A semiconductor package structure and a semiconductor chip

Abstract

This invention relates to the field of semiconductor packaging technology. The invention discloses a semiconductor packaging structure and a semiconductor chip, including a substrate. An encapsulation layer is disposed on the outside of the substrate. Multiple bosses are distributed on one side of the encapsulation layer, and at least one connection hole is provided on the encapsulation layer. A protrusion is provided at the opening of the connection hole. By integrating the bosses into the package, a separate support bracket is eliminated, simplifying the bill of materials and reducing management costs. During assembly, the bosses can be directly used for positioning, reducing processes, simplifying procedures, and improving production efficiency. Eliminating the support bracket frees up space, allowing for a more compact layout of the control board and providing more space for other components, thus improving space utilization. The integrally formed bosses have no connection gaps, resulting in better structural rigidity and enhanced stability and reliability after installation.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a semiconductor packaging structure and a semiconductor chip. Background Technology

[0002] Currently, semiconductor circuits, whether discrete devices or highly integrated products, all employ planar packaging designs. However, planar designs require additional brackets during the mounting process on the control board, which not only increases costs and reduces production efficiency but also occupies space on the control board, and other circuits cannot be placed beneath the brackets. Furthermore, when planar packages are mounted to heat sinks, they mainly rely on brackets for fixation or screw installation. Screw installation is prone to causing chipping at the edges of the package, and the disassembly and assembly process is cumbersome. Additionally, discrete devices share large heat sinks, resulting in low heat dissipation efficiency and low space utilization efficiency, making it difficult to meet the market demands for miniaturization and high integration. It is evident that existing technologies still need improvement and enhancement. Summary of the Invention

[0003] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a semiconductor packaging structure that, by providing multiple boss structures on a substrate, facilitates connection with an electronic control board or heat sink without affecting the integrated installation of components.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: A semiconductor packaging structure includes a substrate, an encapsulation layer disposed on the outside of the substrate, a plurality of protrusions distributed on one side of the substrate, at least one connection hole disposed on the encapsulation layer, and a protrusion disposed on the encapsulation layer at the opening of the connection hole.

[0005] In the semiconductor packaging structure, there are four bosses, which are distributed at the four corners of the packaging layer, and the connection holes are located between adjacent bosses.

[0006] In the semiconductor packaging structure, the top surface area of ​​the boss is smaller than the bottom surface area, and the sidewalls of the top and bottom surfaces of the boss are connected by a slope transition.

[0007] In the semiconductor packaging structure, at least one anti-overflow hole is provided on the packaging layer.

[0008] In the semiconductor packaging structure, a plurality of support platforms for mounting heat sinks are distributed on the side of the packaging layer away from the boss portion.

[0009] In the semiconductor packaging structure, the top surface of the support platform has multiple grooves.

[0010] In the semiconductor packaging structure, a screw portion is provided at the bottom of the boss portion, and a screw hole is provided on the packaging layer to cooperate and connect with the screw portion.

[0011] In the semiconductor packaging structure, a groove is provided at the bottom of the protrusion, and a slider that cooperates with and connects to the groove is provided on the packaging layer.

[0012] In the semiconductor packaging structure, there are four support platforms, which are distributed at the four corners of the side of the packaging layer away from the protrusion.

[0013] This application also provides a semiconductor chip, which includes the semiconductor packaging structure described above.

[0014] Beneficial effects: This invention provides a semiconductor packaging structure. Because the boss is an integral part of the package itself, the separate procurement, storage, and management of independent brackets are eliminated, thus simplifying the bill of materials and helping to reduce material management costs and pre-assembly material preparation costs. Secondly, on the assembly line, operators or automated equipment do not need to perform additional bracket installation steps; the boss can directly position the package on the control board, thereby reducing processes, simplifying the assembly flow, and improving production efficiency to some extent. Furthermore, by eliminating the independent bracket between the package and the control board, the horizontal and vertical space previously occupied by brackets and their fasteners is freed up. This not only allows for a more compact layout of the control board but also provides more space for arranging other components within the package's projection area and on both sides of the control board, thereby improving the overall space utilization of the control board. In addition, the integrated boss eliminates connection gaps or loosening issues between the molded boss and the package, and its structural rigidity is generally superior to that of brackets assembled later, contributing to improved overall stability and reliability after installation. Attached Figure Description

[0015] Figure 1 A schematic diagram of the first embodiment of the semiconductor packaging structure provided by the present invention. Figure 1 ; Figure 2 A schematic diagram of the first embodiment of the semiconductor packaging structure provided by the present invention. Figure 2 ; Figure 3 A schematic diagram of the first embodiment of the semiconductor packaging structure provided by the present invention. Figure 3 ; Figure 4 A schematic diagram of the second embodiment of the semiconductor packaging structure provided by the present invention. Figure 1 ; Figure 5A schematic diagram of the second embodiment of the semiconductor packaging structure provided by the present invention. Figure 2 ; Figure 6 A schematic diagram of the third embodiment of the semiconductor packaging structure provided by the present invention. Figure 1 ; Figure 7 A schematic diagram of the third embodiment of the semiconductor packaging structure provided by the present invention. Figure 2 .

[0016] Explanation of main component symbols: 1-Encapsulation layer, 2-Boss part, 3-Connecting hole, 4-Protrusion part, 5-Anti-overflow hole, 6-Support platform, 7-Screw part, 8-Screw hole, 9-Groove, 10-Slider. Detailed Implementation

[0017] This invention provides a semiconductor packaging structure and a semiconductor chip. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention.

[0018] In the description of this invention, it should be understood that the terms "middle," "inner side," "outer side," etc., indicate the orientation or positional relationship of this invention based on the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0019] The semiconductor packaging structure of this application will be described in detail below with reference to specific embodiments.

[0020] Please see Figures 1 to 3 This invention provides a first embodiment of a semiconductor packaging structure, comprising a substrate. An encapsulation layer 1 is disposed on the exterior of the substrate, which encapsulates and protects the circuits and components on the substrate. Multiple protrusions 2 are distributed on one side of the encapsulation layer 1. These protrusions 2 protrude outward from the surface of the encapsulation layer 1. By providing the protrusions 2, when the packaging structure is mounted to an electronic control board, the protrusions 2 can cooperate with corresponding structures on the electronic control board, thereby helping to reduce or eliminate the reliance on additional mounting brackets. This can reduce assembly costs to some extent and improve production efficiency. At the same time, due to the reduction in the use of brackets, the space utilization on the electronic control board is more flexible.

[0021] In this embodiment, since the boss 2 is an integral part of the package itself, the separate procurement, storage, and management of independent brackets are eliminated, simplifying the bill of materials and helping to reduce material management costs and pre-assembly material preparation costs. Secondly, on the assembly line, operators or automated equipment do not need to perform additional bracket installation steps; the package can be directly positioned on the control board via the boss 2, thereby reducing processes, simplifying the assembly process, and improving production efficiency to some extent. Furthermore, by eliminating the independent bracket between the package and the control board, the horizontal area and three-dimensional space originally occupied by the bracket and its fasteners are freed up. This not only makes the layout of the control board more compact but also provides more possibilities for arranging other components within the package's projection area and on both sides of the control board, thus improving the overall space utilization of the control board. In addition, there are no connection gaps or loosening issues between the integrally formed boss 2 and the package, and its structural rigidity is generally superior to that of brackets assembled later, which helps to improve the overall stability and reliability after installation.

[0022] Furthermore, when the encapsulation layer 1 is made of epoxy resin and the encapsulation process is carried out by one-time injection molding, in order to reduce the injection defects caused by the boss part 2, the flowability can be improved by reducing the resin particle diameter, extending the gelation time, increasing the spiral flow length, and deepening the injection port depth to avoid injection defects.

[0023] The specific working principle is as follows: The bosses 2 are directly formed as part of the encapsulation layer 1, becoming an integrated structure protruding outward from the encapsulation surface. When this encapsulation structure needs to be installed onto the control board, these bosses 2 can directly abut against or embed into the corresponding positioning holes or recesses on the control board. In this process, the bosses 2 assume the mechanical support and positioning functions of a traditional independent bracket. Through the direct cooperation between the bosses 2 and the control board, the installation height and planar position of the encapsulation relative to the control board can be determined, thereby providing a stable reference for subsequent soldering or fastening operations.

[0024] In one embodiment, the encapsulation layer 1 also has at least one connection hole 3. This connection hole 3 can be used to pass wires through or provide a connection point with other components. To make the structure at the connection hole 3 more stable, the encapsulation layer 1 has a protrusion 4 at the opening of the connection hole 3. This protrusion 4 surrounds the opening and can guide and limit the connector entering the connection hole 3, making the connection process smoother and reducing damage to the edge of the opening. In addition, the connection hole 3 can be provided with a screw hole 8 for bolt connection with the control board. The protrusion 4 increases the strength of the connection hole 3 and prevents chipping of the encapsulation during screw installation.

[0025] In one specific arrangement, four bosses 2 are provided. These four bosses 2 can be distributed at the four corners of the surface of the encapsulation layer 1. This symmetrical distribution helps to achieve balanced support during installation. The connecting holes 3 can be located in the area between two adjacent bosses 2. This layout ensures that the connection and support functions do not interfere with each other spatially, resulting in a more reasonable structural arrangement. At the same time, it effectively enhances the strength of the connecting holes 3, preventing edge chipping during connection and installation. Meanwhile, the bosses 2 and protrusions 4 surround the entire circumferential layout of the front side of the substrate, eliminating the need for additional brackets during the installation of the electronic control board, thus achieving support and fixation of the substrate on the electronic control board. More importantly, the enclosed space formed can be used to house core components such as MCUs, protecting these components and improving product reliability.

[0026] Regarding the shape of the boss portion 2, its top surface area can be set to be smaller than its bottom surface area. That is, the cross-sectional dimensions of the boss portion 2 gradually taper outward from the surface of the encapsulation layer 1. Furthermore, the sidewalls between the top and bottom surfaces of the boss portion 2 are connected by a slope. This slope design makes the boss portion 2 trapezoidal, which provides a guiding effect when inserting or positioning with other components, making installation and alignment easier. The inclination angle of the slope is between 3° and 20°, and the height of the boss portion 2 is positively correlated with the inclination angle; that is, the higher the boss portion 2, the larger the inclination angle, thus ensuring smooth mold flow and reducing the risk of air bubble formation. At the same time, the slope has a venting function, which can prevent filling defects caused by trapped air. In addition, the slope can reduce stress concentration and enhance the mechanical reliability of the encapsulation structure. The top plane dimension of the boss portion 2 is smaller than the bottom plane dimension, forming a stable structure that is narrower at the top and wider at the bottom, which helps to disperse stress and improve structural strength, while also achieving good demolding effect.

[0027] To further optimize the encapsulation process, at least one anti-overflow hole 5 can also be provided on the encapsulation layer 1. During the encapsulation process, the molten encapsulation material may flow. The anti-overflow hole 5 can provide a certain channel for the excess encapsulation material to be contained or flow, thereby helping to reduce the impact of overflow on the structural accuracy of the boss part 2, connecting hole 3, etc., and making the structural dimensions after encapsulation more regular.

[0028] like Figures 4 to 5As shown in the second embodiment of the invention, multiple support platforms 6 can be distributed on the side of the encapsulation layer 1 away from the boss 2, i.e., the side opposite to where the boss 2 is located. These support platforms 6 provide support when the heat sink is installed, creating a gap between the heat sink and the main body of the encapsulation layer 1. This gap can serve as a heat dissipation channel, thereby helping to improve heat dissipation efficiency. To further enhance heat conduction between the heat sink and the support platform 6, multiple grooves can also be distributed on the top surface of the support platform 6. The grooves increase the surface area of ​​the contact surface between the support platform 6 and the heat sink, and may accommodate a heat-conducting medium, thus improving heat transfer efficiency. In a specific arrangement, the number of support platforms 6 can also be four, distributed at the four corners of one side of the encapsulation layer 1 to provide stable support.

[0029] In addition, such as Figures 6 to 7 As shown, there are multiple embodiments of the connection between the boss portion 2 and the encapsulation layer 1. In a third embodiment, a screw portion 7 may be provided at the bottom of the boss portion 2. Correspondingly, a screw hole 8 is provided on the encapsulation layer 1 to engage with the screw portion 7. By screwing the screw portion 7 into the screw hole 8, a detachable connection between the boss portion 2 and the encapsulation layer 1 can be achieved. This method facilitates the replacement or maintenance of the boss portion 2. In another embodiment, to ensure a stable connection between the boss portion 2 and the encapsulation layer 1, a groove 9 may be provided at the bottom of the protrusion portion 4. At the same time, a slider 10 is provided on the encapsulation layer 1 to engage with the groove 9. Through the snap-fit ​​engagement between the slider 10 and the groove 9, the protrusion portion 4 can be firmly positioned at the opening of the connection hole 3.

[0030] In summary, regarding installation and integration, by integrating the boss 2 onto the encapsulation layer 1, this structure can directly mate and position with the electronic control board, reducing or eliminating reliance on independent mounting brackets. This not only simplifies material management and procurement processes and reduces the direct and indirect costs of assembly materials, but also simplifies the assembly process of the electronic control board, thereby improving overall production efficiency. Simultaneously, it frees up the space occupied by traditional brackets, providing greater flexibility for the layout of other components on the electronic control board, which is conducive to achieving higher density and smaller-scale integration of electronic products.

[0031] In terms of connection reliability and manufacturability, the protrusion 4 at the opening of the connection hole 3 guides and protects the connector, making the electrical connection more stable and reliable. The anti-overflow hole 5 helps control material flow during the encapsulation process, improves the consistency of the package structure dimensions, and plays a positive role in ensuring the accuracy of structures such as the boss 2.

[0032] Regarding heat dissipation and mechanical stability, the support platform 6 located on the other side of the encapsulation layer 1 can form an effective airflow channel when the heat sink is installed, thereby improving heat dissipation efficiency. The groove design on the top surface of the support platform 6 increases the heat dissipation contact area, which helps to further improve heat dissipation performance. In addition, the boss part 2 is detachably connected to the encapsulation body through a structure such as a screw or a slide 9, which provides convenience for installation, debugging and maintenance.

[0033] This application also provides a semiconductor chip that includes the semiconductor packaging structure described above. When applied to applications such as electronic control boards, the semiconductor chip with this packaging structure offers improved ease of installation and space utilization efficiency.

[0034] It is understood that those skilled in the art can make equivalent substitutions or modifications to the technical solution and inventive concept of the present invention, and all such substitutions or modifications should fall within the protection scope of the appended claims.

Claims

1. A semiconductor packaging structure, characterized in that, The device includes a substrate, an encapsulation layer is disposed on the outside of the substrate, the encapsulation layer has a plurality of protrusions distributed on one side of the substrate, at least one connection hole is disposed on the encapsulation layer, and a protrusion is disposed on the encapsulation layer at the opening of the connection hole.

2. The semiconductor packaging structure according to claim 1, characterized in that, The number of the bosses is four, and the four bosses are distributed at the four corners of the encapsulation layer, and the connecting holes are located between adjacent bosses.

3. A semiconductor packaging structure according to claim 1, characterized in that, The top surface area of ​​the boss is smaller than the bottom surface area, and the sidewalls of the top and bottom surfaces of the boss are connected by a slope transition.

4. A semiconductor packaging structure according to claim 1, characterized in that, The encapsulation layer is provided with at least one anti-overflow hole.

5. A semiconductor packaging structure according to claim 1, characterized in that, The encapsulation layer has multiple support platforms for mounting heat sinks distributed on the side away from the boss portion.

6. A semiconductor packaging structure according to claim 5, characterized in that, The top surface of the support platform has multiple grooves.

7. A semiconductor packaging structure according to claim 1, characterized in that, The bottom of the boss is provided with a screw part, and the encapsulation layer is provided with a screw hole that mates with the screw part.

8. A semiconductor packaging structure according to claim 1, characterized in that, The bottom of the protrusion is provided with a groove, and the encapsulation layer is provided with a slider that is connected to the groove.

9. A semiconductor packaging structure according to claim 5, characterized in that, The number of support platforms is four, and the four support platforms are distributed at the four corners of the side of the encapsulation layer away from the boss portion.

10. A semiconductor chip, characterized in that, Includes the semiconductor packaging structure as described in any one of claims 1-9.

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