A high-isolation dual-polarized phased array TR component based on front-back layout

Abstract

The application provides a high-isolation dual-polarized phased array TR assembly based on front and back layouts, and relates to the technical fields of microwave and phased array radar. The assembly comprises a multilayer printed board structure cavity, a first surface of the multilayer printed board structure cavity is provided with a radio frequency link of a first polarization channel, and a second surface is mirror-imaged with a radio frequency link of a second polarization channel; the first surface is opposite to the second surface; the first polarization channel and the second polarization channel are orthogonal polarization channels. The application fundamentally solves the polarization crosstalk problem caused by the traditional side-by-side layout, can improve the dual-polarization isolation to more than 80 dB, optimizes the space utilization and the heat dissipation path, and is particularly suitable for high-density and high-performance dual-polarized phased array antenna systems.

Description

Technical Field

[0001] This application relates to the fields of microwave technology and phased array radar technology, and more specifically, to a high-isolation dual-polarized phased array TR component based on a front and back layout. Background Technology

[0002] Phased array antennas are widely used in modern radar and communication systems due to their advantages such as beam agility and multi-target tracking. Dual-polarized phased array antennas can simultaneously transmit and receive electromagnetic waves with two orthogonal polarizations (such as vertical and horizontal polarization), thereby acquiring richer target information and improving the system's performance in polarization identification, anti-jamming, and meteorological observation.

[0003] One of the core components for achieving dual-polarization performance is the dual-polarization transmit / receive (TR) assembly. Traditional dual-polarization TR assemblies typically arrange the RF channels supporting both polarizations side-by-side on the same plane. This layout has inherent drawbacks: 1. Limited polarization isolation: In a side-by-side layout, the RF traces, chips, pads, and connectors of the two polarization channels are very close together, resulting in strong near-field coupling and space leakage. Energy can crosstalk from one polarization channel to the other, severely degrading polarization isolation, which typically only reaches 30-40 dB, making it difficult to meet the requirements of high-performance applications.

[0004] 2. Crowded layout and difficult thermal management: All functional units are concentrated on a single side, resulting in high wiring density and complex electromagnetic compatibility design. At the same time, heat sources such as power amplifiers are concentrated, which is not conducive to heat dissipation and affects channel performance and reliability.

[0005] 3. The contradiction between integration and miniaturization: When pursuing cell spacing of less than half a wavelength to achieve wide-angle scanning, the spatial contradiction of single-sided layout is particularly prominent, which limits the integrity of channel performance.

[0006] Therefore, there is an urgent need for an innovative TR component layout scheme to fundamentally solve the isolation problem between dual polarizations. Summary of the Invention

[0007] The embodiments of this application provide a high-isolation dual-polarized phased array TR module based on a front-and-back layout to solve the problems of poor polarization isolation and crowded layout of traditional side-by-side dual-polarized TR modules.

[0008] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0009] According to a first aspect of the embodiments of this application, a high-isolation dual-polarized phased array (TR) component based on a front-and-back layout is provided, comprising: A multilayer printed circuit board structure cavity, wherein a first polarization channel radio frequency link is provided on the first side of the multilayer printed circuit board structure cavity, and a second polarization channel radio frequency link is provided on the second side in mirror image. The first surface is opposite to the second surface; The first polarization channel and the second polarization channel are orthogonal polarization channels.

[0010] In some embodiments of this application, based on the aforementioned scheme, at least one metal grounding layer is provided inside the cavity of the multilayer printed circuit board structure, which serves as a physical and electrical isolation layer to isolate the first polarization channel and the second polarization channel.

[0011] In some embodiments of this application, based on the aforementioned scheme, the at least one metal grounding layer is connected to the housing of the multilayer printed circuit board structure cavity to form a closed shielded cavity.

[0012] In some embodiments of this application, based on the foregoing scheme, the radio frequency link for each polarization channel includes at least: Power amplifiers, limiters, low-noise amplifiers, receiver driver chips, transmitter driver chips, multi-functional amplitude and phase control chips, and transceiver driver amplifier chips; The power amplifier is connected to the limiter, the limiter is connected to the low-noise amplifier, and the low-noise amplifier is connected to the receiver driver chip and the transmitter driver chip respectively. Both the receiver driver chip and the transmitter driver chip are connected to the multi-functional amplitude and phase control chip. The multi-functional amplitude and phase control chip is connected to the transceiver driver amplifier chip.

[0013] In some embodiments of this application, based on the aforementioned scheme, the vertical projection of the power amplifier in the first polarization channel RF link is opposite to the low noise amplifier in the second polarization channel RF link.

[0014] In some embodiments of this application, based on the foregoing scheme, the multilayer printed circuit board structure cavity is provided with a first polarization signal common terminal and a first polarization signal sub-port for connection with the first polarization channel radio frequency link; The first polarization signal common terminal is connected to the transceiver driver amplifier chip; The first polarization signal port is connected to the power amplifier.

[0015] In some embodiments of this application, based on the foregoing scheme, the multilayer printed circuit board structure cavity is provided with a second polarization signal common terminal and a second polarization signal sub-port for connection with the second polarization channel radio frequency link; The second polarization signal common terminal is connected to the transceiver driver amplifier chip; The second polarization signal port is connected to the power amplifier.

[0016] In some embodiments of this application, based on the aforementioned scheme, the multilayer printed circuit board structure cavity is further provided with a control connector for receiving external control signals and a power supply connector for receiving external power supply signals.

[0017] In some embodiments of this application, based on the aforementioned scheme, both the first surface and the second surface are provided with a through-layer control connector for receiving external control signals and a through-layer power supply connector for receiving external power supply signals.

[0018] In some embodiments of this application, based on the foregoing scheme, a metal heat-conducting boss is provided inside the second surface.

[0019] The technical solution of this application has the following beneficial effects: 1. Extremely high polarization isolation: By physically separating the two polarization channels on opposite sides of the dielectric substrate and utilizing a continuous ground layer in between to form a natural shield, direct crosstalk of RF energy through near-field coupling and spatial radiation is minimized. Experiments show that this structure can improve dual-polarization isolation to over 80dB, representing a qualitative leap compared to traditional solutions.

[0020] 2. Optimized spatial layout and heat dissipation: The front and back layout makes full use of three-dimensional space, effectively alleviating the layout pressure of a single side, allowing for more spacious wiring, and facilitating optimal RF performance. At the same time, heat sources are dispersed, and combined with the double-sided heat dissipation design, the thermal management performance of the TR component is significantly improved.

[0021] 3. Facilitates high-density integration: This layout better meets the requirements of high-density arrangement of phased array antenna elements. The corresponding polarized antenna elements are connected to the front and back sides respectively, making the integration of TR components and antenna array simpler and more direct, which is conducive to achieving smaller element spacing and wider scanning angle.

[0022] 4. Symmetrical structure and consistent performance: The front and back layouts can be designed as electrically symmetrical structures, which helps to ensure the consistency of amplitude and phase performance of the two polarization channels and reduce the complexity of system calibration.

[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings: Figure 1 A front view schematic diagram of a high-isolation dual-polarized phased array TR component based on a front and back layout according to an embodiment of this application is shown; Figure 2 A schematic diagram of the back of a high-isolation dual-polarized phased array TR component based on a front and back layout according to an embodiment of this application is shown; Figure 3 This is a front view schematic diagram of a high-isolation dual-polarization phased array TR component based on a front and back layout according to an embodiment of this application; Figure 4 A schematic diagram of the output terminal of a high-isolation dual-polarization phased array TR component based on a front-and-back layout according to an embodiment of this application is shown; Figure 5 An exploded view of a high-isolation dual-polarized phased array TR component based on a front-and-back layout according to an embodiment of this application is shown.

[0025] Explanation of reference numerals in the attached figures 1-Front-side channel isolation metal wall, 2-V-polarized power amplifier chip, 3-V-polarized transceiver switch switching chip, 4-Limiter chip, 5-Low-noise amplifier chip, 6-Receiver driver chip, 7-Transmitter driver amplifier chip, 8-Four-channel multi-functional amplitude and phase control chip, 9-Control connector, 10-Power supply connector, 11-Through-layer control connector, 12-Through-layer power supply connector, 13-Transceiver driver amplifier chip, 14-Rear metal heat-conducting boss, 15-Horizontal polarization signal common terminal, 16-Vertical polarization signal common terminal, 17-Vertical polarization signal sub-port, 18-Horizontal polarization signal sub-port. Detailed Implementation

[0026] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0027] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0028] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such uses of these terms can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described.

[0029] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0030] The following detailed description of some embodiments of this application will be provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0031] To address the technical problems existing in the prior art, embodiments of this application provide a high-isolation dual-polarized phased array TR component based on a front-and-back layout, comprising: A multilayer printed circuit board structure cavity, wherein a first polarization channel radio frequency link is provided on the first side of the multilayer printed circuit board structure cavity, and a second polarization channel radio frequency link is provided on the second side in mirror image. The first surface is opposite to the second surface; The first polarization channel and the second polarization channel are orthogonal polarization channels.

[0032] It should be noted that the first polarization channel can be a vertical polarization channel, in which case the second polarization channel is a horizontal polarization channel.

[0033] It should be noted that in this embodiment, the first side can be the front side of the multilayer printed circuit board structure cavity, and in this case, the second side is the back side of the multilayer printed circuit board structure cavity.

[0034] For example, see Figure 1 The diagram shows a front view of a high-isolation dual-polarized phased array TR component based on a front and back layout according to an embodiment of this application.

[0035] See Figure 2 The diagram shows a schematic rear view of a high-isolation dual-polarized phased array TR component based on a front and back layout according to an embodiment of this application.

[0036] like Figure 1 , Figure 2 As shown, the front of the cavity integrates all the RF chips and microstrip lines for the vertical polarization channel, including a four-channel multi-functional amplitude and phase control chip, a final-stage power amplifier, a driver amplifier chip, a low-noise amplifier, and switches. The back of the cavity integrates all the RF chips and microstrip lines for the horizontal polarization channel in a mirror image.

[0037] In some feasible embodiments, based on the aforementioned scheme, at least one metal grounding layer is provided inside the cavity of the multilayer printed circuit board structure to serve as a physical and electrical isolation layer, isolating the first polarization channel and the second polarization channel.

[0038] In some feasible embodiments, based on the aforementioned scheme, the at least one metal grounding layer is connected to the housing of the multilayer printed circuit board structure cavity to form a closed shielded cavity.

[0039] For example, such as Figure 1 As shown, taking the front of the cavity as an example, a front channel isolation metal wall 1 is designed inside the front of the cavity. These metal walls isolate the channels inside the cavity from each other through a tight fit with the cavity, and together form a complete electromagnetic shielding cavity by controlling the bonding of the power supply board to the cavity.

[0040] In some feasible embodiments, based on the foregoing scheme, the RF link for each polarization channel includes at least: Power amplifiers, limiters, low-noise amplifiers, receiver driver chips, transmitter driver chips, multi-functional amplitude and phase control chips, and transceiver driver amplifier chips; The power amplifier is connected to the limiter, the limiter is connected to the low-noise amplifier, and the low-noise amplifier is connected to the receiver driver chip and the transmitter driver chip respectively. Both the receiver driver chip and the transmitter driver chip are connected to the multi-functional amplitude and phase control chip. The multi-functional amplitude and phase control chip is connected to the transceiver driver amplifier chip.

[0041] For example, taking a radio frequency link with a vertically polarized channel located on the front as an example, such as Figure 1As shown, the RF link of the vertical polarization channel includes: V-polarization power amplifier chip 2, V-polarization transceiver switch chip 3, limiter chip 4, low noise amplifier chip 5, receiver driver chip 6, transmitter driver amplifier chip 7, four-channel multi-function amplitude and phase control chip 8, and transceiver driver amplifier chip 13.

[0042] It should be noted that, as Figure 2 As shown, the RF link structure of the horizontal polarization channel on the back is roughly the same as that of the RF link of the vertical polarization channel on the front.

[0043] In some feasible embodiments, based on the aforementioned scheme, the vertical projection of the power amplifier in the first polarization channel RF link is opposite to the low noise amplifier in the second polarization channel RF link.

[0044] In some feasible embodiments, based on the aforementioned scheme, the multilayer printed circuit board structure cavity is provided with a first polarization signal common terminal and a first polarization signal sub-port for connection with the first polarization channel radio frequency link; The first polarization signal common terminal is connected to the transceiver driver amplifier chip; The first polarization signal port is connected to the power amplifier.

[0045] In some feasible embodiments, based on the aforementioned scheme, the multilayer printed circuit board structure cavity is provided with a second polarization signal common terminal and a second polarization signal sub-port for connection with the second polarization channel radio frequency link; The second polarization signal common terminal is connected to the transceiver driver amplifier chip; The second polarization signal port is connected to the power amplifier.

[0046] For example, see Figure 3 The diagram shows a front view schematic of a high-isolation dual-polarized phased array TR component based on a front and back layout according to an embodiment of the present application.

[0047] See Figure 4 The diagram shows a schematic output of a high-isolation dual-polarized phased array TR component based on a front-and-back layout according to an embodiment of this application.

[0048] See Figure 5 An exploded view of a high-isolation dual-polarized phased array TR component based on a front-and-back layout, according to an embodiment of this application, is shown.

[0049] like Figure 3 , Figure 5As shown, a horizontal polarization signal common terminal 15 and a vertical polarization signal common terminal 16 are provided at the front end of the multilayer printed circuit board structure cavity. The horizontal polarization signal common terminal 15 is used to connect with the horizontal polarization channel RF link located on the back side, and the vertical polarization signal common terminal 16 is used to connect with the vertical polarization channel RF link located on the front side.

[0050] like Figure 4 , Figure 5 As shown, a vertical polarization signal sub-port 17 and a horizontal polarization signal sub-port 18 are provided at the rear end of the multilayer printed circuit board structure cavity. The vertical polarization signal sub-port 17 is used to connect to the vertical polarization channel RF link located on the front side, and the horizontal polarization signal sub-port 18 is used to connect to the horizontal polarization channel RF link located on the back side.

[0051] Below, taking the vertically polarized channel RF link located on the front of the cavity as an example, the signal transmission and reception process includes: The transmit link signal is input from the vertical polarization signal common terminal 16, amplified by the transceiver driver amplifier chip 13, and then transmitted to the four-channel multi-functional amplitude and phase control chip 8 for phase shifting, attenuation and other functions. The processed signal is transmitted to the transmit driver amplifier chip 7 through the microstrip line for power amplification, and then transmitted to the vertical polarization signal output port 17 through the V polarization power amplifier chip 2 and the V polarization transceiver switch switching chip 3 for the output of the transmit signal.

[0052] The received link signal is input from the vertical polarization signal sub-port 17, and after passing through the V polarization transceiver switch chip 3, the limiter chip 4, the low noise amplifier chip 5, and the receiver driver chip 6, it enters the four-channel multi-functional amplitude and phase control chip 8 for phase shifting, attenuation and other functions. The processed signal is transmitted to the transceiver driver amplifier chip 13 through the microstrip line, and after amplification, it is transmitted along the microstrip line to the vertical polarization signal common terminal 16, and then transmitted to the subsequent power supply synthesis network through the connection.

[0053] The signal reception and transmission process of the horizontal polarization channel RF link located on the back is similar to that on the front, and the principle is the same, so it will not be described again here.

[0054] In some feasible embodiments, based on the aforementioned scheme, the multilayer printed circuit board structure cavity is further provided with a control connector for receiving external control signals and a power supply connector for receiving external power supply signals.

[0055] like Figure 3 As shown, the front end of the multilayer printed circuit board structure cavity is also provided with a control connector 9 and a power supply connector 10 for interconnection with the outside.

[0056] In some feasible embodiments, based on the aforementioned scheme, both the first surface and the second surface are provided with a through-layer control connector for receiving external control signals and a through-layer power supply connector for receiving external power supply signals.

[0057] For example, such as Figure 1 and Figure 2 As shown, external input signals are transmitted to the back panel via through-layer control connector 11 and through-layer power supply connector 12, enabling interconnection between control and power supply. Compared to the traditional two sets of control and power supply connectors, this invention uses only one set of external control and power supply input signals, interconnected through layers within the module. This significantly saves space and thickness.

[0058] In some feasible embodiments, based on the aforementioned scheme, a metal heat-conducting boss is provided inside the second surface.

[0059] For example, such as Figure 2 , Figure 5 As shown, a back-side metal thermally conductive protrusion 14 is designed inside the back of the cavity. Its function is to transfer the heat generated by the front-side final-stage power amplifier chip to the outside of the cavity through metal heat transfer, facilitating heat dissipation. Simultaneously, the back-side metal thermally conductive protrusion also acts as a metal isolation wall between channels. These back-side metal thermally conductive protrusions, through tight fitting with the daughter board, isolate the channels inside the cavity from each other. By controlling the bonding of the power supply board to the cavity, they together form a complete electromagnetic shielding cavity. This completely separates the RF links between different channels on the same side into different independent electromagnetic environments, forming a horizontally polarized isolation environment between different channels.

[0060] In summary, the advantages of this technical solution are that the electromagnetic coupling path between the front and back channels is greatly weakened because the channels are isolated by a thick dielectric and a ground plane. Test results show that in the L~KA band, the isolation between the two polarization channels under this layout is better than 80dB across the entire frequency band, which is more than 55dB higher than the traditional layout (about 35dB).

[0061] Other embodiments of this application will readily conceive of by those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. It should be understood that this application is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A high-isolation dual-polarized phased array TR package based on front-back layout, characterized in that, include: A multilayer printed circuit board structure cavity, wherein a first polarization channel radio frequency link is provided on the first side of the multilayer printed circuit board structure cavity, and a second polarization channel radio frequency link is provided on the second side in mirror image. The first surface is opposite to the second surface; The first polarization channel and the second polarization channel are orthogonal polarization channels.

2. The assembly of claim 1, wherein, The interior of the multilayer printed circuit board structure cavity is provided with at least one metal grounding layer, which serves as a physical and electrical isolation layer to isolate the first polarization channel and the second polarization channel.

3. The assembly of claim 2, wherein, The at least one metal grounding layer is connected to the shell of the multilayer printed circuit board structure cavity to form a closed shielded cavity.

4. The assembly of claim 1, wherein, Each polarization channel's RF link includes at least: Power amplifiers, limiters, low-noise amplifiers, receiver driver chips, transmitter driver chips, multi-functional amplitude and phase control chips, and transceiver driver amplifier chips; The power amplifier is connected to the limiter, the limiter is connected to the low-noise amplifier, and the low-noise amplifier is connected to the receiver driver chip and the transmitter driver chip respectively. Both the receiver driver chip and the transmitter driver chip are connected to the multi-functional amplitude and phase control chip. The multi-functional amplitude and phase control chip is connected to the transceiver driver amplifier chip.

5. The assembly of claim 4, wherein, The vertical projection of the power amplifier in the first polarization channel RF link is opposite to that of the low noise amplifier in the second polarization channel RF link.

6. The assembly of claim 4, wherein, The multilayer printed circuit board structure cavity is provided with a first polarization signal common terminal and a first polarization signal sub-port for connection with the first polarization channel radio frequency link; The first polarization signal common terminal is connected to the transceiver driver amplifier chip; The first polarization signal port is connected to the power amplifier.

7. The assembly of claim 4, wherein, The multilayer printed circuit board structure cavity is provided with a second polarization signal common terminal and a second polarization signal sub-port for connection with the second polarization channel radio frequency link; The second polarization signal common terminal is connected to the transceiver driver amplifier chip; The second polarization signal port is connected to the power amplifier.

8. The assembly of claim 1, wherein, The multilayer printed circuit board structure cavity is also provided with a control connector for receiving external control signals and a power supply connector for receiving external power supply signals.

9. The component according to claim 8, characterized in that, Both the first and second surfaces are provided with a through-layer control connector for receiving external control signals and a through-layer power supply connector for receiving external power supply signals.

10. The component according to claim 1, characterized in that, The interior of the second surface is provided with a metal heat-conducting boss.

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