive gases are decomposed and chemically reacted on the substrate surface, thereby depositing the desired thin film material on the substrate surface.

[0003] In the LPCVD process, the uniformity of the film is greatly affected by temperature. The temperature uniformity of each heating plate is different, and the temperature is high or low at different locations. Currently, when spraying reactive gases onto the substrate using a spray plate with a standard distribution of spray holes, it can lead to large differences in the uniformity of the film. Summary of the Invention

[0004] The present invention aims to provide an adjustable airflow spray plate and an airflow adjustment method, which can improve the problem of large differences in the uniformity of films on substrates.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] In a first aspect, the present invention provides an airflow-adjustable spray plate, comprising:

[0007] The spray plate body has multiple spray holes spaced apart.

[0008] A plug is detachably mounted on the spray plate body and inserted into at least one of the spray holes to seal the spray holes.

[0009] In an optional embodiment, the plug has a first surface, a second surface, and a sealing portion. The first surface is provided with a first preset number of sealing portions for insertion into a first preset number of spray holes. The second surface is provided with a second preset number of sealing portions for insertion into a second preset number of spray holes, wherein the second preset number is greater than the first preset number.

[0010] In an optional embodiment, the first surface and the second surface are disposed opposite to each other on the plug.

[0011] In an optional embodiment, the plug further has a first stepped portion and a second stepped portion, the first stepped portion and the second stepped portion are connected, the first surface is located on the side of the first stepped portion away from the second stepped portion, and the second surface is located on the side of the second stepped portion away from the first stepped portion.

[0012] The plug has a symmetrical axis, and the plugs on the first and second surfaces are symmetrically arranged along the symmetrical axis. The distance between the edge of the second step and the symmetrical axis is less than the distance between any two adjacent spray holes.

[0013] Secondly, the present invention provides an airflow regulation method, applied to the airflow adjustable spray plate described in any of the foregoing embodiments, for regulating the reaction gas sprayed onto the substrate, comprising the following steps:

[0014] Determine the sealing area on the spray plate body;

[0015] Determine the number of sealed holes within the sealing area, wherein the sealed holes are the spray holes that need to be sealed;

[0016] Based on the blocked area and the number of the sealing holes, the location of the sealing holes within the blocked area is determined;

[0017] The plug is inserted into the sealed hole so that the reactive gas is sprayed onto the substrate through the unsealed spray hole.

[0018] In an optional implementation, the step of determining the blocking area on the spray plate body includes:

[0019] Temperature simulation of the substrate is performed to determine the average temperature of the substrate and the temperature map of the substrate surface. Areas on the substrate surface with a temperature higher than the average temperature of the substrate are marked as high-temperature areas.

[0020] The high-temperature area is marked on the mapping area of ​​the spray plate body, wherein the mapping area is the sealing area.

[0021] In an optional implementation, the step of determining the number of sealed holes within the sealing area includes:

[0022] The regional average temperature of the high-temperature area is determined based on the temperature map.

[0023] Based on the temperature difference between the average temperature of the region and the average temperature of the substrate, the degree of temperature influence on the reactive gas in the high-temperature region is calculated, and the proportion of gas flow rate that needs to be reduced in the sealing region is calculated.

[0024] The number of sealing holes is calculated based on the ratio of the number of spray holes in the sealing area to the gas flow rate that needs to be reduced in the sealing area.

[0025] In an optional implementation, the step of determining the location of the sealing hole within the sealing area based on the sealing area and the number of sealing holes includes:

[0026] Using the spray holes within the sealing area as grid nodes, a grid is drawn within the sealing area;

[0027] Based on the number of grids and the number of closed holes, the number of grids between adjacent closed holes is calculated, and the positions of multiple closed holes within the sealing area are determined.

[0028] In an optional embodiment, the high-temperature region includes at least one temperature gradient region, the average temperature of the temperature gradient region is an interval average temperature, and the difference between any interval average temperature and the average temperature of the substrate is a positive integer multiple of a set temperature difference value; the sealing region includes sealing partitions corresponding to the temperature gradient region;

[0029] The step of determining the number of sealed holes within the sealing area includes:

[0030] When the high-temperature region includes multiple temperature gradient regions, the degree of temperature influence on the reactant gas in the multiple temperature gradient regions is calculated based on the temperature difference between the average temperature of the multiple intervals and the average temperature of the substrate, and the proportion of gas flow rate to be reduced in the multiple sealing zones is calculated separately.

[0031] The number of sealing holes in multiple sealing zones is calculated based on the ratio of the number of spray holes in the sealing zone to the gas flow rate that needs to be reduced in the sealing area.

[0032] In an optional implementation, the step of determining the location of the sealing hole within the sealing area based on the sealing area and the number of sealing holes includes:

[0033] Using the closed holes within the sealing partitions as grid nodes, a grid is drawn within the multiple sealing partitions;

[0034] Based on the number of grids and the number of closed holes, the number of grids between adjacent closed holes is calculated, and the positions of multiple closed holes within the sealing zone are determined.

[0035] The beneficial effects of the adjustable airflow spray plate and airflow adjustment method provided in this embodiment of the invention include:

[0036] By setting a detachable plug structure, the spray holes on the spray plate body can be selectively blocked to adjust the gas flow distribution below the spray plate body, thereby adjusting the flow distribution of the reactive gas sprayed on the substrate. When facing different heating plates and the temperature distribution on the substrate is uneven, the flow of reactive gas in the high-temperature area of ​​the substrate can be reduced to reduce the concentration of reactive gas in the high-temperature area, thereby reducing the reaction rate in the high-temperature area of ​​the substrate. This balances the reaction rate of reactive gas on the substrate when facing different heating plates, improving the uniformity of film formation on the substrate. Attached Figure Description

[0037] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the structure of the spray plate body provided in this embodiment;

[0039] Figure 2 This is a schematic diagram of the plug from a first-view perspective provided in this embodiment;

[0040] Figure 3 This is a schematic diagram of the plug from a second perspective provided in this embodiment;

[0041] Figure 4 This is a flowchart illustrating the airflow regulation method provided in this embodiment;

[0042] Figure 5 This is a schematic diagram of the sealing area on the spray plate body provided in this embodiment;

[0043] Figure 6 This is a schematic diagram of the sealing area on the spray plate body provided for some alternative embodiments.

[0044] icon:

[0045] 100 – Spray plate body; 110 – Spray hole; 200 – Plug; 210 – First surface; 220 – Second surface; 230 – Sealing part; 240 – First step part; 250 – Second step part; 300 – Sealing area; 310 – Sealing zone. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0047] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0048] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0049] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0050] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0051] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.

[0052] LPCVD, or low-pressure chemical vapor deposition, is an important thin film deposition technique. It involves introducing reactive gases into a reaction chamber under low pressure, and then using methods such as heating or plasma excitation to decompose the gases and induce a chemical reaction on the substrate surface. The resulting material forms a thin film that is uniformly deposited on the substrate. LPCVD offers advantages such as high film quality, suppression of impurities, and self-doping, and is widely used in semiconductor manufacturing, photovoltaics, and MEMS device manufacturing.

[0053] In LPCVD processes, film uniformity is significantly affected by the heating plates. Due to variations in temperature uniformity across different processing techniques and the varying temperature distribution of each heating plate, the temperature distribution on the substrate also differs, leading to varying reaction rates of the reactive gases. Using the same standard spray plate to uniformly spray the reactive gases onto the substrate surface results in significant and difficult-to-adjust film uniformity. Customizing different spray plates for different heating plates is necessary, but this prevents plate interchangeability, increases costs, and lengthens the customization and replacement cycle, ultimately impacting production efficiency.

[0054] To address the aforementioned technical problems, this invention provides an adjustable airflow spray plate and an airflow regulation method, used to adjust the gas flow distribution passing through the spray plate, so that the gas flow distribution passing through the spray plate is adapted to the temperature distribution of the substrate surface, thereby improving the uniformity of the film on the substrate. Furthermore, it enables one spray plate to be matched with multiple different heating plates, improving the compatibility and applicability of the spray plate.

[0055] The following describes in detail the overall structure, working principle, and technical effects of the airflow adjustable spray plate provided by the present invention, as well as the detailed steps, implementation principle, and technical effects of the supporting airflow adjustment method, through embodiments and in conjunction with the accompanying drawings.

[0056] Please refer to Figure 1 - Figure 3 This invention provides an adjustable airflow spray plate for use in LPCVD processes. The spray plate is placed inside the reaction chamber, and the reaction gas is sprayed onto the substrate through the spray plate to carry out the reaction.

[0057] The airflow adjustable spray plate includes a spray plate body 100 and a plug 200. The spray plate body 100 has a conventional spray plate structure with multiple spray holes 110 spaced apart. During LPCVD processing of the substrate, the reaction gas is sprayed onto the substrate through the spray holes 110 on the spray plate body 100. The plug 200 is detachably mounted on the spray plate body 100 and is inserted into at least one spray hole 110, thereby sealing the spray hole 110.

[0058] By setting a detachable plug 200 structure, the spray holes 110 on the spray plate body 100 can be selectively blocked to adjust the gas flow distribution below the spray plate body 100, thereby adjusting the flow distribution of the reactive gas sprayed on the substrate and improving the film uniformity on the substrate.

[0059] Please refer to Figure 2 and Figure 3In some optional embodiments, the plug 200 has a first surface 210, a second surface 220, and a sealing portion 230, wherein the sealing portion 230 is a cylindrical structure adapted to the spray hole 110. The first surface 210 has a first preset number of sealing portions 230, and the second surface 220 has a second preset number of sealing portions 230, wherein the second preset number is greater than the first preset number. In this embodiment, taking one sealing portion 230 on the first surface 210 and at least two sealing portions 230 on the second surface 220 as an example, the sealing portion 230 on the first surface 210 is used to insert into a single spray hole 110; the spacing between the sealing portions 230 on the second surface 220 is adapted to the spacing of the spray holes 110 on the spray plate body 100, so that at least two sealing portions 230 on the second surface 220 are used to insert into at least two adjacent spray holes 110.

[0060] By providing a sealing part 230 on the first surface 210 and at least two sealing parts 230 on the second surface 220 of the plug 200, when adjusting the gas flow distribution through the spray plate, as needed, when sealing a single spray hole 110, the sealing part 230 on the first surface 210 is inserted into the spray hole 110 to be sealed; when sealing multiple adjacent spray holes 110, the sealing part 230 on the second surface 220 is inserted into the spray holes 110 to be sealed. Furthermore, since the number of sealing parts 230 on the second surface 220 is limited, in actual operation, multiple plugs 200 can be used in combination, and the first surface 210 and the second surface 220 of multiple plugs 200 can be used in combination to meet different sealing requirements of the spray plate body 100.

[0061] Please refer to Figure 2 and Figure 3 Furthermore, during the process of adjusting the airflow distribution through the spray plate body 100, it may be necessary to use multiple plugs 200 to seal multiple adjacent spray holes 110. It may also be possible to encounter situations where one of two adjacent plugs 200 is sealed using the sealing part 230 on the first surface 210, and the other using the sealing part 230 on the second surface 220. Therefore, to avoid interference between adjacent plugs 200, the first surface 210 and the second surface 220 are positioned opposite each other on the plug 200, that is, the sealing part 230 on the first surface 210 and the sealing part 230 on the second surface 220 are positioned at 180°.

[0062] Furthermore, the plug 200 also has a first stepped portion 240 and a second stepped portion 250, which are connected. A first surface 210 is located on the side of the first stepped portion 240 opposite to the second stepped portion 250, and a second surface 220 is located on the side of the second stepped portion 250 opposite to the first stepped portion 240. The first stepped portion 240 and the second stepped portion 250 have the same height. When the sealing portion 230 on the first surface 210 is inserted into the spray hole 110, the first stepped portion 240 abuts against the surface of the spray plate body 100; when the sealing portion 230 on the second surface 220 is inserted into the spray hole 110, the second stepped portion 250 abuts against the surface of the spray plate body 100. Furthermore, the plug 200 has an axis of symmetry, which coincides with the axis of the sealing portion 230 on the first surface 210, and the sealing portions 230 on the second surface 220 are symmetrically arranged along the axis of symmetry.

[0063] By setting the first step portion 240 and the second step portion 250, when the two plugs 200 are arranged adjacently and are in a centrally symmetrical state, that is, when the first surface 210 of one plug 200 is attached to the spray plate body 100 and the second surface 220 of the other plug 200 is attached to the spray plate body 100, the first step portion 240 and the second step portion 250 overlap to avoid interference between adjacent plugs 200.

[0064] It is understandable that the distance between the edge of the second step portion 250 and the axis of symmetry is less than the distance between any two adjacent spray holes 110, so that when the sealing portion 230 on the first surface 210 is inserted into the spray hole 110, the second step portion 250 is prevented from blocking the surrounding spray holes 110 and affecting the passage of the reaction gas through the spray plate.

[0065] In summary, the implementation principle of the airflow adjustable spray plate provided by the present invention is as follows: a detachable plug 200 structure is provided, which can selectively block the spray holes 110 on the spray plate body 100 to adjust the gas flow distribution below the spray plate body 100, thereby adjusting the flow distribution of the reactive gas sprayed on the substrate and improving the film uniformity on the substrate.

[0066] Please refer to Figure 4 The present invention also provides an airflow regulation method, which is based on the airflow adjustable spray plate provided in any of the foregoing embodiments, for adjusting the gas flow distribution through the spray plate body 100, specifically including the following steps:

[0067] Step S100: Determine the sealing area 300 on the spray plate body 100.

[0068] Step S200: Determine the number of sealing holes within the sealing area 300, where the sealing holes are the spray holes 110 that need to be sealed.

[0069] Step S300: Determine the location of the sealing holes within the sealing area 300 based on the sealing area 300 and the number of sealing holes;

[0070] Step S400: Insert the plug 200 into the closed hole to allow the reaction gas to pass through the unsealed closed hole and spray onto the substrate.

[0071] In this embodiment, to facilitate the determination of the sealing area 300 on the spray plate body 100, step S100 further includes step S110: performing temperature simulation on the substrate to determine the average temperature of the substrate and the temperature map of the substrate surface, and marking the area on the substrate surface that is higher than the average temperature of the substrate as a high temperature area;

[0072] Step S120: Determine the blocking area 300 on the spray plate body 100 based on the high temperature area, wherein the blocking area 300 is the mapping area of ​​the high temperature area on the spray plate body 100.

[0073] Combination Figure 5 During the processing of different substrates, the substrates are heated by a heating plate. Since the various parameters of the heating plate are known, temperature simulation of the substrate can be performed using specialized software, thereby obtaining a temperature map and temperature data of the substrate surface. The average temperature of the substrate is then calculated, and based on the temperature map, areas on the substrate with temperatures higher than the average temperature are marked as high-temperature areas. The mapping area of ​​the high-temperature areas on the substrate onto the spray plate body 100 is then marked; this mapping area is the sealing area 300 on the spray plate body 100. This facilitates the identification of the sealing area 300 on the spray plate body 100.

[0074] In some optional embodiments of this application, step S200 includes step S210: determining the average temperature of the high-temperature region based on the temperature map. The average temperature of the high-temperature region is calculated using data from the substrate temperature map and based on the defined high-temperature regions.

[0075] Furthermore, step S200 includes step S220: based on the temperature difference between the average temperature of the region and the average temperature of the substrate, determining the proportion of the reactive gas that needs to be reduced in the high-temperature region, and then determining the proportion of gas flow reduction through the sealing region 300.

[0076] Understandably, in the substrate LPCVD manufacturing process, the impact of substrate surface temperature changes on the reaction rate of reactive gases on the substrate can be estimated using empirical formulas, such as the Arrhenius equation. Similarly, the effect of reactive gas concentration on the reaction rate can also be calculated using a series of empirical formulas. To ensure good film uniformity on the substrate, the supply of reactive gas in high-temperature, high-reaction-rate regions needs to be reduced, lowering the reactive gas concentration to decrease the reaction rate. This balances the overall reaction rate of the reactive gases on the substrate, thereby balancing the film formation efficiency and resulting in good film uniformity. Based on this, the temperature difference between the average temperature of the region and the average temperature of the substrate can be used to calculate the degree of temperature influence on the reactive gases in the high-temperature region. This allows for the calculation of the proportion of reactive gases that need to be reduced in the high-temperature region, and consequently, the reduction in gas flow rate through the 300°C sealing region.

[0077] Furthermore, step S200 includes step S230: determining the number of closed holes in the sealing area 300 based on the number of spray holes 110 in the sealing area 300 and the reduction ratio of gas flow rate in the sealing area 300.

[0078] The number of spray holes 110 contained within the sealing area 300 and the percentage by which the gas flow rate needs to be reduced within the sealing area 300 are known. The percentage by which the gas flow rate needs to be reduced within the sealing area 300 is the ratio of the number of sealing holes within the sealing area 300 to the total number of spray holes 110 within the sealing area 300. Therefore, the number of sealing holes within the sealing area 300 can be calculated.

[0079] In this embodiment, step S300 includes step S310: drawing a grid in the blocking area 300 using the spray holes 110 in the blocking area 300 as grid nodes;

[0080] Based on the number of grids and the number of closed holes, calculate the number of grids between adjacent closed holes to determine the location of multiple closed holes within the 300-meter sealing area.

[0081] A mesh generation method is used, with the spray holes 110 within the sealing area 300 as mesh nodes. A mesh is drawn within the sealing area 300, dividing it into multiple meshes of equal area. To ensure the uniform distribution of the sealed holes within the sealing area 300, the ratio between the number of sealed holes and the number of meshes is calculated based on the number of meshes and the number of sealed holes. This yields the number of meshes surrounding a single sealed hole, and consequently, the number of meshes between adjacent sealed holes, thus determining the specific location of the sealed holes within the sealing area 300. A plug 200 is then inserted at each sealed hole to adjust the gas flow distribution through the spray plate body 100.

[0082] By partially blocking the sealing area 300 corresponding to the high-temperature region, the gas flow rate in the high-temperature region is reduced, thereby balancing the film formation rate on the substrate and improving the uniformity of the film formed on the substrate. However, in actual processing, a large temperature difference may be encountered in the high-temperature region. In this case, evenly inserting the plugs 200 within the sealing area 300 can also lead to large differences in the uniformity of the film formed in the high-temperature region.

[0083] Based on this, combined Figure 6 In some alternative embodiments provided by the present invention, a set temperature difference value is selected, which is chosen based on actual processing requirements. The high-temperature region is divided into multiple temperature gradient regions, each including at least one temperature gradient region. The average temperature within the temperature gradient region can be obtained through a substrate temperature map: the interval average temperature. The difference between any interval average temperature and the substrate average temperature is a positive integer multiple of the set temperature difference value. This further divides the high-temperature region into multiple temperature gradient regions with varying temperatures, achieving a further subdivision of the high-temperature region. Correspondingly, the sealing region 300 serves as a mapping of the high-temperature region onto the spray plate body 100, and the sealing region 300 includes sealing partitions 310 corresponding to the temperature gradient regions.

[0084] Accordingly, step S200 includes step S240: when the high-temperature region includes multiple temperature gradient regions, the proportion of gas flow that needs to be reduced in multiple sealing zones 310 is calculated separately based on the temperature difference between the average temperature of multiple zones and the average temperature of the substrate.

[0085] Step S200 also includes step S250: calculating the number of closed holes in multiple sealing zones 310 based on the ratio of the number of spray holes 110 in the sealing zone 310 to the gas flow rate that needs to be reduced in the sealing area 300.

[0086] The required reduction in gas flow rate within the sealing zone 310 is calculated. This ratio is the ratio of the number of sealed holes in the sealing zone 310 to the total number of spray holes 110 within the sealing zone 310. The number of sealed holes within the sealing zone 310 can then be calculated using the number of spray holes 110.

[0087] Furthermore, step S300 includes step S320: using the closed holes in the sealing partition 310 as grid nodes, a grid is drawn in multiple sealing partitions 310;

[0088] Based on the number of grids and the number of closed holes, calculate the number of grids between adjacent closed holes to determine the location of multiple closed holes within the sealing zone 310.

[0089] A grid is drawn within the sealing zone 310, dividing it into multiple grid regions of equal area. The number of grids surrounding each sealing hole is then calculated based on the number of sealing holes, thus determining the grid spacing between adjacent sealing holes and effectively pinpointing their specific locations within the sealing zone 310. A plug 200 is inserted at each sealing hole to regulate the gas flow distribution through the spray plate body 100.

[0090] In summary, the implementation principle of the airflow regulation method provided by the present invention is as follows: multiple plugs 200 are uniformly inserted in the sealing area 300 to reduce the gas flow rate sprayed to the high temperature area, thereby balancing the film formation rate on the substrate and improving the uniformity of the film formed on the substrate.

[0091] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. An airflow-adjustable spray plate, characterized in that, include: The spray plate body has multiple spray holes spaced apart. A plug is detachably mounted on the spray plate body and inserted into at least one of the spray holes to seal the spray holes.

2. The airflow adjustable spray plate according to claim 1, characterized in that, in, The plug has a first surface, a second surface, and a sealing portion. The first surface is provided with a first preset number of sealing portions for insertion into a first preset number of spray holes. The second surface is provided with a second preset number of sealing portions for insertion into a second preset number of spray holes, wherein the second preset number is greater than the first preset number.

3. The airflow adjustable spray plate according to claim 2, characterized in that, The first surface and the second surface are positioned opposite to each other on the plug.

4. The airflow adjustable spray plate according to claim 3, characterized in that, The plug also has a first stepped portion and a second stepped portion, the first stepped portion and the second stepped portion are connected, the first surface is located on the side of the first stepped portion away from the second stepped portion, and the second surface is located on the side of the second stepped portion away from the first stepped portion; The plug has a symmetrical axis, and the plugs on the first and second surfaces are symmetrically arranged along the symmetrical axis. The distance between the edge of the second step and the symmetrical axis is less than the distance between any two adjacent spray holes.

5. An airflow regulation method, applied to the airflow adjustable spray plate according to any one of claims 1-4, for regulating the reaction gas sprayed onto a substrate, characterized in that, Includes the following steps: Determine the sealing area on the spray plate body; Determine the number of sealed holes within the sealing area, wherein the sealed holes are the spray holes that need to be sealed; Based on the blocked area and the number of the sealing holes, the location of the sealing holes within the blocked area is determined; The plug is inserted into the sealed hole so that the reactive gas is sprayed onto the substrate through the unsealed spray hole.

6. The airflow regulation method according to claim 5, characterized in that, The step of determining the sealing area on the spray plate body includes: Temperature simulation of the substrate is performed to determine the average temperature of the substrate and the temperature map of the substrate surface. Areas on the substrate surface with a temperature higher than the average temperature of the substrate are marked as high-temperature areas. The high-temperature area is marked on the mapping area of ​​the spray plate body, wherein the mapping area is the sealing area.

7. The airflow regulation method according to claim 6, characterized in that, The step of determining the number of sealed holes within the sealing area includes: The regional average temperature of the high-temperature area is determined based on the temperature map. Based on the temperature difference between the average temperature of the region and the average temperature of the substrate, the degree of temperature influence on the reactive gas in the high-temperature region is calculated, and then the proportion of gas flow rate that needs to be reduced in the sealing region is calculated. The number of sealing holes is calculated based on the ratio of the number of spray holes in the sealing area to the gas flow rate that needs to be reduced in the sealing area.

8. The airflow regulation method according to claim 7, characterized in that, The step of determining the location of the sealing hole within the sealing area based on the sealing area and the number of sealing holes includes: Using the spray holes within the sealing area as grid nodes, a grid is drawn within the sealing area; Based on the number of grids and the number of closed holes, the number of grids between adjacent closed holes is calculated, and the positions of multiple closed holes within the sealing area are determined.

9. The airflow regulation method according to claim 6, characterized in that, The high-temperature region includes at least one temperature gradient region, the average temperature of the temperature gradient region is an interval average temperature, and the difference between any interval average temperature and the average temperature of the substrate is a positive integer multiple of a set temperature difference value; the sealing region includes sealing partitions corresponding to the temperature gradient region; The step of determining the number of sealed holes within the sealing area includes: When the high-temperature region includes multiple temperature gradient regions, the degree of temperature influence on the reactant gas in the multiple temperature gradient regions is calculated based on the temperature difference between the average temperature of the multiple intervals and the average temperature of the substrate, and the proportion of gas flow rate that needs to be reduced in the multiple sealing zones is calculated. The number of sealing holes in multiple sealing zones is calculated based on the ratio of the number of spray holes in the sealing zone to the gas flow rate that needs to be reduced in the sealing area.

10. The airflow regulation method according to claim 9, characterized in that, The step of determining the location of the sealing hole within the sealing area based on the sealing area and the number of sealing holes includes: Using the closed holes within the sealing partitions as grid nodes, a grid is drawn within the multiple sealing partitions; Based on the number of grids and the number of closed holes, the number of grids between adjacent closed holes is calculated, and the positions of multiple closed holes within the sealing zone are determined.

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