A TO-CAN optical module, a laser and a packaging method using the same
By introducing a butterfly-shaped package of a TEC semiconductor cooler and a thermistor into the TO-CAN chip, combined with a fiber optic clamping structure of a telescopic cylinder and abutment, the problem of insufficient heat dissipation of the TO-CAN chip is solved, achieving more stable power output and fiber optic connection.
CN122348419APending Publication Date: 2026-07-07SHENZHEN PHOTONSTREAM LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN PHOTONSTREAM LTD
- Filing Date
- 2026-04-14
- Publication Date
- 2026-07-07
Smart Images
Figure CN122348419A_ABST
Abstract
The application relates to the technical field of TO-CAN chip packaging, in particular to a TO embedded butterfly-shaped packaging assembly, a TO-CAN optical module, a laser and a packaging method adopting the same, wherein the embedded butterfly-shaped packaging assembly comprises a metal support, a TEC semiconductor refrigerator, a thermistor and a semiconductor chip; the semiconductor chip and the thermistor are arranged on the metal support; the metal support is arranged on the TEC semiconductor refrigerator; and the thermistor is electrically connected with the TEC semiconductor refrigerator. In the scheme, the TEC semiconductor refrigerator can cool the semiconductor chip when the temperature of the semiconductor chip rises, so that the probability of power reduction, power instability and wavelength drift of the chip due to temperature rise in the use process can be reduced, thereby improving the stability of the power of the TO-CAN chip in use.
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