Adsorption refrigeration device and server liquid cooling system

Abstract

This invention discloses an adsorption refrigeration device, comprising an adsorption bed and a condenser arranged side-by-side in a horizontal direction. The condenser has a first steam inlet at its upper part, and the adsorption bed has a first steam outlet at its upper part, with the first steam inlet connected to the adsorption bed. This arrangement significantly improves overall efficiency and reduces the resistance to steam transfer between the condenser and the adsorption bed. Therefore, this adsorption refrigeration device effectively solves the problem of poor steam transfer between the condenser and the adsorption bed. This invention also discloses a server liquid cooling system incorporating the above-mentioned adsorption refrigeration device.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, and more specifically, to an adsorption refrigeration device, and also to a server liquid cooling system including the above-mentioned adsorption refrigeration device. Background Technology

[0002] Currently, data center air conditioning units mainly rely on the traditional method of converting electrical energy into mechanical energy for cooling. The high power consumption and heat generated by data centers, as well as the inexhaustible natural cooling sources, are not fully utilized. This waste heat utilization cooling solution can make full use of the heat of the data center, without the need for compressor cooling, and can still provide the cooling capacity required by the data center.

[0003] In the process of realizing this invention, the inventors discovered that the prior art has at least the following problems: For adsorption beds, when the adsorption bed enters the desorption stage, a high-temperature fluid for desorption is introduced into the adsorption bed. The adsorbent in the adsorption chamber of the adsorption bed begins to desorb the gaseous adsorbent working medium. When the pressure in the adsorption chamber is relatively high, the gaseous adsorbent working medium in the adsorption chamber will be discharged into the condenser and then condensed into a liquid adsorbent working medium in the condenser. However, the current arrangement of the condenser and the repair bed is unreasonable and the arrangement effect is not good. Summary of the Invention

[0004] In view of this, the first objective of the present invention is to provide an adsorption refrigeration device that can effectively solve the problem of poor steam transfer effect in condensers and adsorption beds. The second objective of the present invention is to provide a server liquid cooling system including the above-mentioned adsorption refrigeration device.

[0005] To achieve the first objective mentioned above, the present invention provides the following technical solution:

[0006] An adsorption refrigeration device is characterized in that it includes an adsorption bed and a condenser arranged side by side in a horizontal direction, the upper part of the condenser is provided with a first steam inlet, the upper part of the adsorption bed is provided with a first steam outlet, and the first steam inlet is connected to the first steam outlet.

[0007] In the aforementioned adsorption refrigeration device, the adsorption bed and condenser are arranged side-by-side horizontally. A first steam inlet is located at the top of the condenser, and a first steam outlet is located at the top of the adsorption bed. Firstly, this arrangement allows the first steam inlet and outlet to be close to each other, reducing flow resistance through their respective pipe paths. Secondly, the top location of both the inlet and outlet ensures a good distribution of steam in the upper part and liquid in the lower part of the condenser, while facilitating the upward movement of refrigerant vapor for easy discharge in the adsorption bed. In summary, this arrangement significantly improves overall efficiency and reduces the resistance to steam transfer between the condenser and adsorption bed. Therefore, this adsorption refrigeration device effectively solves the problem of poor steam transfer between the condenser and adsorption bed.

[0008] In some technical solutions, multiple adsorption beds are arranged sequentially along the side of the condenser around its vertical center and are connected to the condenser.

[0009] In some technical solutions, a frame and an evaporator are also included, with the evaporator and the condenser arranged on a first side of the frame and the adsorption bed arranged on a second side of the frame, the first side and the second side being the two sides of the frame in the horizontal direction, respectively.

[0010] In some technical solutions, at least two units arranged side by side in a horizontal direction are included. The units include the frame and the evaporator, the condenser and the plurality of adsorption beds that are connected to each other to form an adsorption refrigeration system.

[0011] In some technical solutions, in the unit: the adsorption bed includes an adsorption chamber provided with adsorbent and a heat exchange channel capable of exchanging heat with the adsorbent in the adsorption chamber;

[0012] The second steam outlet of the evaporator is connected to the second steam inlet corresponding to each of the adsorption beds through multiple second switching valves. The evaporator is also provided with a cryogenic fluid channel for heat exchange with the liquid adsorption working fluid in the evaporation chamber. The inlet end of the cryogenic fluid channel is connected to a cryogenic fluid reflux interface, and the outlet end is connected to a cryogenic fluid outlet interface.

[0013] The first steam inlet of the condenser is connected to the first steam outlet corresponding to each of the adsorption beds through multiple first switching valves. The condenser is also provided with a cooling fluid channel for exchanging heat with the gaseous adsorption working fluid in the condensation chamber. The inlet of the cooling fluid channel is connected to the cooling fluid inlet port and the inlet of the cooling fluid channel is connected to the cooling fluid outlet port.

[0014] One end of each heat exchange channel is optionally connected to a heat source fluid inlet port via a first multi-way valve, and the other end of each heat exchange channel is optionally connected to a heat source fluid outlet port via a second multi-way valve.

[0015] One end of each heat exchange channel is optionally connected to the cooling fluid inlet port via a third multi-way valve, and the other end of each heat exchange channel is optionally connected to the cooling fluid outlet port via a fourth multi-way valve.

[0016] Some technical solutions also include a heat source supply port for supplying heat source fluid to the heat source inlet to enable the unit to operate in cooling mode;

[0017] A main control valve is used to change the number of units supplied by the heat source supply port.

[0018] In some technical solutions, the various generating units are connected in parallel.

[0019] In some technical solutions, the first sides of each of the units are arranged close to each other.

[0020] In some technical solutions, multiple units are arranged in a circular arrangement with the center close to each other.

[0021] To achieve the second objective mentioned above, the present invention also provides a server liquid cooling system, which includes any of the aforementioned adsorption refrigeration devices, comprising a server liquid cooling device, wherein the heat source fluid inlet of the adsorption refrigeration device is connected to the outlet of the server liquid cooling device. Since the aforementioned adsorption refrigeration devices possess the above-mentioned technical effects, the server liquid cooling system having such adsorption refrigeration devices should also possess corresponding technical effects. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the adsorption refrigeration device provided in an embodiment of the present invention;

[0024] Figure 2 This is a rear view schematic diagram of the adsorption refrigeration device provided in an embodiment of the present invention;

[0025] Figure 3 This is a side view of the adsorption refrigeration device provided in an embodiment of the present invention;

[0026] Figure 4This is a schematic diagram of the multi-unit layout provided in an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the adsorption refrigeration system provided in an embodiment of the present invention;

[0028] Figure 6 This is a schematic diagram of the overall structure of the adsorption refrigeration system provided in an embodiment of the present invention.

[0029] The following labels are shown in the attached diagram:

[0030] Heat source fluid inlet 1, heat source fluid outlet 2, cooling fluid inlet 3, cooling fluid outlet 4, chilled fluid outlet 5, chilled fluid return 6, adsorption bed 7, evaporator 8, condenser 9, first switching valve 10, second switching valve 11, first multi-way valve 12, second multi-way valve 13, third multi-way valve 14, fourth multi-way valve 15, heat exchange channel 16, chilled fluid channel 17, cooling fluid channel 18, frame 19, main control valve 20, unit 100. Detailed Implementation

[0031] This invention discloses an adsorption refrigeration device to effectively solve the problem of poor steam transfer efficiency in condensers and adsorption beds.

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Please see Figures 1-6 , Figure 1 This is a schematic diagram of the adsorption refrigeration device provided in an embodiment of the present invention; Figure 2 This is a rear view schematic diagram of the adsorption refrigeration device provided in an embodiment of the present invention; Figure 3 This is a side view of the adsorption refrigeration device provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the multi-unit layout provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the adsorption refrigeration system provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the overall structure of the adsorption refrigeration system provided in an embodiment of the present invention.

[0034] In some embodiments, an adsorption refrigeration device is provided to prepare a corresponding cryogenic fluid from an introduced high-temperature fluid and a cooling fluid. The high-temperature fluid is also referred to as the heat source fluid for desorption. The cooling fluid is required for both the condenser 9 and the adsorption bed 7 in the adsorption state. The cooling fluid can be supplied sequentially to the condenser 9 and the adsorption bed 7 in the adsorption state, or it can be divided into two parts and supplied to the condenser and the adsorption bed 7 in the adsorption state, respectively.

[0035] Generally, adsorption refrigeration devices mainly include an adsorption bed 7 and a heat exchanger. One or more heat exchangers can be used. With only one heat exchanger, it alternates between serving as a condenser 9 and an evaporator 8. With two heat exchangers, one functions as a condenser 9 and the other as an evaporator 8. The heat exchanger mainly includes a heat exchange chamber and a heat exchange fluid channel, where the heat exchange chamber can also be a channel structure. Heat exchange occurs between the heat exchange fluid channel and the heat exchange chamber. When the heat exchanger is used as a condenser 9, the heat exchange chamber has a certain space to accommodate the gaseous adsorbent, while the heat exchange fluid flows through the heat exchange fluid channel.

[0036] When the heat exchanger is used as a condenser 9, the heat exchange chamber is used to introduce refrigerant vapor from the adsorption chamber. At this time, the heat exchange fluid channel serves as the cooling fluid channel 18, through which a low-temperature fluid flows. After the low-temperature fluid enters the cooling fluid channel 18, it begins to absorb heat through the channel wall, so that the refrigerant vapor in the condensation chamber of the condenser 9 condenses into liquid refrigerant.

[0037] When the heat exchanger is used as an evaporator 8, the heat exchange chamber stores liquid refrigerant and can export refrigerant vapor. At this time, the heat exchange fluid channel serves as a refrigeration fluid channel 17, through which low-temperature fluid flows. After the low-temperature fluid enters the refrigeration fluid channel 17, it begins to release heat through the channel wall, so that the liquid refrigerant in the evaporation chamber of the evaporator 8 evaporates into refrigerant vapor.

[0038] The adsorption chamber of the adsorption bed 7 is equipped with an adsorbent, and a refrigerant (also called an adsorbent working fluid) used in conjunction with the adsorbent flows between the adsorption chamber and the heat exchange chamber. The refrigerant and adsorbent combine to form a working fluid pair. In an adsorption refrigeration device, multiple sets of adsorbent working fluid pairs can be set. One adsorbent can correspond to different refrigerants, or multiple adsorbents can correspond to one refrigerant.

[0039] For the adsorption bed 7, there are two main working states: adsorption and desorption, which are generally carried out in stages. In the adsorption state, a cooling fluid is used to cool the adsorption bed 7, allowing the adsorbent within the bed to adsorb refrigerant vapor, ensuring continuous adsorption capacity until the adsorbent reaches a preset saturation state. Taking physical adsorption as an example, the refrigerant vapor liquefies into liquid refrigerant, maintaining a low-pressure state within the adsorption chamber to continuously draw in refrigerant vapor, such as continuously adsorbing refrigerant vapor from the evaporator 8, allowing the evaporator 8 to continuously absorb heat through evaporation. In the desorption state, a high-temperature fluid is generally used to heat the adsorption bed 7, causing the adsorbent to desorb from the adsorbent, reverting to a gaseous refrigerant vapor. This refrigerant vapor then enters the condenser 9, where it liquefies into liquid refrigerant. It should be noted that a heat exchange channel 16 can be provided to alternately circulate high-temperature and low-temperature fluids; alternatively, a heat exchange channel 16 can be provided specifically for low-temperature fluids, while another channel is provided specifically for high-temperature fluids; alternatively, only a heat exchange channel 16 can be provided for high-temperature fluids, and the adsorption stage of the adsorption bed 7 does not involve the high-temperature fluid, but rather heat dissipation is achieved through other heat-conducting structures, such as metal heat-conducting components. The evaporator 8 and condenser 9 can be two separate components, or they can be combined into one component to reflect different stages of this structure.

[0040] The adsorption bed 7 has a heat exchange channel 16 for heat exchange with the adsorbent in the adsorption chamber. This heat exchange channel 16 is a channel capable of carrying at least a high-temperature fluid (heat source fluid), so that a high-temperature fluid flows through it during the desorption phase of the adsorption bed 7. During the adsorption phase, the heat exchange channel 16 can be closed or used to carry a low-temperature fluid. The heat exchange channel 16 can exchange heat with the adsorbent, so that during the desorption phase, a high-temperature fluid flows through it, keeping the entire adsorption chamber at a high temperature. After absorbing heat, the adsorbent desorbs a gaseous adsorbent, which absorbs heat from the high-temperature fluid in the heat exchange channel 16. This gaseous adsorbent can be discharged to the outside or to the condensation chamber of the condenser 9, where it is condensed back into a gaseous adsorbent.

[0041] The condenser 9 has a first steam inlet at its upper part, and the adsorption bed 7 has a first steam outlet at its upper part. The first steam inlet is connected to the adsorption bed 7, allowing them to communicate with each other. This enables the adsorbent generated in the adsorption bed 7 to enter the first steam inlet through the first steam outlet during the desorption stage. Furthermore, a first switching valve 10 is provided between the condenser 9 and the adsorption bed 7. Specifically, the first switching valve 10 can be connected between the first steam pipe 20 and the first steam inlet, which brings the first switching valve 10 closer to the condenser 9.

[0042] In some embodiments, as described above, an evaporator 8 may be further included, wherein the second steam outlet 8-1 of the evaporator 8 is connected to the second steam inlet of the adsorption chamber via a second steam pipe and a second switching valve 11 connected in series. The second switching valve 11 may be connected in series between the second steam pipe and the second steam outlet 8-1, or it may be connected in series between the second steam pipe and the second steam inlet.

[0043] It should be noted that the condenser has a first steam inlet at its upper part, which can be located on the top side of the condenser or on the upper part of its lateral side. Correspondingly, the adsorption bed has a first steam outlet at its upper part, which can be located on the top side of the adsorption bed or on its lateral side.

[0044] As shown in the attached figure, the top side of the condenser is provided with a first steam inlet, and the top side of the adsorption bed is provided with a first steam outlet. The two can be connected by an inverted U-shaped tube.

[0045] Of course, the first steam inlet is provided on the upper part of the transverse side of the condenser, and the first steam outlet is provided on the transverse side of the adsorption bed. At this time, the two can be connected by a straight pipe.

[0046] In the aforementioned adsorption refrigeration device, the adsorption bed and condenser are arranged side-by-side horizontally. A first steam inlet is located at the top of the condenser, and a first steam outlet is located at the top of the adsorption bed. Firstly, this arrangement allows the first steam inlet and outlet to be close to each other, reducing flow resistance through their respective pipe paths. Secondly, the top location of both the inlet and outlet ensures a good distribution of steam in the upper part and liquid in the lower part of the condenser, while facilitating the upward movement of refrigerant vapor for easy discharge in the adsorption bed. In summary, this arrangement significantly improves overall efficiency and reduces the resistance to steam transfer between the condenser and adsorption bed. Therefore, this adsorption refrigeration device effectively solves the problem of poor steam transfer between the condenser and adsorption bed.

[0047] In some embodiments, multiple adsorption beds may be arranged sequentially along the side of the condenser around its vertical center and communicate with the condenser. As shown in the accompanying drawings, two adsorption beds are arranged side by side along a first direction, and the condenser is provided with the two adsorption beds on one side along a second direction, wherein the first and second directions are perpendicular and both are horizontal.

[0048] In some embodiments, the system further includes a frame and an evaporator. The evaporator and the condenser can be arranged on a first side of the frame, and the adsorption bed can be arranged on a second side of the frame. The first side and the second side are respectively the two sides of the frame in the horizontal direction. The side-by-side direction of the first side and the second side is the second direction. On the first side, the evaporator and condenser can be arranged vertically side-by-side or horizontally side-by-side; vertical arrangement is preferred. The condenser is positioned above the evaporator to facilitate the flow of liquid refrigerant from the condenser's condensation chamber to the evaporator's evaporation chamber under gravity, thereby reducing flow resistance between them.

[0049] In some embodiments, for ease of layout, a unit 100 may be provided, comprising at least two horizontally arranged side by side, the unit including the frame and the evaporator, the condenser and the plurality of adsorption beds communicating with each other to form an adsorption refrigeration system.

[0050] Multiple units are used as modules, which facilitates quantity control and allows for better utilization of the heat source.

[0051] As shown in the attached diagram, the first sides of each unit can be arranged close to each other, such as two units having their first sides close to each other. Alternatively, multiple units can be arranged in a reversed configuration; specifically, multiple units can be arranged around each other with their centers close together. This arrangement simplifies pipeline routing, reduces pipeline length, and consequently lowers overall flow resistance.

[0052] Furthermore, the aforementioned units can be connected in series or in parallel. It should be noted that series or parallel connection refers to the corresponding piping being connected in series or parallel. For a single unit, there are mainly three sets of pipes: one set for introducing and exiting the heat source fluid, one set for introducing and exiting the cooling fluid, and the remaining set for introducing and exiting the chilled fluid. In a parallel connection, any one set of pipes can be connected in parallel, or all three sets can be connected in parallel separately. In a series connection, any one set of pipes can be connected in series, or all three sets can be connected in series separately.

[0053] In some embodiments, as described above, the adsorption bed 7 may include an adsorption chamber provided with an adsorbent and a heat exchange channel 16 capable of exchanging heat with the adsorbent in the adsorption chamber.

[0054] The evaporation chamber of the evaporator 8 is connected to the second steam inlet corresponding to each of the adsorption beds 7 via a second switching valve 11. This allows the adsorption chamber of a portion of the adsorption bed 7 to be connected to the evaporation chamber while disconnected from the condensation chamber during the adsorption phase. The evaporator 8 also includes a cryogenic fluid channel 17 for heat exchange with the liquid adsorbent in the evaporation chamber. The inlet of the cryogenic fluid channel 17 is connected to a cryogenic fluid return port 6, and the outlet is connected to a cryogenic fluid outlet port 5. This allows the liquid adsorbent remaining in the evaporation chamber to continue evaporating after the gaseous adsorbent is drawn away from the adsorption chamber during the adsorption phase. During evaporation, the cryogenic fluid absorbs heat, resulting in the temperature of the cryogenic fluid outlet port 5 being lower than that of the cryogenic fluid return port 6.

[0055] The first steam inlet of the condenser 9 is connected to the first steam outlet corresponding to each of the adsorption beds 7 via multiple first switching valves 10, so that during the desorption stage of some adsorption beds 7, their adsorption chambers are connected to the condensation chamber, while being disconnected from the evaporation chamber. The condenser 9 is also provided with a cooling fluid channel 18 for heat exchange with the gaseous adsorbent in the condensation chamber. The inlet of the cooling fluid channel 18 is connected to the cooling fluid inlet port 3, and the inlet of the cooling fluid channel 18 is connected to the cooling fluid outlet port 4. This allows the condensation chamber to receive the gaseous adsorbent when it discharges from the adsorption chamber during the desorption stage, and then transfer heat to the cooling fluid in the cooling fluid channel 18, so that the cooling fluid entering the cooling fluid channel 18 is heated and then discharged from the outlet.

[0056] Each of the heat exchange channels 16 has one end optionally connected to the heat source fluid inlet port 1 via a first multi-way valve 12, and the other end optionally connected to the heat source fluid outlet port 2 via a second multi-way valve 13. This allows heat source fluid to be introduced through the first multi-way valve 12 when the corresponding adsorption bed 7 enters the desorption stage, and the heat source fluid releases heat and is then discharged through the second multi-way valve 13.

[0057] Each heat exchange channel 16 has one end optionally connected to the cooling fluid inlet port 3 via a third multi-way valve 14, and the other end optionally connected to the cooling fluid outlet port 4 via a fourth multi-way valve 15. This allows cooling fluid to be introduced through the third multi-way valve 14 when the corresponding adsorption bed 7 enters the adsorption stage, and the cooling fluid releases heat and is then discharged through the fourth multi-way valve 15.

[0058] It should be noted that the heat exchange channel 16 and the cooling fluid channel 18 in the adsorption stage can be connected in series or in parallel.

[0059] The first multi-way valve 12, the second multi-way valve 13, the third multi-way valve 14, and the fourth multi-way valve 15 can all be electric valves, such as three-way valves when there are two adsorption beds 7.

[0060] In some embodiments, the adsorption refrigeration system 1 may be connected in a manner similar to current regenerative cycles, thermal wave cycles, and multi-stage cycles.

[0061] In some embodiments, the system may further include a heat source supply port for supplying heat source fluid to the heat source inlet to enable the unit to operate in a cooling manner; and a control main valve for changing the number of units supplied by the heat source supply port.

[0062] A heat source supply port is generally used to supply heat source fluid from the heat source load to the heat exchange channel. It typically also includes a heat source discharge port, which supplies heat source fluid to the heat source load. In use, the heat source supply port is connected to the heat source channel of the heat source load, and the heat source discharge port is also connected to the aforementioned heat source channel. Fluid flowing from the heat source discharge port enters the heat source channel, where it absorbs heat from the heating element of the heat source load to raise its temperature, and then is discharged back into the heat source supply port.

[0063] The heat source supply port supplies heat source fluid to the heat source inlet to enable the unit to operate in a cooling mode. If heat source fluid is continuously supplied from the heat source supply port to the heat source inlet of the unit, the unit will operate in a continuous cooling mode. Since the adsorption beds need to alternate between desorption and adsorption, at least two adsorption beds are typically installed to allow for alternating desorption and adsorption, thereby achieving continuous heat utilization and ultimately continuous cooling.

[0064] The main control valve is used to change the number of units supplied by the heat source supply port, so that different numbers of units can be selected to operate as needed, such as selecting some or all units to operate. Specifically, when the heat flux supplied by the heat source supply port is relatively large, more units are selected to operate; conversely, when the heat flux supplied by the heat source supply port is relatively small, fewer units are selected to operate. The main control valve can have at least a first control state and a second control state, where the number of units connected to the heat source supply port when the main control valve is in the first control state differs from the number of units connected when the main control valve is in the second control state. Specifically, the main control valve can be a multi-port valve, with its inlet connected to the heat source supply port and its outlet connected to each heat source inlet. The number of outlets connected to the inlet can be adjusted. The main control valve can also include multiple on / off valves, which can be set at each heat source inlet or at the heat source outlet to prevent the heat source fluid from flowing out. The heat source inlets cannot receive the heat source fluid, thus preventing the heat source fluid from entering the unit and preventing the unit from performing adsorption refrigeration.

[0065] Based on the adsorption refrigeration device provided in the above embodiments, the present invention also provides a server liquid cooling system. This server liquid cooling system includes any one of the adsorption refrigeration devices described in the above embodiments, and includes a server liquid cooling device. The heat source fluid inlet of the adsorption refrigeration device is connected to the outlet of the server liquid cooling device. Since this server liquid cooling system uses the adsorption refrigeration device described in the above embodiments, the beneficial effects of this adsorption refrigeration device can be found in the above embodiments.

[0066] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0067] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An adsorption refrigeration device, characterized in that, The device includes an adsorption bed and a condenser arranged side by side in a horizontal direction. The upper part of the condenser is provided with a first steam inlet, and the upper part of the adsorption bed is provided with a first steam outlet. The first steam inlet is connected to the first steam outlet.

2. The adsorption refrigeration device according to claim 1, characterized in that, Multiple adsorption beds are arranged sequentially along the side of the condenser around its vertical center and are connected to the condenser.

3. The adsorption refrigeration device according to claim 1, characterized in that, It also includes a frame and an evaporator, the evaporator and the condenser being arranged on a first side of the frame, and the adsorption bed being arranged on a second side of the frame, the first side and the second side being the two sides of the frame in the horizontal direction, respectively.

4. The adsorption refrigeration device according to claim 3, characterized in that, It includes at least two units arranged side by side in a horizontal direction, the units including the frame and the evaporator, the condenser and the plurality of adsorption beds that are connected to each other to form an adsorption refrigeration system.

5. The adsorption refrigeration device according to claim 4, characterized in that, In the unit: the adsorption bed (7) includes an adsorption chamber provided with adsorbent and a heat exchange channel (16) capable of exchanging heat with the adsorbent in the adsorption chamber; The second steam outlet (8-1) of the evaporator (8) is connected to the second steam inlet corresponding to each adsorption bed (7) through multiple second switching valves (11). The evaporator (8) is also provided with a cryogenic fluid channel (17) for heat exchange with the liquid adsorption working fluid in the evaporation chamber. The inlet end of the cryogenic fluid channel (17) is connected to the cryogenic fluid return interface (6), and the outlet end is connected to the cryogenic fluid outlet interface (5). The first steam inlet (9-1) of the condenser (9) is connected to the first steam outlet (7-1) of each adsorption bed (7) through multiple first switching valves (10). The condenser (9) is also provided with a cooling fluid channel (18) for exchanging heat with the gaseous adsorption working fluid in the condensation chamber. The inlet of the cooling fluid channel (18) is connected to the cooling fluid inlet port (3), and the inlet of the cooling fluid channel (18) is connected to the cooling fluid outlet port (4). One end of each of the heat exchange channels (16) is optionally connected to the heat source fluid inlet interface (1) via a first multi-way valve (12), and the other end of each of the heat exchange channels (16) is optionally connected to the heat source fluid outlet interface (2) via a second multi-way valve (13). One end of each of the heat exchange channels (16) is optionally connected to the cooling fluid inlet port (3) via a third multi-way valve (14), and the other end of each of the heat exchange channels (16) is optionally connected to the cooling fluid outlet port (4) via a fourth multi-way valve (15).

6. The adsorption refrigeration device according to claim 5, characterized in that, It also includes a heat source supply port for supplying heat source fluid to the heat source inlet port so that the unit can operate in cooling mode; A main control valve is used to change the number of units supplied by the heat source supply port.

7. The adsorption refrigeration device according to claim 6, characterized in that, The various generating units are connected in parallel.

8. The adsorption refrigeration device according to claim 4, characterized in that, The first side of each of the aforementioned units is arranged close to each other.

9. The adsorption refrigeration device according to claim 8, characterized in that, Multiple units are arranged around each other, with the center close to the unit.

10. A server liquid cooling system, comprising server liquid cooling equipment, characterized in that, Includes the adsorption refrigeration device as described in any one of claims 1-9, wherein the heat source fluid inlet (1) of the adsorption refrigeration device is connected to the outlet of the server liquid cooling device.

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