Composite silver foil applied to 224G and 448G high-frequency communication and high-speed interconnection structure

By setting a continuous and dense silver layer on a copper foil substrate and performing electrochemical treatment, a high-frequency signal transmission surface and a bonding functional surface are formed, which solves the problem of difficulty in balancing high-frequency low-loss transmission, dielectric layer bonding and storage stability in 224G and 448G high-frequency communication, and achieves high-frequency low-loss transmission and storage stability.

CN122348097APending Publication Date: 2026-07-07HANGZHOU JULI INSULATION
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Patent Information

Application Number
CN202610498687.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-04-15
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

Existing technologies struggle to simultaneously achieve high-frequency, low-loss transmission, integration performance with the media layer, and storage stability in 224G and 448G high-frequency communication scenarios.

Method used

A continuous and dense silver layer is formed on the first surface of the copper foil substrate by pulse electroplating or double pulse electroplating, and then electrochemical leveling or electropolishing is performed to make the surface roughness Ra≤0.05μm of the silver layer, forming a high-frequency signal transmission surface; a bonding functional surface is formed on the second surface, which is bonded to the dielectric layer through the interface bonding area, and a temporary anti-gloss protection layer is set.

Benefits of technology

It achieves high-frequency, low-loss transmission, reliable integration with the medium layer, and stable storage, and is suitable for 224G and 448G high-frequency communication.

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Abstract

The invention relates to the technical field of high-speed data communication materials and high-speed interconnection structures, and discloses a composite silver foil applied to 224G and 448G high-frequency communication and a high-speed interconnection structure. The single-face silver layer composite copper foil comprises a copper foil base band, a continuous compact silver layer is arranged on the first surface of the copper foil base band and forms a high-frequency signal transmission face, and a combination function face is formed on the second surface of the copper foil base band. The silver layer is formed by pulse electroplating or double-pulse electroplating, and is subjected to electrochemical leveling or electropolishing treatment, so that the surface roughness Ra of the leveled silver layer is less than or equal to 0.05 mu m. The high-speed interconnection structure comprises a dielectric layer, a bonding layer and the single-face silver layer composite copper foil, the side where the silver layer is located forms a high-frequency signal transmission side, and the second surface is combined with the dielectric layer through the bonding layer. The scheme can give consideration to high-frequency low-loss transmission performance, reliability of combination with the dielectric layer and storage stability, and is suitable for 224G and 448G high-frequency data communication.
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