A thermal decoupling kit for bolted connections

Abstract

This invention belongs to the field of high-precision equipment connection technology and discloses a thermal decoupling kit for bolted connections. This thermal decoupling kit is used to fix a component to a mounting component. The kit includes a thermal decoupling structure and a locking component; wherein, the thermal decoupling structure includes an inner ring body, an outer ring body, and an elastic plate. A locking hole is axially formed at the center of the inner ring body. The outer ring body is coaxially spaced around the outer periphery of the inner ring body. The elastic plate is radially positioned between the inner and outer ring bodies, with both ends connected to the inner and outer ring bodies respectively. The direction perpendicular to the elastic plate is the first direction. The component to be fixed has a thermal expansion direction, and during installation, the first direction must be aligned with the thermal expansion direction. The locking component passes sequentially through the locking hole and the mounting component to fix the thermal decoupling structure at a preset angle.

Description

Technical Field

[0001] This invention relates to the field of high-precision equipment connection technology, and in particular to a thermal decoupling kit for bolted connections. Background Technology

[0002] As a common connection method, bolted connections require the release of thermal stress in high-precision equipment applications. For example, two square thin plates are fastened together by bolts at their four corners. When the ambient temperature changes, if the thermal expansion coefficients of the materials used in the two plates differ, deformation inevitably occurs due to thermal expansion and contraction. However, because the bolts restrict the deformation to a plane, the surface of the plates deforms, resulting in poor flatness. In the field of high-precision equipment, this deformation severely affects the precision features already machined on precision components. To solve this problem, existing technologies add decoupling features to the connected parts, i.e., cutting decoupling grooves at the bolted connection points. While this structure can solve the deformation problem, it still has drawbacks: the parts often have many other precision features, requiring an excessive number of corresponding decoupling grooves, significantly increasing the processing difficulty and the risk of scrapping; furthermore, if the decoupling grooves on the thin plates are damaged during use, the entire component is scrapped, increasing operating costs.

[0003] Therefore, there is an urgent need for a thermal decoupling kit for bolted connections to solve the above-mentioned technical problems. Summary of the Invention

[0004] The purpose of this invention is to provide a thermal decoupling kit for bolted connections, which not only has thermal decoupling features, but also significantly reduces the processing difficulty of parts, reduces the manufacturing cost of parts, and also reduces the repair cost in case of decoupling feature failure during use. In addition, it can also be used on thin plates, reducing the risk of scrapping the entire part during processing.

[0005] To achieve this objective, the present invention adopts the following technical solution: A thermal decoupling kit for bolted connections, used to secure a component to a mounting component, comprising: A thermal decoupling structure includes an inner ring body, an outer ring body, and an elastic plate. The inner ring body has a locking hole axially formed at its center. The outer ring body is coaxially and spaced apart from the outer periphery of the inner ring body. The elastic plate is radially disposed between the inner ring body and the outer ring body, and both ends of the elastic plate are respectively connected to the inner ring body and the outer ring body. The direction perpendicular to the elastic plate is the first direction. The component to be fixed has a thermal expansion direction. During installation, the first direction must be aligned with the thermal expansion direction. The locking member passes through the locking hole and the mounting member in sequence to fix the thermal decoupling structure at a preset angle.

[0006] Preferably, the thickness of the elastic plate is D, where 0.5mm ≤ D ≤ 1mm.

[0007] Preferably, the length of the elastic plate is L, the height of the elastic plate is H, and 2L>H.

[0008] Preferably, the connection between the elastic plate and the inner ring body is provided with an arc-shaped groove or an arc-shaped chamfer.

[0009] Preferably, the diameter of the arc-shaped groove or the arc-shaped chamfer is d, and d≥D.

[0010] Preferably, the two elastic plates are grouped together, and at least one group of elastic plates is provided between the inner ring body and the outer ring body, and the two elastic plates in the same group are arranged in the same straight line or at an angle.

[0011] Preferably, the inner ring body, the outer ring body, and the plurality of elastic plates are integrally formed and are all made of spring steel.

[0012] Preferably, the outer ring body is provided with a positioning groove, the opening direction of the positioning groove is the same as the first direction, the component to be fixed is provided with an installation groove, the direction of the installation groove is the same as the thermal expansion direction, and when installing the thermal decoupling structure, the positioning groove and the installation groove must be aligned.

[0013] Preferably, the thermal decoupling structure includes an inner body and an outer body, and the thermal decoupling structure is assembled into the through hole of the component to be fixed by means of interference fit or transition fit.

[0014] Preferably, the outer periphery of the outer ring body is provided with an anti-detachment groove; and / or The top surface of the outer ring is provided with a flange; and / or The outer ring body is provided with a glue injection groove on its outer periphery, and the top surface of the outer ring body is provided with a glue injection hole that communicates with the glue injection groove. The glue injected from the glue injection hole can flow into the glue injection groove, and after the glue solidifies, it will fix the thermal decoupling structure in the through hole.

[0015] The beneficial effects of this invention are: This invention discloses a thermal decoupling kit for bolted connections. This kit is used to fix a component to a mounting component. The kit includes a thermal decoupling structure and a locking element. The thermal decoupling structure includes an inner ring, an outer ring, and an elastic plate. A locking hole is axially formed at the center of the inner ring. The outer ring is coaxially spaced around the outer periphery of the inner ring. The elastic plate is radially positioned between the inner and outer rings, with its two ends connected to the inner and outer rings respectively. The direction perpendicular to the elastic plate is a first direction. The component to be fixed has a thermal expansion direction; during installation, the first direction must be aligned with the thermal expansion direction. The locking element passes sequentially through the locking hole and the mounting component to fix the thermal decoupling structure at a preset angle.

[0016] In this kit, a thermal decoupling structure replaces the decoupling groove in existing technologies. The elastic plate supports the outer ring body along its length at the installation position, thus hindering deformation at that location. In a first direction perpendicular to the elastic plate, the outer ring body deforms under stress. Therefore, when the component to be fixed is heated, it deforms from the inside out along the direction of thermal expansion. Since the direction of thermal expansion is the same as the first direction, the thermal expansion stress causes the outer ring body to deform along the first direction, thereby fully releasing the thermal stress inside the component to be fixed. Therefore, this kit not only has thermal decoupling characteristics but also eliminates the need to machine decoupling grooves on the component to be fixed; only through holes for mounting the thermal decoupling structure are required, significantly reducing manufacturing difficulty. Furthermore, the manufacturing cost of the thermal decoupling structure is low. If the decoupling characteristic fails, only the corresponding kit needs to be disassembled and the new parts replaced, effectively reducing repair costs and preventing the entire component from being scrapped. Combined with these advantages, this kit can also be used on thin plates, significantly reducing the risk of overall component failure. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure provided by the present invention for fixing the plate to the base plate using the thermal decoupling kit for bolted connections; Figure 2 This is a schematic diagram of the structure of the plate material provided by the present invention; Figure 3 This is a schematic diagram of the structure of Embodiment 1 provided by the present invention; Figure 4 This is a schematic diagram of the structure of Embodiment 2 provided by the present invention; Figure 5 This is a schematic diagram of the structure of Embodiment 3 provided by the present invention; Figure 6 This is a schematic diagram of the structure of Embodiment 4 provided by the present invention; Figure 7 yes Figure 2 A magnified view of part A in the middle; Figure 8This is a structural diagram showing the selectable layout of the flexible plate.

[0018] In the picture: 10. Thermal decoupling structure; 11. Locking hole; 12. Anti-detachment groove; 13. Flange; 14. Injection groove; 15. Injection hole; 16. Inner ring body; 17. Outer ring body; 18. Elastic plate; 19. Positioning groove; 20. Locking components; 100. Component to be fixed; 110. Through hole; 120. Limiting groove; 130. Mounting groove; 200. Installation components. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0020] In this invention, the terms "comprising," "including," "having," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0021] In this invention, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A alone, A and B simultaneously, and B alone. Additionally, in this invention, the character " / " generally indicates that the preceding and following related objects have an "and / or" relationship.

[0022] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," "fixed," "combined," "coupled," and "installed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a direct connection or an indirect connection via an intermediate medium; or the internal communication of two components or the interaction between two components. As examples, a direct connection refers to two parts or components being connected together without the need for an intermediate medium, while an indirect connection refers to two parts or components each being connected to at least one intermediate medium, with the connection achieved through the intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Furthermore, "connected" and "coupled" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.

[0023] In this invention, those skilled in the art will understand that relative terms (e.g., “about,” “approximately,” “basically,” etc.) used in conjunction with quantities or conditions are to include the value and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances associated with the particular value due to manufacturing, assembly, use, etc. Such terms should also be considered as disclosing a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​not using relative terms should also be disclosed as specific values ​​with tolerances. Furthermore, “basically” when expressing relative angular relationships (e.g., substantially parallel, substantially perpendicular) may refer to a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) added to or subtracted from the indicated angle.

[0024] In this invention, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0025] In this invention, the terms "upper," "lower," "left," "right," "front," and "rear," etc., refer to the orientations or positional relationships shown in the accompanying drawings. They are used solely for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, in the context, it should be understood that when an element is mentioned as being "upper" or "lower" than another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as "upper side," "lower side," "left side," "right side," "front side," and "rear side" not only represent positive orientation but can also be understood as lateral orientation. For example, "above," "on top of," "upper side of," and "above" the first feature "above" or "on the second feature" includes the first feature being directly above, to the upper left, to the upper right, to the upper front, and to the upper rear of the second feature, or simply indicating that the first feature is at a higher horizontal level than the second feature. The terms "below," "under," "below," and "below" for "first feature" and "second feature" include situations where the first feature is directly below, to the lower left, to the lower right, in front of, or behind the second feature, or simply indicate that the first feature is at a lower horizontal level than the second feature. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no specific meaning.

[0026] As a common connection method, bolted connections require thermal stress relief in high-precision equipment applications. For example, two square thin plates are fastened together by bolts at their four corners. When the ambient temperature changes, if the thermal expansion coefficients of the materials used in the two plates differ, deformation inevitably occurs due to thermal expansion and contraction. However, because the bolts restrict the expansion along a plane, the surface of the plates deforms, resulting in poor flatness. In the field of high-precision equipment, this deformation severely affects the precision features already machined on precision components. To solve this problem, existing technologies add decoupling features to the connected parts, i.e., cutting decoupling grooves at the bolted connection. While this structure can solve the deformation problem, it still has drawbacks: the parts often have many other precision features, requiring an excessive number of corresponding decoupling grooves, significantly increasing the processing difficulty and the risk of scrapping; furthermore, if the decoupling grooves on the thin plates are damaged during use, the entire component is scrapped, increasing operating costs. To address the problems in the existing technology, this invention provides a thermal decoupling kit for bolted connections. The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0027] like Figures 1-6As shown, the present invention provides a thermal decoupling kit for bolted connections, used to fix a component 100 to a mounting component 200. The kit includes a thermal decoupling structure 10 and a locking component 20. The thermal decoupling structure 10 includes an inner ring 16, an outer ring 17, and an elastic plate 18. The center of the inner ring 16 has an axially oriented locking hole 11. The outer ring 17 is coaxially and spaced apart on the outer periphery of the inner ring 16. The elastic plate 18 is radially disposed between the inner ring 16 and the outer ring 17, and both ends of the elastic plate 18 are respectively connected to the inner ring 16 and the outer ring 17. The direction perpendicular to the elastic plate 18 is the first direction. The component 100 to be fixed has a thermal expansion direction, and during installation, the first direction must be in the same direction as the thermal expansion direction. The locking component 20 passes through the locking hole 11 and the mounting component 200 in sequence to fix the thermal decoupling structure 10 at a preset angle.

[0028] In this kit, a thermal decoupling structure 10 replaces the decoupling groove in the prior art. The elastic plate 18 supports the outer ring 17 along its length at the installation position, thus hindering deformation at the corresponding location. In a first direction perpendicular to the elastic plate 18, the outer ring 17 deforms under stress. Therefore, when the component to be fixed 100 is heated, it deforms from the inside out along the direction of thermal expansion. Since the direction of thermal expansion is the same as the first direction, the thermal expansion stress causes the outer ring 17 to deform along the first direction, thereby fully releasing the thermal stress inside the component to be fixed 100. Therefore, this kit not only has thermal decoupling characteristics but also eliminates the need to machine a decoupling groove on the component to be fixed 100. Only a through hole 110 corresponding to the installation of the thermal decoupling structure 10 needs to be machined, significantly reducing processing difficulty. Furthermore, the manufacturing cost of the thermal decoupling structure 10 is low. If the decoupling characteristic fails, only the corresponding kit needs to be disassembled and a new part replaced, effectively reducing repair costs and preventing the entire component to be fixed 100 from being scrapped. In addition to this effect, the kit can also be used on thin plates, significantly reducing the risk of overall component failure. It should be noted that in this embodiment, the component to be fixed 100 is a thin plate, and the mounting component 200 is a base plate.

[0029] To significantly improve installation convenience, the thermal decoupling structure 10 is fitted into the through hole 110 of the component to be fixed using an interference fit or a transition fit. The interference fit and transition fit methods are simple and quick, facilitate disassembly and replacement, reduce maintenance costs, and do not damage the component to be fixed 100, resulting in high reliability.

[0030] like Figures 3-6 As shown, the thermal decoupling structure 10 has the following scheme: The outer periphery of the outer ring body 17 is provided with an anti-detachment groove 12; and / or A flange 13 is provided on the top surface of the outer ring body 17; and / or The outer ring body 17 is provided with a glue injection groove 14 on its outer periphery, and a glue injection hole 15 is provided on the top surface of the outer ring body 17, which is connected to the glue injection groove 14. The glue injected from the glue injection hole 15 can flow to the glue injection groove 14. After the glue solidifies, it will fix the thermal decoupling structure 10 in the through hole 110.

[0031] The following detailed description uses specific embodiments. Example 1 like Figure 3 As shown, in this embodiment, the outer ring 17 of the thermal decoupling structure 10 has an anti-detachment groove 12. It is pressed into the through hole 110 by an interference fit. Since the plate 100 has a certain deformation capability, after the thermal decoupling structure 10 is interference fitted, the hole wall of the through hole 110 undergoes slight deformation and can be correspondingly locked into the anti-detachment groove 12, thereby forming a partial locking, ensuring that the thermal decoupling structure 10 will not detach from the through hole 110, and the thermal decoupling structure 10 and the plate 100 are formed into a whole. Combined with the locking member 20, the plate 100 and the thermal decoupling structure 10 can be fixed together on the base plate 200.

[0032] Preferably, multiple anti-detachment grooves 12 are provided at intervals along the axial direction of the thermal decoupling structure 10. In this embodiment, multiple anti-detachment grooves 12 can effectively improve the anti-detachment effect, ensuring that the thermal decoupling structure 10 will not detach from the through hole 110 along the axial direction, thereby improving its firmness.

[0033] Example 2 like Figure 4 As shown, in this embodiment, the outer ring 17 of the thermal decoupling structure 10 has a glue injection groove 14 around its outer periphery, and the top surface of the outer ring 17 has a glue injection hole 15 that connects to the glue injection groove 14. The thermal decoupling structure 10 can be installed by transition assembly or interference fit. After the thermal decoupling structure 10 is interference fit or transition fit into the through hole 110, glue is injected into the glue injection groove 14 through the glue injection hole 15. The glue in the glue injection groove 14 can bond the outer body 16 of the thermal decoupling structure 10 to the inner wall of the through hole 110, thereby playing a limiting and fixing role, ensuring that the thermal decoupling structure 10 will not detach from the through hole 110 (preventing the thermal decoupling structure 10 from rotating around the axis), forming the thermal decoupling structure 10 and the plate 100 into a whole. Combined with the locking member 20, the plate 100 and the thermal decoupling structure 10 can be fixed together on the base plate 200.

[0034] Preferably, multiple injection holes 15 are evenly arranged along the circumference of the outer ring body 17. In this embodiment, multiple injection holes 15 can improve the injection speed, and the even distribution along the circumference can ensure the uniformity of injection, ensuring that there is glue in the injection groove 14, thus ensuring a good bonding effect.

[0035] Example 3 like Figure 5As shown, the outer periphery of the thermal decoupling structure 10 lacks the anti-detachment groove 13 and the glue injection groove 14, but the top surface of the outer ring body 17 is provided with a flange 13, which is pressed into the through hole 110 by interference fit. In this embodiment, the structure without the positioning groove can more quickly assemble the thermal decoupling structure 10 into the through hole 110. At this time, the flange 13 presses against the top surface of the plate 100, and together with the locking part 20 in the kit, it passes through the locking hole 11 and works with the base plate 200 to fix the thermal decoupling structure 10 to the plate 100, and at the same time lock the plate 100 to the base plate 200. The structure is simple and easy to install. While having the thermal decoupling characteristics, it reduces the installation difficulty and the scrap rate of parts.

[0036] Example 4 like Figure 6 As shown, the outer periphery of the thermal decoupling structure 10 is provided with a glue injection groove 14, the top surface of the outer ring body 17 is provided with a flange 13, and the top surface of the flange 13 is provided with a glue injection hole 15 that connects to the glue injection groove 14. The glue injected from the glue injection hole 15 can flow to the glue injection groove 14 so that the glue limits the thermal decoupling structure 10. Unlike Embodiment 3, this embodiment also has a flange 13 and an injection groove 14. After assembly, the flange 13 abuts against the top surface of the plate 100, and the glue is injected into the injection groove 14 through the injection hole 15. The glue in the injection groove 14 can bond the outer body 16 of the thermal decoupling structure 10 to the inner wall of the through hole 110, thereby playing a limiting and fixing role, ensuring that the thermal decoupling structure 10 will not detach from the through hole 110, and forming the thermal decoupling structure 10 and the plate 100 into a whole. Combined with the abutting effect of the locking member 20 and the flange 13, the plate 100 and the thermal decoupling structure 10 can be fixed together on the base plate 200.

[0037] Preferably, multiple injection holes 15 are evenly arranged along the circumference of the flange 13. In this embodiment, multiple injection holes 15 can improve the injection speed, and the even distribution along the circumference can ensure the uniformity of injection, ensuring that there is glue in the injection groove 14, thus ensuring a good bonding effect.

[0038] In addition, such as Figure 7 As shown, if a structure with flange 13 is selected, a limiting groove 120 can be opened at the top of the through hole 110. During installation, flange 13 can be directly embedded in the limiting groove 120, thereby ensuring the flatness of the top surface of plate 100.

[0039] It should be noted that the thermal decoupling structures 10 shown in Embodiments 1 to 4 are different, and their axial load bearing capabilities are also different. The structures in Embodiments 1 and 2 are suitable for applications with small axial loads; the structures in Embodiments 3 and 4 are suitable for tooling with large axial loads. In use, different thermal decoupling structures 10 can be selected according to the material of the plate 100 and the degree of deformation, and can also be arbitrarily combined from the four structures according to the different magnitudes of local stress.

[0040] Preferably, in the embodiments one to four, the thickness of the elastic plate 18 is D, where 0.5mm ≤ D ≤ 1mm. This thickness of the elastic plate 18 ensures its structural strength while reducing raw material usage, thereby controlling manufacturing costs and the overall weight of the thermal decoupling structure 10. It should be noted that the thickness of the elastic plate 18 can be set within the range of 0.5mm-1mm according to actual needs, with 0.8mm being optimal.

[0041] Furthermore, in the schemes of Embodiments 1 to 4, the length of the elastic plate 18 is L, the height of the elastic plate 18 is H, and 2L>H. This setting can control the ratio of the length to the height of the elastic plate 18, thereby further controlling the structural strength of the elastic plate 18, thus indirectly ensuring that the thermal decoupling structure 10 can only deform along the first direction, thereby ensuring a good thermal decoupling effect.

[0042] In addition, such as Figures 3-6 As shown, an arc-shaped groove or arc-shaped chamfer is provided at the connection between the elastic plate 18 and the inner ring body 16. This design can effectively decompose the stress generated at the connection between the elastic plate 18 and the inner ring body 16, thereby effectively avoiding the situation of excessive stress concentration or overload leading to breakage, thus ensuring a good thermal decoupling effect and significantly reducing the scrap rate of parts.

[0043] It should be noted that, depending on the actual processing needs or conditions, the processing can be done by choosing to process arc-shaped grooves or arc-shaped chamfers; no specific limitation is made in this embodiment.

[0044] Furthermore, in the schemes of Embodiments 1 to 4, the diameter of the arc-shaped groove or arc-shaped chamfer is d, and d ≥ D. This setting can fully guarantee the structural strength of the connection, avoid excessive inward concavity which would increase the "brittleness" of the connection, effectively reduce the probability and risk of breakage and scrap, and has good application effect.

[0045] To ensure good thermal decoupling performance and expand the application range, such as Figure 8As shown, two elastic plates 18 form a group, and at least one group of elastic plates 18 is provided between the inner ring body 16 and the outer ring body 17, with the two elastic plates 18 in the same group being arranged in a straight line or at an angle. Typically, a structure with one group of elastic plates 18 and the two elastic plates 18 being arranged in a straight line can be selected for thermal decoupling. Figure 8 (See Figure A in the diagram); however, if the deformation is too large in the first direction, it can be replaced with... Figure 8 The structures shown in B, C, and D need to be adjusted according to the actual magnitude of thermal stress during use, thereby increasing the range of options available for the thermal decoupling structure 10, and enabling the selection of the appropriate structure for different situations.

[0046] It should be noted that, regardless of the structure, the inner ring 16, outer ring 17, and multiple elastic plates 18 are integrally formed and all made of spring steel. This integrally formed structure not only reduces processing difficulty and improves processing convenience but also ensures overall structural strength. Spring steel has extremely high elastic limit and yield strength, allowing it to return to its original shape after the load (thermal stress) disappears without permanent deformation, resulting in a high yield strength ratio.

[0047] To improve installation convenience, a positioning groove 19 is provided on the outer ring 17. The opening direction of the positioning groove 19 is the same as the first direction. An installation groove 130 is provided on the fastener 100. The direction of the installation groove 130 is the same as the thermal expansion direction. When installing the thermal decoupling structure 10, the positioning groove 19 and the installation groove 130 must be aligned. Figures 3-6 Taking the example, the positioning groove 19 is perpendicular to the length direction of the elastic plate 18 itself, which is the first direction. Therefore, during installation, it is only necessary to align the positioning groove 19 with the mounting groove 130 to ensure that the first direction is the same as the thermal expansion direction, thereby improving the installation speed, installation accuracy and installation convenience, and indirectly ensuring the thermal decoupling effect.

[0048] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A thermal decoupling kit for bolted connections, used to fix a component (100) to a mounting component (200), characterized in that, include: The thermal decoupling structure (10) includes an inner ring body (16), an outer ring body (17), and an elastic plate (18). The center of the inner ring body (16) is provided with a locking hole (11) along the axial direction. The outer ring body (17) is coaxially and spaced apart on the outer periphery of the inner ring body (16). The elastic plate (18) is radially disposed between the inner ring body (16) and the outer ring body (17). The two ends of the elastic plate (18) are respectively connected to the inner ring body (16) and the outer ring body (17). The direction perpendicular to the elastic plate (18) is the first direction. The component to be fixed (100) has a thermal expansion direction. During installation, the first direction must be in the same direction as the thermal expansion direction. The locking member (20) passes through the locking hole (11) and the mounting member (200) in sequence to fix the thermal decoupling structure (10) at a preset angle.

2. The thermal decoupling kit for bolted connections according to claim 1, characterized in that, The thickness of the elastic plate (18) is D, where 0.5mm ≤ D ≤ 1mm.

3. The thermal decoupling kit for bolted connections according to claim 2, characterized in that, The length of the elastic plate (18) is L, the height of the elastic plate (18) is H, and 2L>H.

4. The thermal decoupling kit for bolted connections according to claim 3, characterized in that, An arc-shaped groove or an arc-shaped chamfer is provided at the connection between the elastic plate (18) and the inner ring body (16).

5. The thermal decoupling kit for bolted connections according to claim 4, characterized in that, The diameter of the arc-shaped groove or the arc-shaped chamfer is d, and d≥D.

6. The thermal decoupling kit for bolted connections according to any one of claims 1-5, characterized in that, Two elastic plates (18) are a group, and at least one group of elastic plates (18) is provided between the inner ring body (16) and the outer ring body (17), and the two elastic plates (18) in the same group are arranged in the same straight line or at an angle.

7. The thermal decoupling kit for bolted connections according to claim 6, characterized in that, The inner ring (16), the outer ring (17), and the multiple elastic plates (18) are integrally formed and are all made of spring steel.

8. The thermal decoupling kit for bolted connections according to any one of claims 1-5, characterized in that, The outer ring body (17) is provided with a positioning groove (19), the opening direction of the positioning groove (19) is the same as the first direction, the component to be fixed (100) is provided with an installation groove (130), the direction of the installation groove (130) is the same as the thermal expansion direction, when installing the thermal decoupling structure (10), the positioning groove (19) and the installation groove (130) must be aligned.

9. The thermal decoupling kit for bolted connections according to any one of claims 1-5, characterized in that, The thermal decoupling structure (10) is assembled into the through hole (110) of the component to be fixed (100) by means of interference or transition.

10. The thermal decoupling kit for bolted connections according to claim 9, characterized in that, The outer periphery of the outer ring (17) is provided with an anti-detachment groove (12); and / or The top surface of the outer ring (17) is provided with a flange (13); and / or The outer ring body (17) is provided with a glue injection groove (14) on its outer periphery. The top surface of the outer ring body (17) is provided with a glue injection hole (15) that connects to the glue injection groove (14). The glue injected from the glue injection hole (15) can flow to the glue injection groove (14). After the glue solidifies, it will fix the thermal decoupling structure (10) in the through hole (110).

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