Heat dissipation structure and circuit board module

Abstract

This invention proposes a heat dissipation structure and a circuit board module. The heat dissipation structure is suitable for dissipating heat from a heat source disposed on a substrate. The heat dissipation structure includes an insulating layer, a leak-proof layer, a thermally conductive material, and a heat sink. The insulating layer is connected to the substrate and has a first opening, within which the heat source is located. The leak-proof layer is connected to the insulating layer and has a second opening. The second opening corresponds to the first opening. The thermally conductive material is located within the second opening and in contact with the heat source. The heat sink covers the second opening. The leak-proof layer is located between the heat sink and the insulating layer. Heat from the heat source is suitable for conduction to the heat sink via the thermally conductive material. A circuit board module is also mentioned.

Description

Technical Field

[0001] This invention relates to a heat dissipation structure and a circuit board module, and more particularly to a heat dissipation structure disposed on a circuit board and a circuit board module having the above-mentioned heat dissipation structure. Background Technology

[0002] As the efficiency of electronic devices continues to improve, some commercially available electronic devices currently use liquid metal for heat dissipation. However, when electronic devices are tilted or vibrated, liquid metal may leak onto the substrate or circuit board, causing short circuits and affecting heat dissipation performance. Therefore, how to achieve good heat dissipation in electronic devices while avoiding short circuits on the substrate or circuit board is a problem that this field is dedicated to exploring. Summary of the Invention

[0003] One objective of this invention is to provide a heat dissipation structure that has good heat dissipation effect and can avoid short circuits in the substrate or circuit board.

[0004] Another object of the present invention is to provide a circuit board module having the above-mentioned heat dissipation structure.

[0005] The present invention provides a heat dissipation structure suitable for dissipating heat from a heat source disposed on a substrate. The heat dissipation structure includes an insulating layer, a leak-proof layer, a thermally conductive material, and a heat sink. The insulating layer is connected to the substrate and has a first opening, within which the heat source is located. The leak-proof layer is connected to the insulating layer and has a second opening corresponding to the first opening. The thermally conductive material is located within the second opening and in contact with the heat source. The heat sink covers the second opening. The leak-proof layer is located between the heat sink and the insulating layer. Heat from the heat source is suitable for conduction to the heat sink via the thermally conductive material.

[0006] A circuit board module of the present invention includes a circuit board, a processor, and a heat dissipation structure. The processor is disposed on the circuit board and includes a substrate and a heat source, the heat source being disposed on the substrate. The heat dissipation structure is in contact with the processor and includes an insulating layer, a leak-proof layer, a thermally conductive material, and a heat sink. The insulating layer has a first opening, and the heat source is located within the first opening. The leak-proof layer is connected to the insulating layer and has a second opening, wherein the second opening corresponds to the first opening. The thermally conductive material is located within the second opening and in contact with the heat source. The heat sink covers the second opening, wherein the leak-proof layer is located between the heat sink and the insulating layer, and the heat from the heat source is adapted to be conducted to the heat sink via the thermally conductive material.

[0007] In one embodiment of the present invention, the heat dissipation structure further includes a mesh structure layer, wherein the mesh structure layer corresponds to the second opening and is located between the heat sink and the thermally conductive material.

[0008] In one embodiment of the present invention, the above-mentioned leak-proof layer further includes a first leak-proof area and a second leak-proof area, the first leak-proof area being located between the thermally conductive material and the second leak-proof area, and the hardness of the second leak-proof area being greater than that of the first leak-proof area.

[0009] In one embodiment of the present invention, the above-mentioned heat dissipation structure further includes an inert gas layer, wherein the inert gas layer is distributed between the heat sink and the heat source.

[0010] In one embodiment of the present invention, the heat dissipation structure further includes a coating layer disposed on the circuit board.

[0011] Based on the above, the heat dissipation structure of the circuit board module of the present invention includes a thermally conductive material located between the heat sink and the heat source, allowing heat from the heat source to be conducted to the heat sink via the thermally conductive material, thus achieving good heat dissipation. Furthermore, the heat dissipation structure of the circuit board module of the present invention, by surrounding the thermally conductive material with a leak-proof layer, reduces the probability of the thermally conductive material leaking to the substrate or circuit board, thereby reducing the probability of a short circuit on the substrate or circuit board. Moreover, the heat dissipation structure of the circuit board module of the present invention, by covering the substrate around the heat source with an insulating layer, prevents leaked thermally conductive material from directly contacting the substrate, further reducing the probability of a short circuit on the substrate. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a circuit board module according to an embodiment of the present invention.

[0013] Figure 2 yes Figure 1 An exploded view of the circuit board module.

[0014] Figure 3 yes Figure 1 A partial cross-sectional view of the circuit board module.

[0015] Figure 4 This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention.

[0016] Figure 5 yes Figure 4 The front view of the mesh structure layer.

[0017] Figure 6 This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention.

[0018] Figure 7 yes Figure 6 A schematic diagram of the substrate, insulating layer, leak-proof layer, thermally conductive material, and a portion of the circuit board from another angle.

[0019] Figure 8 This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention.

[0020] Figure 9 This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention.

[0021] Figure 10 This is an exploded view of a circuit board module according to another embodiment of the present invention.

[0022] The attached figures are labeled as follows:

[0023] 100, 100a, 100b, 100c, 100d: Circuit board modules

[0024] 110: Processor

[0025] 111: Substrate

[0026] 1111: Electronic components

[0027] 113: Heat source

[0028] 120, 120a, 120b, 120c, 120d: Heat dissipation structure

[0029] 121: Insulation layer

[0030] 1211: First opening

[0031] 122, 122b: Leak-proof layer

[0032] 1221: Second opening

[0033] 1222: First Leakage Prevention Zone

[0034] 1223: Second Leakage Prevention Zone

[0035] 123: Thermal conductive materials

[0036] 124: Radiator

[0037] 125: Network structure layer

[0038] 126: Inert gas layer

[0039] 127: Coating layer

[0040] 130: Circuit board Detailed Implementation

[0041] Figure 1 This is a schematic diagram of a circuit board module according to an embodiment of the present invention. Figure 2 yes Figure 1 An exploded view of the circuit board module. Figure 3 yes Figure 1 A partial cross-sectional view of the circuit board module. See also... Figures 1 to 3The circuit board module 100 (e.g., a graphics card) in this embodiment includes a circuit board 130, a processor 110, and a heat dissipation structure 120. The processor 110 is disposed on the circuit board 130 and includes a substrate 111 and a heat source 113, with the heat source 113 disposed on the substrate 111. The heat dissipation structure 120 contacts the processor 110 to dissipate heat from the heat source 113.

[0042] Please refer to Figure 2 and Figure 3 Specifically, the heat dissipation structure 120 includes an insulating layer 121, a leak-proof layer 122, a thermally conductive material 123, and a heat sink 124. The insulating layer 121 is connected to the substrate 111, and as... Figure 3 The diagram shows an electronic component 1111 (e.g., a capacitor) surrounding a heat source 113. An insulating layer 121 has a first opening 1211 within which the heat source 113 is located. A leak-proof layer 122 is connected to the insulating layer 121, which is located between the substrate 111 and the leak-proof layer 122. The leak-proof layer 122 has a second opening 1221 corresponding to the first opening 1211. A thermally conductive material 123 is located within the second opening 1221 and in contact with the heat source 113. A heat sink 124 covers the second opening 1221 to contact the thermally conductive material 123, and the leak-proof layer 122 is located between the heat sink 124 and the insulating layer 121. Accordingly, the heat from the heat source 113 is suitable for conduction to the heat sink 124 via the thermally conductive material 123, thus providing good heat dissipation for the heat source 113.

[0043] In addition, the heat dissipation structure 120 of the circuit board module 100 in this embodiment surrounds the heat-conducting material 123 with a leak-proof layer 122 to reduce the probability of the heat-conducting material 123 leaking to the substrate 111 or the circuit board 130, and covers the electronic components 1111 around the heat source 113 with an insulating layer 121 to prevent the leaked heat-conducting material 123 from causing a short circuit in the substrate 111.

[0044] In this embodiment, the heat source 113 is, for example, the die of a graphics processing unit (GPU) or a central processing unit (CPU), but is not limited thereto. Furthermore, in this embodiment, the insulating layer 121 is, for example, composed of an insulating pad or ultraviolet-curable adhesive (UV adhesive), the leak-proof layer 122 is, for example, composed of thermally conductive gel or foam, and the thermally conductive material 123 is, for example, thermally conductive paste, liquid metal, composite metal thermally conductive paste, or other thermally conductive materials that may be in liquid form. However, the constituent materials of the insulating layer 121, the leak-proof layer 122, and the thermally conductive material 123 are not limited to those described above.

[0045] In this embodiment, the thermally conductive gel constituting the leak-proof layer 122 has flexibility and compressibility, which allows the heat dissipation structure 120 to adapt to contact surfaces of different shapes and sizes, thereby enabling the heat dissipation structure 120 to have good mechanical stability and durability.

[0046] Figure 4 This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. Figure 5 yes Figure 4 The front view of the mesh structure layers. Please refer to... Figure 4 and Figure 5 In this embodiment, the heat dissipation structure 120a of the circuit board module 100a further includes a mesh structure layer 125. The mesh structure layer 125 corresponds to the second opening 1221 and is located between the heat sink 124 and the thermally conductive material 123. The mesh structure layer 125 of this embodiment has high porosity and good mechanical strength and flatness, which allows the thermally conductive material 123 to be more evenly connected to the heat sink 124, thereby further improving the heat dissipation effect of the heat source 113. In addition, the mesh structure layer 125 can also improve the adhesion of the thermally conductive material 123 to the heat sink 124, so as to prevent the thermally conductive material 123 from shifting in one direction, thereby reducing the probability of thermally conductive material 123 leakage, and facilitating the application by assembly personnel during production, thus improving production efficiency.

[0047] In this embodiment, the material of the mesh structure layer 125 is, for example, metal, but is not limited thereto. In other embodiments, the material of the mesh structure layer 125 can be any material that can improve the adhesion of the thermally conductive material 123.

[0048] The remaining configuration and function of the heat dissipation structure 120a in this embodiment are the same as or similar to those of the heat dissipation structure 120a in this embodiment. Figures 1 to 3 The heat dissipation structure 120 of the embodiment shown will not be described in detail here.

[0049] Figure 6 This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. Figure 7 yes Figure 6 A schematic diagram of the substrate, insulating layer, leak-proof layer, thermally conductive material, and a portion of the circuit board from another angle. Please refer to... Figure 6 and Figure 7In this embodiment, the heat dissipation structure 120b of the circuit board module 100b includes a leak-proof layer 122b with a first leak-proof area 1222 and a second leak-proof area 1223. The first leak-proof area 1222 is located between the thermally conductive material 123 and the second leak-proof area 1223. The thermally conductive material 123 is located within the first leak-proof area 1222. The hardness of the second leak-proof area 1223 is greater than that of the first leak-proof area 1222. Accordingly, the first leak-proof area 1222 of this embodiment has better resilience. When the thermally conductive material 123 in the leak-proof layer 122b is compressed and comes into contact with the first leak-proof area 1222, the thermally conductive material 123 can be rebounded by the first leak-proof area 1222, thereby further improving the leak-proof effect of the leak-proof layer 122b. Furthermore, the second leak-proof area 1223 of this embodiment has greater hardness, which can confine the thermally conductive material 123 within it, so that the leak-proof layer 122b achieves a double leak-proof effect.

[0050] In this embodiment, the first leak-proof area 1222 is made of, for example, 3-watt thermally conductive gel, and the second leak-proof area 1223 is made of, for example, 6-watt thermally conductive gel. However, the materials of the first leak-proof area 1222 and the second leak-proof area 1223 are not limited to these. In other embodiments, the first leak-proof area 1222 may also be made of a material with a mesh structure (e.g., foam or sponge) that can absorb the thermally conductive material 123 to further improve the leak-proof effect of the leak-proof layer 122b.

[0051] The remaining configuration and function of the heat dissipation structure 120b in this embodiment are the same as or similar to those of the heat dissipation structure 120b in this embodiment. Figures 1 to 3 The heat dissipation structure 120 of the embodiment shown will not be described in detail here.

[0052] Figure 8 This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. Please refer to... Figure 8 In this embodiment, the heat dissipation structure 120c of the circuit board module 100c further includes an inert gas layer 126. The inert gas layer 126 is distributed between the heat sink 124 and the heat source 113, which can prevent oxygen in the air from causing oxidation of the thermally conductive material 123, thereby ensuring the thermal conductivity of the thermally conductive material 123. In this embodiment, the inert gas layer 126 is composed of nitrogen, for example, but is not limited thereto.

[0053] In this embodiment, after the insulating layer 121 and the leak-proof layer 122 of the heat dissipation structure 120c are sequentially assembled onto the substrate 111 and the thermally conductive material 123 is coated onto the heat source 113, the assembly personnel can continuously blow inert gas onto the circuit board module 100c through an air tube, thereby blowing away the air around the thermally conductive material 123. Next, after the heat sink 124 is assembled onto the leak-proof layer 122, the inert gas is sealed within the heat dissipation structure 120c, forming an inert gas layer 126. Furthermore, when the heat sink 124 is assembled onto the leak-proof layer 122, the leak-proof layer 122 is compressed by the heat sink 124, allowing the thermally conductive material 123 to directly contact the heat sink 124, thereby enabling the heat dissipation structure 120c to have a good heat dissipation effect.

[0054] The remaining configuration and function of the heat dissipation structure 120c in this embodiment are the same as or similar to those of the heat dissipation structure 120c in this embodiment. Figures 1 to 3 The heat dissipation structure 120 of the embodiment shown will not be described in detail here.

[0055] Figure 9 This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. Please refer to... Figure 9 In this embodiment, the heat dissipation structure 120d of the circuit board module 100d further includes a coating layer 127, which is disposed on the circuit board 130 and provides protection against corrosion, moisture, and short circuits for the circuit board 130. In this embodiment, the coating layer 127 is, for example, composed of conformal coating, but is not limited thereto.

[0056] The remaining configuration and function of the heat dissipation structure 120d in this embodiment are the same as or similar to those of the heat dissipation structure 120d in this embodiment. Figures 1 to 3 The heat dissipation structure 120 of the embodiment shown will not be described in detail here.

[0057] Furthermore, it should be noted that in other embodiments, the heat dissipation structure 120 may also simultaneously include the leak-proof layer 122b, the mesh structure layer 125, the inert gas layer 126, and the coating layer 127 described in the above embodiments; the present invention does not limit this. Figure 10 This is an exploded view of a circuit board module according to another embodiment of the present invention, such as... Figure 10 As shown, the processor 110 may contain only one heat source 113, and the substrate 111 and the circuit board 130 in the above embodiment may also have the same structure, that is, the heat source 113 is directly disposed on the circuit board 130.

[0058] In summary, the heat dissipation structure of the circuit board module of the present invention includes a thermally conductive material located between the heat sink and the heat source, allowing heat from the heat source to be conducted to the heat sink via the thermally conductive material, thus achieving good heat dissipation. Furthermore, the heat dissipation structure of the circuit board module of the present invention, by surrounding the thermally conductive material with a leak-proof layer, reduces the probability of the thermally conductive material leaking to the substrate or circuit board, thereby reducing the probability of short circuits in the substrate or circuit board. Moreover, the heat dissipation structure of the circuit board module of the present invention, by covering the substrate around the heat source with an insulating layer, prevents leaked thermally conductive material from directly contacting the substrate, further reducing the probability of short circuits in the substrate.

Claims

1. A heat dissipation structure suitable for dissipating heat from a heat source disposed on a substrate, characterized in that, The heat dissipation structure includes: An insulating layer is attached to the substrate and has a first opening, the heat source being located within the first opening; A leak-proof layer is attached to the insulating layer and has a second opening, wherein the second opening corresponds to the first opening; A thermally conductive material is located within the second opening and in contact with the heat source; and A radiator covers the second opening, wherein the leak-proof layer is located between the radiator and the insulating layer. The heat from the heat source is suitable for conduction to the heat sink via the thermally conductive material.

2. The heat dissipation structure as described in claim 1, characterized in that, It also includes a mesh structure layer, which corresponds to the second opening and is located between the heat sink and the thermally conductive material.

3. The heat dissipation structure as described in claim 1, characterized in that, The leak-proof layer also includes a first leak-proof area and a second leak-proof area. The first leak-proof area is located between the thermally conductive material and the second leak-proof area, and the hardness of the second leak-proof area is greater than that of the first leak-proof area.

4. The heat dissipation structure as described in claim 1, characterized in that, It also includes an inert gas layer, wherein the inert gas layer is distributed between the radiator and the heat source.

5. The heat dissipation structure as described in claim 1, characterized in that, It also includes a coating layer, which is applied to a circuit board.

6. A circuit board module, characterized in that, include: A circuit board; A processor is disposed on the circuit board and includes a substrate and a heat source, the heat source being disposed on the substrate; as well as A heat dissipation structure, in contact with the processor, includes: An insulating layer having a first opening, wherein the heat source is located within the first opening; A leak-proof layer is attached to the insulating layer and has a second opening, wherein the second opening corresponds to the first opening; A thermally conductive material is located within the second opening and in contact with the heat source; and A radiator covers the second opening, wherein the leak-proof layer is located between the radiator and the insulating layer. The heat from the heat source is suitable for conduction to the heat sink via the thermally conductive material.

7. The circuit board module as described in claim 6, characterized in that, The heat dissipation structure also includes a mesh structure layer, which corresponds to the second opening and is located between the heat sink and the thermally conductive material.

8. The circuit board module as described in claim 6, characterized in that, The leak-proof layer also includes a first leak-proof area and a second leak-proof area. The first leak-proof area is located between the thermally conductive material and the second leak-proof area, and the hardness of the second leak-proof area is greater than that of the first leak-proof area.

9. The circuit board module as described in claim 6, characterized in that, The heat dissipation structure also includes an inert gas layer, which is distributed between the heat sink and the heat source.

10. The circuit board module as described in claim 6, characterized in that, The heat dissipation structure also includes a coating layer applied to the circuit board.

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