Ring encapsulation process, smart ring, and ring kit

By using injection molding to integrate the functional modules with the shell, the problem of poor sealing in smart rings is solved, achieving improved sealing performance and structural strength, and simplifying the production process.

CN122323461APending Publication Date: 2026-07-03GEER TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GEER TECH CO LTD
Filing Date
2026-04-21
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

The existing smart rings have separate housings and functional modules, resulting in poor sealing, easy water leakage, and the need for additional seals or adhesives, which affects reliability and service life.

Method used

The functional integration module is directly formed into the shell as an insert by using injection molding process, so that the shell and the module are integrally formed. A continuous, interface-free sealing layer is formed on the periphery and inner periphery of the module by low temperature molding material to avoid assembly gaps.

Benefits of technology

It improves the overall sealing performance and structural strength of the smart ring, simplifies the manufacturing process, reduces production costs, and avoids problems such as poor sealing and loose structure.

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Abstract

This invention relates to the field of smart wearable device technology, and particularly to a ring encapsulation process, a smart ring, and a ring kit. The ring encapsulation process includes: placing a functional integrated module as an insert into an injection mold; performing an injection molding process on the functional integrated module to form a shell around its periphery; the shell encapsulating the functional integrated module and being integrally formed with it. The main objective of this invention is to provide a ring encapsulation process that improves the sealing between the shell and the functional integrated module.
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