A circuit board solder paste thickness detection device

Abstract

This invention discloses a circuit board solder paste thickness detection device, belonging to the field of solder paste thickness detection technology. It includes a side clamp assembly mounted on a side support, rigid rods symmetrically fixed on both sides of the detector, a roller rotatably mounted on the rigid rods, and a leveling assembly mounted on the side clamp assembly and rigid rods that moves with the detector and adaptively pulls down the corresponding upturned sides of the circuit board. This invention can adaptively raise and pull down the sides of the circuit board at the corresponding position according to the position of the detector beam, and raise and lower the middle recess, ensuring that the area where the detector beam illuminates the circuit board is at a reference height with no obstruction above. This improves the accuracy and comprehensiveness of solder paste thickness detection, while other areas remain untreated to prevent over-correction of the circuit board and unnecessary damage.

Description

Technical Field

[0001] This invention relates to the field of solder paste thickness detection technology, specifically to a circuit board solder paste thickness detection device. Background Technology

[0002] In surface mount technology (SMT) manufacturing, the quality of solder paste printing directly affects the reliability of component soldering. Solder paste thickness is a key control indicator. Currently, the mainstream method for solder paste thickness measurement is three-dimensional optical inspection, mainly including laser triangulation and structured light phase measurement. The basic principle is as follows: traditional optical inspection methods typically assume a flat, ideal plane and use this imaginary plane as a reference for measuring solder paste thickness. Then, structured light is projected onto the solder paste surface at a specific angle. Utilizing the optical triangulation relationship where the height difference between the solder paste and the substrate causes a shift in the image position of the reflected light, the height information is calculated by determining the displacement.

[0003] However, in actual production, due to the difference in the coefficients of thermal expansion between the upper and lower layers of the circuit board (such as the insulating layer and the circuit layer), the circuit board often exhibits slight warping, typically manifested as a "smiley face" shape (i.e., the sides are upturned and the middle is concave). Although warping is difficult to observe directly with the naked eye within a certain range and does not affect the functionality of the circuit board, it will disrupt the height reference preset by the testing instrument, causing the calculated solder paste thickness value to include the warping amount, thereby reducing the measurement accuracy.

[0004] In existing technologies, to solve the above problems, clamps are typically used to hold the circuit board on both sides to prevent it from tilting, while ejector pins are used to push the recessed area in the middle to a reference height. However, this method results in the solder paste area being blocked by the upper clamping plate being undetectable, affecting the comprehensiveness of the detection.

[0005] To address the aforementioned issues, there is an urgent need for innovative designs based on existing circuit board solder paste thickness detection devices. Summary of the Invention

[0006] The present invention addresses the problem that existing technical solutions are too simplistic and provides a solution that is significantly different from existing technologies. Specifically, the present invention aims to provide a circuit board solder paste thickness detection device to solve the problem mentioned in the background art that slight warping of the circuit board will destroy the preset height reference of the detector, and existing solutions will result in the inability to detect solder paste areas blocked by the upper clamping plate.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a circuit board solder paste thickness detection device, comprising an equipment cabinet, a detector slidably mounted above the equipment cabinet via a horizontal rail, and side support members symmetrically mounted on the equipment cabinet via a vertical rail, characterized in that it further comprises: The side clamp assembly is set on the side support, the rigid rods are symmetrically fixed on both sides of the detector, the rollers are rotated and sleeved on the rigid rods, and the leveling assembly is set on the side clamp assembly and the rigid rods to follow the movement of the detector and adaptively pull down the corresponding position of the circuit board on the upturned side. The side clamp assembly includes a limiting rod fixed on the side support, a side push plate movably mounted on the limiting rod via an I-shaped slide rail, a first telescopic rod mounted on one side of the side push plate, and a first rectangular plate fixed to one end of the first telescopic rod. The leveling assembly includes a second telescopic rod fixed to a rigid rod, a guide roller rotatably mounted on the top of the second telescopic rod, a second rectangular plate movably mounted on one side of the first rectangular plate, and a guide plate fixed to the lower end of the other side of the second rectangular plate.

[0008] Preferably, a conveyor belt is provided on the inner side of both sets of side support members; The equipment cabinet is movably connected to an upper push plate via a cylinder. The push plate and the conveyor belt are staggered, close to each other but not in contact.

[0009] Preferably, the side clamp assembly further includes an electric push rod fixed to one side of the side support member by a support frame; The piston end of the electric push rod is fixedly connected to one side of the side push plate; A clamping component is fixed to the upper end of the other side of the second rectangular plate; The clamping members are provided in several groups, and the several groups of clamping members are equally distributed in a linear array. The clamping member consists of a short rod fixed at one end to the second rectangular plate and a square plate fixed at the other end of the short rod; The surface of the square plate is smooth and has been polished. Several groups of square plates are closely distributed without gaps; The clamping member is located above the side support member, and there is a clear gap between the bottom surface of the clamping member and the top surface of the side support member.

[0010] Preferably, the first telescopic rod is provided in several groups, and the several groups of the first telescopic rod are equally distributed in a linear array. The No. 1 telescopic rod consists of an outer cylinder with one end fixed to the side push plate and an inner rod that is movably inserted into the outer cylinder. The other end of the inner rod is fixedly connected to the first rectangular plate; A spring is fixed between the inner wall of the outer cylinder and one end of the first telescopic rod.

[0011] Preferably, an I-beam slider is fixed on one side of the second rectangular plate; The first rectangular plate has a groove inside that is adapted to the I-shaped slider, and the I-shaped slider slides in the groove. A No. 3 spring is fixed between the bottom of the I-shaped slider and the inner wall of the No. 1 rectangular plate.

[0012] Preferably, both the second rectangular plate and the guide plate are provided in several groups; The guide plate has inclined surfaces on both sides and a flat surface in the middle; The guide plates in several groups are configured as comb-shaped and are interlocked and movably connected.

[0013] Preferably, the roller is located between the two sets of side supports; The side of the roller is very close to the side wall of the upper push plate, but there is still a gap; The surfaces of the side support and the upper push plate are provided with through grooves; The rigid rod moves through the inside of the through slot.

[0014] Preferably, the second telescopic rod consists of a sleeve rod whose bottom is fixed to a rigid rod and a sliding rod that is movably inserted into the sleeve rod; A second spring is fixed between the inner wall of the sleeve rod and the bottom of the slide rod; The elastic force of spring number two is significantly greater than that of spring number three.

[0015] Preferably, the surface of the guide roller is polished; The height of the guide roller is lower than the height of the top surface of the guide plate; The guide roller moves along the surface of the guide plate.

[0016] Compared with the prior art, the beneficial effects of the present invention are: This invention employs a side-clamping method to hold the circuit board on both sides, exposing all the solder paste on the top of the circuit board to the detector, thus improving the comprehensiveness of solder paste thickness detection. Simultaneously, guide rollers move with the detector, sequentially pulling several sets of clamping components down to their limits, meaning the side of the circuit board is tightly pressed against the top of the push plate. This forces down any warped sides of the circuit board, ultimately aligning them with a reference height. At this point, a certain position on the side of the circuit board pulled down to the reference height is precisely aligned with the detector's beam, while the slightly concave parts in the middle of the circuit board are lifted up to the reference height by the rollers. This invention can adaptively lift and pull down the sides of the circuit board at corresponding positions according to the location of the detector's beam, and lift the concave parts in the middle, ensuring that the area illuminated by the detector's beam is at the reference height with no obstruction above, thereby improving the accuracy and comprehensiveness of solder paste thickness detection. Other areas are left untreated to prevent over-correction of the circuit board and unnecessary damage.

[0017] Note: For circuit boards that are warped within a reasonable range, after smoothing out the sides, the middle part of the circuit board can automatically recover a little due to its own stress distribution, but it is still in a very slight warped state. Therefore, the bottom of the circuit board needs to be lifted up with rollers. Similarly, if the bottom of the circuit board only has an upward lifting device and no clamping and fixing structure, the circuit board cannot be successfully corrected. Considering that it is necessary to keep the area irradiated by the detector on the circuit board flat and at the reference height, and to prevent the solder paste on the sides of the circuit board from being blocked, this invention adopts a side clamping fixation method, which is used to straighten the sides and the middle together following the changes in the beam of the detector. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the first three-dimensional structure of the present invention.

[0019] Figure 2 This is a schematic diagram of the second three-dimensional structure of the present invention.

[0020] Figure 3 This is a schematic diagram of the side support structure of the present invention.

[0021] Figure 4 This is a partial side view of the structure of the present invention.

[0022] Figure 5 This is a schematic diagram of the limiting rod structure of the present invention.

[0023] Figure 6 This is a schematic diagram of a partial working state structure of the present invention.

[0024] Figure 7 This is a partial cross-sectional side view of the present invention.

[0025] Figure 8 This is a partial cross-sectional structural diagram of the present invention.

[0026] Figure 9 This is a schematic diagram of the guide plate structure of the present invention.

[0027] Figure 10 This is a partial frontal view of the structure of the present invention.

[0028] Figure 11 This is an exaggerated schematic diagram of the warped state of the circuit board of the present invention.

[0029] In the diagram: 1. Equipment cabinet; 2. Detector; 3. Conveyor belt; 4. Top push plate; 5. Electric push rod; 6. Side push plate; 7. Limit rod; 8. Rigid rod; 9. Roller; 10. Telescopic rod No. 1; 11. Rectangular plate No. 1; 12. Rectangular plate No. 2; 13. Clamping component; 14. Guide plate; 15. I-beam slider; 16. Spring No. 1; 17. Telescopic rod No. 2; 18. Spring No. 2; 19. Guide roller; 20. Spring No. 3; 21. Side support component. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Please see Figures 1 to 11 The present invention provides a technical solution: a circuit board solder paste thickness detection device, comprising a device cabinet 1, a detector 2 slidably mounted above the device cabinet 1 via a horizontal rail, and side support members 21 symmetrically mounted on the device cabinet 1 via a vertical rail, and further comprising: The side clamp assembly is set on the side support 21, the rigid rods 8 are symmetrically fixed on both sides of the detector 2, the roller 9 is rotatably sleeved on the rigid rods 8, and the leveling assembly is set on the side clamp assembly and the rigid rods 8 to follow the movement of the detector 2 and adaptively pull down the corresponding position of the circuit board on the upturned side. In specific implementation, as shown in the appendix Figure 2As shown, the two sets of side support members 21 can be moved to suitable positions according to the size of the circuit board using the longitudinal electric rail, thus facilitating the placement of both sides of the circuit board on the two sets of conveyor belts 3 respectively. The conveyor belts 3 then transport the circuit board to the designated position. Afterwards, a cylinder pushes the upper push plate 4, causing the circuit board to rise and detach from the conveyor belt 3. The height pushed by the upper push plate 4 is set as the reference height. The transverse electric rail can be used to move the detector 2 to the corresponding position. The detector 2 emits a beam of light towards the circuit board while moving at a constant speed, allowing the beam to scan the solder paste on the circuit board from beginning to end. The above are all common methods in the prior art, and will not be elaborated on further in this invention. Similarly, the specific working principle of the detector 2 can be kept consistent with the prior art. It is important to note that the axes of roller 9 and guide roller 19 must be on the same longitudinal horizontal plane as the light illuminating the circuit board from the detector 2, and the height reached by the highest point of roller 9 pushing the circuit board is consistent with the reference height. In this way, when the highest point of roller 9 pushes the circuit board to a certain position to the reference height, the two sides of the circuit board corresponding to that position are pulled down and flattened, while keeping this position aligned with the light.

[0032] The side clamping assembly includes a limiting rod 7 fixed on the side support 21, a side push plate 6 movably mounted on the limiting rod 7 via an I-shaped slide rail, a first telescopic rod 10 mounted on one side of the side push plate 6, and a first rectangular plate 11 fixed to one end of the first telescopic rod 10. The leveling assembly includes a second telescopic rod 17 fixed on the rigid rod 8, a guide roller 19 rotatably disposed at the top of the second telescopic rod 17, a second rectangular plate 12 movably disposed on one side of the first rectangular plate 11, and a guide plate 14 fixed at the lower end of the other side of the second rectangular plate 12.

[0033] Conveyor belts 3 are provided on the inner side of both sets of side support members 21; An upper push plate 4 is movably connected to the equipment cabinet 1 via a cylinder; The upper push plate 4 and the conveyor belt 3 are staggered, close to each other but not in contact.

[0034] In specific implementation, as shown in the appendix Figure 10 As shown, the two edges of the circuit board must be directly above the upper push plate 4, and the portion extending directly above the conveyor belt 3 should be as small as possible. Of course, the circuit board should not fall during transport. This prevents excessive pulling down when the clamping member 13 holds and pulls down the sides of the circuit board, which could cause the sides of the circuit board to bend downwards. Therefore, although the upper push plate 4 and the conveyor belt 3 are staggered, the distance between them should not be too far.

[0035] The side clamp assembly also includes an electric push rod 5 that is fixed to one side of the side support 21 by a support frame; The piston end of the electric push rod 5 is fixedly connected to one side of the side push plate 6; A clamping component 13 is fixed to the upper end of the other side of the second rectangular plate 12; The clamping members 13 are provided in several groups, and the several groups of clamping members 13 are equally distributed in a linear array. The clamping member 13 consists of a short rod fixed at one end to the second rectangular plate 12 and a square plate fixed at the other end of the short rod; The surface of the square plate is smooth and has been polished. Several groups of square plates are closely arranged without gaps; The clamping member 13 is located above the side support member 21, and there is a clear gap between the bottom surface of the clamping member 13 and the top surface of the side support member 21.

[0036] In practice, when one or more sets of clamping members 13 pull down the side of the circuit board, the remaining parts of the circuit board side will experience a very slight tilt change. This will generate a small amount of friction between the circuit board and the non-rotatable square plate. Even if this change is very small, the surface of the square plate must be smooth and flat to prevent scratching the edge of the circuit board and to avoid creating excessive resistance when pulling down a certain part of the circuit board. In addition, in order for the entire side of the circuit board to be pulled down, each set of square plates needs to be tightly joined together. Furthermore, since the clamping members 13 need to move downwards, sufficient space needs to be left below them.

[0037] Several groups of No. 1 telescopic poles 10 are set up, and the groups of No. 1 telescopic poles 10 are equally distributed in a linear array. The No. 1 telescopic rod 10 consists of an outer cylinder with one end fixed to the side push plate 6 and an inner rod that is movably inserted into the outer cylinder; The other end of the inner rod is fixedly connected to rectangular plate 11. A spring 16 is fixed between the inner wall of the outer cylinder and one end of the first telescopic rod 10.

[0038] In practical implementation, when the side push plate 6 simultaneously pushes several sets of telescopic rods 10 and clamping members 13 to the side of the circuit board, it is necessary to ensure that the clamping members 13 have sufficient clamping force on the circuit board. Therefore, when clamping the circuit board, the first spring 16 should be in a properly compressed state, not a relaxed state. The rebound force of the first spring 16 pushes the clamping members 13 back, ensuring the stability of the clamping members 13 in clamping the circuit board. During the straightening process, the stress distribution of the circuit board will change. Simply put, as shown in the attached... Figure 11As shown, when the two sides of the circuit board are lifted and pulled down forcefully, the two sides of the circuit board will also extend to both sides. Therefore, the function of the first spring 16 is to provide elastic space for the extension of the two sides of the circuit board, so that the circuit board can be squeezed again by the clamping member 13 when it extends, instead of directly colliding with the clamping member 13. Therefore, the elastic force of the first spring 16 cannot resist the extension force of the circuit board. It should also be noted that when the second rectangular plate 12 and the guide plate 14 are forcibly pulled down, a small component force may be transmitted to the first spring 16, causing the first spring 16 to be slightly compressed. This will reduce the clamping force on the circuit board. However, on the one hand, the elastic force of the first spring 16 can resist this component force, so the first spring 16 is not affected. On the other hand, since the first spring 16 is in a compressed state when clamping the circuit board from the beginning, that is, the friction between the clamping member 13 and the circuit board is large enough, even if the clamping force is slightly reduced, it will not affect the stability of the clamping of the circuit board.

[0039] An I-beam slider 15 is fixed on one side of the second rectangular plate 12; The interior of the first rectangular plate 11 is provided with a groove that matches the I-shaped slider 15, and the I-shaped slider 15 slides in the groove. A No. 3 spring 20 is fixed between the bottom of the I-shaped slider 15 and the inner wall of the No. 1 rectangular plate 11.

[0040] In practical implementation, the second rectangular plate 12 can move longitudinally independently of the first rectangular plate 11. Under the action of the third spring 20, several groups of second rectangular plates 12 can maintain their highest point and be flush when not disturbed by other external forces, providing an important condition for repeated use in the future. In addition, the I-beam slider 15 and the groove are polished, resulting in very low friction between them.

[0041] Both the second rectangular plate 12 and the guide plate 14 are provided with several sets; The two sides of the guide plate 14 are set as inclined surfaces, and the middle is set as a flat surface; Several sets of guide plates 14 are configured as comb-shaped and are interlocked and connected.

[0042] In specific implementation, as shown in the appendix Figure 8 and attached Figure 9As shown, the width of the middle plane of the guide plate 14 is the same as the width of the second rectangular plate 12, and the two are aligned. The guide plate 14 extends to both sides of the second rectangular plate 12. This ensures that when the axis of the guide roller 19 moves to any set of second rectangular plates 12, that set of second rectangular plates 12 has already been pulled down to the bottom, instead of the second rectangular plates 12 still being pulled down evenly when the guide roller 19 moves to one set of second rectangular plates 12. This would result in the side of the circuit board at that location not being pulled down to the reference height when the beam of the detector 2 irradiates a certain position. It is precisely because the two sides of the guide plate 14 need to extend to the other two sets of second rectangular plates 12 on the side that several sets of guide plates 14 need to be set in a comb shape, interlacing and moving without interfering with each other when moving up and down.

[0043] The roller 9 is located between the two sets of side support members 21; The side of roller 9 is very close to the side wall of the upper push plate 4, but there is still a gap; The surfaces of the side support member 21 and the upper push plate 4 are provided with through grooves; The rigid rod 8 moves through the inside of the through slot.

[0044] In specific implementation, as shown in the appendix Figure 10 As shown, the closer the roller 9 is to the upper push plate 4, the more the bottom of the circuit board can be pushed to the reference height, greatly reducing omissions.

[0045] The second telescopic pole 17 consists of a sleeve rod fixed to the bottom of the rigid pole 8 and a sliding rod that is movably inserted into the sleeve rod; A second spring 18 is fixed between the inner wall of the sleeve rod and the bottom of the slide rod; The elastic force of spring number 2 (18) is significantly greater than that of spring number 3 (20).

[0046] In practical implementation, when the guide roller 19 presses the guide plate 14 down to its limit, this limit refers to the point where the clamping member 13, relying on the friction between itself and the side of the circuit board, moves the circuit board down together until it finally comes into close contact with the bottom of the circuit board and the top surface of the roller 9 and the upper push plate 4, making it difficult for the circuit board to move further down. This is the limit to which the clamping member 13 and the guide plate 14 can move down. However, the degree of warping on the side of the circuit board is not uniform, meaning that the downward stroke that several sets of guide plates 14 can move is different. The guide roller 19 needs to move at a constant speed along with the detector 2. If the guide roller 19 has not yet moved to the plane of the guide plate 14, If the guide plate 14 cannot move further down, the guide roller 19 will get stuck on the inclined surface of the guide plate 14, which may eventually damage the device. Therefore, the guide roller 19 also needs to be passively moved with the help of the second spring 18. When the guide roller 19 is still on the inclined surface of the guide plate 14, but the guide plate 14 cannot move further down, the second spring 18 will be stretched as the guide roller 19 continues to move forward, so that the guide roller 19 moves up and presses on the plane of the guide plate 14. Therefore, the elastic force of the second spring 18 needs to be greater than that of the third spring 20 to ensure that the guide plate 14 moves before the guide roller 19 under the same force.

[0047] The surface of guide roller 19 has been polished. The height of guide roller 19 is lower than the height of the top surface of guide plate 14; The guide roller 19 moves along the surface of the guide plate 14.

[0048] In practice, regardless of whether there is warping at a certain position on the side of the circuit board, as long as the guide roller 19 passes the plane of the guide plate 14, it will attempt to press down on the guide plate 14 to reduce omissions.

[0049] Working principle: When using this circuit board solder paste thickness detection device, the circuit board is first transported to the designated position according to existing technology. Then, the electric push rod 5 pushes the side push plates 6 on both sides to center them, so that several sets of clamping members 13 on both sides tightly clamp the two sides of the circuit board. At the same time, the first spring 16 must be in a moderately compressed state. When the detector 2 emits a beam and begins to move to scan the solder paste on the circuit board, the rigid rod 8 and the roller 9 also move together. The roller 9 lifts the corresponding position of the circuit board to the reference height, while the guide roller 19 continuously attempts to press down the guide plate 14 at the corresponding position. If the circuit... If a section of the board has a warped side, when the guide roller 19 passes the guide plate 14 at that location, it will press down the guide plate 14 and the second rectangular plate 12 together. This causes the clamping member 13 to move the board downwards using static friction until the board is in contact with the top surface of the push plate 4 and the roller 9. At this point, the location on the board illuminated by the beam of the detector 2 is at the reference height. The detector 2 uses the optical triangulation relationship—the height difference between the solder paste and the board causing a shift in the image position of the reflected light—to calculate the height information by calculating the displacement. Similarly, wherever the detector 2 moves, the corresponding board substrate will be lifted to the reference height, thus significantly reducing measurement errors.

[0050] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A circuit board solder paste thickness detection device, comprising an equipment cabinet (1), a detector (2) slidably mounted above the equipment cabinet (1) via a horizontal electric rail, and side support members (21) symmetrically mounted on the equipment cabinet (1) via a vertical electric rail, characterized in that, Also includes: Side clamp assembly set on side support (21), rigid rod (8) symmetrically fixed on both sides of detector (2), roller (9) rotatably sleeved on rigid rod (8), leveling assembly set on side clamp assembly and rigid rod (8) to follow detector (2) to move and adaptively pull down the upper side of circuit board at corresponding position; The side clamp assembly includes a limiting rod (7) fixed on the side support (21), a side push plate (6) movably mounted on the limiting rod (7) via an I-shaped slide rail, a first telescopic rod (10) mounted on one side of the side push plate (6), and a first rectangular plate (11) fixed to one end of the first telescopic rod (10). The leveling assembly includes a second telescopic rod (17) fixed on a rigid rod (8), a guide roller (19) rotatably disposed at the top of the second telescopic rod (17), a second rectangular plate (12) movably disposed on one side of the first rectangular plate (11), and a guide plate (14) fixed at the lower end of the other side of the second rectangular plate (12).

2. The circuit board solder paste thickness detection device according to claim 1, characterized in that: Conveyor belts (3) are provided on the inner side of both sets of side support members (21); The equipment cabinet (1) is connected to an upper push plate (4) via a cylinder. The push plate (4) and the conveyor belt (3) are staggered, close to each other but not in contact.

3. The circuit board solder paste thickness detection device according to claim 1, characterized in that: The side clamp assembly also includes an electric push rod (5) that is fixed to one side of the side support (21) by a support frame. The piston end of the electric push rod (5) is fixedly connected to one side of the side push plate (6); A clamping member (13) is fixed to the upper end of the other side of the second rectangular plate (12); The clamping member (13) is provided in several groups, and the several groups of clamping members (13) are equally distributed in a linear array. The clamping member (13) consists of a short rod with one end fixed to the second rectangular plate (12) and a square plate fixed to the other end of the short rod; The surface of the square plate is smooth and has been polished. Several groups of square plates are closely distributed without gaps; The clamping member (13) is located above the side support member (21), and there is a clear gap between the bottom surface of the clamping member (13) and the top surface of the side support member (21).

4. The circuit board solder paste thickness detection device according to claim 1, characterized in that: The first telescopic pole (10) is provided in several groups, and the several groups of the first telescopic pole (10) are distributed at equal intervals in a linear array. The first telescopic rod (10) consists of an outer cylinder with one end fixed to the side push plate (6) and an inner rod that is movably inserted into the outer cylinder; The other end of the inner rod is fixedly connected to the first rectangular plate (11); A spring (16) is fixed between the inner wall of the outer cylinder and one end of the first telescopic rod (10).

5. The circuit board solder paste thickness detection device according to claim 1, characterized in that: One side of the second rectangular plate (12) is fixed with an I-shaped slider (15); The first rectangular plate (11) has a groove inside that is adapted to the I-shaped slider (15), and the I-shaped slider (15) slides in the groove; A No. 3 spring (20) is fixed between the bottom of the I-shaped slider (15) and the inner wall of the No. 1 rectangular plate (11).

6. The circuit board solder paste thickness detection device according to claim 1, characterized in that: The second rectangular plate (12) and the guide plate (14) are each provided with several sets; The guide plate (14) has inclined surfaces on both sides and a flat surface in the middle; Several sets of guide plates (14) are configured as comb-shaped and are interlocked and connected.

7. The circuit board solder paste thickness detection device according to claim 1, characterized in that: The roller (9) is located between the two sets of side supports (21); The side of the roller (9) is very close to the side wall of the upper push plate (4), but there is still a gap; The surfaces of the side support (21) and the upper push plate (4) are provided with through grooves; The rigid rod (8) moves through the inside of the through slot.

8. The circuit board solder paste thickness detection device according to claim 1, characterized in that: The second telescopic rod (17) consists of a sleeve rod whose bottom is fixed to the rigid rod (8) and a sliding rod that is movably inserted into the sleeve rod; A second spring (18) is fixed between the inner wall of the sleeve and the bottom of the slide rod. The elastic force of the second spring (18) is significantly greater than that of the third spring (20).

9. The circuit board solder paste thickness detection device according to claim 1, characterized in that: The surface of the guide roller (19) is polished; The height of the guide roller (19) is lower than the height of the top surface of the guide plate (14); The guide roller (19) moves along the surface of the guide plate (14).

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