Polishing apparatus and method

Abstract

This application relates to the field of polishing technology, providing a polishing apparatus and method. The polishing apparatus includes a housing and a first driving device, a second driving device, and an energy beam array generator disposed within the housing. The first driving device carries the workpiece to be polished and drives the workpiece to vibrate or move unidirectionally along a first direction. The second driving device is equipped with the energy beam array generator, which drives the energy beam array generator to vibrate along a second direction. The energy beam array generator faces the first driving device and generates an energy beam array covering the workpiece to be polished. The first direction and the second direction form an angle. This application can effectively improve polishing efficiency and precision, is suitable for industrial production lines, and facilitates the realization of fully automated mass production of workpieces.

Description

Technical Field

[0001] This application relates to the field of polishing technology, and in particular to a polishing apparatus and method suitable for industrial production lines. Background Technology

[0002] Polishing generally refers to the processing method of modifying the surface of a workpiece using polishing tools to improve its precision. Currently, the main methods for polishing parts include manual polishing and mechanical polishing (such as asphalt disc polishing, airbag polishing, stress disc polishing, etc.). However, both manual and mechanical polishing require a long processing time, making them unsuitable for industrial production lines and hindering automated mass production of workpieces. Summary of the Invention

[0003] The purpose of this application is to provide a polishing apparatus and method, which aims to solve the problems of low efficiency and unsuitability for industrial assembly line operations in traditional polishing methods.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0005] In a first aspect, this application provides a polishing apparatus, comprising: a housing and a first driving device, a second driving device, and an energy beam array generator disposed within the housing, wherein:

[0006] The first driving device is used to carry the workpiece to be polished and drive the workpiece to vibrate or move unidirectionally along the first direction;

[0007] The second driving device is equipped with the energy beam array generator, which is used to drive the energy beam array generator to vibrate along the second direction;

[0008] The energy beam array generator is oriented toward the first driving device to generate an energy beam array that covers the workpiece to be polished.

[0009] The first direction and the second direction form an angle.

[0010] In some embodiments, when the first driving device drives the workpiece to be polished to vibrate along the first direction, the vibration amplitude is A1, and the energy beam spacing of the energy beam array along the first direction is L1, wherein: L1 / 2 < A1 < 2L1.

[0011] In some embodiments, the second driving device drives the energy beam array generator to vibrate along the second direction with an amplitude of A2, and the energy beam spacing of the energy beam array along the second direction is L2, wherein: L2 / 2 < A2 < 2L2.

[0012] In some embodiments, the included angle is between 45° and 90°.

[0013] In some embodiments, the first drive device is located at the bottom of the housing, and the second drive device is located at the top of the housing.

[0014] In some embodiments, the first driving device is a first vibration device or a conveyor belt device, and when the first driving device is the conveyor belt device, the conveyor belt device passes through the housing.

[0015] In some embodiments, the second driving device is a second vibration device.

[0016] In some embodiments, the energy beam array is a pure water jet beam array, an abrasive water jet beam array, a plasma beam array, a laser beam array, or an ion beam array.

[0017] In some embodiments, the distribution profile of the energy beam array is rectangular, circular, or hexagonal.

[0018] Secondly, this application also provides a polishing method for the above-mentioned polishing apparatus, comprising:

[0019] The workpiece to be polished is mounted on the first driving device;

[0020] Set the operating parameters of the first driving device, the second driving device, and the energy beam array generator;

[0021] The first driving device, the second driving device, and the energy beam array generator are controlled to start operation and polish the workpiece to be polished.

[0022] The beneficial effects of the polishing apparatus provided in this application include at least the following:

[0023] (1) This application uses an energy beam array for polishing, which can improve efficiency by hundreds or even thousands of times compared with traditional polishing methods, and can shorten the polishing time to less than 1 minute. It is especially suitable for industrial production lines and is conducive to realizing fully automated mass production of workpieces.

[0024] (2) This application uses vibration to replace the feed motion of traditional machine tools, which can provide rapid full-range coverage on the one hand, and simplify the device structure and reduce development costs on the other hand.

[0025] (3) This application uses an energy beam array for polishing, which does not cause heat generation and will not cause the workpiece to heat up and deform.

[0026] (4) The polishing device of this application can be used to polish various non-spherical surfaces, curved surfaces and flat surfaces, and can be used to polish various materials, with a wide range of applications. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is one of the structural schematic diagrams of the polishing apparatus provided in the embodiments of this application;

[0029] Figure 2 for Figure 1 A cross-sectional view of the polishing apparatus shown;

[0030] Figure 3 for Figure 1 The front view of the polishing apparatus shown;

[0031] Figure 4 This is a second schematic diagram of the polishing apparatus provided in the embodiments of this application;

[0032] Figure 5 for Figure 4 A cross-sectional view of the polishing apparatus shown;

[0033] Figure 6 for Figure 4 The front view of the polishing apparatus shown;

[0034] Figure 7 This is a schematic flowchart of the polishing method provided in an embodiment of this application.

[0035] The following are the labeling elements in the figure:

[0036] 1. Housing; 2. First drive unit; 3. Second drive unit; 4. Energy beam array generator;

[0037] 5. Workpiece to be polished; 6. Energy beam array. Detailed Implementation

[0038] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0039] In the description of the embodiments of this application, it should be understood that the terms "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0041] In the embodiments of this application, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0042] Currently, the main methods for polishing parts include manual polishing and mechanical polishing (such as asphalt disc polishing, airbag polishing, stress disc polishing, etc.). However, both manual and mechanical polishing require a long processing time, making them unsuitable for industrial production lines and hindering the automated mass production of workpieces.

[0043] Therefore, this application provides a polishing apparatus and method that uses an energy beam array combined with vibration for polishing. Compared with traditional polishing methods, this method can effectively improve polishing efficiency, is suitable for industrial production lines, and is conducive to realizing fully automated mass production of workpieces.

[0044] In some embodiments, refer to Figures 1 to 6As shown, the polishing apparatus provided in this application includes: a housing 1 and a first driving device 2, a second driving device 3, and an energy beam array generator 4 disposed within the housing 1. The first driving device 2 carries the workpiece 5 to be polished and drives the workpiece 5 to vibrate or move unidirectionally along a first direction X; the second driving device 3 is equipped with the energy beam array generator 4, which drives the energy beam array generator 4 to vibrate along a second direction Y; the energy beam array generator 4 faces the first driving device 2 and generates an energy beam array 6 covering the workpiece 5 to be polished; the first direction X and the second direction Y form an angle.

[0045] Specifically, housing 1 serves as the outer shell of the entire polishing apparatus, providing protection for the internal components and ensuring a safe operating environment.

[0046] The first drive unit 2 is installed inside the housing 1, responsible for supporting the workpiece 5 to be polished and enabling it to vibrate or move unidirectionally along the first direction X. It can be understood that vibration along the first direction X refers to the workpiece undergoing periodic reciprocating motion in the first direction X, while unidirectional movement along the first direction X refers to the workpiece undergoing continuous forward motion in the first direction X, moving left or right without reciprocating vibration. Here, the first direction X can be transverse (the length direction of the housing 1), longitudinal (the width direction of the housing 1), or a specific axis specified according to the equipment design. In one example, such as... Figure 2 As shown, the first direction X can be horizontal.

[0047] The second drive unit 3 is also installed inside the housing 1, and an energy beam array generator 4 is mounted on the second drive unit 3. This energy beam array generator 4 can vibrate in a second direction Y, different from the first drive unit 2. For example, it can be... Figure 2 The directions shown are longitudinal or oblique. This design ensures that the energy beam array 6 generated by the energy beam array generator 4 contacts the workpiece surface at different motion angles, covering different areas of the workpiece surface, thereby achieving a more uniform and comprehensive polishing effect.

[0048] The energy beam array generator 4 is the core component of the entire device, which can generate a set of energy beam arrays 6. This set of energy beam arrays 6 can act on the surface of the workpiece simultaneously to achieve large-area, high-efficiency polishing.

[0049] In this polishing apparatus, when the first driving device 2 drives the workpiece to vibrate along the first direction X, the workpiece surface can fully contact the energy beam array 6 generated by the energy beam array generator 4, ensuring a uniform and efficient polishing process. Simultaneously, since the second driving device 3 drives the energy beam array generator 4 to vibrate along the second direction Y, the combination of vibrations in these two different directions allows the energy beam array 6 to cover the entire surface of the workpiece, achieving a comprehensive and efficient polishing effect.

[0050] When the first driving device 2 drives the workpiece to move unidirectionally to the left or right along the first direction X, the workpiece can pass through the effective area of ​​the energy beam array generator 4 at a constant speed, thereby ensuring that each moving workpiece receives uniform polishing treatment. At the same time, combined with the vibration of the energy beam array 6 generated by the energy beam array generator 4 driven by the second driving device 3, a comprehensive and efficient polishing operation can be completed by covering different movement angles of the energy beam array 6 while maintaining unidirectional movement of the workpiece.

[0051] Understandably, this application employs an energy beam array 6 instead of a single energy beam for polishing. Since the energy beam array 6 operates simultaneously, it can complete large-area polishing tasks in a short time, significantly reducing polishing time and effectively improving polishing efficiency. Furthermore, replacing traditional machine tool feed motion with vibration not only simplifies the equipment structure and reduces manufacturing costs but also provides rapid and comprehensive surface coverage. In addition, since vibration itself does not generate significant heat accumulation, it avoids the problem of thermal deformation affecting machining accuracy.

[0052] Therefore, the polishing device proposed in this application combines the advantages of vibration technology and energy beam array 6, which improves polishing speed and ensures processing quality. It also has good adaptability and cost-effectiveness, making it very suitable for use in industrial production lines to support the needs of continuous mass production.

[0053] In some embodiments, when the first driving device 2 drives the workpiece 5 to be polished to vibrate along the first direction X, the vibration amplitude is A1, and the energy beam spacing of the energy beam array 6 along the first direction X is L1, wherein: L1 / 2 < A1 < 2L1.

[0054] Specifically, when the vibration amplitude A1 is greater than half of the energy beam spacing L1, even if there is a certain gap between adjacent energy beams, the workpiece surface in the corresponding direction will be covered by the energy beam due to the vibration of the workpiece, thus ensuring that there are no areas that cannot be polished.

[0055] Meanwhile, a vibration amplitude A1 less than twice the energy beam spacing L1 effectively limits the overlap between adjacent energy beam action areas. This avoids excessive repeated irradiation of the same area by energy beams, preventing surface quality degradation due to over-polishing.

[0056] Understandably, by reasonably adjusting the relationship between the vibration amplitude and the energy beam spacing, this application can achieve a relatively uniform energy distribution on the workpiece surface, allowing the workpiece surface to receive a relatively consistent polishing treatment, thereby improving the uniformity of the overall polishing effect. Furthermore, limiting the vibration amplitude within the aforementioned range also helps maintain the precision of the polishing process, as it avoids insufficient coverage due to excessively small vibration amplitude, and unnecessary over-polishing due to excessive amplitude, thus better controlling the polishing quality.

[0057] Therefore, the embodiments of this application not only ensure full coverage polishing, but also effectively improve polishing quality and efficiency, making them very suitable for use in automated mass production environments.

[0058] In one embodiment, when the first driving device 2 drives the workpiece 5 to be polished to vibrate along the first direction X, the vibration amplitude is A1, and the energy beam spacing of the energy beam array 6 along the first direction X is L1, where: A1=L1.

[0059] Specifically, since the vibration amplitude of the workpiece is exactly equal to the spacing between the energy beams, this means that during each vibration cycle, the workpiece surface in the corresponding direction will be irradiated by the energy beam. This ensures that the entire surface to be polished is effectively treated without any omissions. The effective area of ​​each energy beam will be evenly distributed on the workpiece surface, ensuring the consistency and uniformity of the polishing effect, without excessive overlap or insufficient coverage, thereby improving the polishing quality.

[0060] Furthermore, this design ensures that each energy beam is fully utilized, preventing energy waste due to unnecessary overlap. It also avoids the need for multiple processing steps caused by insufficient coverage, thus improving overall work efficiency.

[0061] In some embodiments, the second driving device 3 drives the energy beam array generator 4 to vibrate along the second direction Y with an amplitude of A2, and the energy beam spacing of the energy beam array 6 along the second direction Y is L2, wherein: L2 / 2 < A2 < 2L2.

[0062] Specifically, by setting L2 / 2 < A2, even if there is a certain gap between adjacent energy beams, the workpiece surface in the corresponding direction will be covered by the energy beam due to the vibration of the energy beam array generator 4, ensuring that there are no areas that cannot be polished.

[0063] At the same time, the condition A2 < 2L2 can limit the degree of overlap between adjacent energy beam action areas, prevent the same area from being repeatedly irradiated by too many energy beams, and avoid surface quality degradation or excessive material removal due to over-polishing.

[0064] This application's embodiments, through a well-designed ratio of vibration amplitude to energy beam spacing, ensure that the workpiece surface receives a relatively uniform energy distribution, thereby improving the overall uniformity of the polishing effect. This design helps maintain precision during the polishing process, preventing insufficient coverage due to excessively small vibration amplitudes and unnecessary over-polishing due to excessive amplitudes, thus better controlling the polishing quality.

[0065] In one embodiment, the second driving device 3 drives the energy beam array generator 4 to vibrate along the second direction Y with an amplitude of A2, and the energy beam spacing of the energy beam array 6 along the second direction Y is L2, where: A2=L2.

[0066] Specifically, since the vibration amplitude of the energy beam array generator 4 is exactly equal to the spacing between the energy beams, this means that during each vibration cycle, the workpiece surface at the corresponding position in the direction will be irradiated by the energy beam. This ensures that the entire surface to be polished is completely covered. The effective area of ​​each energy beam will be evenly distributed on the workpiece surface, ensuring the consistency and uniformity of the polishing effect, without excessive overlap or insufficient coverage, thereby improving the polishing quality.

[0067] This setup ensures that each energy beam is fully utilized, preventing energy waste due to unnecessary overlap. It also avoids the need for multiple processing steps caused by insufficient coverage, thus improving overall work efficiency.

[0068] In some embodiments, the angle between the first direction X and the second direction Y is between 45° and 90°, that is, the angle is greater than or equal to 45° and less than or equal to 90°.

[0069] Specifically, within an angle range of 45° to 90°, the workpiece surface can be more extensively covered by the energy beam array 6. Especially at 90°, where the first direction X can be transverse and the second direction Y can be longitudinal, this vertically intersecting motion mode maximizes the effective area of ​​each energy beam, distributing it evenly over a larger area, thus achieving comprehensive coverage of the workpiece surface. The vertical vibration combination allows for more precise control of the energy beam's position, reducing overlap between adjacent beams and improving the precision of the polishing process. This is particularly important for applications requiring high-precision polishing. Furthermore, the vertical arrangement simplifies the design and installation of the two drive units, as they can be arranged along an orthogonal coordinate system without requiring complex mechanical linkage structures. This not only reduces the complexity of the equipment but also facilitates maintenance and debugging.

[0070] Understandably, for workpieces with complex geometries or non-planar surfaces (such as spheres or curved surfaces), cross vibrations at appropriate angles can help the energy beam array better adapt to these shapes, ensuring that all areas are adequately treated.

[0071] In some embodiments, refer to Figures 1 to 6 As shown, the first drive device 2 is located at the bottom of the housing 1, and the second drive device 3 is located at the top of the housing 1.

[0072] Specifically, since the first drive device 2 is located at the bottom of the housing 1, the workpiece 5 to be polished can be placed directly on it, which facilitates loading and unloading by operators and improves work efficiency. Furthermore, placing the first drive device 2, which carries the workpiece, at the bottom lowers the center of gravity of the entire device and increases stability, which is especially important when handling larger or heavier workpieces.

[0073] The second drive unit 3 is located at the top of the housing 1, allowing the energy beam array 6 to vertically irradiate the workpiece surface from top to bottom. This arrangement simplifies the design of the polishing path and improves energy utilization efficiency.

[0074] Understandably, by placing the main functional components (i.e., the first drive unit 2 and the second drive unit 3) at the top and bottom of the housing 1 respectively, vertical space is fully utilized, making the overall equipment more compact, which is conducive to the miniaturization of the overall structure and saves floor space. Furthermore, this layered layout facilitates maintenance and upgrades, as each component is relatively independent and can be repaired or replaced individually without affecting other parts.

[0075] In some embodiments, refer to Figures 1 to 6 As shown, the first driving device 2 is a first vibration device or a conveyor belt device, and when the first driving device 2 is a conveyor belt device, the conveyor belt device passes through the box body 1.

[0076] Specifically, such as Figures 1 to 3 As shown, when the first driving device 2 is the first vibration device, it can cause the workpiece 5 to be polished to reciprocate periodically along the first direction X, while the second driving device 3 at the top causes the energy beam array generator 4 to vibrate along the second direction Y. The combination of vibrations in the two directions ensures that the energy beam array 6 can uniformly cover the entire surface of the workpiece, thereby improving the uniformity and precision of the polishing effect.

[0077] like Figures 4 to 6 As shown, when the conveyor belt device is used as the first drive device 2, the workpiece moves unidirectionally along the first direction X, that is, along the conveyor belt's transport direction. This allows the workpiece to pass through the effective area of ​​the energy beam array 6 at a constant speed, ensuring uniformity and consistency during the polishing process. The second drive device 3 located at the top allows the energy beam array 6 to vertically irradiate the workpiece surface from top to bottom, simplifying the polishing path design and ensuring the straight-line transmission of the energy beam, thus enhancing the consistency of the polishing effect.

[0078] Understandably, the design of the conveyor belt device running through housing 1 is ideal for automated production environments, allowing direct connection to existing industrial production lines for continuous, high-volume production. Furthermore, the open design of the conveyor belt device makes loading and unloading workpieces extremely easy, improving operational convenience and work efficiency. By precisely controlling the conveyor belt speed, it can be ensured that each workpiece receives a consistent polishing time, guaranteeing consistent product quality.

[0079] To achieve the best polishing results, you can select the appropriate configuration based on the specific application scenario, for example:

[0080] Vibration devices are suitable for high-precision requirements: If the polishing task requires extremely high surface quality and uniformity, a vibration device can be selected because it can provide finer control and better coverage.

[0081] Conveyor belt systems are suitable for high-efficiency, high-volume production: if the focus is on improving production efficiency and achieving automated assembly line operations, then a conveyor belt system can be selected, as it can ensure fast and stable workpiece transport and support continuous production.

[0082] In some embodiments, the second driving device 3 is a second vibration device.

[0083] Specifically, such as Figure 2 As shown, the second vibration device causes the energy beam array generator 4 to vibrate along the second direction Y, which, combined with the first driving device 2, drives the workpiece to move along the first direction X, forming a cross-coverage pattern. This ensures that the energy beam array 6 can contact the workpiece surface from multiple angles, achieving a wider coverage and thus significantly improving the coverage, uniformity, and accuracy during the polishing process.

[0084] In some embodiments, the energy beam array 6 can be a pure water jet beam array, an abrasive water jet beam array, a plasma beam array, a laser beam array, or an ion beam array, etc.

[0085] Specifically, when using a pure water jet array, even if pure water is used as the medium, no additional chemicals are introduced, making it suitable for applications requiring high cleanliness. Furthermore, the water jet itself has a cooling effect, preventing overheating and deformation of the workpiece. Additionally, the polishing intensity can be controlled by adjusting the water pressure, making it suitable for materials of varying hardness.

[0086] When using an abrasive waterjet array, abrasive particles (such as silicon carbide and alumina) are mixed into the high-pressure water jet. This combines the cooling effect of the waterjet with the cutting ability of the abrasive, enabling rapid removal of surface material. It is suitable for materials of various hardnesses, and is particularly effective for difficult-to-machine materials such as cemented carbide and ceramics. Furthermore, different polishing effects can be achieved by adjusting the type, size, and concentration of abrasive particles.

[0087] When using plasma beam arrays, the plasma temperature is extremely high, which can change the surface structure of materials in a short time to achieve polishing, cleaning, or modification. Furthermore, it eliminates the need for direct contact with the workpiece, reducing the risk of mechanical damage.

[0088] When using a laser beam array, the laser beam has high focusing precision, enabling micron-level or even nanometer-level fine processing. By adjusting parameters such as laser power, frequency, and scanning speed, the polishing depth and surface roughness can be flexibly controlled. Furthermore, the laser beam does not directly contact the workpiece, avoiding damage caused by mechanical stress.

[0089] When using an ion beam array, the ion beam energy is relatively low, resulting in less damage to the workpiece material, making it particularly suitable for processing precision parts. Furthermore, the ion beam is well-focused, allowing for precise machining within extremely small areas.

[0090] To achieve the best polishing effect, the appropriate type of energy beam array can be selected according to the specific application scenario, for example:

[0091] High precision requirements: If the polishing task requires extremely high surface quality and uniformity, laser beam arrays or ion beam arrays can be selected, which can provide fine control and good coverage.

[0092] High-efficiency mass production: If the focus is on improving production efficiency and supporting automated production line operations, pure water jet arrays or abrasive water jet arrays can be selected. They can ensure fast and stable workpiece processing and support continuous production.

[0093] Special material handling: For tasks requiring surface modification or handling of special materials, plasma beam arrays can be selected because they can achieve surface chemical changes without damaging the material.

[0094] Therefore, this application can flexibly adjust different types of energy beam arrays according to specific needs to achieve the best polishing effect.

[0095] In some embodiments, the distribution profile shape of the energy beam array 6 can be rectangular, circular, or hexagonal, etc.

[0096] Specifically, rectangular distributions can effectively utilize space and are particularly suitable for processing workpieces with regular geometric shapes, such as metal sheets and glass panels. Rectangularly arranged energy beams easily form a uniform energy distribution, ensuring consistent polishing in every area.

[0097] A circular energy distribution concentrates energy in the central area, making it suitable for tasks requiring localized high-intensity polishing. Compared to a rectangular distribution, a circular distribution better reduces energy loss at the edges, ensuring that edges are also adequately treated. It can adapt to various curved surfaces and irregularly shaped workpieces, such as spherical or cylindrical parts, providing greater flexibility.

[0098] The hexagonal distribution can be well adapted to workpieces of different sizes and shapes, providing wide applicability.

[0099] To achieve the best polishing effect, an appropriate energy beam distribution profile shape can be selected based on the specific application scenario, for example:

[0100] Regular-shaped workpieces: If the workpiece has a relatively regular shape (such as a cuboid), a rectangular distribution profile can be selected, which can provide efficient coverage and uniform energy distribution.

[0101] For curved or complex shaped workpieces: For curved surfaces or workpieces with complex geometry, circular or hexagonal distribution profiles can be selected, as they can better adapt to these shapes and ensure full coverage.

[0102] Therefore, this application can flexibly adjust the distribution of different energy beam arrays according to specific needs to achieve the best polishing effect.

[0103] In some embodiments, refer to Figure 7 As shown, this application also provides a polishing method for the polishing apparatus of the above embodiments, comprising the following steps:

[0104] S701. The workpiece 5 to be polished is mounted on the first drive device 2.

[0105] First, place the workpiece 5 to be polished on the first drive device 2 and ensure that it is securely fixed in place. If the first drive device 2 is a conveyor belt device, it is necessary to ensure that the workpiece can move smoothly on the conveyor belt; if it is a vibration device, it is necessary to ensure that the workpiece will not shift or fall off due to vibration.

[0106] Adjust the position of the workpiece so that it is below the energy beam array generator 4, ensuring that the entire surface of the workpiece is within the coverage of the energy beam array 6. This step is crucial for ensuring complete polishing.

[0107] S702, Set the operating parameters of the first driving device 2, the second driving device 3 and the energy beam array generator 4.

[0108] If the first drive device 2 is a vibration device, the vibration frequency and amplitude can be set according to actual needs. For example, the vibration amplitude A1 is equal to the energy beam spacing L1 to ensure optimal coverage. If the first drive device 2 is a conveyor belt device, the unidirectional movement speed of the workpiece can be set according to actual needs.

[0109] Furthermore, the vibration frequency and amplitude of the second drive device 3 can be set according to actual needs. For example, the vibration amplitude A2 is equal to the energy beam spacing L2 to ensure that the energy beam array can effectively cover different areas of the workpiece surface and avoid excessive repeated polishing.

[0110] In addition, the appropriate type of energy beam array (such as pure water jet array, abrasive water jet array, plasma beam array, laser beam array or ion beam array), energy beam spacing and jet pressure of the energy beam can be selected according to actual needs.

[0111] S703, control the first drive device 2, the second drive device 3 and the energy beam array generator 4 to start operation and polish the workpiece 5 to be polished.

[0112] The first drive unit 2, the second drive unit 3, and the energy beam array generator 4 can be activated through the control system to ensure that all components work together according to preset parameters. During the polishing process, the operating status of each device is monitored in real time, and fine adjustments can be made as necessary to ensure that the polishing effect meets expectations. When the predetermined polishing cycle ends or the desired polishing effect is achieved, the operation of all devices is stopped, and the polished workpiece is removed.

[0113] Therefore, the polishing method provided in this application embodiment can ensure that the workpiece 5 to be polished receives a comprehensive and uniform polishing treatment, which not only improves work efficiency but also increases flexibility and adaptability. It is very suitable for application in automated mass production environments to ensure the high quality and consistency of products.

[0114] The polishing apparatus and method provided in this application will be further described below with reference to specific examples. In the following examples, an abrasive water jet array is used as the energy beam array 6. The energy beam array 6 is an 11×11 rectangular jet array. The spacing between the energy beams in the first direction X and the second direction Y is 10 mm, and the jet pressure of each energy beam is 10 bar. The workpiece 5 to be polished vibrates at a speed of 10 mm / s and an amplitude of 10 mm in the first direction X. The energy beam array generating device 4 vibrates at a speed of 10 mm / s and an amplitude of 10 mm in the second direction Y.

[0115] Example 1: Reference Figures 1 to 3 As shown, the first driving device 2 is a first vibration device, and the second driving device 3 is a second vibration device. This embodiment allows the polishing device to be placed at one of the workstations in an industrial production line.

[0116] In this embodiment, the polishing device mainly includes a housing 1 and a first vibration device, a second vibration device, and an energy beam array generator 4 disposed within the housing 1. The first vibration device is fixed to the bottom of the housing 1, and a workpiece 5 to be polished can be mounted on the first vibration device. The second vibration device is fixed to the top of the housing 1, and the energy beam array generator 4 is fixed below the second vibration device, generating an energy beam array 6 that acts on the surface of the workpiece 5 to achieve comprehensive and efficient polishing.

[0117] The polishing method of this polishing device mainly includes the following steps:

[0118] (1) Fix the workpiece 5 to be polished on the first vibration device and place it within the coverage area of ​​the energy beam array 6;

[0119] (2) Set the vibration frequency and amplitude of the first vibration device and the second vibration device. The vibration amplitude is equal to the energy beam spacing in the corresponding direction. The vibration frequency can be set according to actual needs. Also set the operating parameters of the energy beam array generator 4, such as the energy beam spacing and the energy beam jet pressure.

[0120] (3) Start each device to polish the workpiece 5 to be polished, and wait for several seconds to several minutes to complete the polishing.

[0121] Example 2: Reference Figures 4 to 6 As shown, the first driving device 2 is a conveyor belt device, and the second driving device 3 is a second vibration device. This embodiment allows the polishing device to be directly applied to an industrial production line.

[0122] In this embodiment, the polishing device mainly includes a housing 1 and a conveyor belt device, a second vibration device, and an energy beam array generator 4 disposed within the housing 1. The conveyor belt device is fixed to the bottom of the housing 1 and passes through the housing 1. Several workpieces 5 to be polished can be mounted on the conveyor belt device. The second vibration device is fixed to the top of the housing 1. The energy beam array generator 4 is fixed below the second vibration device and can generate an energy beam array 6 acting on the surface of the workpieces 5 to be polished, achieving comprehensive and efficient polishing.

[0123] The polishing method of this polishing device mainly includes the following steps:

[0124] (1) Fix several workpieces 5 to be polished at the center of the conveyor belt device so that when they pass through the energy beam array generator 4, they can be within the coverage of the energy beam array 6.

[0125] (2) Set the conveying speed of the conveyor belt device, the vibration frequency and amplitude of the second vibration device. The vibration amplitude can be equal to the energy beam spacing in the corresponding direction. The vibration frequency can be set according to actual needs. Also set the operating parameters of the energy beam array generator 4, such as the energy beam spacing and the energy beam jet pressure.

[0126] (3) Start each device. Polishing begins when several workpieces 5 to be polished enter the box 1 one after another. Polishing is completed when the workpieces leave the box 1.

[0127] In summary, the polishing apparatus and method provided in this application, by combining the advantages of vibration technology and energy beam array, can improve polishing speed and ensure processing quality, and are especially suitable for industrial production lines to support the needs of continuous mass production.

[0128] The above are merely preferred embodiments of this application and are not intended to limit the embodiments of this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A polishing apparatus, characterized in that, include: The enclosure and the first drive unit, the second drive unit, and the energy beam array generator disposed within the enclosure, wherein: The first driving device is used to carry the workpiece to be polished and drive the workpiece to vibrate or move unidirectionally along the first direction; The second driving device is equipped with the energy beam array generator, which is used to drive the energy beam array generator to vibrate along the second direction; The energy beam array generator is oriented toward the first driving device to generate an energy beam array that covers the workpiece to be polished. The first direction and the second direction form an angle.

2. The polishing apparatus according to claim 1, characterized in that, When the first driving device drives the workpiece to be polished to vibrate along the first direction, the vibration amplitude is A1, and the energy beam spacing of the energy beam array along the first direction is L1, where: L1 / 2 < A1 < 2L1.

3. The polishing apparatus according to claim 1, characterized in that, The second driving device drives the energy beam array generator to vibrate along the second direction with an amplitude of A2, and the energy beam spacing of the energy beam array along the second direction is L2, where: L2 / 2 < A2 < 2L2.

4. The polishing apparatus according to claim 1, characterized in that, The included angle is between 45° and 90°.

5. The polishing apparatus according to claim 1, characterized in that, The first driving device is located at the bottom of the housing, and the second driving device is located at the top of the housing.

6. The polishing apparatus according to claim 1, characterized in that, The first driving device is a first vibration device or a conveyor belt device, and when the first driving device is the conveyor belt device, the conveyor belt device passes through the box body.

7. The polishing apparatus according to claim 1, characterized in that, The second driving device is a second vibration device.

8. The polishing apparatus according to any one of claims 1 to 7, characterized in that, The energy beam array is a pure water jet beam array, an abrasive water jet beam array, a plasma beam array, a laser beam array, or an ion beam array.

9. The polishing apparatus according to any one of claims 1 to 7, characterized in that, The distribution outline of the energy beam array is rectangular, circular, or hexagonal.

10. A polishing method for a polishing apparatus according to any one of claims 1 to 9, characterized in that, include: The workpiece to be polished is mounted on the first driving device; Set the operating parameters of the first driving device, the second driving device, and the energy beam array generator; The first driving device, the second driving device, and the energy beam array generator are controlled to start operation and polish the workpiece to be polished.

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