A fully automatic laser dicing apparatus

Abstract

This invention discloses a fully automatic laser scribing device, belonging to the field of solar photovoltaic module production. It includes a worktable, with a frame fixed to its top surface. Guide rails one, two, and three are fixed to the frame. Adsorption devices are slidably mounted on guide rails one and two. A sliding seat one is slidably mounted on guide rail three, and a laser cutter is mounted on the sliding seat one. Two parallel slide rails are fixed to the top surface of the worktable, perpendicular to guide rail one. One slide rail has a station one for placing silicon wafers, and the other slide rail has a station two. A lifting loading platform is provided on the worktable. This application improves the cutting efficiency of photovoltaic silicon wafers.

Description

Technical Field

[0001] This invention relates to the field of solar photovoltaic module manufacturing, and in particular to a fully automated laser scribing device. Background Technology

[0002] In the production of solar cells, there is an increasing demand to divide square solar cells into two elongated solar cells. The cutting method is generally to first use a laser to scribe the entire solar cell, and then use a splitting mechanism to break it into two.

[0003] Dicing and slitting photovoltaic silicon wafers is a critical process that determines module efficiency and yield. Currently, silicon wafer dicing is done using lasers. However, laser cutting generates a large amount of waste gas and debris, polluting the working environment. When workers inhale these fumes and debris, it can negatively impact their health. Summary of the Invention

[0004] To address the issue of workers inhaling exhaust fumes and debris during operation, thereby affecting their health, this application provides a fully automated laser scribing device.

[0005] The fully automatic laser scribing device provided in this application adopts the following technical solution: A fully automatic laser scribing device includes a worktable, a frame fixed to the top surface of the worktable, and guide rails one, two, and three fixed to the frame. Adsorption devices are slidably mounted on guide rails one and two. A sliding seat one is slidably mounted on guide rail three, and a laser cutter is mounted on the sliding seat one. Two parallel slide rails are fixed to the top surface of the worktable, perpendicular to guide rail one. One slide rail has a station one for placing silicon wafers, and the other slide rail has a station two. A lifting loading platform is provided on the worktable. A dust suction pipe is fixed to the sliding seat one, with its bottom end facing downwards towards the laser cutter. A connecting pipe is fixed to the top end of the dust suction pipe. A vacuum cleaner is provided on the worktable, with the end of the connecting pipe away from the dust suction pipe fixed to the air inlet of the vacuum cleaner. A fume treatment component is provided on the worktable for filtering the fumes and debris sucked in by the vacuum cleaner.

[0006] By adopting the above technical solution, photovoltaic silicon wafers are placed on a lifting loading platform. The lifting loading platform then raises the photovoltaic silicon wafers to a designated height. The adsorption device on guide rail one then slides above the lifting loading platform, allowing it to pick up the photovoltaic silicon wafers. The adsorption device then moves the photovoltaic silicon wafers to above station one, where it places them. The sliding seat one then moves the laser cutter above station one. Station one then moves the photovoltaic silicon wafers downwards along guide rail two. During this movement, the laser cutter cuts the photovoltaic silicon wafers. Simultaneously, the adsorption device on guide rail one moves back above the lifting loading platform, picking up the photovoltaic silicon wafers and moving them... The laser cutter moves to station two. When station one moves downwards towards guide rail two, the adsorption device on guide rail two removes the cut photovoltaic silicon wafers from station one for processing at the next station. Then, station one moves back below guide rail for easy material placement. Simultaneously, sliding seat one moves the laser cutter above station two. When station two moves downwards towards guide rail two, the laser cutter cuts the photovoltaic silicon wafers on station two. When the laser cutter cuts the photovoltaic silicon wafers on station one or station two, the dust and debris generated during cutting are promptly removed by the dust extraction pipe. The dust and debris are then filtered by the dust extraction component before being discharged, reducing air pollution in the factory and thus reducing the possibility of the exhaust gas and debris generated by laser cutting affecting the health of workers.

[0007] Preferably, the flue gas treatment assembly includes a flue gas treatment cylinder fixed to the top surface of the workbench, a flue gas filter cylinder disposed inside the flue gas treatment cylinder, an air supply pipe fixedly connected to the air outlet of the vacuum cleaner, one end of the air supply pipe away from the vacuum cleaner being fixed to the outer peripheral surface of the flue gas treatment cylinder, the air supply pipe being connected to the flue gas treatment cylinder, and an exhaust pipe fixed to the outer peripheral surface of the flue gas treatment cylinder, the exhaust pipe being connected to the flue gas treatment cylinder.

[0008] By adopting the above technical solution, the gas and debris sucked in by the vacuum cleaner are transported to the flue gas treatment cylinder through the air supply pipe. The flue gas filter in the flue gas treatment cylinder filters out the debris and adsorbs harmful substances in the exhaust gas. Then the treated gas is discharged through the exhaust pipe.

[0009] Preferably, the top surface of the flue gas filter cylinder is provided with an inclined surface, and a limiting ring is fixed at the top of the flue gas filter cylinder at an inclined position. The outer peripheral surface of the limiting ring is in contact with the inner peripheral surface of the flue gas treatment cylinder, and the outlet of the gas supply pipe is arranged facing the opening of the flue gas filter cylinder.

[0010] By adopting the above technical solution, the gas discharged from the gas pipeline is blown towards the opening of the flue gas filter cartridge, which facilitates the falling of debris into the flue gas filter cartridge and makes it easier to collect the debris.

[0011] Preferably, a sliding seat 2 is slidably disposed on both the first guide rail and the second guide rail. The adsorption device includes a cylinder 1 fixed on the sliding seat 2. A mounting plate is fixed to the bottom end of the piston rod of the cylinder 1. Suction cups are disposed at the bottom corners of the mounting plate.

[0012] By adopting the above technical solution, when the photovoltaic silicon wafer is placed on the lifting loading platform, the lifting loading platform raises the photovoltaic silicon wafer to a specified height. The sliding seat 2 on the guide rail 1 moves towards the direction close to the lifting loading platform, so that the sliding seat 2 drives the cylinder 1 to move above the loading lifting platform. Then, the cylinder 1 is activated, and the piston rod of the cylinder 1 pushes the mounting plate downward, so that the mounting plate drives the suction cup downward, so that the suction cup picks up the photovoltaic silicon wafer. Then, by moving the sliding seat 2, the sliding seat 2 drives the cylinder to move above station 1 or station 2, so that the suction cup places the photovoltaic silicon wafer on station 1 or station 2.

[0013] Preferably, the connecting pipe includes a flexible tube fixed to the top of the vacuum cleaner pipe, a fixing tube fixed to the end of the flexible tube away from the vacuum cleaner pipe, the fixing tube fixed to the top surface of the guide rail three, and the fixing tube fixed to the air inlet of the vacuum cleaner at the end away from the flexible tube.

[0014] By adopting the above technical solution, a flexible hose is connected to the top of the vacuum tube, which facilitates the movement of the vacuum tube by the sliding seat.

[0015] Preferably, a groove is provided on one side of the top surface of the workbench, and the lifting loading platform includes a cylinder two fixed to the bottom surface of the groove. Two guide bars are fixed on the top surface of the workbench and arranged parallel to each other. A movable frame is provided between the two guide bars. A feeding tray is placed above the movable frame. The piston rod of the cylinder two can push the feeding tray to move vertically. A handle is fixed on the top surface of the feeding tray.

[0016] By adopting the above technical solution, the photovoltaic silicon wafer is placed on the moving disk, and then the handle is pushed. The handle drives the moving disk to move, so that the moving disk moves above the groove. Then, cylinder two is activated. The piston rod of cylinder two pushes the moving disk upward, and the moving disk drives the photovoltaic silicon wafer upward to the designated position, so that the sliding seat two on guide rail one can drive the suction cup to move above the moving disk to pick up the photovoltaic silicon wafer.

[0017] Preferably, two positioning posts are fixed at each of the four edges of the top surface of the movable frame, and the positioning posts are located around the feeding tray.

[0018] By adopting the above technical solution, positioning posts are fixed at the four edges of the top surface of the moving frame, which facilitates the positioning of the photovoltaic silicon wafers placed on the moving frame.

[0019] Preferably, the feeding tray has grooves on all four sides, and the positioning post passes through the grooves.

[0020] By adopting the above technical solution, the positioning column passes through the slide groove, thereby making the start cylinder two more stable when the piston rod of cylinder two pushes the moving plate to move vertically.

[0021] Preferably, guide grooves are provided on the opposite sides of the two guide strips, and the two ends of the movable frame are respectively disposed in the two guide grooves.

[0022] By adopting the above technical solution, the two ends of the moving disk are respectively set in the guide grooves on the two guide bars, which makes the moving frame move more stably.

[0023] Preferably, a receiving box is placed on the top surface of the workbench, and the receiving box is located on one side of the lifting loading platform.

[0024] By adopting the above technical solution, the receiving box is set on one side of the loading platform. After the laser cutter finishes cutting the photovoltaic silicon wafer, the sliding seat on the guide rail 2 drives the suction cup to move above station 1 or station 2, so that the suction cup picks up the photovoltaic silicon wafer on station 1 or station 2. Then the sliding seat 2 drives the suction cup to move above the receiving box, so that the suction cup can place the cut photovoltaic silicon wafer into the receiving box.

[0025] In summary, this application includes at least one of the following beneficial technical effects: 1. Place the photovoltaic silicon wafer on the lifting loading platform, then the lifting loading platform raises the photovoltaic silicon wafer to the designated height. The adsorption device on guide rail one then slides above the lifting loading platform, allowing it to pick up the photovoltaic silicon wafer. The adsorption device then moves the photovoltaic silicon wafer to above station one, where it is placed. The sliding seat one then moves the laser cutter above station one. Station one then moves the photovoltaic silicon wafer downwards towards guide rail two. During this movement, the laser cutter cuts the photovoltaic silicon wafer. Simultaneously, the adsorption device on guide rail one moves back above the loading lifting platform, picking up the photovoltaic silicon wafer and moving it to station two. As station one moves downwards towards guide rail two... After the laser cutter moves, the adsorption device on guide rail 2 removes the photovoltaic silicon wafers cut at station 1 for processing at the next station. Then, station 1 moves back to below guide rail 2 for easy material placement. At the same time, sliding seat 1 moves the laser cutter above station 2. As station 2 moves downwards towards guide rail 2, the laser cutter cuts the photovoltaic silicon wafers at station 2, achieving alternating operation between the two stations, thereby improving the cutting efficiency of the photovoltaic silicon wafers. When the laser cutter cuts the photovoltaic silicon wafers at station 1 or station 2, the dust and debris generated during cutting are promptly removed by the dust extraction pipe. The dust and debris are then filtered by the dust extraction component before being discharged, reducing air pollution in the factory and thus reducing the possibility of the exhaust gas and debris generated by laser cutting affecting the health of the workers. 2. When the photovoltaic silicon wafer is placed on the lifting loading platform, the lifting loading platform raises the photovoltaic silicon wafer to the designated height. The sliding seat 2 on the guide rail 1 is moved towards the direction close to the lifting loading platform, so that the sliding seat 2 drives the cylinder 1 to move above the loading lifting platform. Then, the cylinder 1 is activated, and the piston rod of the cylinder 1 pushes the mounting plate downward, so that the mounting plate drives the suction cup downward, so that the suction cup picks up the photovoltaic silicon wafer. Then, by moving the sliding seat 2, the sliding seat 2 drives the cylinder to move above station 1 or station 2, so that the suction cup places the photovoltaic silicon wafer on station 1 or station 2. 3. Place the photovoltaic silicon wafer on the moving plate, then push the handle to move the moving plate to the top of the groove. Then activate cylinder two. The piston rod of cylinder two pushes the moving plate upward, and the moving plate moves the photovoltaic silicon wafer upward to the designated position, so that the sliding seat two on guide rail one can move the suction cup to the top of the moving plate to pick up the photovoltaic silicon wafer. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of the fully automatic laser scribing equipment according to an embodiment of this application.

[0027] Figure 2 This is a schematic diagram of the structure of guide rail two in the embodiment of this application.

[0028] Figure 3 This is a schematic diagram of the adsorption device in the embodiments of this application.

[0029] Figure 4 This is a cross-sectional view of the workbench in an embodiment of this application.

[0030] Figure 5 This is a schematic diagram of the lifting loading platform in the embodiments of this application.

[0031] Figure 6 This is a schematic diagram of the structure of the flue gas treatment cylinder in the embodiments of this application. Reference numerals: 1. Workbench; 11. Slide rail; 12. Station 1; 13. Station 2; 2. Hinge; 21. Guide rail 1; 22. Guide rail 2; 23. Guide rail 3; 24. Sliding seat 1; 25. Laser cutter; 26. Dust suction pipe; 27. Connecting pipe; 271. Flexible hose; 272. Fixing pipe; 28. Vacuum cleaner; 3. Adsorption device; 31. Sliding seat 2; 32. Cylinder 1; 33. Mounting plate; 34. Suction cup; 4. Lifting loading platform; 41. Groove; 42. Cylinder 2; 43. Guide bar; 431. 44. Guide groove; 45. Moving frame; 46. Positioning post; 47. Slide groove; 48. Handle; 49. Receiving box; 70. Discharge tray; 71. Flue gas treatment assembly; 72. Flue gas treatment cylinder; 73. Flue gas filter cylinder; 74. Spring; 75. Inclined surface; 76. Limiting ring; 77. Sealing cover; 761. Rotating rod; 762. Baffle; 77. Drive rod; 78. Insertion groove; 89. Gas supply pipe; 80. Exhaust pipe; 81. Solenoid valve one; 82. Solenoid valve two; 83. Flue gas detector; 84. Controller; 85. Return pipe. Detailed Implementation

[0032] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0033] This application discloses a fully automatic laser scribing device.

[0034] Reference Figure 1 A fully automatic laser scribing device includes a worktable 1. The top surface of the worktable 1 is fixed with two parallel slide rails 11. One slide rail 11 has a station 12 for placing silicon wafers, and the other slide rail 11 has a station 13.

[0035] Reference Figure 1 and Figure 2A frame 2 is fixed to the top surface of the worktable 1. Two slide rails 11 are located below the frame 2 and are perpendicular to the frame 2. Guide rail 1 21, guide rail 22, and guide rail 3 23 are fixed on the frame 2, with guide rail 3 23 located between guide rail 1 21 and guide rail 2 22. A sliding seat 24 is slidably mounted on guide rail 3 23, and a laser cutter 25 is fixed to the side of the sliding seat 24.

[0036] Reference Figure 1 , Figure 2 and Figure 3 Adsorption devices 3 are slidably arranged on both guide rail 1 21 and guide rail 2 22. Sliding seats 2 31 are slidably arranged on both guide rail 1 21 and guide rail 2 22. Adsorption devices 3 include cylinder 1 32 fixed to the side of sliding seat 2 31. A mounting plate 33 is fixed to the bottom end of the piston rod of cylinder 1 32. Suction cups 34 are fixed to the bottom corners of the mounting plate 33.

[0037] Reference Figure 2 , Figure 4 and Figure 5 The workbench 1 is equipped with a lifting loading platform 4, which is located below the guide rail 21. A groove 41 is formed on one side of the top surface of the workbench 1. The lifting loading platform 4 includes a cylinder 42 fixed to the bottom surface of the groove 41. Two parallel guide bars 43 are fixed to the top surface of the workbench 1. A moving frame 44 is positioned between the two guide bars 43. Guide grooves 431 are formed on opposite sides of the two guide bars 43, passing through one end of each guide bar 43. The two ends of the moving frame 44 are respectively positioned within the two guide grooves 431. A feeding tray 49 for placing photovoltaic silicon wafers is placed above the moving frame 44. The piston rod of the cylinder 42 can push the feeding tray 49 to move vertically. A handle 47 is fixed to the top surface of the feeding tray 49. Two positioning posts 45 are fixed at each of the four edges of the top surface of the movable frame 44. The positioning posts 45 are located around the material feeding tray 49. Two sliding grooves 46 are opened around the material feeding tray 49, and the positioning posts 45 pass through the sliding grooves 46. A receiving box 48 is placed on the top surface of the workbench 1, and the receiving box 48 is located below the guide rail 22.

[0038] Reference Figure 1 and 6 A suction pipe 26 is fixed to the side of the sliding seat 24, with the bottom end of the suction pipe 26 facing downwards from the laser cutter 25. A fixed connecting pipe 27 is inserted into the top end of the suction pipe 26. The connecting pipe 27 includes a flexible hose 271 inserted and fixed to the top end of the suction pipe 26. A fixing pipe 272 is fixed to the end of the flexible hose 271 away from the suction pipe 26. The fixing pipe 272 is fixed to the top surface of the frame 2. A vacuum cleaner 28 is fixed to the top surface of the workbench 1, and the end of the fixing pipe 272 away from the flexible hose 271 is fixed to the air inlet of the vacuum cleaner 28.

[0039] Reference Figure 1 and Figure 6 A flue gas treatment assembly 7 is fixed to the top surface of the workbench 1. The flue gas treatment assembly 7 includes a flue gas treatment cylinder 71 fixed to the top surface of the workbench 1. A flue gas filter cylinder 72 is installed inside the flue gas treatment cylinder 71. An activated carbon layer is installed inside the flue gas filter cylinder 72. There is a gap between the outer circumferential surface of the flue gas filter cylinder 72 and the inner circumferential surface of the flue gas treatment cylinder 71. A spring 73 is fixed to the inner bottom surface of the flue gas treatment cylinder 71, and the top end of the spring 73 abuts against the bottom surface of the flue gas filter cylinder 72. An inclined surface 74 is opened on the top surface of the flue gas filter cylinder 72. An inclined limit ring 75 is fixed to the top end of the flue gas filter cylinder 72, and the outer circumferential surface of the limit ring 75 fits against the inner circumferential surface of the flue gas treatment cylinder 71. A sealing cover 76 is provided at the top end of the flue gas treatment cylinder 71, and the sealing cover 76 is fixedly connected to the flue gas treatment cylinder 71 by bolts. Two drive rods 77 are fixed to the bottom surface of the sealing cover 76, and two insertion slots 78 are opened on the top surface of the limiting ring 75. The bottom ends of the drive rods 77 are inserted into the insertion slots 78. A rotating rod 761 is rotatably mounted on the bottom surface of the sealing cover 76. The bottom end of the rotating rod 761 is located inside the flue gas filter cartridge 72. Multiple baffles 762 are fixed on the outer circumferential surface of the rotating rod 761. The multiple baffles 762 are evenly spaced along the outer circumferential surface of the rotating rod 761.

[0040] When the flue gas filter cartridge 72 is placed inside the flue gas treatment cartridge 71, the bottom end of the drive rod 77 is inserted into the insertion slot 78, and the sealing cover 76 is moved downward, so that the drive rod 77 drives the flue gas filter cartridge 72 to move downward. Then, the sealing cover 76 is fixed to the top surface of the flue gas treatment cartridge 71 with bolts, so that the drive rod 77 restricts the movement of the flue gas filter cartridge 72.

[0041] Reference Figure 1 and Figure 6An air supply pipe 8 is fixedly connected to the air outlet of the vacuum cleaner 28. The end of the air supply pipe 8 furthest from the vacuum cleaner 28 is fixed to the outer circumferential surface of the flue gas treatment cylinder 71. The air supply pipe 8 is connected to the flue gas treatment cylinder 71, and its outlet faces the opening of the flue gas filter cylinder 72. An exhaust pipe 81 is fixed to the outer circumferential surface of the flue gas treatment cylinder 71, and is connected to it. The air inlet of the exhaust pipe 81 is located below the limiting ring 75. A return pipe 86 is fixed between the exhaust pipe 81 and the air supply pipe 8, and is connected to both the exhaust pipe 81 and the air supply pipe 8. A solenoid valve 1 82 is fixed to the outer circumferential surface of the exhaust pipe 81, and a solenoid valve 2 83 is fixed to the outer circumferential surface of the return pipe 86. A flue gas detector 84 is fixed to the air outlet of the exhaust pipe 81, located on the side of the solenoid valve 1 82 closest to the flue gas treatment cylinder 71. A controller 85 is fixed on the side of the workbench 1. The output terminal of the flue gas detector 84 is electrically connected to the input terminal of the controller 85. The output terminal of the controller 85 is electrically connected to the control terminals of solenoid valve 1 82 and solenoid valve 2 83 respectively, so as to control the opening and closing of solenoid valve 1 82 and solenoid valve 2 83 in response to the detection signal of the flue gas detector 84.

[0042] The implementation principle of a fully automatic laser scribing device according to an embodiment of this application is as follows: Pull the handle 47 to pull out the moving frame 44, then place the photovoltaic silicon wafer on the feeding tray, then push the handle 47 to move the moving frame 44 to the feeding tray to the feeding position, then start the cylinder 2 42, the piston rod of the cylinder 2 42 pushes the feeding tray to move the photovoltaic silicon wafer upward, raising the photovoltaic silicon wafer to the specified height.

[0043] Then move the sliding seat 31 on the guide rail 21, so that the sliding seat 31 drives the suction cup 34 to move above the loading platform. Then start the cylinder 32. The piston rod of the cylinder 32 pushes the mounting plate 33 to move the suction cup 34 upward, so that the suction cup 34 picks up the photovoltaic silicon wafer on the loading tray. Then move the sliding seat 31 again, so that the sliding seat 31 drives the photovoltaic silicon wafer to slide above the station 12, so that the suction cup 34 places the photovoltaic silicon wafer on the station 12. Then repeat the above operation to make the suction cup 34 pick up the photovoltaic silicon wafer again and place it on the station 23.

[0044] When the photovoltaic silicon wafer is placed on station 12, the sliding seat 24 is moved, causing the laser cutter 25 to move above station 12. Station 12 then moves the photovoltaic silicon wafer below guide rail 22. During this movement, the laser cutter 25 cuts the photovoltaic silicon wafer. After cutting the photovoltaic silicon wafer on station 12, the laser cutter 25 moves above station 13, ready to cut the photovoltaic silicon wafer on station 23. When the photovoltaic silicon wafer cut at station 12 moves to below guide rail 22, the adsorption device 3 on guide rail 22 moves to above station 12, so that the suction cup 34 picks up the photovoltaic silicon wafer cut at station 12. Then the adsorption device 3 moves to above the receiving box 48 and places the laser-cut photovoltaic silicon wafer in the receiving box 48. After the laser-cut photovoltaic silicon wafer is removed from station 12, station 12 moves to below guide rail 21 to place the photovoltaic silicon wafer to be cut.

[0045] When station 12 moves below guide rail 21, station 23 moves below guide rail 22. The laser cutter 25 cuts the photovoltaic silicon wafer on station 23, so that the laser cutter 25 continuously cuts the photovoltaic silicon wafer on station 12 and station 23, realizing the alternating operation of the two stations, thereby improving the cutting efficiency of photovoltaic silicon wafer.

[0046] The vacuum cleaner 28 sucks in the fumes and debris generated by laser cutting through the suction pipe 26 and discharges them into the fume treatment cylinder 71 through the exhaust pipe 81. The gas discharged from the exhaust pipe 81 blows towards the baffle 762, causing the baffle 762 to rotate and increase the airflow in the fume filter cylinder 72. This facilitates the fumes to pass through the fume filter cylinder 72 more quickly. At the same time, the debris hits the baffle 762 and falls to the bottom of the fume filter cylinder 72, thereby reducing the possibility of debris being blown directly onto the inner wall of the fume filter cylinder 72 and clogging the fume filter cylinder 72. This makes it easier for the fumes to pass through the fume filter cylinder 72. The filtered flue gas is discharged into the exhaust pipe 81. The flue gas detector 84 detects the filtered flue gas and transmits the detection signal to the controller 85. When the detection result transmitted from the flue gas detector 84 to the controller 85 is qualified, the controller 85 controls the opening of solenoid valve 1 82 and the closing of solenoid valve 2 83, so that the qualified flue gas is discharged through the exhaust pipe 81. When the detection result transmitted from the flue gas detector 84 to the controller 85 is unqualified, the controller 85 controls the closing of solenoid valve 1 82 and the opening of solenoid valve 2 83, so that the filtered flue gas in the exhaust pipe 81 flows back to the gas supply pipe 8 through the return pipe 86 for further filtration. This reduces the discharge of unqualified flue gas and thus reduces the possibility of the exhaust gas and debris generated by laser cutting affecting the health of the workers.

[0047] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A fully automatic laser scribing device, characterized in that: The system includes a workbench (1), on the top surface of which a frame (2) is fixed. A guide rail (21), a guide rail (22), and a guide rail (23) are fixed on the frame (2). An adsorption device (3) is slidably mounted on both guide rail (21) and guide rail (22). A sliding seat (24) is slidably mounted on guide rail (23). A laser cutter (25) is mounted on the sliding seat (24). Two parallel slide rails (11) are fixed on the top surface of the workbench (1). The slide rails (11) are perpendicular to guide rail (21). One of the slide rails (11) has a workstation (12) for placing silicon wafers slidably mounted on it. Another slide rail (11) is slidably provided with a second workstation (13). A lifting loading platform (4) is provided on the workbench (1). A dust suction pipe (26) is fixed on the first sliding seat (24). The bottom end of the dust suction pipe (26) is set towards the bottom of the laser cutter (25). A connecting pipe (27) is fixed at the top end of the dust suction pipe (26). A vacuum cleaner (28) is provided on the workbench (1). The end of the connecting pipe (27) away from the dust suction pipe (26) is fixed at the air inlet of the vacuum cleaner (28). A flue gas treatment component (7) is provided on the workbench (1) for filtering the smoke and debris sucked in by the vacuum cleaner (28).

2. The fully automatic laser scribing device according to claim 1, characterized in that: The flue gas treatment assembly includes a flue gas treatment cylinder (71) fixed to the top surface of the workbench (1), a flue gas filter cylinder (72) is provided inside the flue gas treatment cylinder (71), an air supply pipe (8) is fixedly connected to the air outlet of the vacuum cleaner (28), one end of the air supply pipe (8) away from the vacuum cleaner (28) is fixed to the outer peripheral surface of the flue gas treatment cylinder (71), the air supply pipe (8) is connected to the flue gas treatment cylinder (71), and an exhaust pipe (81) is fixed to the outer peripheral surface of the flue gas treatment cylinder (71), the exhaust pipe (81) is connected to the flue gas treatment cylinder (71).

3. The fully automatic laser scribing device according to claim 2, characterized in that: The top surface of the flue gas filter cylinder (72) is provided with an inclined surface (74), and a limiting ring (75) is fixed at the top of the flue gas filter cylinder (72) at an incline. The outer circumferential surface of the limiting ring (75) is in contact with the inner circumferential surface of the flue gas treatment cylinder (71), and the outlet of the gas supply pipe (8) is set towards the opening of the flue gas filter cylinder (72).

4. The fully automatic laser scribing device according to claim 1, characterized in that: Sliding seats (31) are slidably arranged on both guide rail one (21) and guide rail two (22). The adsorption device (3) includes a cylinder one (32) fixed on the sliding seat two (31). The bottom end of the piston rod of the cylinder one (32) is fixed with a mounting plate (33). Suction cups (34) are provided at the bottom corners of the mounting plate (33).

5. The fully automatic laser scribing device according to claim 4, characterized in that: The connecting pipe (27) includes a flexible tube (271) fixed to the top of the suction pipe (26). A fixing tube (272) is fixed to one end of the flexible tube (271) away from the suction pipe (26). The fixing tube (272) is fixed to the top surface of the guide rail (23). The fixing tube (272) is fixed to the air inlet of the vacuum cleaner (28) at one end away from the flexible tube (271).

6. The fully automatic laser scribing device according to claim 1, characterized in that: The workbench (1) has a groove (41) on one side of its top surface. The lifting loading platform (4) includes a cylinder (42) fixed to the bottom surface of the groove (41). The top surface of the workbench (1) has two parallel guide bars (43) fixed on it. A moving frame (44) is provided between the two guide bars (43). A feeding tray (49) is placed above the moving frame (44). The piston rod of the cylinder (42) can push the feeding tray (49) to move vertically. A handle (47) is fixed on the top surface of the feeding tray (49).

7. The fully automatic laser scribing device according to claim 6, characterized in that: Two positioning posts (45) are fixed at each of the four edges of the top surface of the movable frame (44), and the positioning posts (45) are located around the feeding tray (49).

8. The fully automatic laser scribing device according to claim 6, characterized in that: The feeding tray (49) has grooves (46) around its perimeter, and the positioning post (45) passes through the grooves (46).

9. A fully automatic laser scribing device according to claim 8, characterized in that: Guide grooves (431) are provided on the opposite sides of the two guide bars (43), and the two ends of the moving frame (44) are respectively located in the two guide grooves (431).

10. A fully automatic laser scribing device according to claim 9, characterized in that: A receiving box (48) is placed on the top surface of the workbench (1), and the receiving box (48) is located on one side of the lifting loading platform (4).

Images