A dust-proof beauty mask

Abstract

The dustproof beauty mask relates to the cosmetic technical field, including the mask body of the silicone rubber material, the FPC circuit board arranged in the recess of the mask body, the illuminator arranged on the FPC circuit board, the transparent protective layer of the silicone rubber material covering the FPC circuit board and the illuminator, the anti-static cloth is arranged on the outer side of the mask body, the hot melt adhesive film is arranged between the anti-static cloth and the outer side of the mask body, the illuminator is a semiconductor illuminator, more than one semiconductor illuminator constitutes a group of illuminator groups, the illuminator groups are uniformly distributed on the FPC circuit board, and the semiconductor illuminator is fixed on the FPC circuit board through the die bonding technology.Compared with the prior art, the dustproof mask has the advantages that the silicone rubber static level can be effectively reduced, the mask body appearance pattern is enriched, the density of the illuminator can be increased, the uniformity of illumination can be improved, the mask thickness can be significantly reduced to facilitate modeling, the material consumption can be reduced, and the manufacturing cost can be reduced.

Description

Technical Field

[0001] This invention relates to the field of beauty technology, and in particular to dustproof beauty masks. Background Technology

[0002] Existing LED beauty masks generally consist of a silicone cover and an LED light source mounted on the silicone cover. Due to the properties of the silicone cover, it is easy to attract dust due to static electricity during use or storage. Moreover, it is not easy to reduce the static electricity level of the silicone through modification technology. Furthermore, due to the properties of silicone, it is not easy to firmly print patterns on the silicone surface to enrich the aesthetics of the mask. In addition, LED beauty masks use light waves of different wavelengths (such as red light, blue light, yellow light, etc.) to penetrate deep into various layers of the skin. Through photobiological regulation mechanisms, they stimulate cells to produce ATP, accelerate blood circulation, cell renewal and collagen synthesis, and achieve non-invasive skin care. Existing LED beauty masks consist of an LED light composed of a base and semiconductor light-emitting elements fixed on the base. The base has power pins leading out from the bottom. For example, three semiconductor light-emitting elements emitting three colors are fixed on the base and connected to the circuit on the base. There are three sets of leads at the bottom of the base connected to the circuit. Because the semiconductor light-emitting elements are very small, precision equipment and the precision surface of the base are required to reliably connect the circuit. However, it is easy to connect the three sets of leads from the base to the FPC circuit board inside the beauty mask and to ensure the reliability of the connection. Although using base-type LED lights ensures reliable connection, the space occupied by the base restricts the layout design of the LED lights, reduces the density of light-emitting points, and affects the intensity of light, thus affecting the cosmetic effect. At the same time, insufficient light divergence causes the light to hit the skin in multiple local areas, which can easily cause uneven lighting and uneven treatment. Moreover, the presence of the base raises the starting position of the light, preventing the light from being effectively reflected from the bottom surface of the mask, thereby increasing the local concentration of light and exacerbating the uneven lighting. In addition, the presence of the base results in a thicker beauty mask, which not only increases the material and manufacturing costs, but also affects the mask's curvature and shape, hindering its ability to fit snugly against the face and ensure the desired beauty effect. Summary of the Invention

[0003] The purpose of this invention is to provide a dustproof beauty mask that overcomes one or more of the above-mentioned disadvantages, effectively reduces the static electricity level of silicone, enriches the shape pattern of the mask, increases the density of the light source, improves the uniformity of light illumination, significantly reduces the thickness of the mask to facilitate shaping, and reduces the amount of material used, thereby reducing manufacturing costs.

[0004] The dustproof beauty mask of this invention is implemented as follows: it includes a mask body made of silicone rubber, an FPC circuit board set in a groove in the mask body, a light-emitting element set on the FPC circuit board, and a transparent protective layer of silicone rubber covering the FPC circuit board and the light-emitting element. Its special feature is that an anti-static cloth is provided on the outer side of the mask body, and a hot melt adhesive film is provided between the anti-static cloth and the outer side of the mask body. The hot melt adhesive film is heated and melted, bonding the outer side of the mask body to the anti-static cloth. The light-emitting element is a semiconductor light-emitting element, and one or more semiconductor light-emitting elements constitute a group of light-emitting elements. The groups of light-emitting elements are evenly distributed on the FPC circuit board, and the semiconductor light-emitting elements are fixed to the FPC circuit board using die bonding technology.

[0005] By using hot melt adhesive film for heating and bonding, the antistatic cloth can be effectively bonded to the outer side of the mask body. At the same time, it avoids the problem of adhesive seeping out of the outer surface of the antistatic cloth and affecting the decorative effect of the antistatic cloth when using other types of flowing adhesives. The antistatic cloth is designed because the fibers used in the fabric are technically mature modified fibers with antistatic properties. Therefore, while ensuring the achievement of the invention objective of this patent application, the weaving cost is low. Moreover, the antistatic cloth can be enriched with patterns and colors on the surface of the fabric through weaving and dyeing processes, thereby enriching the shape and pattern of the cover. Semiconductor light emitters are thin and small, with small electrode contact surfaces. Therefore, existing technologies require a base platform to ensure high flatness of the welding surface, thereby ensuring the accuracy and reliability of welding between the semiconductor light emitter electrodes and the circuit board on the base. At the same time, the stable shape of the base ensures that the electrode welds will not fall off due to subsequent frequent movements (such as bending). However, its disadvantages are as described in the background art. Using the technology of this patent application, thin and small semiconductor light emitters are directly soldered onto the FPC circuit board. Each group of light emitters occupies a small area, thus enabling high-density arrangement of light emitter groups. Moreover, because the semiconductor light emitters are very thin, after emitting light, a large portion of the emitted light, except for the part that is directly emitted, will hit the FPC circuit board and be reflected by the FPC circuit board, so that the entire working surface of the mask emits a surface beauty light, rather than a point beauty light. Using a precision-flat mold, the FPC circuit board is tightly attached to the precision-flat surface of the mold, thus ensuring that the flexible FPC circuit board is laid flat into a precision plane. The semiconductor light-emitting element can be reliably soldered to the FPC circuit board using a die bonder. Then, the transparent protective layer of silicone rubber covers the board, so even if it is bent during use due to the need for shaping, the solder connection structure will not be damaged. Moreover, under the double protection of the silicone rubber mask and the transparent protective layer of silicone rubber, bending during use is prevented, avoiding the circuit board from breaking or the solder connection structure from being damaged due to bending of the FPC circuit board. Without a base, the overall thickness of the mask is significantly reduced. This reduces material usage and manufacturing costs. Furthermore, the thinner mask makes it easier to shape, allowing it to fit the face more closely and enhancing the cosmetic effect.

[0006] Compared with existing technologies, this invention has the advantages of effectively reducing the static electricity level of silicone, enriching the shape pattern of the mask, increasing the density of the light source, improving the uniformity of light illumination, significantly reducing the thickness of the mask to facilitate shaping, and reducing the amount of material used, thereby reducing manufacturing costs. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of the structure of the dustproof beauty mask of the present invention; Figure 2 for Figure 1 A partial view of point A; Figure 3 for Figure 2 BB cross-sectional view.

[0008] Explanation of reference numerals in the attached drawings: 1-Mask body; 101-Four edges; 2-Groove; 3-FPC circuit board; 4-Light emitter; 401-Semiconductor light emitter; 5-Transparent protective layer; 6-Eye opening; 601-Eye opening edge; 7-Nose opening; 701-Nose opening edge; 8-Mouth opening; 801-Mouth opening edge; 9-Cover; 10-Perforation; 11-Ear; 12-Antistatic cloth; 13-Hot melt adhesive film. Detailed Implementation

[0009] The dustproof beauty mask of the present invention will now be described in further detail with reference to the accompanying drawings and embodiments: like Figure 1 , 2As shown, the dustproof beauty mask of the present invention is implemented as follows: It includes a mask body 1 made of silicone rubber, an FPC circuit board 3 disposed within a groove 2 of the mask body 1, a light-emitting element 4 disposed on the FPC circuit board 3, and a transparent protective layer 5 made of silicone rubber covering the FPC circuit board 3 and the light-emitting element 4. The mask body 1 has a pair of matching eye openings 6, nose openings 7, and mouth openings 8 corresponding to the eyes, nose, and mouth of a human face. Two cover plates 9 are connected to the nose openings 7. The eye opening edges 601 of the pair of eye openings 6, the nose opening edges 701 of the nose openings 7 (not covered by cover plates 9), the mouth opening edges 801 of the mouth openings 8, and the surrounding edges 101 of the mask body 1 form flanges, with grooves 2 formed within the flanges. The FPC circuit board 3 with the light-emitting element 4 and the transparent protective layer 5 made of silicone rubber are sequentially disposed within the grooves 2. Ears 11 with perforations 10 for connecting straps are provided on the top and bottom of both sides of the mask body 1. Figure 2 , 3 As shown, its special feature is that an antistatic cloth 12 is provided on the outer side of the mask body 1, and a hot melt adhesive film 13 is provided between the antistatic cloth 12 and the outer side of the mask body 1. The hot melt adhesive film 13 is heated and melted to bond the outer side of the mask body 1 to the antistatic cloth 12. The light source 4 is a semiconductor light source group. One or more semiconductor light sources 401 constitute a group of light sources 4. The groups of light sources are evenly distributed on the FPC circuit board 3. The semiconductor light sources 401 are fixed on the FPC circuit board 3 by die bonding technology.

[0010] Preferably, such as Figure 2 , 3 As shown, each light-emitting group consists of three semiconductor light-emitting bodies 401 that emit red, yellow, and blue colors respectively and are arranged side by side. The surface of the FPC circuit board 3 is a white reflective surface. The light-emitting body group is set in the middle of the frame printed on the FPC circuit board 3. The frame is set to facilitate the accurate positioning of the semiconductor light-emitting bodies 401 in the die bonding process.

Claims

1. A dustproof beauty mask, comprising a mask body made of silicone rubber, an FPC circuit board disposed within a groove in the mask body, a light-emitting element disposed on the FPC circuit board, and a transparent protective layer of silicone rubber covering the FPC circuit board and the light-emitting element, characterized in that, An antistatic cloth is provided on the outer side of the mask body, and a hot melt adhesive film is provided between the antistatic cloth and the outer side of the mask body. The hot melt adhesive film is heated and melted to bond the outer side of the mask body to the antistatic cloth. The light source is a semiconductor light source. One or more semiconductor light sources constitute a group of light sources. The groups of light sources are evenly distributed on the FPC circuit board. The semiconductor light sources are fixed on the FPC circuit board by die bonding technology.

2. The improved structure of the beauty mask according to claim 1, characterized in that, Each group of light emitters consists of three semiconductor light emitters that emit red, yellow, and blue colors respectively.

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