An optical module

Abstract

This disclosure provides an optical module with a light emitting component located on the first surface of a circuit board and electrically connected to the circuit board. The circuit board has a recess and signal pads, and a semiconductor cooler is located within the recess. The light emitting component includes a laser chip array, which includes laser chips. A lens array is located in the light emission direction of the laser chip array. A first fiber array is located in the convergence direction of the lens array. The light emitting component includes a first substrate located on the first surface of the circuit board, with the laser chip array disposed above the first substrate. The first substrate has vias, with a first end connected to the laser chip and a second end connected to the signal pads, thereby electrically connecting the laser chip and the signal pads. This disclosure connects the laser chip and the signal pads through the vias of the first substrate, avoiding the routing of signal lines on the first substrate, thereby reducing high-frequency signal reflection loss and ensuring the high-frequency signal integrity of the optical module.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing. Summary of the Invention

[0003] This disclosure provides an optical module that reduces reflection loss of high-frequency signals.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] The circuit board has recessed placement areas and signal pads.

[0006] A light-emitting component is located on the first surface of the circuit board and is electrically connected to the circuit board.

[0007] A semiconductor cooler is located within the recessed area of ​​the object;

[0008] The light emitting component includes:

[0009] A laser chip array, comprising laser chips for emitting optical signals;

[0010] A lens array is located in the light-emitting direction of the laser chip array to focus the optical signal;

[0011] A first fiber optic array is located in the convergence direction of the lens array to transmit optical signals converged by the lens array;

[0012] A first substrate is located on the first surface of the circuit board, and the laser chip array is disposed on top of it; the first substrate has a via, the first end of the via is connected to the laser chip, and the first end of the via is connected to the signal pad, so that the laser chip is electrically connected to the signal pad.

[0013] The above technical solution has the following beneficial effects: This disclosure provides an optical module, including a circuit board, an optical emitting component, and a semiconductor cooler. The optical emitting component is located on the first surface of the circuit board and is electrically connected to the circuit board. The circuit board has a recess and signal pads. The semiconductor cooler is located in the recess to regulate the temperature of the optical module. The optical emitting component includes a laser chip array, which includes laser chips for emitting optical signals. A lens array is located in the light-emitting direction of the laser chip array to converge the optical signals emitted by the laser chip array. A first fiber array is located in the convergence direction of the lens array to transmit the optical signals converged by the lens array. The optical emitting component includes a first substrate, which is located on the first surface of the circuit board. The laser chip array is disposed above the first substrate. The first substrate has vias, with a first end connected to the laser chip and a second end connected to the signal pads, so that the laser chip and the signal pads are electrically connected. This disclosure connects the laser chip and the signal pads through the vias of the first substrate, which avoids routing signal lines on the first substrate, thereby reducing the reflection loss of high-frequency signals and ensuring the high-frequency signal integrity of the optical module.

[0014] In some embodiments, an optical module is provided, wherein the placement recess is a placement through hole, the first substrate covers the placement through hole, and the signal pad is located on the upper surface of the sidewall of the placement through hole.

[0015] The above technical solution has the following beneficial effects: the recessed area can be a through-hole, and the first substrate covers the through-hole, so that the first substrate can be connected to the circuit board around the through-hole, thereby improving the connection stability between the first substrate and the circuit board. The signal pad is located on the upper surface of the side wall of the through-hole, which facilitates the first substrate to cover the signal pad and also prevents the signal pad from being directly above the thermoelectric cooler, thus preventing the via and laser chip located directly above the signal pad from being directly above the thermoelectric cooler.

[0016] In some embodiments, an optical module is provided, wherein the recess is a storage groove, the opening of the storage groove faces away from the light emitting component; the signal pad is located in the projection area of ​​the sidewall of the storage groove on the first surface of the circuit board, or the signal pad is located on the outer surface of the bottom of the storage groove.

[0017] The above technical solution has the following beneficial effects: The recessed area can be a storage groove, with its opening facing away from the light-emitting component, thus separating the thermoelectric cooler inside the groove from the first substrate, facilitating the placement of the first substrate on the circuit board. The signal pad can be located in the projection area of ​​the sidewall of the storage groove onto the first surface of the circuit board, allowing the first substrate to cover the signal pad and ensuring that the signal pad is not directly above the thermoelectric cooler, thus preventing vias and laser chips located directly above the signal pad from being directly above the thermoelectric cooler. The signal pad can be located on the outer surface of the bottom of the storage groove, facilitating the first substrate to cover the signal pad and allowing the signal pad to be directly above the thermoelectric cooler, thus improving heat dissipation efficiency.

[0018] In some embodiments, an optical module is provided, wherein the placement recess is a placement through hole, and the top of the semiconductor cooler is connected to the bottom surface of the first substrate;

[0019] Alternatively, the recessed area can be a storage groove, with the top of the thermoelectric cooler connected to the inner surface of the bottom of the storage groove.

[0020] The above technical solution has the following beneficial effects: the recessed area is a through hole for placing objects, and the semiconductor cooler can be directly connected to the bottom surface of the first substrate, so that the semiconductor cooler can directly adjust the temperature of the first substrate.

[0021] Alternatively, the recessed area can be a storage slot, with the semiconductor cooler connected to the inner surface of the bottom of the storage slot. The semiconductor cooler inside the storage slot is separated from the first substrate by a circuit board to facilitate the placement of the first substrate.

[0022] In some embodiments, an optical module is provided, wherein the first substrate includes:

[0023] The first bearing part includes:

[0024] The first bearing surface is used to support the laser chip array;

[0025] The connecting surface has one end connected to the first bearing surface;

[0026] The via;

[0027] The second bearing component includes:

[0028] The second bearing surface is connected to the other end of the connecting surface and is used to support the lens array; the first bearing surface and the second bearing surface have a height difference.

[0029] The above technical solution has the following beneficial effects: The first substrate includes a first carrier portion and a second carrier portion, which are connected to each other. The first carrier portion includes a first carrier surface for carrying the laser chip. The first carrier portion includes a via located below the laser chip to allow the laser chip to be wire-connected to the via. The first carrier portion includes a connecting surface, one end of which is connected to the first carrier surface. The second carrier portion includes a second carrier surface, the other end of which is connected to the connecting surface to connect the first and second carrier portions. The second carrier surface is used to carry a lens array, and there is a height difference between the first and second carrier surfaces to ensure that the light outlet of the laser chip coincides with the central axis of the lens array.

[0030] In some embodiments, an optical module is provided in which the laser chip is located directly above the via and the signal pad is located directly below the via.

[0031] The above technical solution has the following beneficial effects: The laser chip is wire-connected to the via, with the laser chip directly above the via, thus shortening the wire bonding distance between the laser chip and the via. The signal pad is located directly below the via, further shortening the connection distance between the signal pad and the via. The laser chip is positioned directly above the via, and the signal pad is located directly below the via, allowing the signal pad to be positioned directly below the laser chip, thereby shortening the length of the via and further reducing high-frequency signal reflection loss.

[0032] In some embodiments, an optical module is provided, the lens array comprising:

[0033] The first lens array is located in the light emission direction of the laser chip array and is located on the first substrate;

[0034] The light emitting component also includes:

[0035] The second substrate supports and connects to the first optical fiber array.

[0036] The above technical solution has the following beneficial effects: The lens array includes a first lens array located on a first substrate and positioned in the light-emitting direction of the laser chip array to converge the light signal emitted by the laser chip array. The light-emitting component also includes a second substrate, which supports and connects to the first fiber optic array. The first substrate supporting and connecting to the first lens array, and the second substrate supporting and connecting to the first fiber optic array, not only allow the light inlet of the first fiber optic array, the central axis of the first lens array, and the light outlet of the laser chip array to coincide, thereby enabling the first fiber optic array to receive the light signal converged by the first lens array; it also reduces the length of the first substrate, thus reducing deformation of the first substrate.

[0037] In some embodiments, an optical module is provided, the lens array comprising:

[0038] The first lens array is located in the light-emitting direction of the laser chip array;

[0039] A second lens array is disposed on the first substrate and located between the laser chip array and the first lens array to collimate the light signal emitted by the laser chip array.

[0040] The light emitting component also includes:

[0041] The second substrate supports and connects the first lens array and the first fiber array.

[0042] The above technical solution has the following beneficial effects: The lens array includes a first lens array and a second lens array. The first lens array is located in the light-emitting direction of the laser chip array to converge the light signal emitted by the laser chip array. The second lens array is disposed on the first substrate and is located between the laser chip array and the first lens array to collimate the light signal emitted by the laser chip array. The light-emitting component also includes a second substrate, which supports and connects the first lens array and the first fiber array. The first substrate supporting and connecting the second lens array, and the second substrate supporting and connecting the first lens array and the first fiber array, not only allows the light inlet of the first fiber array, the central axis of the first lens array, and the light outlet of the laser chip array to coincide, thereby enabling the first fiber array to receive the light signal converged by the first lens array; it also reduces the length of the first substrate, thus reducing the deformation of the first substrate.

[0043] In some embodiments, an optical module is provided, wherein the first substrate is provided with:

[0044] A temperature sensing component is located on one side of the laser chip array to monitor the temperature of the laser chip array.

[0045] The above technical solution has the following beneficial effects: A temperature sensing component is disposed on the first substrate, located on one side of the laser chip array, and is used to sense the temperature of the laser chip array. The temperature sensing component can be connected to an MCU, so that the MCU can determine the temperature of the laser chip array based on the resistance value of the temperature sensing component, and thus the MCU can control the output current of the drive circuit based on the temperature of the laser chip array, thereby realizing the heating or cooling of the semiconductor cooler.

[0046] In some embodiments, an optical module is provided, wherein the first substrate is a silicon substrate.

[0047] The above technical solution has the following beneficial effects: The first substrate is a silicon substrate, which can be etched not only to form vias, but also to form terminating resistors and matching capacitors. The terminating resistors can be wire-connected to the laser chip to reduce high-frequency signal reflection caused by impedance discontinuities. The matching capacitors are connected to the terminating resistors to reduce power consumption. Attached Figure Description

[0048] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments;

[0050] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0051] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0052] Figure 4 An exploded view of an optical module according to some embodiments;

[0053] Figure 5 This is an internal structural diagram of an optical module according to some embodiments;

[0054] Figure 6 This is an internal structural diagram of an optical module provided according to some embodiments, viewed from another perspective.

[0055] Figure 7 This is an exploded view of the internal structure of an optical module according to some embodiments;

[0056] Figure 8a A cross-sectional view of a first type of circuit board provided according to some embodiments;

[0057] Figure 8b A cross-sectional view of a second type of circuit board provided according to some embodiments;

[0058] Figure 8c This is a cross-sectional view of a third type of circuit board provided according to some embodiments;

[0059] Figure 9 This is an exploded view of the internal structure of another optical module provided according to some embodiments;

[0060] Figure 10This is a partial view of the internal structure of an optical module according to some embodiments;

[0061] Figure 11 This is a partially exploded view of the internal structure of an optical module according to some embodiments;

[0062] Figure 12a This is a structural diagram of a first substrate provided according to some embodiments;

[0063] Figure 12b This is a structural diagram of a first substrate provided according to some embodiments, viewed from another perspective.

[0064] Figure 13 This is a partial view of the internal structure of an optical module according to some embodiments, viewed from another perspective.

[0065] Figure 14 This is a cross-sectional view of the internal structure of an optical module according to some embodiments;

[0066] Figure 15 This is a partial view of the internal structure of another optical module provided according to some embodiments, from another perspective;

[0067] Figure 16a A cross-sectional view of the internal structure of another optical module according to some embodiments. Figure 1 ;

[0068] Figure 16b A cross-sectional view of the internal structure of another optical module according to some embodiments. Figure 2 . Detailed Implementation

[0069] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure are within the scope of protection of this disclosure.

[0070] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0071] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0072] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0073] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0074] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0075] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0076] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0077] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0078] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0079] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0080] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0081] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0082] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0083] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0084] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0085] Figure 2 This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0086] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0087] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0088] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0089] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0090] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0091] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0092] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0093] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0094] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0095] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0096] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0097] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0098] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0099] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0100] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0101] In some implementations, the gold fingers are located on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers are set on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is large.

[0102] In some implementations, the gold fingers of the circuit board extend from the electrical port and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0103] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0104] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0105] In some embodiments, the optical module includes a light emitting component 400, such as... Figure 3 and Figure 4 As shown. The light emitting component 400 is used to emit light signals.

[0106] In some embodiments, the optical module includes an optical receiving component 500, such as... Figure 3 and Figure 4 As shown. The optical receiving unit 500 is used to receive optical signals and convert them into electrical signals.

[0107] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold fingers.

[0108] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0109] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0110] In some embodiments, the laser chip of the light emitting component 400 can be placed on an adapter substrate. The adapter substrate is provided with signal lines. One end of the laser chip is connected to one end of the signal line via a first gold wire bonding, and the other end of the signal line is connected to the circuit board 300 via a second gold wire bonding. Since neither the first nor the second gold wire is located on the surface of the adapter substrate, but is suspended in air or a vacuum, and the material of the adapter substrate has a different dielectric constant than that of air or a vacuum, the impedances of the first and second gold wires and the signal line are different, resulting in increased reflection loss of high-frequency signals and affecting the high-frequency signal integrity of the optical module.

[0111] To address this issue, in some embodiments, the laser chip can be placed on a first substrate. The first substrate has vias, with one end of the via connected to the laser chip and the other end connected to a circuit board, allowing the laser chip and circuit board to be electrically connected via the vias. This via-connection avoids routing signal lines on the first substrate, thereby reducing high-frequency signal reflection loss and ensuring the high-frequency signal integrity of the optical module.

[0112] Figure 5 This is an internal structural diagram of an optical module according to some embodiments. Figure 6 This is a diagram of the internal structure of an optical module according to some embodiments, viewed from another perspective. Figure 5 and Figure 6 As shown, in some embodiments, the light emitting component 400 may be placed on the surface of the circuit board 300.

[0113] In some embodiments, the light receiving component 500 may be placed on the surface of the circuit board 300.

[0114] In some embodiments, the light emitting component 400 and the light receiving component 500 may be placed on the same surface of the circuit board 300. For example, the light emitting component 400 and the light receiving component 500 may be placed on a first surface of the circuit board 300, namely the upper surface of the circuit board 300.

[0115] In some embodiments, the light emitting component 400 and the light receiving component 500 may be placed on different surfaces of the circuit board 300. For example, the light emitting component 400 may be placed on a first surface of the circuit board 300, and the light receiving component 500 may be placed on a second surface of the circuit board 300, i.e., the lower surface of the circuit board 300.

[0116] In some embodiments, the circuit board 300 may have a recess 310. A thermoelectric cooler 900 may be placed in the recess 310. The thermoelectric cooler 900 can control the temperature of the optical module within a target temperature range.

[0117] The thermoelectric cooler 900 may include a first electrode post and a second electrode post, both of which are connected to the output terminal of a driving circuit, enabling the driving circuit to provide operating current to the thermoelectric cooler. The driving circuit provides operating current to the thermoelectric cooler to heat or cool it, thereby controlling the temperature of the optical module within a target temperature range.

[0118] The MCU can be connected to the drive circuit so that the MCU can control the output current of the drive circuit, thereby achieving heating or cooling of the semiconductor cooler, and thus enabling the temperature of the optical module to be controlled within the target temperature range.

[0119] Figure 7 This is an exploded view of the internal structure of an optical module according to some embodiments. Figure 8a This is a cross-sectional view of a first type of circuit board provided according to some embodiments. For example... Figure 7 and Figure 8a As shown, in some embodiments, a signal pad array 320 may be provided on the surface of the circuit board 300. The signal pad array 320 may include signal pads 321. The signal pad array 320 and the light emitting component 400 may be located on the same surface of the circuit board 300 to facilitate electrical connection between the signal pad array 320 and the light emitting component 400. For example, the signal pad array 320 and the light emitting component 400 may be located on the upper surface of the circuit board 300.

[0120] In some embodiments, the placement recess 310 may be a placement through-hole 312. The placement through-hole 312 may extend from one surface of the circuit board 300 to the other surface of the circuit board 300, so that the placement through-hole 312 can penetrate the circuit board 300. The signal pad array 320 may be located on the upper surface of the sidewall of the placement through-hole 312, so that the signal pad array 320 is not located directly above the thermoelectric cooler 900 within the placement through-hole 312, that is, the signal pad array 320 and the thermoelectric cooler 900 are offset along the height direction of the optical module.

[0121] Figure 8b This is a cross-sectional view of a second type of circuit board provided according to some embodiments. Figure 8c This is a cross-sectional view of a third type of circuit board provided according to some embodiments. Figure 9 This is an exploded view of the internal structure of another optical module according to some embodiments. For example... Figure 8b , Figure 8c and Figure 9 As shown, in some embodiments, the recess 310 may be a slot 311. The slot 311 may extend from one surface of the circuit board 300 to the other surface of the circuit board 300 but not to the other surface of the circuit board, so that the slot 311 does not penetrate the circuit board 300. For example, the slot 311 may extend from the lower surface of the circuit board 300 to the upper surface of the circuit board 300 but not to the upper surface of the circuit board 300, that is, the opening of the slot 311 faces away from the light emitting member 400 located on the upper surface of the circuit board 300.

[0122] In some embodiments, the signal pad array 320 may be located in the projection area of ​​the sidewall of the storage slot 311 onto the upper surface of the circuit board 300, so that the signal pad array 320 is not located directly above the thermoelectric cooler 900 in the storage slot 311, that is, the signal pad array 320 and the thermoelectric cooler 900 are offset along the height direction of the optical module.

[0123] In some embodiments, the signal pad array 320 may be located on the outer surface of the bottom of the storage slot 311, so that the signal pad array 320 may be located directly above the thermoelectric cooler 900 inside the storage slot 311.

[0124] Figure 10 This is a partial view of the internal structure of an optical module according to some embodiments. Figure 11 This is a partially exploded view of the internal structure of an optical module according to some embodiments. Figure 10 and Figure 11As shown, in some embodiments, the light emitting component 400 may include a first substrate 410. The first substrate 410 may be disposed on the surface of the circuit board 300 and electrically connected to the signal pad array 320 on the circuit board 300. For example, the first substrate 410 may be disposed on the upper surface of the circuit board 300.

[0125] The placement recess 310 for placing the semiconductor cooler 900 is a placement through hole 312, and the bottom surface of the first substrate 410 can be connected to the top of the semiconductor cooler 900.

[0126] The placement recess 310 for placing the semiconductor cooler 900 is a placement through hole 312. The first substrate 410 can cover the placement through hole 312 so that the first substrate 410 can be connected to the circuit board 300 around the placement through hole 312, thereby improving the connection stability between the first substrate 410 and the circuit board 300.

[0127] The recess 310 for placing the thermoelectric cooler 900 is a storage slot 311. The opening of the storage slot 311 faces away from the light emitting component 400, so that the thermoelectric cooler 900 in the storage slot 311 is separated from the first substrate 410. The first substrate 410 can be placed at any position in the projection area of ​​the light emitting component 400 on the circuit board 300, which facilitates the placement of the first substrate 410 on the circuit board 300. For example, the first substrate 410 may not cover the storage slot 311.

[0128] In some embodiments, the light emitting component 400 may include a laser chip array 420. The laser chip array 420 may be disposed on a first substrate 410. The laser chip array 420 may be electrically connected to the first substrate 410 so that it is electrically connected to a signal pad array 320 on the circuit board 300. The laser chip array 420 may include a laser chip 421, which can emit one optical signal. For example, the laser chip array 420 may include eight laser chips arranged side-by-side along the width of the circuit board to emit eight optical signals. The laser chips may be 100G EML laser chips; one 100G EML laser chip emits a 100G optical signal of one wavelength according to a high-frequency drive signal, so that the laser chip array 420 emits eight 100G optical signals.

[0129] In some embodiments, the light emitting component 400 may include a lens array 430. The lens array 430 may be disposed on the first substrate 410. The lens array 430 may couple the optical signal emitted by the laser chip array 420.

[0130] In some embodiments, the lens array 430 may include a first lens array 432. The first lens array 432 may be a converging lens array, capable of converging optical signals. The first lens array 432 may be located in the light emission direction of the laser chip array 420.

[0131] The first lens array 432 may include first lenses 4321 to converge at least one optical signal. For example, the first lens array 432 includes eight first lenses 4321 arranged side-by-side along the width of the circuit board to converge eight optical signals. The converging lens has a light-transmitting surface, through which the optical signals are converged.

[0132] The number of first lens arrays 432 is the same as the number of laser chip arrays 420, so that the laser chips of the laser chip array 420 correspond one-to-one with the first lenses 4321 of the first lens array 432.

[0133] In some embodiments, the lens array 430 may include a second lens array 431. The second lens array 431 may be located between the laser chip array 420 and the first lens array 432. The second lens array 431 may be a collimating lens array, capable of collimating the optical signal. The second lens array 431 may be located in the light emission direction of the laser chip array 420 to collimate the optical signal emitted by the laser chip array 420.

[0134] The second lens array 431 may include second lenses 4311 to collimate at least one optical signal. For example, the second lens array 431 includes eight second lenses 4311 arranged side-by-side along the width of the circuit board to collimate eight optical signals. The collimating lens has a light-transmitting surface, through which the optical signal passes and is collimated.

[0135] The number of the second lens array 431 is the same as the number of the first lens array 432, so that the first lens 4321 of the second lens array 431 corresponds one-to-one with the second lens 4311 of the first lens array 432.

[0136] Since the optical signal between the first lens array 432 and the second lens array 431 is collimated light, the distance between them can be short or long, facilitating the placement of more components. This flexibility not only increases the tolerance of the emitted optical path, making it more tolerant of changes in the position and angle of the components, but also improves the stability of the emitted optical path.

[0137] In some embodiments, the light emitting component 400 may include an isolator array 440. The isolator array 440 may be disposed on the first substrate 410. The isolator array 440 may prevent the optical signal from returning to the laser chip array 420 via the original path.

[0138] The isolator array 440 may include at least one isolator to prevent at least one optical signal from returning to the laser chip array 420 via its original path. For example, the isolator array 440 includes eight isolators arranged side by side along the width of the circuit board to prevent eight optical signals from returning to the laser chip array 420 via their original path.

[0139] The number of isolator arrays 440 is the same as the number of lens arrays 430, so that the isolators of isolator array 440 correspond one-to-one with the lenses of lens array 430.

[0140] In some embodiments, the light emitting component 400 may include a first fiber array 450. The first fiber array 450 may be disposed on a first substrate 410. The first fiber array 450 may include a first fiber 451. The first fiber array 450 may be located in the convergence direction of the first lens array 432, so that the end face of the fiber of the first fiber array 450 may be located at the focal point of the first lens array 432, thereby enabling the first fiber 451 of the first fiber array 450 to receive optical signals.

[0141] In some embodiments, the light emitting component 400 may include a second substrate 460. The second substrate 460 may be disposed on the surface of the circuit board 300. The second substrate 460 and the first substrate 410 jointly support the optical device of the light emitting component 400 to reduce the deformation caused by the excessive size of the first substrate 410, thereby ensuring the optical path stability of the light signal emitted by the light emitting component 400.

[0142] In some embodiments, the laser chip array 420 can be disposed on the first substrate 410, and the isolator array 440 and the first fiber array 450 can both be disposed on the second substrate 460, so that the light output port of the laser chip array 420, the central axis of the isolator array 440 and the light input port of the first fiber array 450 coincide, thereby enabling the first fiber array to receive the optical signal emitted by the laser chip array 420; the length of the first substrate can also be reduced, thereby reducing the deformation of the first substrate.

[0143] When the lens array 430 includes only the first lens array 432, the first lens array 432 can be located between the laser chip array 420 and the isolator array 440. The first lens array 432 can be disposed on the first substrate 410 so that the light outlet of the laser chip array 420, the central axis of the first lens array 432, the central axis of the isolator array 440, and the light inlet of the first fiber array 450 coincide.

[0144] When the lens array 430 includes a first lens array 432 and a second lens array 431, the isolator array 440 can be located between the first lens array 432 and the second lens array 431. The second lens array 431 can be disposed on the first substrate 410, and the first lens array 432 can be disposed on the second substrate 460, so that the light outlet of the laser chip array 420, the central axis of the first lens array 432, the central axis of the isolator array 440, the central axis of the second lens array 431, and the light inlet of the first fiber array 450 coincide.

[0145] The optical transmission path is as follows: the laser chip array 420 emits 8 optical signals, the 8 optical signals are collimated by the second lens array 432, the collimated 8 optical signals are converged by the first lens array 431, pass through the isolator array 440, and converge to the first fiber array 450.

[0146] In some embodiments, the light emitting component 400 may include a temperature sensing component 470. The temperature sensing component 470 may be placed on the first substrate 410. The temperature sensing component 470 may be located around the laser chip array 420. The temperature sensing component 470 may be used to monitor the temperature around the laser chip array 420 and identify the temperature around the laser chip array 420 as the temperature of the laser chip array 420, thereby achieving temperature monitoring of the laser chip array 420.

[0147] The temperature sensing component 470 may include a temperature sensing element and a support substrate. The thermistor is placed on the support substrate, which may be placed on the first substrate 410. The temperature sensing element is a temperature-sensitive component whose resistance value changes with temperature. Therefore, the temperature around the temperature sensing element can be determined by the resistance value of the temperature sensing element.

[0148] The temperature sensing element can be connected to the MCU, so that the MCU can determine the temperature around the temperature sensing element based on the resistance value of the temperature sensing element. In turn, the MCU can control the output current of the drive circuit based on the temperature around the temperature sensing element, thereby realizing the heating or cooling of the semiconductor cooler.

[0149] In some embodiments, the optical receiving component 500 may include a second fiber array 510. The end face of the second fiber array 510 is an inclined surface so that the optical signal within the second fiber array 510 can be reflected downwards through the end face.

[0150] The optical receiving component 500 may include an optical receiving chip array 520. The optical receiving chip array 520 may be located below the second fiber array 510 to receive optical signals reflected from the end face of the second fiber array 510 and convert the received optical signals into high-frequency current signals.

[0151] The optical receiver 500 may include a transimpedance amplifier chip 530. The transimpedance amplifier chip 530 may be wire-connected to the optical receiver chip array 520 to convert high-frequency current signals into high-frequency voltage signals.

[0152] In some embodiments, the optical receiver chip array 520 may be placed above the transimpedance amplifier chip 530 and electrically connected to the transimpedance amplifier chip 530.

[0153] In some embodiments, the optical receiver chip array 520 may be placed around the transimpedance amplifier chip 530 and electrically connected to the transimpedance amplifier chip 530.

[0154] Figure 12a This is a structural diagram of a first substrate provided according to some embodiments. Figure 12b This is a structural diagram of a first substrate provided according to some embodiments, viewed from another perspective. Figure 12a and Figure 12b As shown, in some embodiments, the first substrate 410 may include a first support portion 411. The first support portion 411 may include a via array. The via array may include vias 4113. The vias 4113 extend from the upper surface of the first support portion 411 to the lower surface of the first support portion 411 and extend to the lower surface of the first support portion 411, so that the vias 4113 can penetrate the first support portion 411.

[0155] One end of via 4113 can be connected to laser chip 421. For example, one end of via 4113 can be connected to laser chip 421 via wire bonding.

[0156] In some embodiments, the laser chip 421 may be located directly above the via 4113 to shorten the wire bonding distance between the laser chip 421 and the via 4113.

[0157] The other end of via 4113 can be connected to signal pad 321. For example, the other end of via 4113 and signal pad 321 can be connected by soldering.

[0158] In some embodiments, the signal pad 321 may be located directly below the via 4113 to shorten the connection distance between the signal pad 321 and the via 4113. The laser chip 421 is located directly above the via 4113, and the signal pad 321 is located directly below the via 4113, so that the signal pad 321 can be located directly below the laser chip 421, thereby shortening the length of the via 4113 and further reducing the reflection loss of high-frequency signals.

[0159] In some embodiments, the first substrate 410 may be a ceramic substrate. The vias 4113 on the ceramic substrate can only be formed by laser drilling, resulting in low positional accuracy of the vias 4113.

[0160] In some embodiments, the first substrate 410 may be a silicon substrate. Vias 4113 on the silicon substrate can be formed by semiconductor etching to ensure the positional accuracy of the vias 4113. Additionally, terminating resistors and matching capacitors can be formed on the silicon substrate by semiconductor etching. The terminating resistors can be wire-connected to the laser chip to reduce high-frequency signal reflections caused by impedance discontinuities. The matching capacitors are connected to the terminating resistors to reduce power consumption.

[0161] In some embodiments, the first substrate 410 may include a first support portion 411. The first support portion 411 may include a first support surface 4111, which is used to support the laser chip array 420. The first support portion 411 may include a connecting surface 4112. One end of the connecting surface 4112 may be connected to the first support surface 4111.

[0162] In some embodiments, the first substrate 410 may include a second support portion 412. The second support portion 412 may include a second support surface 4121. The second support surface 4121 may be connected to the other end of the connecting surface 4112. The second support surface 4121 may support the lens array 430. For example, when the lens array 430 includes only the first lens array 432, the second support surface 4121 may support the first lens array 432. When the lens array 430 includes the first lens array 432 and the second lens array 431, the second support surface 4121 may support the second lens array 431.

[0163] The lower surface of the first support portion 411 and the lower surface of the second support portion 412 can form a bottom surface 413. The bottom surface 413 can be connected to the upper surface of the circuit board 300. The bottom surface 413 can be connected to the top of the semiconductor cooler 900.

[0164] In some embodiments, the first bearing surface 4111 and the second bearing surface 4121 have a height difference so that the central axis of the lens array 430 coincides with the light output port of the laser chip array 420, so that the light signal emitted by the laser chip array 420 is converged by the lens array 430.

[0165] Figure 13 This is a partial view of the internal structure of an optical module provided according to some embodiments, viewed from another perspective. Figure 14 This is a cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 13 and Figure 14 As shown, in some embodiments, the semiconductor cooler 900 may be located within the storage through-hole 312, and the first substrate 410 may cover the storage through-hole 312 and the signal pads 321 on the circuit board 300.

[0166] The semiconductor cooler 900 can be located inside the storage through hole 312, and the bottom surface 413 of the first substrate 410 can be connected to the top of the semiconductor cooler 900 and the upper surface of the circuit board 300.

[0167] The semiconductor cooler 900 can be located inside the storage via 312. The via 4113 of the first substrate 410 and the laser chip 421 can both be located directly above the sidewall of the storage via 312. The signal pad 321 can be located on the sidewall of the storage via 312 so that the laser chip 421 is not located directly above the semiconductor cooler 900. This allows the heat generated by the laser chip 421 to be conducted through the upper surface of the first substrate 410 to the lower surface of the first substrate 410, and then from one end of the lower surface of the first substrate 410 to the other end of the lower surface of the first substrate 410, and finally to the semiconductor cooler 900.

[0168] Figure 15 This is a partial view of the internal structure of another optical module provided according to some embodiments, viewed from another perspective. Figure 16a A cross-sectional view of the internal structure of another optical module according to some embodiments. Figure 1 . Figure 16b A cross-sectional view of the internal structure of another optical module according to some embodiments. Figure 2 .like Figure 15 , Figure 16a and Figure 16b As shown, in some embodiments, the semiconductor cooler 900 may be located in the storage slot 311, and the first substrate 410 may not cover the storage slot 311 but may cover the signal pads 321 on the circuit board 300.

[0169] The semiconductor cooler 900 can be located in the storage slot 311, and the bottom surface 413 of the first substrate 410 is no longer connected to the top of the semiconductor cooler 900, but can only be connected to the upper surface of the circuit board 300.

[0170] In some embodiments, the thermoelectric cooler 900 may be located in the storage slot 311. The via 4113 of the first substrate 410 and the laser chip 421 may both be located directly above the projection area of ​​the sidewall of the storage slot 311 on the upper surface of the circuit board 300. The signal pad 321 may be located on the projection area of ​​the sidewall of the storage slot 311 on the upper surface of the circuit board 300, so that the laser chip 421 is not located directly above the thermoelectric cooler 900. This allows the heat generated by the laser chip 421 to be conducted through the upper surface of the first substrate 410 to the lower surface of the first substrate 410, and then from one end of the lower surface of the first substrate 410 to the other end of the lower surface of the first substrate 410, and finally to the thermoelectric cooler 900.

[0171] In some embodiments, the semiconductor cooler 900 may be located within the storage slot 311. The via 4113 of the first substrate 410 and the laser chip 421 may both be located directly above the outer surface of the bottom of the storage slot 311. The signal pad 321 may be located on the outer surface of the bottom of the storage slot 311, so that the laser chip 421 is located directly above the semiconductor cooler 900. This allows the heat generated by the laser chip 421 to be conducted through the upper surface of the first substrate 410 to the lower surface of the first substrate 410, and then through one end of the lower surface of the first substrate 410 to the semiconductor cooler 900, thereby improving heat dissipation efficiency.

[0172] like Figure 14 , Figure 16a and Figure 16b As shown, one end of the via 4113 of the first substrate 410 is connected to the laser chip 421, and the other end of the via 4113 of the first substrate 410 is connected to the signal pad 321, so that the laser chip 421 and the signal pad 321 are electrically connected through the via 4113 of the first substrate 410.

[0173] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, characterized in that, include: The circuit board has recessed placement areas and signal pads. A light-emitting component is located on the first surface of the circuit board and is electrically connected to the circuit board. A semiconductor cooler is located within the recessed area of ​​the object; The light emitting component includes: A laser chip array, comprising laser chips for emitting optical signals; A lens array is located in the light-emitting direction of the laser chip array to focus the optical signal; A first fiber optic array is located in the convergence direction of the lens array to transmit optical signals converged by the lens array; A first substrate is located on the first surface of the circuit board, and the laser chip is disposed on top of it; the first substrate has a via, the first end of the via is connected to the laser chip, and the first end of the via is connected to the signal pad, so that the laser chip is electrically connected to the signal pad.

2. The optical module according to claim 1, characterized in that, The placement recess is a placement through hole, the first substrate covers the placement through hole, and the signal pad is located on the upper surface of the side wall of the placement through hole.

3. The optical module according to claim 1, characterized in that, The recessed area is a storage groove, and the opening of the storage groove faces away from the light emitting component; the signal pad is located in the projection area of ​​the sidewall of the storage groove on the first surface of the circuit board, or the signal pad is located on the outer surface of the bottom of the storage groove.

4. The optical module according to claim 1, characterized in that, The recessed area is a through hole for placing objects, and the top of the semiconductor cooler is connected to the bottom surface of the first substrate; Alternatively, the recessed area can be a storage groove, with the top of the thermoelectric cooler connected to the inner surface of the bottom of the storage groove.

5. The optical module according to claim 1, characterized in that, The first substrate includes: The first bearing part includes: The first bearing surface is used to support the laser chip array; The connecting surface has one end connected to the first bearing surface; The via; The second bearing component includes: The second bearing surface is connected to the other end of the connecting surface and is used to support the lens array; the first bearing surface and the second bearing surface have a height difference.

6. The optical module according to claim 1, characterized in that, The laser chip is located directly above the via, and the signal pad is located directly below the via.

7. The optical module according to claim 1, characterized in that, The lens array includes: The first lens array is located in the light emission direction of the laser chip array and is located on the first substrate; The light emitting component also includes: The second substrate supports and connects to the first optical fiber array.

8. The optical module according to claim 1, characterized in that, The lens array further includes: The first lens array is located in the light-emitting direction of the laser chip array; A second lens array is disposed on the first substrate and located between the laser chip array and the first lens array to collimate the light signal emitted by the laser chip array. The light emitting component also includes: The second substrate supports and connects the first lens array and the first fiber array.

9. The optical module according to claim 1, characterized in that, The first substrate is provided with: A temperature sensing component is located on one side of the laser chip array to monitor the temperature of the laser chip array.

10. The optical module according to claim 1, characterized in that, The first substrate is a silicon substrate.

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