Battery sheet coating system

Abstract

The application discloses a battery piece coating system, relates to the technical field of vacuum coating, and is used for improving the efficiency of battery piece production and improving the battery piece production capacity. The battery piece coating system comprises a plurality of processing chambers, an ionization assembly and a conveying device, and the plurality of processing chambers comprise at least one process chamber. The ionization assembly comprises a base, a plurality of positive electrode plates and a plurality of negative electrode plates, the plurality of positive electrode plates and the plurality of negative electrode plates are connected to the base, and are alternately arranged at intervals along a first direction. The conveying device is arranged in the plurality of processing chambers and is used for conveying the ionization assembly through the plurality of processing chambers. In the case that the ionization assembly is located in the process chamber, the positive electrode plates and the negative electrode plates can ionize the process gas between the positive electrode plates and the negative electrode plates, so as to coat the substrate between the positive electrode plates and the negative electrode plates. The first direction is parallel to the bearing surface of the conveying device. The battery piece coating system in the application is used for coating the substrate.

Description

Technical Field

[0001] This application relates to the field of vacuum coating technology, and more particularly to a battery cell coating system. Background Technology

[0002] Plasma-enhanced chemical vapor deposition (Pecvd) technology is widely used in the photovoltaic industry to coat substrates and ultimately produce solar cells.

[0003] In related technologies, the substrate is placed on a carrier, and then the carrier passes through a process chamber. Inside the process chamber, the process gas inside the process chamber can form a film on the surface of the substrate on the carrier, thereby achieving coating on the substrate.

[0004] However, due to the limited carrying area of ​​the carrier, the number of substrates that the carrier can carry is limited, resulting in low efficiency in producing solar cells and limiting the production capacity of solar cells. Summary of the Invention

[0005] The battery cell coating system provided in this application embodiment is used to improve the efficiency of battery cell production, thereby increasing battery cell production capacity.

[0006] This application provides a battery cell coating system, including several processing chambers, an ionization assembly, and a conveying device. The processing chambers include at least one process chamber. The ionization assembly includes a base, multiple positive electrode plates, and multiple negative electrode plates. The positive and negative electrode plates are all connected to the base and are arranged alternately at intervals along a first direction. The conveying device passes through the processing chambers and is used to transport the ionization assembly through the processing chambers. When the ionization assembly is located within the process chamber, the positive and negative electrode plates can ionize the process gas between them to coat the substrate between them. The first direction is parallel to the bearing surface of the conveying device.

[0007] The battery cell coating system provided in this application embodiment allows for the placement of a substrate between the positive and negative electrode plates on an ionization assembly. The ionization assembly is placed on a conveying device that sequentially transports it through several processing chambers, thereby processing the substrate on the ionization assembly. When the ionization assembly passes through a processing chamber, the positive and negative electrode plates are energized with process gas located between them, causing the process gas to deposit on the substrate, thus achieving coating.

[0008] Since there are multiple positive and negative electrode plates arranged alternately along the first direction, coating can be performed between any adjacent positive and negative electrode plates, thus increasing the production capacity of the solar cells. Furthermore, because the first direction is parallel to the bearing surface of the conveying device, the multiple positive and negative electrode plates are stacked in a direction parallel to the bearing surface. This not only facilitates the placement of the substrate but also allows for the placement of as many positive and negative electrode plates as possible while controlling the space within the processing chamber.

[0009] In some embodiments, the thickness directions of both the positive electrode plate and the negative electrode plate are parallel to the first direction.

[0010] With this configuration, the planes containing the positive electrode plate and the negative electrode plate are both perpendicular to the first direction. Since the first direction is parallel to the bearing surface of the conveying device, both the positive and negative electrode plates are vertically arranged. Thus, more positive and negative electrode plates can be arranged in a unit area in the first direction. In this way, the ionization module can coat more substrates at once, which can improve the production efficiency of the battery cells and increase production capacity.

[0011] In some embodiments, the conveying direction of the conveying device is consistent with or at an angle to the first direction.

[0012] With this configuration, multiple positive electrode plates and multiple negative electrode plates can be arranged along the conveying direction of the conveying device, or the arrangement direction (first direction) of multiple positive electrode plates and multiple negative electrode plates can be at an angle to the conveying direction of the conveying device. In this way, multiple positive electrode plates and multiple negative electrode plates can be arranged in different directions as needed to meet the actual coating requirements.

[0013] In some embodiments, multiple positive electrode plates and multiple negative electrode plates are electrically connected to the base; the cell coating system further includes an electrode feeding assembly, which includes an electrode feeding end. When the ionization assembly is located within the process chamber, the electrode feeding end can be electrically connected to the base.

[0014] This configuration allows for simultaneous electrical connection of multiple positive and negative electrode plates using a single electrode feed terminal, thereby enabling the ionization of the process gas by the multiple positive and negative electrode plates and simplifying the circuit setup.

[0015] In some embodiments, the electrode feeding assembly further includes an electrode rod, with the electrode feeding end located at the end of the electrode rod, and the electrode rod being movable to cause the electrode feeding end to contact or separate from the base.

[0016] With this configuration, after the ionization unit enters the process chamber, the electrode rod can move to bring the electrode feed end into contact with the substrate, thereby enabling the ionization of the process gas and achieving film deposition on the substrate. When the ionization unit needs to exit the process chamber, the electrode rod moves to separate the electrode feed end from the substrate.

[0017] In some embodiments, the base has an electrode mating hole, and the electrode rod can move to drive the electrode feed end into or out of the electrode mating hole.

[0018] Because the base has electrode mating holes, the electrode feed end can extend into the electrode mating holes, thereby achieving electrical connection between the electrode feed end and the base. Alternatively, the electrode feed end can extend out of the electrode mating holes, thereby achieving separation between the electrode feed end and the base. The electrode mating holes ensure positioning and contact stability.

[0019] In some embodiments, the cell coating system further includes: a gas distribution plate disposed in a process chamber, the gas distribution plate having a cavity, the cavity being able to communicate with at least one of a process gas source and a plasma gas source, and a plurality of gas outlets communicating with the cavity on a first surface of the gas distribution plate.

[0020] With the ionization component located within the process chamber, the first surface faces the ionization component, and the plane containing the first surface is parallel to the first direction.

[0021] With this configuration, process gases can flow into the process chamber through the gas distribution plate, thereby achieving coating. And / or, the plasma source can flow into the process chamber through the gas distribution plate, thereby achieving dry cleaning of the accumulated film layer on at least one of the ionization module and the inner wall of the process chamber. Since this application can utilize plasma gas for online cleaning, it can improve cleaning efficiency and reduce cleaning time, thereby increasing the efficiency of the cell coating system in coating the substrate per unit time, and thus improving the utilization rate of the cell coating system. Because the first surface faces the ionization module and the plane containing the first surface is parallel to the first direction, the process gas and plasma gas discharged from the outlet can flow better into the space between the positive electrode plate and the negative electrode plate, reducing or avoiding interference and obstruction of the flow of process gas and plasma gas by the positive electrode plate and the negative electrode plate, ensuring the normal progress of coating and dry cleaning.

[0022] In some embodiments, there are multiple conveying devices, which are laid sequentially at the bottom of several processing chambers along a conveying direction perpendicular to the conveying device.

[0023] With this setup, each conveying device can carry and transport ionization components, which can improve the production efficiency of solar cells and increase production capacity.

[0024] In some embodiments, the plurality of processing chambers further include a preheating chamber located in front of the process chamber, in which the ionization components can be heated.

[0025] With this setup, the preheating chamber can heat the ionization assembly, ensuring that the substrate on the ionization assembly is within a suitable temperature range, thus guaranteeing the efficiency of the coating process.

[0026] In some embodiments, the cell coating system further includes multiple heating plates, with heating plates laid on at least one of the inner wall surface of the process chamber and the inner wall surface of the preheating chamber, the heating plates being used to heat the ionization components.

[0027] This setup allows for the use of multiple heating plates to heat the substrate located in the preheating chamber or the process chamber, ensuring the coating efficiency of the solar cells.

[0028] In some embodiments, a plurality of processing chambers constitute a processing section; the battery cell coating system further includes at least one loading and unloading mechanism for carrying the ionization component and clamping the substrate.

[0029] Along the conveying direction of the conveying device, the processing section includes an inlet end and an outlet end, both of which are equipped with loading and unloading mechanisms; or, along the extension direction of the conveying device, the conveying device has a first conveying direction and a second conveying direction in opposite directions, and the processing section has inlet and outlet ends located at the ends of the conveying device, with loading and unloading mechanisms provided at the inlet and outlet ends.

[0030] With this setup, where loading and unloading mechanisms are installed at both the inlet and outlet ends, the ionization unit without a substrate will load the uncoated substrate at the loading and unloading mechanism at the inlet end. The substrate will then be conveyed through multiple processing chambers to complete the coating process, and then transported to the loading and unloading mechanism at the outlet end. The loading and unloading mechanism at the outlet end can then pick up the coated substrate and remove it from the ionization unit for further processing.

[0031] When the conveying device has a first conveying direction and a second conveying direction in opposite directions, the ionization unit without a substrate is located at the inlet and outlet ends. Then, the loading and unloading mechanism picks up the uncoated substrate onto the ionization unit, and then it passes through multiple processing chambers along the first conveying direction to complete the coating. It is then conveyed along the second conveying direction to the loading and unloading mechanism at the inlet and outlet ends, where the coated substrate is picked up from the ionization unit for further processing.

[0032] In some embodiments, the number of ionization components is multiple, and a processing chamber can accommodate multiple ionization components. The multiple ionization components are arranged sequentially along the conveying direction of the conveying device; or, the multiple ionization components are arranged sequentially along a direction perpendicular to the conveying device.

[0033] With this setup, a single processing chamber can accommodate multiple ionization components at once, which can further improve the production efficiency of solar cells and increase production capacity. Attached Figure Description

[0034] Figure 1 A top view schematic diagram of a battery cell coating system provided in an embodiment of this application;

[0035] Figure 2 A side view schematic diagram of a battery cell coating system provided in an embodiment of this application;

[0036] Figure 3 A side view schematic diagram of an ionization component provided in an embodiment of this application;

[0037] Figure 4 This is another top view schematic diagram of the battery cell coating system provided in the embodiments of this application;

[0038] Figure 5 Another top view schematic diagram of the battery cell coating system provided in the embodiments of this application;

[0039] Figure 6 Another top view schematic diagram of the battery cell coating system provided in the embodiments of this application;

[0040] Figure 7 Another top view schematic diagram of the battery cell coating system provided in the embodiments of this application;

[0041] Figure 8 This is another side view schematic diagram of the battery cell coating system provided in the embodiments of this application;

[0042] Figure 9 Another side view schematic diagram of the battery cell coating system provided in the embodiments of this application;

[0043] Figure 10 Another side view schematic diagram of the battery cell coating system provided in the embodiments of this application;

[0044] Figure 11 Another side view schematic diagram of the battery cell coating system provided in the embodiments of this application;

[0045] Figure 12 This is another side view schematic diagram of the battery cell coating system provided in the embodiments of this application.

[0046] Figure label:

[0047] 01-Battery cell coating system;

[0048] 1-Processing chamber; 1A-Process chamber; 1A1-Upper shell; 1A2-Lower shell; a-Tail discharge port; 1B-Preheating chamber; 1C-Sheet ejection chamber; 2-Ionization assembly; 21-Base; 22-Positive electrode plate; 23-Negative electrode plate; 3-Conveying device; 4-Electrode feeding assembly; 41-Electrode feeding end; 42-Power supply; 43-Electrode rod; 5-Gas distribution plate; 5a-Cavity; 5b-First surface; 5c-Gas outlet; B-Process gas source; C-Plasma gas source; 6-Heating plate; 7-Loading and unloading mechanism; 71-Operating table; 72-Robotic arm; X-First direction; Y-Thickness direction; Z-Conveying direction; Z1-First conveying direction; Z2-Second conveying direction. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the specific technical solutions of this application will be further described in detail below with reference to the accompanying drawings of the embodiments of this application. The following embodiments are used to illustrate this application, but are not intended to limit the scope of this application.

[0050] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0051] Furthermore, in the embodiments of this application, directional terms such as "upper," "lower," "left," and "right" are defined relative to the positions in which the components are schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the position of the components in the accompanying drawings.

[0052] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0053] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0054] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0055] Plasma-enhanced chemical vapor deposition (Pecvd) technology is widely used in the photovoltaic industry to coat substrates and ultimately produce solar cells.

[0056] In related technologies, in order to achieve coating on a substrate, the substrate is usually placed on a carrier, and then the carrier passes through a process chamber. Inside the process chamber, the process gas inside the process chamber can form a film layer on the surface of the substrate on the carrier, thereby achieving coating on the substrate.

[0057] However, due to the limited carrying area of ​​the carrier, the number of substrates that the carrier can carry is limited, resulting in low efficiency in producing solar cells and limiting the production capacity of solar cells.

[0058] Based on this, such as Figure 1 , Figure 2 As shown, this application provides a battery cell coating system 01, including a plurality of processing chambers 1, an ionization assembly 2, and a conveying device 3. The plurality of processing chambers 1 include at least one process chamber 1A. The ionization assembly 2 includes a base 21, a plurality of positive electrode plates 22, and a plurality of negative electrode plates 23. The plurality of positive electrode plates 22 and the plurality of negative electrode plates 23 are all connected to the base 21 and are arranged alternately at intervals along a first direction X. The conveying device 3 passes through the plurality of processing chambers 1 and is used to transport the ionization assembly 2 through the plurality of processing chambers 1. When the ionization assembly 2 is located in the process chamber 1A, the positive electrode plates 22 and the negative electrode plates 23 can ionize the process gas between them to coat the substrate between them. The first direction X is parallel to the bearing surface of the conveying device 3.

[0059] It is understandable that the alternating arrangement of multiple positive electrode plates 22 and multiple negative electrode plates 23 along the first direction X means that, in the first direction X, the large surface of the carrier substrate of the positive electrode plate 22 and the large surface of the carrier substrate of the negative electrode plate 23 are arranged sequentially. The large surface of the carrier substrate of the positive electrode plate 22 refers to the surface with the largest area of ​​the positive electrode plate 22, and the large surface of the carrier substrate of the negative electrode plate 23 refers to the surface with the largest area of ​​the negative electrode plate 23.

[0060] The number of processing chambers 1 can be 1, 2, 4, 7, or 10, etc. The specific number can be selected according to the requirements.

[0061] In some examples, the machining chamber 1 includes an upper housing 1A1 and a lower housing 1A2, which are interlocked to form the machining chamber 1, and the upper housing 1A1 and the lower housing 1A2 are detachably connected. This arrangement facilitates the installation and removal of components within the machining chamber 1.

[0062] There are no strict restrictions on the material of the processing chamber 1. For example, the material of the processing chamber 1 can be metal, such as aluminum alloy or stainless steel.

[0063] In addition, multiple positive electrode plates 22 and multiple negative electrode plates 23 can be located on one side surface of the base 21, and the base 21 provides mounting support positions for the multiple positive electrode plates 22 and multiple negative electrode plates 23.

[0064] Of course, the base 21 may also include two mounting plates, with multiple positive electrode plates 22 and multiple negative electrode plates 23 located between the two mounting plates to achieve the installation and fixation of the multiple positive electrode plates 22 and multiple negative electrode plates 23.

[0065] The number of positive electrode plates 22 and negative electrode plates 23 can be set as needed.

[0066] For example, the vertical projection of multiple positive electrode plates 22 and multiple negative electrode plates 23 onto the bottom wall of the process chamber 1A occupies 70% to 90% of the bottom wall area of ​​the process chamber 1A.

[0067] Furthermore, the materials of the positive electrode plate 22 and the negative electrode plate 23 can be graphite, carbon fiber, or metal, etc. As long as they are conductive and can ensure a uniform electric field between the positive electrode plate 22 and the negative electrode plate 23, this application does not impose specific limitations on them.

[0068] In some examples, the conveying device 3 can be a roller conveyor 3, which uses the friction between multiple rollers and the base 21 to transport multiple ionization components 2. Of course, the conveying device 3 can also be a belt conveyor 3.

[0069] The conveying device 3 can be laid at the bottom of the processing chamber 1, for example, it can be connected to the bottom wall of the processing chamber 1, or it can be connected to the bottom of the side wall of the processing chamber 1.

[0070] In some examples, the substrate can be a semiconductor substrate, such as a silicon wafer or a silicon carbide wafer.

[0071] In some examples, when the substrate is located in the process chamber 1A, process gas needs to be introduced into the process chamber 1A. The process gas flows to the space between the positive electrode plate 22 and the negative electrode plate 23, and is then ionized by the positive electrode plate 22 and the negative electrode plate 23 and deposited on the substrate. After passing through the process chamber 1A, the surface of the substrate can grow thin films such as doped or undoped amorphous silicon, microcrystalline silicon, polycrystalline silicon, silicon nitride, silicon oxide, silicon oxynitride, or aluminum oxide. The type of thin film is determined according to the type of process gas.

[0072] The process gas can be one or more of the following: SiH4 (silicon tetrahydrogen), H2 (hydrogen), PH3 (phosphine), B2H6 (diborane), NH3 (ammonia), N2O (nitrous oxide), CO2 (carbon dioxide), Ar (argon), TMB (methylboron), TMA (trimethylaluminum), or Si2H6 (disilane). The specific gas can be selected based on requirements.

[0073] In addition, in order to ensure the normal progress of the coating process, the gas pressure in the process chamber 1A needs to be adjusted so that when the ionization component 2 is located in the process chamber 1A for coating, the gas pressure in the process chamber 1A meets the requirements of vacuum or near vacuum.

[0074] Based on this, such as Figure 2 As shown, the process chamber 1A has a tail outlet a, a butterfly valve located at the tail outlet a, and a vacuum pump. The gas pressure inside the process chamber 1A is regulated by controlling the butterfly valve and the vacuum pump. Simultaneously, waste gas from the process chamber 1A can be discharged.

[0075] The tailpipe a can be located at the bottom of the lower housing 1A2.

[0076] With the above configuration, a substrate can be accommodated between the positive electrode plate 22 and the negative electrode plate 23 on the ionization assembly 2. The ionization assembly 2 is placed on the conveying device 3, which transports the ionization assembly 2 sequentially through several processing chambers 1, thereby processing the substrate on the ionization assembly 2. When the ionization assembly 2 passes through the process chamber 1A, the positive electrode plate 22 and the negative electrode plate 23 can be energized with process gas located between them, thereby causing the process gas to be deposited on the substrate, thus achieving film deposition.

[0077] Since there are multiple positive electrode plates 22 and negative electrode plates 23, and they are arranged alternately along the first direction X, coating can be performed between any adjacent positive electrode plates 22 and negative electrode plates 23, thus increasing the production capacity of the battery cells. Furthermore, since the first direction X is parallel to the bearing surface of the conveying device 3, the multiple positive electrode plates 22 and multiple negative electrode plates 23 are stacked in a direction parallel to the bearing surface. This not only facilitates the placement of the substrate but also allows for the placement of as many positive electrode plates 22 and negative electrode plates 23 as possible while controlling the space within the processing chamber 1.

[0078] The thickness direction Y of the positive electrode plate 22 and the negative electrode plate 23 can be parallel to the first direction X. Or, as... Figure 3 As shown, the thickness direction Y of the positive electrode plate 22 and the negative electrode plate 23 can also be at an acute angle to the first direction X, that is, the positive electrode plate 22 and the negative electrode plate 23 are inclined.

[0079] In some embodiments, such as Figure 2 As shown, the thickness direction Y of both the positive electrode plate 22 and the negative electrode plate 23 is parallel to the first direction X.

[0080] With the above arrangement, the large surfaces of the positive electrode plate 22 and the negative electrode plate 23 are perpendicular to the first direction X. Since the first direction X is parallel to the bearing surface of the conveying device 3, the positive electrode plate 22 and the negative electrode plate 23 are both vertically arranged. In this way, more positive electrode plates 22 and negative electrode plates 23 can be arranged in a unit area in the first direction X. Thus, the ionization component 2 can coat more substrates at once, which can improve the production efficiency of the battery cells and increase the production capacity.

[0081] In some embodiments, such as Figure 2 As shown, the conveying direction Z of the conveying device 3 is consistent with the first direction X.

[0082] In this way, multiple positive electrode plates 22 and multiple negative electrode plates 23 can be arranged along the conveying direction Z of the conveying device 3, and the multiple positive electrode plates 22 and multiple negative electrode plates 23 can be arranged in different directions as needed to meet the actual coating requirements.

[0083] Of course, in other embodiments, such as Figure 4 As shown, the conveying direction Z of the conveying device 3 can also be at an angle to the first direction X.

[0084] For example, such as Figure 4 As shown, the conveying direction Z of the conveying device 3 is perpendicular to the first direction X.

[0085] With this configuration, the arrangement direction (first direction X) of the multiple positive electrode plates 22 and the multiple negative electrode plates 23 can be set at an angle to the conveying direction Z of the conveying device 3, thereby meeting the actual coating requirements.

[0086] In some embodiments, such as Figures 5-7 As shown, there are multiple ionization components 2, and one processing chamber 1 can accommodate multiple ionization components 2. The multiple ionization components 2 are arranged sequentially along the conveying direction Z of the conveying device 3. Alternatively, the multiple ionization components 2 are arranged sequentially along the conveying direction Z perpendicular to the conveying device 3.

[0087] In some examples, the number of ionization components 2 that can be accommodated in a processing chamber 1 at one time can be 2, 3, 4, 7, or 10, etc. The specific number depends on the space within the processing chamber 1 and the volume of a single ionization component 2.

[0088] With the above settings, during the conveying process of the conveying device 3, one processing chamber 1 can accommodate multiple ionization components 2 at one time, and the substrates on multiple ionization components 2 can be processed simultaneously. For example, for the process chamber 1A, when multiple ionization components 2 enter the same process chamber 1A, the process chamber 1A will coat the substrates on multiple ionization components 2 at one time, which can further improve the production efficiency of the battery cells and increase the production capacity.

[0089] In some embodiments, such as Figure 7 As shown, there are multiple conveying devices 3, and along the conveying direction Z perpendicular to the conveying device 3, multiple conveying devices 3 are laid sequentially at the bottom of several processing chambers 1.

[0090] In other words, multiple conveyor devices 3 pass through several processing chambers 1 side by side.

[0091] The number of conveyor devices 3 can be 2, 3, 4, 7, or 10, depending on the space of the processing chamber 1 in the conveying direction Z perpendicular to the conveyor devices 3. Figure 7 As shown, two conveyor devices 3 are illustrated.

[0092] Alternatively, one ionization component 2 can be carried on one conveying device 3. Or, multiple ionization components 2 can be carried on one conveying device 3 at the same time.

[0093] With the above configuration, each conveying device 3 can carry and transport the ionization component 2. Since multiple conveying devices 3 are arranged side by side, more ionization components 2 can be transported using multiple conveying devices 3, thereby improving the production efficiency and capacity of the solar cells. In addition, in the conveying direction Z perpendicular to the conveying device 3, the ionization components 2 located on different conveying devices 3 can enter the processing chamber 1 simultaneously or exit the processing chamber 1 simultaneously, thus ensuring the processing cycle time.

[0094] Of course, in other embodiments, the number of conveying devices 3 may also be one. Multiple ionization components 2 may also be arranged on one conveying device 3 along the conveying direction Z of the conveying device 3. Alternatively, multiple ionization components 2 may be arranged on one conveying device 3 along a conveying direction Z perpendicular to the conveying device 3.

[0095] In some embodiments, such as Figure 8 As shown, multiple positive electrode plates 22 and multiple negative electrode plates 23 are electrically connected to the base 21. The cell coating system 01 also includes an electrode feeding assembly 4, which includes an electrode feeding end 41. When the ionization assembly 2 is located within the process chamber 1A, the electrode feeding end 41 can be electrically connected to the base 21.

[0096] Understandably, after the ionization component 2 stops entering the process chamber 1A and before the process gas enters the process chamber 1A, the electrode feed end 41 is electrically connected to the base 21. Then, the process gas is introduced into the process chamber 1A. As the process gas passes between the positive electrode plate 22 and the negative electrode plate 23, it is ionized, thereby achieving the coating of the substrate. After the coating is completed, the introduction of the process gas is stopped, and the waste gas is discharged through the tail outlet a. At the same time, the electrode feed end 41 is separated from the base 21 to stop the power supply. Then, the ionization component 2 exits the process chamber 1A.

[0097] In some examples, multiple ionization components 2 are provided, and multiple electrode feed terminals 41 are also provided. The multiple ionization components 2 correspond one-to-one with the multiple electrode feed terminals 41. In this way, multiple electrode feed terminals 41 can be used to provide power 42 to the multiple ionization components 2 respectively, so as to achieve synchronous and individual ionization. This can ensure the effect of ionization process gas and ensure the quality of coating.

[0098] In some examples, the electrode feed assembly 4 also includes a power supply 42 electrically connected to the electrode feed end 41 to provide power to the electrode feed end 41. The power supply 42 is located outside the process chamber 1A, and the electrode feed end 41 extends into the process chamber 1A through the inner wall of the process chamber 1A. Thus, a seal is required at the location where the electrode feed end passes through the process chamber 1A to meet the requirement of adjustable gas pressure in the process chamber 1A.

[0099] In addition, the electrode feed end 41 can be connected to the side of the base 21, which can be configured according to requirements.

[0100] With the above configuration, after the ionization assembly 2 enters the process chamber 1A, the electrode feed end 41 can be electrically connected to the base 21, thereby achieving the ionization of the process gas and the deposition of the substrate. After the deposition is completed, the electrode feed end is separated from the base 21 to stop the power supply. Then, the ionization assembly 2 exits the process chamber 1A. This configuration allows for simultaneous electrical connection of multiple positive electrode plates 22 and multiple negative electrode plates 23 using a single electrode feed end 41, thereby achieving the ionization of the process gas by the multiple positive electrode plates 22 and multiple negative electrode plates 23, and thus achieving the deposition of the substrate. This configuration simplifies the wiring setup and makes the layout of the cell deposition system 01 more organized.

[0101] Of course, in other embodiments, the electrode feeding assembly 4 may be electrically connected to a plurality of positive electrode plates 22 and a plurality of negative electrode plates 23 respectively, so as to provide power 42 to the plurality of positive electrode plates 22 and the plurality of negative electrode plates 23 respectively.

[0102] In some embodiments, such as Figure 8 As shown, the electrode feeding assembly 4 also includes an electrode rod 43, with the electrode feeding end 41 located at the end of the electrode rod 43. The electrode rod 43 can move to drive the electrode feeding end 41 to contact or separate from the base 21.

[0103] The electrode rod 43 can pass through the process chamber 1A and extend into the process chamber 1A.

[0104] In some examples, electrode rod 43 is electrically connected to power supply 42, so that electrode feed end 41 can be electrically connected to power supply 42 through electrode rod 43.

[0105] In some examples, the movement of the electrode rod 43 can be telescopic, swinging, or rotating, and the specific movement can be selected as needed.

[0106] With the above configuration, after the ionization component 2 enters the process chamber 1A, the electrode rod 43 can move to bring the electrode feed end 41 into contact with the base 21, thereby achieving an electrical connection with the base 21 to supply power to the ionization component 2. This enables the ionization component 2 to ionize the process gas and achieve film deposition on the substrate. After the film deposition is completed, when the ionization component 2 needs to exit the process chamber 1A, the electrode rod 43 moves to separate the electrode feed end 41 from the base 21, thus stopping the power supply.

[0107] In some embodiments, the base 21 has an electrode mating hole, and the electrode rod 43 is movable to drive the electrode feed end 41 to extend into or out of the electrode mating hole.

[0108] The electrode mating hole can be adapted to the conductive rod, which facilitates the positioning of the electrode rod 43 and ensures that the electrode feed end 41 can achieve accurate contact and electrical connection with the base 21 after extending into the electrode mating hole.

[0109] With the above configuration, since the base 21 has an electrode mating hole, the electrode feed end 41 can extend into the electrode mating hole, thereby achieving an electrical connection between the electrode feed end 41 and the base 21. Alternatively, the electrode feed end 41 can extend out of the electrode mating hole, thereby achieving separation between the electrode feed end 41 and the base 21. The electrode mating hole configuration ensures stable positioning and contact.

[0110] In other embodiments, the base 21 may not have electrode mating holes.

[0111] Since the positive electrode plate 22 and the negative electrode plate 23 are arranged along the first direction X, and are not located in the same position, in order to ensure that the process gas can flow between any adjacent positive electrode plate 22 and negative electrode plate 23 as much as possible, a gas distribution plate 5 needs to be set in the process chamber 1A, which will be described in detail below.

[0112] In some embodiments, such as Figure 9 As shown, the battery cell coating system 01 further includes: a gas distribution plate 5 disposed within the process chamber 1A, the gas distribution plate 5 having a cavity 5a, the cavity 5a being able to communicate with at least one of the process gas source B and the plasma gas source C, and the first surface 5b of the gas distribution plate 5 having a plurality of gas outlets 5c communicating with the cavity 5a. When the ionization component 2 is located within the process chamber 1A, the first surface 5b faces the ionization component 2, and the plane containing the first surface 5b is parallel to the first direction X.

[0113] It is understandable that process gas source B provides process gas to process chamber 1A to ensure the normal implementation of coating. Plasma gas source, on the other hand, provides plasma gas to process chamber 1A to dry clean the film layer accumulated on the inner wall of process chamber 1A and on ionization component 2.

[0114] The battery cell coating system 01 also includes a remote plasma source (RPS) device, which uses RPS as a plasma gas source C. The outlet 5c of the RPS device is connected to the cavity 5a. The RPS device is used to introduce plasma gas into the cavity 5a to remove the accumulated film layer on the inner wall of the process chamber 1A and at least one of the ionization components 2.

[0115] In addition, the plasma gas can be corrosive plasma gases such as nitrogen trifluoride (NF3).

[0116] In this case, for example, the inner wall of the process chamber 1A is made of an anti-etching material that does not react with the plasma gas. This ensures the integrity of the process chamber 1A. For example, the inner wall of the process chamber 1A can be made of an aluminum alloy layer or a stainless steel layer. Alternatively, the entire process chamber 1A can be made of aluminum alloy or stainless steel.

[0117] In some examples, multiple air outlets 5c can be evenly arranged on the first surface 5b, which allows the gas to flow more evenly into the process chamber 1A, thereby enabling the substrate between any positive electrode plate 22 and negative electrode plate 23 to be coated.

[0118] For example, the first surface 5b is square, and a plurality of air outlets 5c are arranged in a square array on the first surface 5b.

[0119] In addition, the shape of the air outlet 5c can be a regular shape such as a circle or a polygon. Alternatively, the shape of the air outlet 5c can also be an irregular shape.

[0120] In some examples, the ionization component 2 is located within or overlaps with the first surface 5b in a direction perpendicular to the plane containing the first surface 5b.

[0121] This ensures that the first surface 5b covers the ionization component 2, thereby ensuring that the process gas or plasma gas discharged from the outlet 5c can flow between any adjacent positive electrode plate 22 and negative electrode plate 23.

[0122] The gas distribution plate 5 can be a single plate. In the direction perpendicular to the plane where the first surface 5b is located, the ionization component 2 is located within the first surface 5b of the gas distribution plate 5 or overlaps with the first surface 5b.

[0123] Alternatively, the gas distribution plate 5 may also include sub-plates, with multiple sub-plates spliced ​​together to form the gas distribution plate 5. Each sub-plate has a first sub-surface, and multiple first sub-surfaces are spliced ​​together to form a first surface 5b. Each sub-plate has a sub-cavity inside, and multiple sub-cavities constitute a cavity 5a. Each sub-cavity is connected to at least one of the process gas source B and the plasma gas source C.

[0124] In some examples, such as Figure 9 As shown, the gas distribution plate 5 can be located at the top of the process chamber 1A, above the ionization assembly 2.

[0125] In other examples, such as Figure 10 As shown, the air distribution plate 5 can also be located on the side of the process chamber 1A.

[0126] With the above configuration, process gas can flow through the gas distribution plate 5 to the process chamber 1A, thereby achieving coating. And / or, a plasma source can flow through the gas distribution plate 5 to the process chamber 1A, thereby achieving dry cleaning of the accumulated film layer on at least one of the ionization component 2 and the inner wall surface of the process chamber 1A. Since this application can utilize plasma gas to achieve online cleaning, it can improve cleaning efficiency and reduce the cleaning time, thereby increasing the efficiency of the cell coating system 01 in coating the substrate per unit time, and thus improving the utilization rate of the cell coating system 01.

[0127] In addition, since the first surface 5b faces the ionization component 2 and the plane on which the first surface 5b is located is parallel to the first direction X, the process gas and plasma gas discharged from the outlet 5c can flow better into the space between the positive electrode plate 22 and the negative electrode plate 23. This can reduce or avoid the interference and obstruction of the flow of process gas and plasma gas by the positive electrode plate 22 and the negative electrode plate 23, and ensure the normal progress of coating and dry cleaning.

[0128] In addition to process chamber 1A, the processing chambers 1 may also include preheating chamber 1B, loading chamber, unloading chamber 1C, etc. These will be described in detail below.

[0129] In some embodiments, such as Figure 11 As shown, the plurality of processing chambers 1 also include a preheating chamber 1B located in front of the process chamber 1A, and the ionization component 2 can be heated in the preheating chamber 1B.

[0130] The temperature inside the preheating chamber 1B can reach between 200 and 500°C. For example, the temperature inside the preheating chamber 1B can be 200°C, 250°C, 290°C, 350°C, or 500°C.

[0131] In addition, a mechanical valve (isolation valve) is installed between the preheating chamber 1B and the process chamber 1A to connect or disconnect the two. By opening the mechanical valve, the preheating chamber 1B and the process chamber 1A are connected, enabling the transport of the ionization component 2. Alternatively, by closing the mechanical valve, the preheating chamber 1B and the process chamber 1A are isolated, enabling the processing of the substrate on the ionization component 2.

[0132] By setting up a preheating chamber 1B, the ionization component 2 will first enter the preheating chamber 1B before entering the process chamber 1A. The preheating chamber 1B can heat the ionization component 2 so that the substrate on the ionization component 2 is within a suitable temperature range. In this way, the coating efficiency can be guaranteed after the ionization component 2 enters the process chamber 1A.

[0133] Based on this, such as Figure 11As shown, the battery cell coating system 01 also includes multiple heating plates 6. At least one of the inner wall surfaces of the process chamber 1A and the preheating chamber 1B is covered with heating plates 6, which are used to heat the ionization component 2.

[0134] The heating plate 6 can be disposed on at least one of the upper inner wall surface and the lower inner wall surface of the process chamber 1A. This not only achieves heating of the ionization component 2 but also avoids interference from the conveying device 3, facilitating the placement of the heating plate 6. Similarly, the heating plate 6 can be disposed on at least one of the upper inner wall surface and the lower inner wall surface of the preheating chamber 1B. This not only achieves heating of the ionization component 2 but also avoids interference from the conveying device 3, facilitating the placement of the heating plate 6.

[0135] Of course, the heating plate 6 can also be disposed on the inner side wall of the process chamber 1A. Similarly, the heating plate 6 can also be disposed on the inner side wall of the preheating chamber 1B.

[0136] In addition, the heating plate 6 can be heated in contact with the ionization component 2, or it can be heated in a non-contact manner with the ionization component 2, such as by radiation heating.

[0137] With the above setup, multiple heating plates 6 can be used to heat the substrate located in the preheating chamber 1B and / or the process chamber 1A to ensure that the substrate can be coated at a suitable temperature, thereby ensuring coating efficiency.

[0138] In order to transport the ionization component 2, the transport device 3 can be a one-way transport or a round-trip transport, which will be described in detail below.

[0139] In some embodiments, such as Figure 11 As shown, several processing chambers 1 constitute a processing section. The battery cell coating system 01 also includes at least one loading / unloading mechanism 7, which is used to carry the ionization component 2 and clamp the substrate. Along the conveying direction Z of the conveying device 3, the processing section includes an inlet end and an outlet end, both of which are equipped with loading / unloading mechanisms 7.

[0140] It is understandable that the inlet of the processing section refers to the end where the ionization assembly 2, carrying the uncoated substrate, enters the processing section. The outlet of the processing section refers to the end where the ionization assembly 2, carrying the substrate after coating, exits. In other words, the conveying device 3 can unidirectionally transport the ionization assembly 2 through several processing chambers 1 within the processing section.

[0141] In some examples, such as Figure 11 As shown, the loading and unloading mechanism 7 includes an operating table 71 and a robotic arm 72. The operating table 71 is used to carry the ionization component 2, and the robotic arm 72 is used to grab the uncoated substrate onto the ionization component 2, or to remove the substrate after coating from the ionization component 2.

[0142] In some examples, such as Figure 11 As shown, the processing chambers 1 also include an exit chamber 1C with adjustable internal gas pressure. The exit chamber 1C is located at the end of the processing section and can be connected to or disconnected from the process chamber 1A via a mechanical valve. By providing the exit chamber 1C, when the exit chamber 1C is empty, the gas pressure inside the exit chamber 1C can be adjusted to be close to that of the process chamber 1A. This facilitates the entry of the ionization component 2 into the exit chamber 1C. After the ionization component 2 enters the exit chamber 1C, the gas pressure inside the exit chamber 1C can be filled to be close to the external gas pressure, thus facilitating the exit of the ionization component 2 from the exit chamber 1C to the outside. The exit chamber 1C facilitates the processing of the substrate on the ionization component 2.

[0143] Furthermore, when the conveying device 3 operates in a unidirectional manner, the preheating chamber 1B can function as an adjustable-pressure wafer loading chamber, similar in principle to the wafer unloading chamber 1C. Specifically, when the wafer loading chamber is empty, the gas pressure inside can be filled to near the external gas pressure, facilitating the entry of the ionization assembly 2. After the ionization assembly 2 enters the wafer loading chamber, the gas pressure inside can be adjusted to near the gas pressure in the process chamber 1A, thus facilitating the entry of the ionization assembly 2 from the wafer loading chamber into the process chamber 1A. The wafer loading chamber facilitates the processing of the substrate on the ionization assembly 2.

[0144] With the above configuration, the ionization assembly 2 without a substrate loads the uncoated substrate at the loading / unloading mechanism 7 at the inlet end. The substrate then passes through multiple processing chambers 1 via the conveying device 3 to complete the coating process. Finally, it is conveyed to the loading / unloading mechanism 7 at the outlet end, where the coated substrate is picked up and removed from the ionization assembly 2 for further processing. This configuration facilitates the loading and unloading of the substrate.

[0145] In other embodiments, such as Figure 12 As shown, several processing chambers 1 constitute a processing section. The battery cell coating system 01 also includes at least one loading / unloading mechanism 7, which is used to carry the ionization component 2 and clamp the substrate. Along the extension direction of the conveying device 3, the conveying device 3 has a first conveying direction Z1 and a second conveying direction Z2 in opposite directions. The processing section has an inlet and outlet end located at the end of the conveying device 3, and the loading / unloading mechanism 7 is provided at the inlet and outlet end.

[0146] It is understandable that the inlet and outlet ends of the processing section refer to the fact that the conveying device 3 can drive the ionization component 2 from one end of the processing section into or out of the processing section.

[0147] In some examples, the cell coating system 01 includes a preheating chamber 1B, which is connected to or isolated from the inlet and outlet ends via mechanical valves.

[0148] In this case, the preheating chamber 1B can simultaneously serve as either the film inlet chamber or the film outlet chamber 1C. The functions of the film inlet chamber and the film outlet chamber 1C have already been described above, and will not be repeated here.

[0149] With the above setup, the ionization assembly 2 without a substrate is located at the inlet / outlet end. The loading / unloading mechanism 7 then picks up the uncoated substrate and places it onto the ionization assembly 2. The substrate then travels along the first conveying direction Z1 through multiple processing chambers 1 to complete the coating process. It is then conveyed along the second conveying direction Z2 to the loading / unloading mechanism 7 at the inlet / outlet end, where the coated substrate is picked up and removed from the ionization assembly 2 for further processing. This setup facilitates the loading and unloading of substrates.

[0150] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A battery cell coating system, characterized in that, include: A plurality of processing chambers (1), including at least one process chamber (1A); The ionization component (2) includes a base (21), a plurality of positive electrode plates (22) and a plurality of negative electrode plates (23), wherein the plurality of positive electrode plates (22) and the plurality of negative electrode plates (23) are all connected to the base (21) and are arranged alternately at intervals along a first direction (X); The conveying device (3) is installed in the plurality of processing chambers (1) and is used to convey the ionization component (2) through the plurality of processing chambers (1). When the ionization component (2) is located in the process chamber (1A), the positive electrode plate (22) and the negative electrode plate (23) can ionize the process gas between them to deposit a film on the substrate between them. The first direction (X) is parallel to the bearing surface of the conveying device (3).

2. The battery cell coating system according to claim 1, characterized in that, The thickness directions of both the positive electrode plate (22) and the negative electrode plate (23) are parallel to the first direction (X).

3. The battery cell coating system according to claim 1, characterized in that, The conveying direction of the conveying device (3) is the same as or at an angle to the first direction (X).

4. The battery cell coating system according to any one of claims 1 to 3, characterized in that, The plurality of positive electrode plates (22) and the plurality of negative electrode plates (23) are all electrically connected to the base (21); the battery cell coating system (01) further includes: an electrode feeding assembly (4), the electrode feeding assembly (4) including an electrode feeding end (41); When the ionization component (2) is located inside the process chamber (1A), the electrode feed end (41) can be electrically connected to the base (21).

5. The battery cell coating system according to claim 4, characterized in that, The electrode feeding assembly (4) further includes an electrode rod (43), the electrode feeding end (41) is located at the end of the electrode rod (43), and the electrode rod (43) is movable to drive the electrode feeding end (41) to contact or separate from the base (21).

6. The battery cell coating system according to claim 5, characterized in that, The base (21) has an electrode mating hole, and the electrode rod (43) can move to drive the electrode feed end (41) to extend into or out of the electrode mating hole.

7. The battery cell coating system according to any one of claims 1 to 3, characterized in that, The battery cell coating system (01) further includes: a gas distribution plate (5) disposed in the process chamber (1A), the gas distribution plate (5) having a cavity (5a), the cavity (5a) being able to communicate with at least one of the process gas source (B) and the plasma gas source (C), and the first surface (5b) of the gas distribution plate (5) having a plurality of gas outlets (5c) communicating with the cavity (5a); When the ionization component (2) is located inside the process chamber (1A), the first surface (5b) faces the ionization component (2), and the plane containing the first surface (5b) is parallel to the first direction.

8. The battery cell coating system according to any one of claims 1 to 3, characterized in that, The number of conveying devices (3) is multiple, and the multiple conveying devices (3) are laid sequentially at the bottom of the plurality of processing chambers (1) along a conveying direction perpendicular to the conveying direction of the conveying devices (3).

9. The battery cell coating system according to any one of claims 1 to 3, characterized in that, The plurality of processing chambers (1) also include a preheating chamber (1B) located in front of the process chamber (1A), and the ionization component (2) can be heated in the preheating chamber (1B).

10. The battery cell coating system according to claim 9, characterized in that, The battery cell coating system (01) also includes multiple heating plates (6), and the heating plates (6) are laid on at least one of the inner wall surface of the process chamber (1A) and the inner wall surface of the preheating chamber (1B). The heating plates (6) are used to heat the ionization component (2).

11. The battery cell coating system according to any one of claims 1 to 3, characterized in that, The plurality of processing chambers (1) constitute a processing section; the battery cell coating system (01) further includes at least one loading and unloading mechanism (7), which is used to carry the ionization component (2) and clamp the substrate; Along the conveying direction (Z) of the conveying device (3), the processing section includes an inlet end and an outlet end, both of which are equipped with the loading and unloading mechanism (7); or, Along the extension direction of the conveying device (3), the conveying device (3) has a first conveying direction (Z1) and a second conveying direction (Z2) in opposite directions. The processing section has an inlet and outlet end located at the end of the conveying device (3), and the inlet and outlet end is provided with the loading and unloading mechanism (7).

12. The battery cell coating system according to any one of claims 1 to 3, characterized in that, The number of ionization components (2) is multiple, and one processing chamber (1) can accommodate the multiple ionization components (2); the multiple ionization components (2) are arranged sequentially along the conveying direction of the conveying device (3); or, the multiple ionization components (2) are arranged sequentially along the conveying direction perpendicular to the conveying device (3).

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