Electronic device

Abstract

This application provides an electronic device. The electronic device's housing has a first sound channel. A microphone has a first surface with a first pickup hole. The microphone is mounted on a motherboard, with the first surface and the first pickup hole facing the housing. An auxiliary seal has a first through hole. The auxiliary seal connects to and covers the microphone surface facing away from the motherboard, and the outer peripheral surface of the auxiliary seal protrudes beyond or is flush with the outer peripheral edge of the first surface. The auxiliary seal surrounds the first pickup hole and seals its outer periphery, and the first through hole communicates with the first pickup hole. The first seal has a second through hole. The first seal is located on the side of the auxiliary seal facing away from the microphone and is sealed to the auxiliary seal, and the first seal is sealed to the housing. The second through hole communicates with the first through hole and the first sound channel. The electronic device provided by this application can solve the technical problem of low motherboard utilization in existing electronic devices.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and more particularly to an electronic device. Background Technology

[0002] With the development of technology, electronic devices (such as mobile phones, tablets, and watches) have become indispensable tools in people's daily lives. Electronic devices typically rely on microphones (also called pickups) to achieve voice communication. To ensure good recording quality, microphones usually need to be sealed. However, in current technology, the sealed structure of the microphone occupies a significant amount of motherboard space, resulting in low motherboard utilization. Summary of the Invention

[0003] This application provides an electronic device that solves the technical problem in the prior art where the sealing structure of the microphone occupies a large space on the motherboard, resulting in low motherboard utilization.

[0004] To address the above problems, this application provides an electronic device. The electronic device includes a mid-frame, a housing, a motherboard, a microphone, an auxiliary seal, and a first seal. The housing has a first sound passage communicating with the outside of the electronic device. The housing is fixedly connected to the mid-frame, forming a receiving cavity. The motherboard is disposed within the receiving cavity and fixedly connected to the mid-frame. The microphone includes a first surface with a first pickup hole. The microphone is disposed on the motherboard, with the first surface facing the housing and the first pickup hole facing the housing. The auxiliary seal has a first through hole that penetrates the auxiliary seal along its thickness direction. The auxiliary seal connects to and covers the first surface, and the outer peripheral surface of the auxiliary seal protrudes beyond the outer periphery of the first surface of the microphone, or the outer peripheral surface of the auxiliary seal is flush with the outer periphery of the first surface. The auxiliary seal surrounds the first pickup hole and seals its outer periphery, and the first through hole communicates with the first pickup hole. The first seal has a second through hole that penetrates the first seal along its thickness direction. The first sealing element is disposed on the side of the auxiliary sealing element facing away from the microphone and is sealed to the auxiliary sealing element. The first sealing element is also sealed to the housing. The second through hole communicates with the first through hole and the first sound channel.

[0005] The first sound passage, the first through hole, the second through hole, and the first pickup hole are sequentially connected and communicate with the outside world of the electronic device. External sound enters the second through hole through the first sound passage, then enters the first through hole through the second through hole, and then enters the microphone through the first pickup hole, causing the vibrating element in the microphone to vibrate. The microphone then converts the vibration signal into an electrical signal and transmits it to the motherboard, thereby realizing the microphone's sound pickup function.

[0006] In this embodiment, by providing an auxiliary seal between the microphone and the housing, and sealing the auxiliary seal to the housing via a first seal, the microphone can be sealed without occupying space on the motherboard, thus improving motherboard utilization. Furthermore, in this embodiment, by connecting and covering the first surface of the microphone with the auxiliary seal, and setting the outer peripheral surface of the auxiliary seal to protrude from or be flush with the outer peripheral edge of the first surface (i.e., setting the surface area of ​​the auxiliary seal to be greater than or equal to the area of ​​the first surface of the microphone), and placing the first seal between the auxiliary seal and the housing to achieve a seal, the sealing area can be increased, improving the microphone's sealing effect, thereby enhancing the microphone's sound pickup performance and simplifying the microphone sealing process.

[0007] In one possible implementation, the area of ​​the surface of the first seal facing the auxiliary seal is greater than or equal to the area of ​​the first surface.

[0008] In this embodiment, by setting the area of ​​the surface of the first seal facing the auxiliary seal to be greater than or equal to the area of ​​the surface of the microphone facing the auxiliary seal, the area of ​​the first seal can be increased, thereby increasing the sealing area between the first seal and the auxiliary seal, as well as the sealing area between the first seal and the housing. This extends the path of external moisture through the first seal into the second through hole, thereby improving the sealing effect of the microphone and the sound pickup effect of the microphone.

[0009] In one possible implementation, the microphone further includes a second pickup hole facing the motherboard and spaced apart from and opposite to the first pickup hole. The motherboard has a third through hole extending through it along its thickness and communicating with the second pickup hole. The mid-frame has a second sound channel communicating with the outside of the electronic device; the mid-frame is sealed to the motherboard, and the second sound channel communicates with the third through hole.

[0010] The second sound passage, the third through hole, and the second pickup hole are sequentially connected and communicate with the outside world of the electronic device. External sounds can also enter the third through hole through the second sound passage, then enter the second pickup hole from the third through hole, and finally enter the microphone, causing the vibrating element in the microphone to vibrate. The microphone then converts the vibration signal into an electrical signal and transmits it to the motherboard, thereby achieving the microphone's sound pickup function. In this embodiment, by simultaneously providing a first pickup hole and a second pickup hole in the microphone, external sounds can enter the microphone through both the first and second pickup holes, thus improving the microphone's sound pickup effect.

[0011] In one possible implementation, the first sound passage includes a first sound port located at one end of the first sound passage opposite to the second through hole. The first sound port is located on the back of the electronic device and communicates with the outside of the electronic device. The second sound passage includes a second sound port located at one end of the second sound passage opposite to the third through hole. The second sound port is located on the side or front of the electronic device and communicates with the outside of the electronic device.

[0012] In this embodiment, by placing the first and second pickup holes on opposite sides of the microphone, and placing the first and second sound ports at different locations on the electronic device, the microphone can pick up sound from different directions of the electronic device, thereby achieving bidirectional sound pickup and improving the microphone's directional pickup, which in turn improves the microphone's pickup effect and the recording effect of the electronic device.

[0013] In one possible implementation, the electronic device further includes a second seal. The second seal has a fourth through-hole extending through it along its thickness. The second seal seals between the mid-frame and the motherboard, and the fourth through-hole connects the second audio channel and the third through-hole.

[0014] In this embodiment, by setting a second seal between the middle frame and the motherboard to seal the space between the middle frame and the motherboard, the sealing performance of the microphone can be improved.

[0015] In one possible implementation, the auxiliary seal is sealed to the first surface.

[0016] In one possible implementation, the auxiliary seal includes a first top plate and a first side plate, the first side plate being disposed around the outer periphery of the first top plate and connected to the first top plate at an angle. The auxiliary seal covers the outer periphery of the microphone and is connected to the main board. A first through hole is provided in the first top plate, and the first seal seals between the first top plate and the housing.

[0017] In this embodiment, by covering the microphone with an auxiliary sealing element and placing the first sealing element between the first top plate and the housing, the microphone can be sealed. This reduces the space occupied by the sealing structure on the motherboard, improving the utilization rate of the motherboard. Furthermore, in this embodiment, by fixing the auxiliary sealing element to the motherboard, the motherboard can be strengthened, thereby improving its structural strength.

[0018] In one possible implementation, the auxiliary seal is sealed to the motherboard.

[0019] In one possible implementation, the auxiliary seal further includes an extension plate connected to the side of the first side plate facing away from the top plate. The extension plate surrounds the first side plate and extends away from the microphone, and is sealed to the motherboard. Exemplarily, the extension plate is sealed to the motherboard by welding or adhesive bonding. In this embodiment, by providing the extension plate and sealing it to the motherboard, the first pickup hole can be sealed, reducing the space occupied by the sealing structure on the motherboard and improving the utilization rate of the motherboard.

[0020] In one possible implementation, the electronic device further includes a third seal disposed on the first surface and sealingly connected to the first surface and the first top plate. The third seal surrounds the outer periphery of the first pickup hole and the first through hole, and is sealingly connected to both the first top plate and the microphone. The third seal can be applied as adhesive or solder.

[0021] In this embodiment, by providing a third sealing element between the microphone and the first top plate to further seal the first pickup hole, the sealing performance of the microphone can be improved, thereby improving the microphone's sound pickup effect.

[0022] In one possible implementation, the auxiliary seal is a metal component. In this case, the auxiliary seal can also be understood as a microphone shield. In this embodiment, using a metal component as the auxiliary seal serves to shield the signal, reducing or even sealing off signal noise from other components within the electronic device that could interfere with the microphone's signal, thereby improving the microphone's sound pickup performance. In other words, the auxiliary seal in this embodiment can simultaneously provide sealing and signal shielding, simplifying the structure of the electronic device and saving internal space.

[0023] In one possible implementation, the first seal is interference-fitted with the housing, and / or the first seal is interference-fitted with the auxiliary seal to improve the sealing effect between the first seal and the housing and the auxiliary seal.

[0024] In one possible implementation, along the thickness direction of the first seal, one side of the first seal is fixedly connected to the housing, and the other side of the first seal abuts against the auxiliary seal. When the housing is removed from the electronic device, the first seal is removed along with the housing. This facilitates the removal of the housing, and when the housing is reinstalled into the electronic device, the first seal abuts against the auxiliary seal again, thus achieving a sealed connection between the housing and the first seal, thereby enabling the reuse of the first seal.

[0025] Alternatively, along the thickness direction of the first seal, one side of the first seal is fixedly connected to the auxiliary seal, and the other side of the first seal abuts against the housing.

[0026] In one possible implementation, the auxiliary seal is a metal or plastic component. The first seal is foam, rubber, or a thermoplastic elastomer.

[0027] In one possible implementation, the first sound channel includes a first segment and a second segment connected to each other at an angle, with the end of the first segment facing away from the second segment pointing towards the outside of the electronic device. Along a direction perpendicular to the first sound channel, the cross-sectional area of ​​the first segment is smaller than that of the second segment. In this embodiment, by setting the cross-sectional area of ​​the first segment communicating with the outside to be smaller than that of the second segment, the amount of dust or debris entering the interior of the electronic device through the first segment can be further reduced.

[0028] In one possible implementation, the first sound passage includes a first channel and a second channel interconnected with each other. The housing includes a back cover, a camera decorative element, and a bracket. The back cover has a mounting hole, the camera decorative element is disposed in the mounting hole and sealed to the back cover, and the first channel is disposed in the camera decorative element. The second channel is disposed in the bracket. The bracket is disposed between the camera decorative element and the first sealing element, and is sealed to both the camera decorative element and the first sealing element, and the second channel communicates with the first channel and the second through hole.

[0029] In summary, the electronic device provided in this application achieves microphone sealing by setting an auxiliary seal between the microphone and the housing, and sealing the auxiliary seal to the housing with a first seal, without occupying space on the motherboard, thus improving motherboard utilization. Furthermore, in this application, by connecting and covering the first surface of the microphone with the auxiliary seal, and setting the outer peripheral surface of the auxiliary seal to protrude from or be flush with the outer peripheral edge of the first surface (i.e., setting the surface area of ​​the auxiliary seal to be greater than or equal to the area of ​​the first surface), and placing the first seal between the auxiliary seal and the housing to achieve microphone sealing, the sealing area can be increased, improving the microphone's sealing effect, thereby enhancing the microphone's sound pickup performance and simplifying the microphone sealing process. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0031] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0032] Figure 2 yes Figure 1 A schematic diagram of the exploded structure of the electronic device shown.

[0033] Figure 3 yes Figure 1 A schematic diagram of the cross-sectional structure of the electronic device shown, cut along point AA.

[0034] Figure 4 yes Figure 3 A schematic diagram of the microphone in the electronic device shown;

[0035] Figure 5 yes Figure 4 A partial structural diagram of the microphone shown;

[0036] Figure 6 yes Figure 3A partial cross-sectional structural diagram of the electronic device shown.

[0037] Figure 7 yes Figure 2 An exploded view of the housing in the electronic device shown.

[0038] Figure 8 yes Figure 3 A partially exploded structural diagram of the electronic device shown.

[0039] Figure 9 This is a partial structural schematic diagram of the electronic device provided in the second embodiment of this application;

[0040] Figure 10 yes Figure 9 A partial cross-sectional structural diagram of the electronic device shown.

[0041] Figure 11 This is a partial cross-sectional structural schematic diagram of the electronic device provided in the third embodiment of this application;

[0042] Figure 12 yes Figure 11 A schematic diagram of the auxiliary seal in the electronic device shown.

[0043] Figure 13 This is a partial cross-sectional structural schematic diagram of the electronic device provided in the fourth embodiment of this application;

[0044] Figure 14 This is a partial cross-sectional structural schematic diagram of the electronic device provided in the fifth embodiment of this application;

[0045] Figure 15 This is a partial cross-sectional structural diagram of the electronic device provided in the sixth embodiment of this application. Detailed Implementation

[0046] With the development of technology, electronic devices (such as mobile phones, tablets, and watches) have become indispensable tools in people's daily lives. Electronic devices typically rely on microphones (also called pickups) to achieve voice communication functions. To ensure good recording quality, microphones usually need to be sealed. Currently, the microphone's sealing structure is generally located on the motherboard, occupying a significant amount of motherboard space, resulting in low motherboard utilization and affecting the placement of components on the motherboard.

[0047] This application provides an electronic device that can reduce or even eliminate the space occupied by the sealing structure on the motherboard, thereby improving the utilization rate of the motherboard.

[0048] The embodiments of this application are described below with reference to the accompanying drawings.

[0049] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the electronic device 100 provided in the embodiments of this application.

[0050] Electronic device 100 includes, but is not limited to, cellphones, notebook computers, tablet computers, wearable devices, and smartwatches. In this embodiment, a cellphone is used as an example for illustration.

[0051] For ease of description, the width direction of the electronic device 100 is defined as the X direction; the length direction of the electronic device 100 is defined as the Y direction; and the thickness direction of the electronic device 100 is defined as the Z direction. The X, Y, and Z directions are all perpendicular to each other.

[0052] Please refer to the following: Figure 2 and Figure 3 , Figure 2 yes Figure 1 An exploded view of the electronic device 100 shown. Figure 3 yes Figure 1 The diagram shows a partial cross-sectional view of the electronic device 100 cut along line AA. "Cut along line AA" means cut along line AA and the plane containing the arrows at both ends of line AA; the same interpretation applies to the description of the accompanying drawings below.

[0053] Electronic device 100 includes a mid-frame 10, a housing 20, a display screen 30, a motherboard 40, and a microphone 50. The housing 20 includes the mid-frame 10 and a housing 20. The mid-frame 10 includes a middle plate 11 and a frame 12. The frame 12 surrounds the outer periphery of the middle plate 11 and is connected to the middle plate 11. The display screen 30 is stacked with the middle plate 11 along the Z-direction and is fixedly connected to the mid-frame 10. For example, the display screen 30 is fixedly connected to the middle plate 11 by an adhesive backing 101. The display surface 31 of the display screen 30 is located on the side facing away from the middle plate 11. The housing 20 is located on the side of the middle plate 11 facing away from the display screen 30; that is, the housing 20 and the display screen 30 are respectively located on opposite sides of the thickness direction (Z-direction) of the middle plate 11. The housing 20 and the middle plate 11 are positioned opposite each other and spaced apart along the Z-direction and are fixedly connected to the frame 12. A receiving cavity 102 is formed between the housing 20 and the mid-frame 10. Both the motherboard 40 and the microphone 50 are located inside the receiving cavity 102.

[0054] The main board 40 is a printed circuit board (PCB). The main board 40 includes a fifth surface 41 and a sixth surface 42. The fifth surface 41 and the sixth surface 42 are arranged opposite to each other along the thickness direction of the main board 40. The main board 40 is located within the receiving cavity 102, with the sixth surface 42 facing the middle plate 11 and fixedly connected to the middle plate 11. The fifth surface 41 faces the housing 20 and is spaced apart from the housing 20.

[0055] Please see Figure 4 and Figure 5 , Figure 4 yes Figure 3 A schematic diagram of the structure of the microphone 50 in the electronic device 100 shown. Figure 5 yes Figure 4 The diagram shows a partial structural schematic of the microphone.

[0056] The microphone 50 includes a microphone circuit board 51, a vibration element 52, and a housing 53. In this embodiment, the microphone circuit board 51 is a PCB board. The microphone circuit board 51 includes a third surface 511 and a fourth surface 512. The third surface 511 and the fourth surface 512 are disposed opposite to each other along the thickness direction of the microphone circuit board 51.

[0057] The housing 53 includes a second top plate 531 and a second side plate 535. The second side plate 535 is disposed around and connected to the second top plate 531. The second top plate 531 includes a first surface 5311 and a second surface 5312. The first surface 5311 and the second surface 5312 are disposed opposite to each other along the thickness direction of the second top plate 531. The first surface 5311 includes a sealing area 532 and a pickup area 533. The pickup area 533 is located in the central region of the first surface 5311, or in a region close to the center of the first surface 5311. The sealing area 532 is disposed around the outer periphery of the pickup area 533. It is understood that the sealing area 532 is an annular structure, and the pickup area 533 is located within the annular sealing area 532. For example, the width of the sealing area 532 is 0.3 mm. That is, the minimum distance from the outer periphery of the pickup area 533 to the outer periphery of the sealing area 532 is 0.3 mm.

[0058] In this embodiment, the housing 53 further includes a connecting plate 537. The connecting plate 537 surrounds the outer periphery of the second top plate 531 and is connected to the second top plate 531 and the second side plate 535. The connecting plate 537 is an arc-shaped plate and is smoothly connected to the second top plate 531 and the second side plate 535. The slope of the connecting plate 537 gradually changes along the direction from the second top plate 531 to the second side plate 535. The tangent line at the end of the connecting plate 537 that connects to the second top plate 531 is parallel or approximately parallel to the second top plate 531, and the tangent line at the end of the connecting plate 537 that connects to the second side plate 535 is parallel or approximately parallel to the second side plate 535. It should be noted that the connecting plate 537 can be understood as an R-angle structure disposed between the second side plate 535 and the second top plate 531 to ensure the smoothness of the outer surface of the microphone 50. In other embodiments, the housing 53 may not include the connecting plate. In this case, the second top plate 531 and the second side plate 535 are directly connected to simplify the manufacturing process of the microphone 50.

[0059] The outer casing 53 is connected to the microphone circuit board 51. The end of the second side plate 535 facing away from the second top plate 531 is fixedly connected to the third surface 511. The second side plate 535 and the third surface 511 can be fixedly connected by welding, or by adhesive bonding, or by a combination of welding and adhesive bonding. The second top plate 531 and the microphone circuit board 51 are positioned opposite each other and spaced apart along the Z-axis. The outer casing 53 and the microphone circuit board 51 enclose a protective cavity 536. The second surface 5312 is located inside the protective cavity 536. The first surface 5311 is located outside the protective cavity 536, specifically, the first surface 5311 faces the positive Z-axis direction.

[0060] The vibration element 52 is disposed within the protective cavity 536 and fixed to the third surface 511. The vibration element 52 is electrically connected to the microphone circuit board 51. Exemplarily, the vibration element 52 includes structures such as a functional integrated circuit chip, a microelectromechanical system chip, and a diaphragm.

[0061] The microphone 50 is provided with a first pickup hole 501. The first pickup hole 501 communicates with the outside of the microphone 50, and the microphone 50 can pick up sound through the first pickup hole 501. In this embodiment, the first pickup hole 501 is provided on the second top plate 531 and penetrates the first surface 5311 and the second surface 5312. Specifically, the first pickup hole 501 is provided in the pickup area 533 of the first surface 5311. In this embodiment, the first pickup hole 501 includes multiple through holes. The multiple through holes are arranged in an array in the pickup area 533, and each through hole penetrates the second top plate 531 along the thickness direction of the second top plate 531. For example, the through hole is a circular hole. Alternatively, the through hole can also be a square hole, an elliptical hole, or an irregularly shaped hole. In other embodiments, the first pickup hole 501 can also be formed by a single through hole.

[0062] Please combine Figure 3 The microphone 50 is housed within the receiving cavity 102 of the electronic device 100, located between the housing 20 and the main board 40. The microphone 50 is fixedly connected to and electrically connected to the main board 40. The fourth surface 512 of the microphone circuit board 51 faces the fifth surface 41 of the main board 40 and is fixedly connected to it. The first surface 5311 of the second top plate 531 faces the housing 20, specifically the support 23 of the housing 20. That is, the first surface 5311 faces the positive Z-axis direction. The first pickup hole 501 communicates with the outside of the electronic device 100. External sound is transmitted to the microphone 50 through the first pickup hole 501, causing the diaphragm of the vibrating element 52 to vibrate. Under the processing of the functional integrated circuit chip and the microelectromechanical system chip, the vibration signal is converted into an electrical signal and transmitted to the main board 40, thereby enabling the microphone 50 to pick up sound and realizing the recording function of the electronic device 100.

[0063] In this embodiment, by providing a housing 53 around the vibrating element 52, the vibrating element 52 can be protected, preventing external dust, moisture, and other impurities from entering and damaging it. The housing 53 can be made of metal or plastic. When the housing 53 is made of metal, it can also act as a signal shield, preventing signal noise from other components within the electronic device 100 from interfering with the vibrating element 52, thereby improving the sound pickup effect of the microphone 50.

[0064] Please see Figure 6 and Figure 7 , Figure 6 yes Figure 3 A partial cross-sectional structural schematic diagram of the electronic device 100 shown. Figure 7 yes Figure 2 An exploded view of the housing 20 in the electronic device 100 shown.

[0065] The housing 20 is provided with a first sound passage 201. The first sound passage 201 connects the outside of the electronic device 100 and the first pickup hole 501. Sound from the outside of the electronic device 100 can be transmitted through the first sound passage 201 to the first pickup hole 501, and then to the vibrating element 52 inside the microphone 50.

[0066] In this embodiment, the housing 20 includes a back cover 21, a camera decorative element 22, and a bracket 23. In this embodiment, the back cover 21 is the battery cover. The back cover 21 includes an inner surface 211 and an outer surface 212. The inner surface 211 and the outer surface 212 are arranged opposite to each other along the thickness direction of the back cover 21. The back cover 21 is provided with a mounting hole 213. The mounting hole 213 penetrates the back cover 21 along the Z direction. That is, the mounting hole 213 penetrates both the inner surface 211 and the outer surface 212.

[0067] The back cover 21 is installed on the side of the middle frame 10 facing away from the display screen 30, and is spaced apart from the middle plate 11 along the Z direction. Specifically, the back cover 21 is fixedly connected to the side of the frame 12 facing away from the middle plate 11. In this embodiment, the side of the frame 12 facing away from the middle plate 11 is provided with a recess 121. The recess 121 is provided around the inner periphery of the frame 12 and is recessed towards the middle plate 11. The outer edge of the back cover 21 is provided in the recess 121 and is fixedly connected to the inner wall surface of the recess 121. For example, the back cover 21 and the frame 12 are fixedly connected by adhesive application or adhesive backing. Alternatively, the back cover 21 and the frame 12 can also be fixedly connected by welding. The outer surface 212 of the back cover 21 is flush with the surface of the frame 12 facing away from the middle plate 11 to ensure the consistency of the appearance of the electronic device 100 and avoid a scratchy feel.

[0068] The camera decorative element 22 includes a decorative element body 221 and an extension 222. The decorative element body 221 includes a first surface 2211, a second surface 2212, and an outer peripheral surface 2213. The first surface 2211 and the second surface 2212 are disposed opposite to each other along the thickness direction of the decorative element body 221. The outer peripheral surface 2213 surrounds the outer periphery of the decorative element body 221 and connects between the first surface 2211 and the second surface 2212. The extension 222 surrounds the outer periphery of the decorative element body 221 and protrudes from the decorative element body 221 in a direction parallel to the second surface 2212. The camera decorative element 22 is provided with one or more camera mounting holes. The camera mounting holes are used to mount the camera of the electronic device 100.

[0069] The camera decorative piece 22 is provided with a first channel 223. The first channel 223 is spaced apart from the camera mounting hole of the camera decorative piece 22. The first channel 223 includes a first sound port 2231 and a first opening 2232. The first sound port 2231 and the first opening 2232 are respectively located at opposite ends of the extension direction of the first channel 223. In this embodiment, the first opening 2232 is located on the second surface 2212, and the first sound port 2231 is located on the outer peripheral surface 2213. The first channel 223 includes a first segment 2233 and a second segment 2234 that are connected and communicate with each other. The first sound port 2231 is located at the end of the first segment 2233 facing away from the second segment 2234, and the first opening 2232 is located at the end of the second segment 2234 facing away from the first segment 2233. The included angle between the first segment 2233 and the second segment 2234 is greater than 0 degrees and less than 180 degrees. In this embodiment, the first segment 2233 and the second segment 2234 are connected perpendicularly. The first segment 2233 extends in a direction parallel to the Y direction, and the second segment 2234 extends in a direction parallel to the Z direction. This reduces the amount of dust or debris from the outside that can directly enter the interior of the electronic device 100 through the first channel 223.

[0070] like Figure 6 As shown, in this embodiment, the area of ​​the first segment 2233 along its cross-section perpendicular to its extension direction is smaller than the area of ​​the second segment 2234 along its cross-section perpendicular to its extension direction. That is, the area of ​​the first segment 2233 along its cross-section parallel to the XZ plane is smaller than the area of ​​the second segment 2234 along its cross-section parallel to the YZ plane. This further reduces the amount of dust or debris entering the interior of the electronic device 100 through the first channel 223.

[0071] The camera decorative piece 22 is mounted on and fixedly connected to the back cover 21. The decorative piece body 221 is located on the inner periphery of the mounting hole 213, with its second surface 2212 facing the interior of the electronic device 100 (i.e., facing the motherboard 40), and its first surface 2211 facing the exterior of the electronic device 100. A first audio port 2231 is located on the side of the back cover 21 near the outer surface 212. The first audio port 2231 protrudes from the exterior of the electronic device 100. In this embodiment, the first audio port 2231 faces the top of the electronic device 100, i.e., towards the positive Y-axis direction. In other embodiments, the first audio port 2231 may also face the bottom of the electronic device 100, i.e., towards the negative Y-axis direction. Alternatively, the first audio port 2231 may also face the side of the electronic device 100, i.e., towards the positive or negative X-axis direction. Alternatively, the first audio port 2231 can also be located on the first surface 2211 of the camera decorative piece 22, that is, the first audio port 2231 faces the back of the electronic device 100, that is, the first audio port 2231 faces the negative Z-axis direction. No specific restrictions are placed on the position of the first audio port 2231 here.

[0072] The extension 222 is located on the side of the rear cover 21 facing the motherboard 40 and is fixedly connected to the inner surface 211 of the rear cover 21. Specifically, the housing 20 also includes a first connector 24. The first connector 24 is disposed around the extension 222 and is located between the extension 222 and the inner surface 211 of the rear cover 21. The first connector 24 is fixedly connected to the extension 222 and the rear cover 21. In this embodiment, the first connector 24 is an adhesive, and the first connector 24 is bonded between the extension 222 and the rear cover 21. For example, the first connector 24 is an adhesive backing. Alternatively, the first connector 24 may also be a dotted adhesive or other adhesive.

[0073] Continue reading Figure 6 and Figure 7 The bracket 23 includes a third surface 231 and a fourth surface 232. The third surface 231 and the fourth surface 232 are arranged opposite to each other along the thickness direction of the bracket 23. The bracket 23 is provided with a second channel 233. The second channel 233 penetrates through the third surface 231 and the fourth surface 232. In this embodiment, the second channel 233 is a square through hole penetrating through the third surface 231 and the fourth surface 232 along the thickness direction of the bracket 23. In other embodiments, the second channel 233 may also be a circular through hole, an elliptical through hole, or an irregularly shaped through hole. The bracket 23 may also be provided with one or more camera mounting holes. The camera mounting holes on the bracket 23 and the camera mounting holes on the camera decorative piece 22 are arranged opposite to each other and are used together to mount the camera of the electronic device 100.

[0074] The bracket 23 is located on the side of the camera decorative piece 22 near the second surface 2212, that is, the bracket 23 is located between the camera decorative piece 22 and the microphone 50. The bracket 23 is sealed to the camera decorative piece 22. The second channel 233 and the first pickup hole 501 are arranged opposite to each other along the Z direction and are interconnected. The second channel 233 and the first opening 2232 of the first channel 223 are offset along the Y direction and are interconnected.

[0075] like Figure 6 and Figure 7 As shown, the housing 20 also includes a fourth sealing element 25. In this embodiment, the fourth sealing element 25 is foam. In other embodiments, the fourth sealing element 25 may also be rubber or other structures with sealing properties. The fourth sealing element 25 is annular. The fourth sealing element 25 has a third channel 251. The fourth sealing element 25 is disposed between the camera decorative element 22 and the bracket 23, and is sealed to both the camera decorative element 22 and the bracket 23. The fourth sealing element 25 surrounds the outer periphery of the first opening 2232 and the second channel 233, and the third channel 251 communicates with the first channel 223 and the second channel 233.

[0076] In this embodiment, the fourth sealing member 25 is interference-fitted between the camera decorative member 22 and the bracket 23. That is, the thickness of the fourth sealing member 25 in its natural state is greater than the size of the gap between the camera decorative member 22 and the bracket 23. For example, one side of the fourth sealing member 25 is bonded and fixed to the bracket 23, and the other side abuts against the camera decorative member 22. It can be understood that when the fourth sealing member 25 is installed between the camera decorative member 22 and the bracket 23, it is in a compressed state. In this way, the installation stability and sealing effect between the fourth sealing member 25 and the camera decorative member 22 and the bracket 23 can be improved, thereby improving the sealing performance of the microphone 50. Furthermore, in this embodiment, by bonding one side of the fourth sealing member 25 to the bracket 23 and abutting the other side to the camera decorative member 22, it is convenient to disassemble the camera decorative member 22 and the bracket 23. When the camera decorative member 22 is reinstalled to the bracket 23, the camera decorative member 22 abuts against the fourth sealing member 25 again, thereby achieving a sealed connection between the camera decorative member 22 and the bracket 23, and enabling the reuse of the fourth sealing member 25.

[0077] In one embodiment, one side of the fourth sealing member 25 can be bonded and fixed to the camera decorative member 22, while the other side abuts against the bracket 23. Alternatively, the fourth sealing member 25 can be bonded and fixed to both the camera decorative member 22 and the bracket 23 simultaneously to improve the connection stability and sealing effect between the fourth sealing member 25 and the camera decorative member 22 and the bracket 23. Alternatively, the fourth sealing member 25 can abut against both the camera decorative member 22 and the bracket 23 simultaneously to simplify the installation process of the fourth sealing member 25.

[0078] Please combine Figure 3 The first channel 223, the second channel 233, and the third channel 251 together form the first sound passage 201 of the housing 20. External sound enters the first sound passage 201 through the first sound port 2231, and then enters the microphone 50 through the first pickup hole 501. Specifically, external sound enters the first channel 223 through the first sound port 2231, then enters the third channel 251 through the first opening 2232, then enters the second channel 233, and finally enters the microphone 50 through the first pickup hole 501.

[0079] In this embodiment, by offsetting the first opening 2232 of the second channel 233 with the first opening 2232 of the first channel 223 along the Y direction, and vertically connecting the third channel 251 with the second segment 2234 of the first channel 223, it is possible to further prevent external dust or other debris from entering the interior of the electronic device 100.

[0080] Please combine Figure 3 and Figure 8 , Figure 8 yes Figure 3A partially exploded structural diagram of the electronic device 100 shown.

[0081] The electronic device 100 also includes an auxiliary seal 60 and a first seal 70. In this embodiment, the auxiliary seal 60 is a rigid plate-like structure. For example, the auxiliary seal 60 is a metal plate such as a steel plate, aluminum plate, or copper plate, or it can also be a plastic plate. No specific limitations are placed on the material of the auxiliary seal plate here, as long as the auxiliary seal 60 is not easily deformed.

[0082] The auxiliary seal 60 is provided with a first through hole 61. The first through hole 61 is located in the middle region of the auxiliary seal 60 and extends through the auxiliary seal 60 along its thickness direction. In this embodiment, the first through hole 61 is a square hole. In other embodiments, the first through hole 61 can also be a round hole or an irregularly shaped hole. It is understood that the auxiliary seal 60 has an annular structure. The width of the annular auxiliary seal 60 is greater than the width of the sealing area 532 on the second top plate 531. In this embodiment, the width of the annular auxiliary seal 60 is greater than or equal to 1 mm. In other embodiments, the width of the auxiliary seal 60 can also be slightly less than 1 mm. The width of the annular auxiliary seal 60 refers to the minimum distance from the inner wall of the first through hole 61 to the outer peripheral surface 2213 of the auxiliary seal 60.

[0083] like Figure 3 As shown, the auxiliary seal 60 is disposed on the side of the second top plate 531 of the microphone 50 facing away from the microphone circuit board 51, that is, the auxiliary seal 60 is disposed on the first surface 5311. Furthermore, the auxiliary seal 60 connects to and covers the first surface 5311. The auxiliary seal 60 is disposed around the outer periphery of the first pickup hole 501 and seals the outer periphery of the first pickup hole 501. Specifically, the first through hole 61 is disposed opposite to the first pickup hole 501 along the Z direction and communicates with the first pickup hole 501. The first through hole 61 completely covers the first pickup hole 501 along the Z direction. In this embodiment, along a direction parallel to the surface of the second top plate 531, the outer peripheral surface of the auxiliary seal 60 protrudes beyond the outer periphery of the first surface 5311. That is, the outer peripheral surface 2213 of the auxiliary seal plate is located on the side of the outer peripheral surface 2213 of the second top plate 531 facing away from the center of the second top plate 531. In other embodiments, the outer peripheral surface of the auxiliary seal 60 may also be flush with the outer periphery of the first surface 5311.

[0084] The auxiliary seal 60 is fixed and sealed to the sealing area 532 of the second top plate 531. In this embodiment, adhesive is applied between the auxiliary seal 60 and the second top plate 531, with the adhesive surrounding the first pickup hole 501 and bonding it to the auxiliary seal 60 and the second top plate 531. Alternatively, the auxiliary seal 60 and the second top plate 531 can also be fixed and sealed together using adhesive backing. When the second top plate 531 and the auxiliary seal 60 are metal parts, the auxiliary seal 60 and the second top plate 531 can also be sealed and fixed together by welding. Alternatively, the auxiliary seal 60 can be welded to the second top plate 531 first, and then adhesive can be applied between the auxiliary seal 60 and the second top plate 531 to improve the connection stability and sealing performance between the auxiliary seal 60 and the second top plate 531.

[0085] Please continue reading. Figure 3 and Figure 8 In this embodiment, the first sealing element 70 is foam. In other embodiments, the first sealing element 70 may also be rubber or other structures with sealing properties. The first sealing element 70 is annular. The first sealing element 70 is provided with a second through hole 71. The second through hole 71 is located in the middle region of the first sealing element 70 and penetrates the first sealing element 70 along its thickness direction. In this embodiment, the second through hole 71 is a circular hole. In other embodiments, the second through hole 71 may also be a square hole or an irregularly shaped hole.

[0086] The first sealing element 70 is disposed between the auxiliary sealing element 60 and the bracket 23. The second through hole 71 is disposed opposite to the first through hole 61 along the Z-direction and communicates with the first through hole 61. The second through hole 71 completely covers the first through hole 61 along the Z-direction. In other words, the first sealing element 70 is disposed around the outer periphery of the first through hole 61. In this embodiment, the area of ​​the surface of the first sealing element 70 facing the auxiliary sealing element 60 is larger than the area of ​​the first surface 5311 of the microphone 50. Alternatively, the area of ​​the surface of the first sealing element 70 facing the auxiliary sealing element 60 may also be equal to the area of ​​the first surface 5311 of the microphone 50.

[0087] In this embodiment, the first sealing element 70 seals the auxiliary sealing element 60 and the bracket 23. Specifically, the first sealing element 70 and the bracket 23 are interference-fitted. One side of the first sealing element 70 is bonded and fixed to the auxiliary sealing element 60, while the other side abuts against the bracket 23. This allows for easy removal of the housing 20 from the electronic device 100. Furthermore, when the housing 20 is reinstalled into the electronic device 100, the bracket 23 within the housing 20 abuts against the first sealing element 70 again, achieving a sealed connection between the housing 20 and the first sealing element 70, thus enabling the reuse of the first sealing element 70.

[0088] In one embodiment, the first seal 70 and the auxiliary seal 60 are interference-fitted. Specifically, one side of the first seal 70 is bonded and fixed to the bracket 23, and the other side abuts against the auxiliary seal 60.

[0089] In one embodiment, the first seal 70 can also be bonded and fixed to the bracket 23 and the auxiliary seal 60 at the same time to improve the connection stability and sealing effect between the first seal 70 and the bracket 23 and the auxiliary seal 60.

[0090] In one embodiment, the first seal 70 may also be interference-fitted with both the bracket 23 and the auxiliary seal 60. Specifically, the first seal 70 abuts against both the bracket 23 and the auxiliary seal 60 to simplify the installation process of the first seal 70.

[0091] like Figure 3 As shown, external sound enters the first sound cavity 201 through the first sound port 2231, then enters the second through hole 71, then enters the first through hole 61 through the second through hole 71, and then enters the microphone 50 through the first pickup hole 501, causing the vibrating element 52 in the microphone 50 to vibrate. The microphone 50 then converts the vibration signal into an electrical signal and transmits it to the motherboard 40, thereby realizing the sound pickup function of the microphone 50.

[0092] It is understandable that the first sound passage 201, the first through hole 61, the second through hole 71 and the first pickup hole 501 are connected in sequence and are connected to the outside of the electronic device 100, while being sealed from other areas inside the electronic device 100.

[0093] In this embodiment, by providing an auxiliary sealing member 60 between the microphone 50 and the housing 20, and sealing the auxiliary sealing member 60 to the housing 20 with a first sealing member 70, the microphone 50 can be sealed without occupying space on the motherboard 40, thus improving the utilization rate of the motherboard 40. For example, in this embodiment, the components on the motherboard 40 can be arranged below the auxiliary sealing member 60, that is, the projection of the auxiliary sealing member 60 along the Z direction at least partially coincides with the projection of the components on the motherboard 40 along the Z direction. In this way, the space on the motherboard 40 located below the auxiliary sealing member 60 can be fully utilized.

[0094] It should be noted that the microphone 50 is generally small in size, and the area of ​​the second top plate 531 is also small. If the second top plate 531 of the microphone 50 is directly sealed to the housing 20, the sealing process will be more demanding due to the small sealing area, and the sealing effect will be poor.

[0095] In this embodiment, by providing an auxiliary sealing member 60 between the microphone 50 and the housing 20, and setting the outer peripheral surface of the auxiliary sealing member 60 to protrude from the outer peripheral edge of the first surface 5311 or to be flush with the outer peripheral edge of the first surface 5311, that is, setting the area of ​​the surface of the auxiliary sealing member 60 facing the microphone 50 to be greater than or equal to the area of ​​the first surface 5311, and setting the first sealing member 70 between the auxiliary sealing member 60 and the housing 20, the microphone 50 is sealed, which can increase the sealing area, improve the sealing effect of the microphone 50, thereby improving the sound pickup effect of the microphone 50, and simplifying the sealing process of the microphone 50.

[0096] For example, in this embodiment, by placing the first sealing member 70 between the auxiliary sealing member 60 and the housing 20, the area of ​​the surface of the first sealing member 70 facing the auxiliary sealing member 60 can be set to be greater than or equal to the area of ​​the microphone 50 facing the first surface 5311. That is, the area of ​​the first sealing member 70 can be increased, thereby increasing the sealing area between the first sealing member 70 and the auxiliary sealing member 60, and increasing the sealing area between the first sealing member 70 and the housing 20. This can extend the path of external moisture through the first sealing member 70 into the second through hole 71, thereby improving the sealing effect of the microphone 50 and improving the sound pickup effect of the microphone 50.

[0097] like Figure 3 As shown, in this embodiment, the electronic device 100 further includes a first dustproof component 80. In this embodiment, the first dustproof component 80 is disposed within the first sealing component 70 and connected to the inner wall surface of the second through hole 71. External sound can pass through the first dustproof component 80 and enter the microphone 50, but dust and other debris cannot pass through the first dustproof component 80. For example, the first dustproof component 80 can be a dustproof mesh or a waterproof and breathable membrane.

[0098] In this embodiment, by setting the first dustproof component 80, while ensuring the sound pickup effect of the microphone 50 inside the electronic device 100, it can also prevent external dust and other debris from entering the microphone 50 and causing blockage, thus playing a dustproof role, thereby improving the sound pickup effect of the microphone 50 and extending the service life of the microphone 50.

[0099] In other embodiments, the first dustproof component 80 may also be disposed within the microphone 50. Alternatively, the first dustproof component 80 may be disposed within the auxiliary sealing component 60 and connected to the inner wall surface of the first through hole 61. Alternatively, the first dustproof component 80 may be disposed within the first sound channel 201 and connected to the inner wall surface of the first sound channel 201. Specifically, the first dustproof component 80 may be disposed within the third channel 251 of the fourth sealing component 25 and connected to the inner wall surface of the third channel 251. Alternatively, the first dustproof component 80 may also be disposed within the second channel 233 of the bracket 23 or the first channel 223 of the rear cover 21.

[0100] There may be one or more first dustproof components 80. When there are multiple first dustproof components 80, the first dustproof component 80 is disposed in the second through hole 71 of the first sealing component 70, and / or disposed in the first through hole 61 of the auxiliary sealing component 60, and / or disposed in the first sound passage 201 of the housing 20.

[0101] In one embodiment, a first seal 70 is sealed between the camera decorative element 22 and the auxiliary seal 60. One side of the first seal 70 is connected to the second side 2212 of the camera decorative element 22, and the other side is connected to the auxiliary seal 60. The second through hole 71 of the first seal 70 directly communicates with the first channel 223 of the camera decorative element 22. In this case, the first sound passage 201 is directly formed by the first channel 223. This simplifies the sealing structure and sealing process of the microphone 50, shortens the distance that external sound is transmitted to the microphone 50, and improves the sound pickup effect of the microphone 50.

[0102] In one embodiment, the first sound passage 201 can also be located on the rear cover 21, and the first sound port 2231 is located on the outer surface 212 of the rear cover 21. The first sealing member 70 seals between the rear cover 21 and the auxiliary sealing member 60. One side of the first sealing member 70 is connected to the inner surface 211 of the rear cover 21, and the other side is connected to the auxiliary sealing member 60. In this way, the sealing structure and sealing process of the microphone 50 can be further simplified, and the distance of external sound transmission to the microphone 50 can be further shortened, thereby improving the sound pickup effect of the microphone 50.

[0103] Please see Figure 9 and Figure 10 , Figure 9 This is a partial structural schematic diagram of the electronic device 100 provided in the second embodiment of this application. Figure 10 yes Figure 9 A partial cross-sectional structural schematic diagram of the electronic device 100 shown.

[0104] This embodiment and Figure 3The difference in the illustrated embodiment is that, in this embodiment, the microphone 50 also has a second pickup hole 502. The second pickup hole 502 is disposed on the microphone circuit board 51 and penetrates the microphone circuit board 51 along the thickness direction of the microphone circuit board 51, that is, the second pickup hole 502 penetrates the third surface 511 and the fourth surface 512. The second pickup hole 502 is disposed opposite to the diaphragm of the vibrating element 52, and sound from outside the microphone 50 can enter the microphone 50 simultaneously through the first pickup hole 501 and the second pickup hole 502.

[0105] In this embodiment, the second pickup hole 502 is a circular hole. In other embodiments, the second pickup hole 502 may also be a square hole, an elliptical hole, or an irregularly shaped hole. In this embodiment, the second pickup hole 502 is formed by a single through hole. In other embodiments, the second pickup hole 502 may also be formed by multiple spaced-apart through holes.

[0106] like Figure 9 and Figure 10 As shown, the motherboard 40 has a third through hole 43. The third through hole 43 penetrates the motherboard 40 along its thickness direction. That is, the third through hole 43 penetrates the fifth surface 41 and the sixth surface 42. In this embodiment, the third through hole 43 is a circular hole. In other embodiments, the third through hole 43 can also be a square hole, an elliptical hole, or an irregularly shaped hole.

[0107] Microphone 50 is mounted on motherboard 40, and microphone circuit board 51 is sealed to motherboard 40. The second pickup hole 502 and the third through hole 43 are positioned opposite each other and are interconnected. Specifically, microphone circuit board 51 is soldered to the fifth surface 41 of motherboard 40, and solder surrounds the outer periphery of the second pickup hole 502 and the third through hole 43, so that the second pickup hole 502 and the third through hole 43 are isolated from other areas inside electronic device 100, preventing noise from other areas inside electronic device 100 from entering microphone 50 through the second pickup hole 502 and the third through hole 43 and affecting the pickup effect of microphone 50.

[0108] The middle frame 10 is provided with a second sound passage 13. The second sound passage 13 connects to the outside of the electronic device 100 and the second pickup hole 502. Sound from the outside of the electronic device 100 can be transmitted through the second sound passage 13 to the second pickup hole 502, and then to the vibrating element 52 inside the microphone 50.

[0109] The second sound passage 13 includes a second sound port 131 and a second opening 132. The second sound port 131 and the second opening 132 are respectively located at opposite ends of the extension direction of the second sound passage 13. In this embodiment, the second opening 132 is located on the surface of the middle plate 11 facing the main plate 40, and the second opening 132 communicates with the third through hole 43 and the second pickup hole 502. The second sound port 131 is located on the outer surface of the frame 12 and communicates with the outside. For example, the second sound port 131 is located on the top of the electronic device 100. In this way, external sound can be transmitted from the top of the electronic device 100 to the microphone 50 through the second sound port 131, that is, the microphone 50 can pick up sound from the top of the electronic device 100.

[0110] The second sound passage 13 includes a third segment 133 and a fourth segment 134 that are connected and communicate with each other. A second sound port 131 is located at the end of the third segment 133 facing away from the fourth segment 134, and a second opening 132 is located at the end of the fourth segment 134 facing away from the third segment 133. The third segment 133 and the fourth segment 134 are connected at an angle, that is, the angle between the third segment 133 and the fourth segment 134 is greater than 0 degrees and less than 180 degrees. In this embodiment, the fourth segment 134 is located on the middle plate 11 and is positioned along the Z-direction. The end of the third segment 133 facing away from the second sound port 131 is connected to the fourth segment 134, and the other end of the third segment 133 extends along the middle plate 11 toward the frame 12 located at the top of the electronic device 100 until it penetrates the frame 12, thus forming the second sound port 131 on the frame 12. In this embodiment, the third segment 133 is parallel to the Y-direction. In this embodiment, by connecting the third segment 133 and the fourth segment 134 of the second sound channel 13 at an angle, the amount of dust or debris from the outside can be reduced from directly entering the interior of the electronic device 100 through the second sound channel 13.

[0111] In one embodiment, the second sound port 131 is located on the side of the electronic device 100. That is, the second sound port 131 can face either the positive X-axis direction or the negative X-axis direction. In this case, external sound can be transmitted from the side of the electronic device through the second sound port 131 to the microphone 50, meaning the microphone 50 can pick up sound from the side of the electronic device 100.

[0112] In one embodiment, the second audio port 131 is located on the front of the electronic device 100, that is, the second audio port 131 faces the positive Z-axis direction. The display screen 30 has an opening communicating with the second audio port 131. At this time, external sound can be transmitted from the front of the electronic device 100 through the opening in the display screen 30 and the second audio port 131 to the microphone 50, that is, the microphone 50 can pick up sound from the front of the electronic device 100.

[0113] Please continue reading. Figure 10The electronic device 100 also includes a second sealing element 90. The second sealing element 90 seals between the motherboard 40 and the middle frame 10. In this embodiment, the second sealing element 90 is foam. In other embodiments, the second sealing element 90 may also be rubber or other structures with sealing properties. The second sealing element 90 is annular. The second sealing element 90 is provided with a fourth through hole 91. The fourth through hole 91 is located in the middle region of the second sealing element 90 and penetrates the second sealing element 90 along its thickness direction. In this embodiment, the fourth through hole 91 is a round hole. In other embodiments, the fourth through hole 91 may also be a square hole or an irregularly shaped hole.

[0114] The second sealing element 90 is disposed between the main plate 40 and the middle plate 11. The fourth through hole 91 is disposed opposite to the third through hole 43 and the second opening 132 of the second sound channel 13 along the Z direction, and communicates with the third through hole 43 and the second sound channel 13. The fourth through hole 91 completely covers the third through hole 43 and the second opening 132 along the Z direction. In other words, the second sealing element 90 is disposed around the outer periphery of the third through hole 43 and the outer periphery of the second opening 132.

[0115] The second sealing element 90 is sealed to the middle plate 11 and the main plate 40. In this embodiment, the surface of the middle plate 11 facing the main plate 40 is provided with a mounting groove 14. The second sealing element 90 is disposed in the mounting groove 14 and is sealed to the inner wall of the mounting groove 14, and the second sealing element 90 is sealed to the sixth surface 42 of the main plate 40. Specifically, one side of the second sealing element 90 is bonded and fixed to the bottom wall of the mounting groove 14, and the other side abuts against the sixth surface 42. The second sealing element 90 is press-fitted to the main plate 40 and the middle frame 10, and is in a compressed state when installed between the main plate 40 and the middle frame 10. In this way, the installation stability and sealing effect between the second sealing element 90 and the main plate 40 and the middle frame 10 can be improved, thereby improving the sealing performance of the microphone 50.

[0116] In other embodiments, one side of the second seal 90 is bonded and fixed to the main board 40, and the other side abuts against the middle frame 10. Alternatively, the second seal 90 may be bonded and fixed to both the main board 40 and the middle frame 10 simultaneously.

[0117] like Figure 10As shown, the second sound passage 13, the third through hole 43, the fourth through hole 91, and the second pickup hole 502 are sequentially connected and communicate with the outside of the electronic device 100, while being sealed from other areas inside the electronic device 100. External sound can enter the second sound passage 13 through the second sound port 131, then enter the fourth through hole 91, then enter the third through hole 43 from the fourth through hole 91, and then enter the microphone 50 from the second pickup hole 502, causing the vibrating element 52 in the microphone 50 to vibrate. The microphone 50 then converts the vibration signal into an electrical signal and transmits it to the motherboard 40, thereby realizing the sound pickup function of the microphone 50.

[0118] In this embodiment, by simultaneously providing a first pickup hole 501 and a second pickup hole 502 on the microphone 50, external sounds can enter the microphone 50 through both the first pickup hole 501 and the second pickup hole 502, thereby improving the microphone 50's sound pickup effect. Furthermore, in this embodiment, by placing the first pickup hole 501 and the second pickup hole 502 on opposite sides of the microphone 50, and placing the first sound port 2231 and the second sound port 131 at different locations on the electronic device 100, the microphone 50 can pick up sound from different directions, thus achieving bidirectional sound pickup and improving the microphone 50's directional pickup, thereby enhancing the microphone 50's sound pickup effect and improving the electronic device 100's recording effect.

[0119] like Figure 10 As shown, the electronic device 100 also includes a second dustproof component 81. In this embodiment, the second dustproof component 81 is disposed within the second sealing component 90 and is connected to the inner wall surface of the fourth through hole 91. External sound can pass through the second dustproof component 81 and enter the microphone 50, but dust and other debris cannot pass through the second dustproof component 81. The second dustproof component 81 can be a dustproof mesh or a waterproof and breathable membrane.

[0120] In this embodiment, by setting a second dustproof component 81, while ensuring the sound pickup effect of the microphone 50 inside the electronic device 100, it can also prevent external dust and other debris from entering the microphone 50 through the second sound port 131 and causing blockage of the microphone 50, thereby playing a dustproof role, improving the sound pickup effect of the microphone 50, and extending the service life of the microphone 50.

[0121] In other embodiments, the second dustproof component 81 may also be disposed within the third through hole 43, or within the second pickup hole 502, or within the second sound passage 13. The position and number of the second dustproof component 81 are not specifically limited here, as long as the second dustproof component 81 is disposed between the second pickup hole 502 and the second sound inlet hole.

[0122] Please see Figure 11 and Figure 12 , Figure 11 This is a partial cross-sectional structural schematic diagram of the electronic device 100 provided in the third embodiment of this application. Figure 12 yes Figure 11 A schematic diagram of the structure of the auxiliary seal 60 in the electronic device 100 shown.

[0123] This embodiment and Figure 3 The difference in the illustrated embodiment is that, in this embodiment, the auxiliary seal 60 is a sealing cover. The sealing cover is disposed on the outer periphery of the microphone 50 and is sealed to the mainboard 40, and the first seal 70 is sealed between the sealing cover and the bracket 23.

[0124] The auxiliary sealing element 60 includes a first top plate 62, a first side plate 63, and an extension plate 64. The first top plate 62 has a first through hole 61. The first through hole 61 extends through the first top plate 62 along its thickness direction. The first through hole 61 communicates with the first pickup hole 501 of the microphone 50. The first side plate 63 surrounds the outer periphery of the first top plate 62 and is connected to the first top plate 62 at an angle. In this embodiment, the first side plate 63 is perpendicularly connected to the first top plate 62. In other embodiments, the angle between the first top plate 62 and the first side plate 63 may be slightly greater than 90 degrees or slightly less than 90 degrees. The extension plate 64 surrounds the outer periphery of the first side plate 63 and is connected to the end of the first side plate 63 facing away from the first top plate 62. The extension plate 64 extends towards the outside of the auxiliary sealing element 60. In this embodiment, the extension plate 64 is perpendicularly connected to the first side plate 63, and the surface of the extension plate 64 is parallel or substantially parallel to the XY plane. In other embodiments, the included angle between the extension plate 64 and the first side plate 63 may be slightly greater than 90 degrees or slightly less than 90 degrees.

[0125] An auxiliary sealing member 60 covers the outer periphery of the microphone 50. An extension plate 64 faces the fifth surface 41 of the main board 40 and is fixedly and sealingly connected to the fifth surface 41. A first side plate 63 is disposed on the outer periphery of the microphone 50, and a first top plate 62 is disposed on the side of the microphone 50 facing away from the main board 40, with the first top plate 62 and the second top plate 531 arranged opposite each other along the Z direction. In this embodiment, the first top plate 62 and the second top plate 531 are spaced apart. In other embodiments, the first top plate 62 and the second top plate 531 may be in direct contact; or, the first top plate 62 and the second top plate 531 may be in partial contact and partially spaced apart. A sealing cavity 65 is formed between the auxiliary sealing member 60, the main board 40, and the microphone 50. The sealing cavity 65 communicates with the first through hole 61 and the first pickup hole 501.

[0126] In this embodiment, the first top plate 62 protrudes from the second top plate 531 along a direction parallel to the surface of the second top plate 531. That is, the outer peripheral surface of the first top plate 62 protrudes from the outer peripheral surface of the second top plate 531. In other words, the outer peripheral surface of the first top plate 62 is located on the side of the outer peripheral surface of the second top plate 531 facing away from the center of the second top plate 531. It can be understood that the first top plate 62 has an annular structure. The width of the annular first top plate 62 is greater than the width of the pickup area 533 of the second top plate 531. For example, the width of the annular first top plate 62 is greater than or equal to 1 mm. The extension plate 64 has an annular structure. For example, the width of the annular extension plate 64 is 0.5 mm to 0.6 mm, or the width of the extension plate 64 may be less than 0.5 mm. Here, the width of the annular first top plate 62 refers to the minimum distance from the inner wall of the first through hole 61 to the outer peripheral surface 2213 of the first top plate 62. The width of the annular extension plate 64 refers to the distance from the inner circumferential surface to the outer circumferential surface 2213 of the extension plate 64.

[0127] In one embodiment, the auxiliary seal 60 may not include the extension plate 64. In this case, the end of the first side plate 63 facing away from the first top plate 62 is directly fixed and sealed to the fifth surface 41 of the main board 40, so as to further reduce the sealing area between the auxiliary seal 60 and the main board 40.

[0128] The first sealing element 70 is disposed between the first top plate 62 and the bracket 23, and surrounds the outer periphery of the first through hole 61. Furthermore, the first sealing element 70 is in a sealing connection with the first top plate 62 and the bracket 23. The second through hole 71 of the first sealing element 70 communicates with the first through hole 61 of the first top plate 62, that is, the second through hole 71 communicates with the sealing cavity 65 and the first pickup hole 501.

[0129] External sounds enter the first sound passage 201 through the first sound port 2231, then through the second through hole 71, and then through the second through hole 71 into the first through hole 61. Next, they enter the microphone 50 through the first pickup hole 501, causing the vibrating element 52 in the microphone 50 to vibrate. The microphone 50 then converts the vibration signal into an electrical signal and transmits it to the motherboard 40, thereby realizing the sound pickup function of the microphone 50.

[0130] In this embodiment, by covering the microphone 50 with an auxiliary sealing member 60, and the outer peripheral surface of the first top plate 62 of the auxiliary sealing member 60 protruding from the outer peripheral surface of the second top plate 531, that is, the area of ​​the first top plate 62 is larger than the area of ​​the second top plate 531, and the first sealing member 70 is disposed between the first top plate 62 and the housing 20, the microphone 50 is sealed. This increases the sealing area, improves the sealing effect of the microphone 50, thereby improving the sound pickup effect of the microphone 50, and simplifies the sealing process of the microphone 50.

[0131] It is understandable that the sealing size required by foam or rubber sealing is greater than that required by welding or adhesive sealing. In this embodiment, a sealing cover is used as an auxiliary sealing element 60. By directly sealing the extension plate 64 of the auxiliary sealing element 60 to the main board 40, and then sealing the first sealing element 70 between the auxiliary sealing plate and the housing 20, the microphone 50 can be sealed. This reduces the space occupied by the sealing structure on the main board 40 and improves the utilization rate of the main board 40. Furthermore, in this embodiment, by fixing the auxiliary sealing element 60 to the main board 40, the main board 40 can be strengthened, thereby improving the structural strength of the main board 40.

[0132] In one embodiment, the auxiliary seal 60 is a metal component. For example, the auxiliary seal 60 may be made of aluminum alloy, copper, stainless steel, etc. In this case, the auxiliary seal 60 can also be understood as a shielding cover for the microphone 50. In this embodiment, using a metal component as the auxiliary seal 60 serves a signal shielding function, reducing or even preventing signal noise from other components within the electronic device 100 from interfering with the microphone 50, thereby improving the microphone 50's sound pickup performance. In other words, the auxiliary seal 60 in this embodiment can simultaneously provide sealing and signal shielding, simplifying the structure of the electronic device 100 and saving space within the electronic device 100.

[0133] Please see Figure 13 , Figure 13 This is a partial cross-sectional structural diagram of the electronic device 100 provided in the fourth embodiment of this application.

[0134] This embodiment and Figure 11 The difference in the illustrated embodiment is that, in this embodiment, the electronic device 100 further includes a third sealing member 1. The third sealing member 1 is disposed on the surface of the second top plate 531 facing the first top plate 62, that is, the third sealing member 1 is disposed between the first top plate 62 and the second top plate 531. The third sealing member 1 is disposed around the outer periphery of the first pickup hole 501 and the first through hole, and the third sealing member 1 is sealed to both the first top plate 62 and the second top plate 531. In this case, the extension plate 64 of the auxiliary sealing member 60 can be fixedly and sealed to the main board 40, or it can be fixedly connected but not sealed.

[0135] In this embodiment, the third sealing element 1 is an adhesive application. Specifically, adhesive can be applied around the outer periphery of the first pickup hole 501 and the first through hole 61 between the first top plate 62 and the second top plate 531 using an adhesive application process, and the adhesive can be bonded and fixed to the first top plate 62 and the second top plate 531.

[0136] When the second top plate 531 and the auxiliary seal 60 are metal parts, the third seal 1 can also be solder. Specifically, solder can be formed between the first top plate 62 and the second top plate 531 through a welding process to achieve a sealed connection between the first top plate 62 and the second top plate 531. Alternatively, the third seal 1 can also be composed of solder. In the specific formation process, the first top plate 62 and the second top plate 531 are first welded together, and then adhesive is applied between the first top plate 62 and the second top plate 531 to improve the connection stability and sealing performance between the first top plate 62 and the second top plate 531.

[0137] In other embodiments, the third seal 1 may also be other structures that can achieve a seal.

[0138] Please see Figure 14 , Figure 14 This is a partial cross-sectional structural diagram of the electronic device 100 provided in the fifth embodiment of this application.

[0139] This embodiment and Figure 11 The difference in the illustrated embodiment is that, in this embodiment, the microphone 50 also has a second pickup hole 502, and the motherboard 40 has a third through hole 43. The microphone 50 is disposed on the motherboard 40, and the second pickup hole 502 and the third through hole 43 are opposite to each other and communicate with each other. The middle frame 10 has a second sound passage 13. The second sound passage 13 includes a second sound port 131 and a second opening 132, and the second sound passage 13 communicates with the outside of the electronic device 100 and the second pickup hole 502. The electronic device 100 also includes a second sealing member 90. The second sealing member 90 has a fourth through hole 91. The second sealing member 90 seals between the motherboard 40 and the middle frame 10. The second sound passage 13, the third through hole 43, the fourth through hole 91 and the second pickup hole 502 are sequentially connected and communicate with the outside of the electronic device 100, and are sealed from other areas inside the electronic device 100.

[0140] External sounds can enter the second sound cavity 13 through the second sound port 131, then enter the fourth sound hole 91, then enter the third sound hole 43 through the fourth sound hole 91, and then enter the microphone 50 through the second sound pickup hole 502, causing the vibrating element 52 in the microphone 50 to vibrate. The microphone 50 then converts the vibration signal into an electrical signal and transmits it to the motherboard 40, thereby realizing the sound pickup function of the microphone 50.

[0141] In this embodiment, a detailed description of the middle frame 10, the second sealing member 90, the motherboard 40, and the microphone 50 can be found in [reference needed]. Figure 9 and Figure 10 The relevant description of the illustrated embodiment.

[0142] In this embodiment, by simultaneously providing a first pickup hole 501 and a second pickup hole 502 on the microphone 50, external sounds can enter the microphone 50 through both the first pickup hole 501 and the second pickup hole 502, thereby improving the microphone 50's sound pickup effect. Furthermore, in this embodiment, by placing the first pickup hole 501 and the second pickup hole 502 on opposite sides of the microphone 50, and placing the first sound port 2231 and the second sound port 131 at different locations on the electronic device 100, the microphone 50 can pick up sound from different directions, thus achieving bidirectional sound pickup and improving the microphone 50's directional pickup, thereby enhancing the microphone 50's sound pickup effect and improving the electronic device 100's recording effect.

[0143] Please see Figure 15 , Figure 15 This is a partial cross-sectional structural diagram of the electronic device 100 provided in the sixth embodiment of this application.

[0144] This embodiment and Figure 13 The difference in the illustrated embodiment is that, in this embodiment, the microphone 50 also has a second pickup hole 502, and the middle frame 10 has a second sound passage 13. The second sealing member 90 has a fourth through hole 91. The second sealing member 90 seals between the motherboard 40 and the middle frame 10. The second sound passage 13, the third through hole 43, the fourth through hole 91, and the second pickup hole 502 are sequentially connected and communicate with the outside of the electronic device 100, while being sealed from other areas inside the electronic device 100. The electronic device 100 provided in this embodiment can simultaneously pick up sound from the first pickup hole 501 and the second pickup hole 502, thereby improving the sound pickup effect of the electronic device 100.

[0145] In this embodiment, a detailed description of the middle frame 10, the second sealing member 90, the motherboard 40, and the microphone 50 can be found in [reference needed]. Figure 13 The relevant descriptions of the embodiments shown are not repeated here.

[0146] The above are merely some embodiments and implementation methods of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: Mid-frame, housing, motherboard, microphone, auxiliary seal, and first seal; The housing is provided with a first sound channel communicating with the outside of the electronic device; the housing is fixedly connected to the middle frame and together form a receiving cavity; The main board is disposed within the receiving cavity and is fixedly connected to the middle frame; The microphone includes a first surface, the first surface is provided with a first pickup hole, the microphone is disposed on the motherboard, the first surface faces the housing, and the first pickup hole faces the housing; The auxiliary seal has a first through hole that penetrates the auxiliary seal along its thickness direction; the auxiliary seal connects to and covers the first surface, and the outer peripheral surface of the auxiliary seal protrudes beyond the outer peripheral edge of the first surface, or the outer peripheral surface of the auxiliary seal is flush with the outer peripheral edge of the first surface; the auxiliary seal surrounds the first pickup hole and seals the outer periphery of the first pickup hole, and the first through hole communicates with the first pickup hole; The first sealing element has a second through hole, which penetrates the first sealing element along its thickness direction; the first sealing element is located on the side of the auxiliary sealing element facing away from the microphone and is sealed to the auxiliary sealing element, and the first sealing element is sealed to the housing; the second through hole communicates with the first through hole and the first sound channel.

2. The electronic device according to claim 1, characterized in that, The area of ​​the surface of the first seal facing the auxiliary seal is greater than or equal to the area of ​​the first surface.

3. The electronic device according to claim 2, characterized in that, The microphone is also provided with a second pickup hole, which faces the motherboard and is spaced apart from and opposite to the first pickup hole; The motherboard has a third through hole, which extends through the motherboard along its thickness direction and is connected to the second pickup hole. The middle frame is provided with a second sound channel communicating with the outside of the electronic device. The middle frame is sealed to the motherboard, and the second sound channel is connected to the third through hole.

4. The electronic device according to claim 3, characterized in that, The first sound passage includes a first sound port, which is located at one end of the first sound passage away from the second through hole; the first sound port is located on the back of the electronic device and communicates with the outside of the electronic device; The second sound passage includes a second sound port, which is located at one end of the second sound passage away from the third through hole; the second sound port is located on the side or front of the electronic device, and the second sound port communicates with the outside of the electronic device.

5. The electronic device according to claim 3, characterized in that, The electronic device further includes a second sealing element, which has a fourth through hole that extends through the second sealing element along its thickness direction; the second sealing element is sealed between the middle frame and the motherboard, and the fourth through hole connects the second sound channel and the third through hole.

6. The electronic device according to any one of claims 1 to 5, characterized in that, The auxiliary seal is sealed to the first surface.

7. The electronic device according to any one of claims 1 to 5, characterized in that, The auxiliary sealing element includes a first top plate and a first side plate. The first side plate is arranged around the outer periphery of the first top plate and is connected to the first top plate at an angle. The auxiliary sealing element covers the outer periphery of the microphone and is connected to the main board. The first through hole is provided in the first top plate, and the first sealing element seals between the first top plate and the housing.

8. The electronic device according to claim 7, characterized in that, The auxiliary seal is sealed to the mainboard.

9. The electronic device according to claim 8, characterized in that, The auxiliary sealing element also includes an extension plate, which is connected to the side of the first side plate facing away from the top plate. The extension plate is arranged around the first side plate and extends in a direction away from the microphone, and the extension plate is sealed to the main board.

10. The electronic device according to claim 7, characterized in that, The electronic device further includes a third sealing element, which is disposed on the first surface and sealed to the first surface and the first top plate, and the third sealing element is arranged around the outer periphery of the first pickup hole and the first through hole.

11. The electronic device according to claim 7, characterized in that, The auxiliary seal is a metal component.

12. The electronic device according to claim 1, characterized in that, The first seal is interference-fitted with the housing, and / or the first seal is interference-fitted with the auxiliary seal.

13. The electronic device according to claim 12, characterized in that, Along the thickness direction of the first seal, one side of the first seal is fixedly connected to the housing, and the other side of the first seal abuts against the auxiliary seal; or, one side of the first seal is fixedly connected to the auxiliary seal, and the other side of the first seal abuts against the housing.

14. The electronic device according to claim 1, characterized in that, The auxiliary sealing element is a metal or plastic part; the first sealing element is foam, rubber or thermoplastic elastomer.

15. The electronic device according to claim 4, characterized in that, The first sound passage includes a first segment and a second segment connected to each other, the first segment and the second segment are connected at an angle, and the end of the first segment facing away from the second segment faces the outside of the electronic device; along the extension direction perpendicular to the first sound passage, the cross-sectional area of ​​the first segment is smaller than the cross-sectional area of ​​the second segment.

16. The electronic device according to claim 1, characterized in that, The first acoustic cavity includes a first channel and a second channel that are interconnected. The housing includes a back cover, a camera trim, and a bracket; The rear cover is provided with mounting holes, the camera decorative piece is disposed in the mounting holes and is sealed to the rear cover, and the first channel is disposed in the camera decorative piece; The second channel is disposed on the bracket; the bracket is disposed between the camera decorative piece and the first sealing piece, and is sealed to the camera decorative piece and the first sealing piece; the second channel communicates with the first channel and the second through hole.

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