Chimeric piezoelectric micropump auxiliary driving loop heat pipe

Abstract

This invention specifically relates to a loop heat pipe assisted by a piezoelectric micropump, belonging to the field of loop heat pipe technology. This loop heat pipe assisted by a piezoelectric micropump includes an evaporation assembly, a condensation assembly, a vapor pipeline, a liquid pipeline, and a piezoelectric micropump. The vapor pipeline connects the steam outlet of the evaporation assembly and the steam inlet of the condensation assembly, the liquid pipeline connects the liquid outlet of the condensation assembly and the liquid inlet of the evaporation assembly, and the piezoelectric micropump is disposed in the vapor pipeline. In this device, the driving force of the piezoelectric micropump can drive the working fluid circulation, improving the working fluid circulation power of the loop heat pipe.

Description

Technical Field

[0001] This invention belongs to the field of loop heat pipe technology, specifically relating to a loop heat pipe with interlocking piezoelectric micropump assisted drive. Background Technology

[0002] Loop heat pipes, as a highly efficient two-phase flow heat dissipation device, have been widely used in electronic equipment heat dissipation, aerospace thermal control, and other fields due to their advantages such as no external driving force, compact structure, and high heat transfer efficiency. Their core working principle is to use capillary force generated by the capillary wick to drive the working fluid through a loop to complete the evaporation and condensation cycle, achieving efficient heat transfer. However, limited by the inherent driving characteristics of capillary force, its capillary driving force has inherent deficiencies, making it difficult to adapt to high-power, long-distance heat transfer requirements. In practical applications, several technical defects have been exposed: 1. When the heat transfer distance is long, the capillary force is difficult to overcome the flow resistance of the working fluid circulation, easily leading to start-up difficulties and hindering rapid and effective heat transfer; 2. When the equipment is overloaded, the inertial force generated by the working fluid circulation will offset part or even all of the capillary force, causing the loop heat pipe to lose its working fluid driving capability and fail; 3. The driving capability of capillary force cannot match the high-power heat dissipation requirements of the heat source, resulting in insufficient working fluid circulation rate, easy dry burning of the evaporator, and a significant decrease in overall heat dissipation performance, making it difficult to meet the thermal control requirements of high-power heat sources.

[0003] To address the insufficient capillary driving force of traditional loop heat pipes, related technical research has proposed improved schemes using pump-assisted drive, such as the existing pump-assisted loop heat pipe (CN118532978A). This technology adds a miniature piezoelectric pump to the loop, which assists in driving the working fluid circulation of the loop heat pipe. The miniature piezoelectric pump enhances the power of the working fluid circulation, thereby improving the start-up capability, overload resistance, and heat dissipation performance of the loop heat pipe. However, this pump-assisted loop heat pipe solution still has significant design flaws: Firstly, the core components such as the evaporator, condenser, liquid receiver, and miniature piezoelectric pump are all connected by flexible hoses. This hose connection method results in insufficient reliability, pressure resistance, and airtightness of the connections, easily leading to problems such as working fluid leakage and loose connections, affecting the stable operation and service life of the device. Secondly, the miniature piezoelectric pump is located in the liquid circuit, which naturally causes the pressure at the evaporator end to increase and the pressure at the condenser end to decrease during operation. This is not conducive to the evaporation and heat absorption of the working fluid in the evaporator and the condensation and heat release of the working fluid in the condenser.

[0004] In summary, providing a loop heat pipe structure with sufficient driving force and good heat dissipation performance is a technical problem that needs to be solved. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention provides a loop heat pipe with integrated piezoelectric micropump auxiliary drive, thereby solving the problems in the prior art. The technical solution adopted by this invention is as follows: A loop heat pipe with integrated piezoelectric micropump auxiliary drive includes an evaporation assembly, a condensation assembly, a steam line, a liquid line, and a piezoelectric micropump. The steam line connects the steam outlet of the evaporation assembly and the steam inlet of the condensation assembly, the liquid line connects the liquid outlet of the condensation assembly and the liquid inlet of the evaporation assembly, and the piezoelectric micropump is disposed in the steam line.

[0006] Furthermore, it also includes a compensation component, which is installed in the liquid pipeline.

[0007] Furthermore, the compensation components can be made of materials such as copper or stainless steel.

[0008] Furthermore, the compensation components are formed by 3D printing.

[0009] Furthermore, the evaporation assembly includes an evaporation shell and a capillary wick housed within the evaporation shell, the material of which may be copper or stainless steel.

[0010] Furthermore, the capillary core is configured to be machined or sintered.

[0011] Furthermore, the condensation assembly includes a condensation housing and fins housed within the condensation housing, the material of which may be copper or stainless steel.

[0012] Furthermore, the condensation components are formed using 3D printing.

[0013] Furthermore, the materials of the steam pipes and liquid pipes include metals, with the steam pipes welded to the evaporation and condensation components, and the liquid pipes welded to the evaporation and condensation components.

[0014] Furthermore, the evaporation assembly includes an evaporation shell, which is provided with a connecting component. The connecting component includes an outer ring channel, an inner ring channel, and a docking channel. The outer ring channel is connected to the evaporation shell and is fitted inside the inner ring channel. The inner ring channel and the outer ring channel are threaded together. The docking channel is used for welding to a steam pipeline or a liquid pipeline. The inner ring channel is fitted inside the docking channel, and the inner ring channel and the docking channel are welded together.

[0015] The present invention has the following beneficial effects: 1. By utilizing the driving force of the piezoelectric micropump, the working fluid can be circulated, thereby enhancing the working fluid circulation power of the loop heat pipe.

[0016] 2. By placing a piezoelectric micropump in the steam pipeline, a pressure difference is created between the two ends of the steam pipeline, reducing the pressure at the evaporator end and increasing the pressure at the condenser end. This makes it easier for the evaporator to vaporize and absorb heat, and easier for the condenser to liquefy and release heat, thereby enhancing the overall heat dissipation performance of the loop heat pipe.

[0017] 3. By adjusting the pressure difference between the inlet and outlet of the piezoelectric micropump, the evaporation temperature of the working fluid can be changed, thereby achieving temperature control of the loop heat pipe.

[0018] 4. All components of the loop heat pipe are welded together to form a loop of steam and liquid pipes, resulting in a high overall structural strength, good sealing performance, and strong pressure resistance. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the loop heat pipe with intercalated piezoelectric micropump auxiliary drive according to the present invention; Figure 2 This is a schematic diagram of the internal structure of the evaporation assembly of the present invention; Figure 3 This is a schematic diagram of the piezoelectric micropump of the present invention; Figure 4 This is a schematic diagram of the condensation assembly of the present invention; Figure 5 This is a schematic diagram of the connecting component of the present invention (taking it as an example of being disposed in the evaporator shell and connected to the steam pipeline); Figure 6 This is a schematic diagram of the connecting component (showing the notch) of the present invention; Figure 7 This is a schematic diagram of the structure of the connecting component of the present invention (outer ring channel cross-section, showing the limiting ring groove); Figure 8 This is a schematic diagram of the connecting component of the present invention (outer ring channel cross-section showing the limiting ring groove and the disassembly of the limiting ring); Figure 9 This is a flowchart of the present invention; Icon labels: 1-Evaporation assembly, 2-Condensation assembly, 3-Steam pipeline, 4-Liquid pipeline, 5-Piezoelectric micropump, 6-Controller, 7-Compensation assembly, 8-Evaporation shell, 9-Capillary wick, 10-Vibrator, 11-Vibrator chamber, 12-Condensation shell, 13-Fins, 14-Flare port, 15-Outer ring channel, 16-Matching channel, 17-Notch, 18-Limiting ring, 19-Inner ring channel, 20-Limiting ring groove, 21-Abutting part, 22-Matching part. Detailed Implementation

[0020] The following will be based on embodiments of the present invention. Figures 1-9 The technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Unless otherwise specified, the technical means used in the embodiments are conventional means well known to those skilled in the art.

[0021] A loop heat pipe with embedded piezoelectric micropump-assisted drive includes an evaporation assembly 1, a condensation assembly 2, a steam pipe 3, a liquid pipe 4, and a piezoelectric micropump 5. The steam pipe 3 connects the steam outlet of the evaporation assembly 1 and the steam inlet of the condensation assembly 2, the liquid pipe 4 connects the liquid outlet of the condensation assembly 2 and the liquid inlet of the evaporation assembly 1, and the piezoelectric micropump 5 is disposed in the steam pipe 3.

[0022] Evaporation component 1 is used in conjunction with a heat source. Under the heat of the heat source, the liquid working fluid in the capillary wick 9 inside the evaporation component 1 undergoes a liquid-gas phase change and carries the latent heat of vaporization to form steam. The steam is transported to the condensation component 2 through the steam pipeline 3.

[0023] The condenser assembly 2 is used to receive the high-temperature working fluid steam delivered by the evaporator assembly 1. Through heat exchange with the cold source, the steam achieves a gas-liquid phase change, and the latent heat of vaporization carried by the steam is efficiently released to the cold source. The condensed liquid working fluid flows back to the evaporator through the liquid pipeline 4 to complete the working fluid cycle.

[0024] For common loop heat pipes without piezoelectric micropumps 5, the condensed liquid working fluid returns to the evaporator via liquid pipe 4, relying on the combined effect of gravity and capillary suction of capillary wick 9 of evaporation component 1.

[0025] The piezoelectric micropump 5 is installed in the steam pipeline 3, which means that the steam pipeline 3 is divided into two sections: one section connects the steam outlet of the evaporation component 1 to the inlet of the piezoelectric micropump 5, and the other section connects the steam inlet of the condensation component 2 to the outlet of the piezoelectric micropump 5.

[0026] In this technical solution, on the one hand, the driving force of the piezoelectric micropump 5 can drive the working fluid circulation, thereby improving the working fluid circulation power of the loop heat pipe. On the other hand, by setting the piezoelectric micropump 5 in the steam pipe 3, a pressure difference is formed between the two ends of the steam pipe 3, reducing the pressure at the evaporator end and increasing the pressure at the condenser end, making it easier for the evaporator to vaporize and absorb heat, and easier for the condenser end to liquefy and release heat, thus enhancing the overall heat dissipation performance of the loop heat pipe.

[0027] Piezoelectric micropumps 5 are technically mature products in the prior art, and those skilled in the art can choose the appropriate type according to their needs. For example, the piezoelectric micropump 5 can use piezoelectric ceramic as the oscillator 10 and a copper substrate as the oscillator cavity 11, with the oscillator 10 bonded to the oscillator cavity 11 via vacuum diffusion welding. Using piezoelectric ceramic as the oscillator 10 allows for precise high-frequency driving of the microfluidic fluid. The copper substrate oscillator cavity 11 has good thermal conductivity, enabling rapid heat dissipation from the oscillator 10. The oscillator 10 and the cavity are bonded at the atomic level through vacuum diffusion welding, resulting in no adhesive layer loss, high energy and heat transfer efficiency, and improved reliability and lifespan of the micropump. Alternatively, the piezoelectric micropump 5 can use a silicon-based piezoelectric thin film, with the piezoelectric oscillator 10 bonded by adhesive bonding, and the oscillator cavity 11 made of stainless steel. This type of piezoelectric micropump 5 offers advantages such as precise flow control, high strength and corrosion resistance of the stainless steel oscillator cavity 11, suitability for complex fluid conditions, and a simple and low-cost adhesive bonding process.

[0028] In this embodiment, the operation of the piezoelectric micropump 5 can be controlled by the controller 6. By adjusting the pressure difference between the inlet and outlet of the piezoelectric micropump 5, the evaporation temperature of the working fluid can be changed, thereby achieving temperature regulation of the loop heat pipe.

[0029] The specific circuit, programming code, and working principle of the controller 6 controlling the piezoelectric micropump 5 are well known to those skilled in the art and will not be described in detail here.

[0030] Furthermore, it also includes a compensation component 7, which is installed in the liquid pipeline 4.

[0031] The compensation component 7 is installed in the liquid pipeline 4, which means that the liquid pipeline 4 is divided into two sections: one section connects the liquid inlet of the evaporation component 1 and the outlet of the compensation component 7, and the other section connects the liquid outlet of the condensation component 2 and the inlet of the compensation component 7.

[0032] The compensation component 7 serves several purposes. First, it stores excess liquid working fluid, replenishing the evaporator as needed to stabilize the total amount of working fluid in the system. Second, it balances loop pressure and suppresses overheating vaporization of the working fluid. Third, it separates the vapor and liquid phases to prevent vapor from entering the liquid path.

[0033] Furthermore, the compensation component 7 is made of materials including copper or stainless steel.

[0034] The compensation component 7 can be a liquid reservoir as in the prior art, the structure and working principle of which are well known to those skilled in the art and will not be described in detail here. In this embodiment, only the material of the compensation component 7 has been improved.

[0035] The advantage of using copper for compensation component 7 is that copper can quickly equalize the temperature of the working fluid inside the reservoir, avoiding localized phase anomalies. At the same time, copper is resistant to working fluid corrosion and has excellent high-temperature stability. Compensation component 7 can also be made of stainless steel, which has good corrosion resistance, pressure resistance, and stable high-temperature mechanical properties, while being lightweight and cost-effective.

[0036] Furthermore, the compensation component 7 is formed by 3D printing.

[0037] The compensation component 7 is formed by 3D printing, which allows the compensation component 7 to be formed in various different types.

[0038] It should be noted that the 3D printing technology for metal materials is well known to those skilled in the art, and will not be elaborated here.

[0039] The compensation component 7 is formed by 3D printing, which facilitates the creation of complex chambers or flow channels. Furthermore, it reduces the need for welding and sealing, lowering the risk of leakage from the compensation component 7.

[0040] In this embodiment, the material of the compensation component 7 needs to be a material suitable for 3D printing, such as stainless steel.

[0041] Furthermore, the evaporation assembly 1 includes an evaporation shell 8 and a capillary wick 9 housed within the evaporation shell 8. The evaporation shell 8 is made of copper or stainless steel.

[0042] Evaporation assembly 1 can be an evaporator as in the prior art. The structure and working principle of the evaporator are well known to those skilled in the art and will not be described in detail here.

[0043] The evaporator shell 8 is made of copper, which increases the thermal conductivity of the evaporator assembly 1, enabling it to quickly transfer heat from the heat source to the working fluid and improve heat exchange efficiency. It is also easy to process and shape.

[0044] The evaporator shell 8 is made of stainless steel, which has the advantages of corrosion resistance and high high-temperature strength. This reduces the risk of reaction between the working fluid and the shell, and extends the service life of the loop heat pipe.

[0045] Furthermore, the capillary core 9 is configured to be machined or sintered.

[0046] It should be noted that the capillary wick 9 formed by machining and the capillary wick 9 formed by sintering are two different processing technologies known to those skilled in the art. That is, there are technically mature products of these two types of capillary wick 9 in the prior art.

[0047] The machined capillary core 9 can be processed into complex structures and can fit tightly with the evaporator shell 8, reducing contact thermal resistance. The sintered capillary core 9 can have its capillary properties controlled by the powder ratio to meet the usage requirements of loop heat pipes under different operating conditions.

[0048] Furthermore, the condensation assembly 2 includes a condensation housing 12 and fins 13 housed within the condensation housing 12. The condensation housing 12 is made of copper or stainless steel.

[0049] The condensing component 2 can be a condenser in the prior art, the structure and working principle of which are well known to those skilled in the art and will not be described in detail here.

[0050] The copper condenser shell 12 has excellent thermal conductivity, enabling it to quickly transfer the heat from the condensation of the working fluid to the outside. The stainless steel condenser shell 12 has excellent high-temperature and corrosion resistance, and also boasts the advantage of low manufacturing cost.

[0051] Furthermore, the condensation component 2 is formed by 3D printing.

[0052] The 3D-printed condenser assembly 2 can be integrally molded with complex flow channels and irregular structures, improving heat exchange efficiency. Furthermore, the overall structure requires no splicing and has excellent sealing performance.

[0053] Furthermore, the materials of the steam pipe 3 and the liquid pipe 4 include metal. The steam pipe 3 is welded to the evaporation assembly 1 and the condensation assembly 2, and the liquid pipe 4 is welded to the evaporation assembly 1 and the condensation assembly 2.

[0054] The materials of the steam pipe 3 and the liquid pipe 4 include metal, so that all the components of the loop heat pipe are welded together in the loop formed by the steam pipe 3 and the liquid pipe 4, resulting in a high overall structural strength, good sealing performance, and strong pressure resistance.

[0055] For example, the steam pipe 3 and the liquid pipe 4 can be made of copper or stainless steel.

[0056] Furthermore, the evaporation assembly 1 includes an evaporation shell 8, which is provided with a connecting component. The connecting component includes an outer ring channel 15, an inner ring channel 19, and a docking channel 16. The outer ring channel 15 is connected to the evaporation shell 8 and is fitted onto the inner ring channel 19. The inner ring channel 19 and the outer ring channel 15 are threaded together. The docking channel 16 is used for welding to the steam pipeline 3 or the liquid pipeline 4. The inner ring channel 19 is fitted onto the docking channel 16, and the inner ring channel 19 and the docking channel 16 are welded together.

[0057] The outer ring channel 15 is connected to the interior of the evaporator shell 8.

[0058] The outer ring channel 15, the inner ring channel 19, and the connecting channel 16 form a complete channel.

[0059] When the steam pipe 3 or the liquid pipe 4 is welded to the docking channel 16, the steam pipe 3 or the liquid pipe 4 is connected to the evaporator shell 8, so that the working fluid can be output from or input to the evaporator shell 8.

[0060] Since the docking channel 16 is threaded to the outer ring channel 15 via the inner ring channel 19, the docking channel 16 can be detachably connected to the evaporator shell 8. The advantage of this arrangement is that after the evaporator assembly 1 is welded to the steam line 3 or the liquid line 4, the evaporator assembly 1 can be disassembled as needed, for example, when the evaporator assembly 1 needs to be replaced.

[0061] The reason why steam pipe 3 and liquid pipe 4 are not directly threaded to evaporator shell 8 is that, firstly, the extension direction of steam pipe 3 and liquid pipe 4 needs to be customized according to the actual situation of the equipment, which is not involved in the manufacturing of evaporator assembly 1. Secondly, the inner diameter of steam pipe 3 and liquid pipe 4 is small, making it difficult to install threads on their surfaces.

[0062] In this embodiment, since the inner diameters of the steam pipe 3 and the liquid pipe 4 are small, the corresponding inner diameter of the docking channel 16 is also small. Welding the inner ring channel 19 to the docking channel 16 allows for a larger diameter, facilitating the installation of threads on the outer circumferential wall of the inner ring channel 19, enabling it to be threadedly connected to the outer ring channel 15. Furthermore, the combination of the inner ring channel 19 and the docking channel 16 increases the overall structural strength of the structure formed by them.

[0063] In this embodiment, the inner circumferential wall of the outer ring channel 15 may be provided with a limiting ring groove 20, and the end of the outer ring channel 15 away from the evaporator shell 8 may be provided with a notch 17, which communicates with the limiting ring groove 20. When the inner ring channel 19 is connected to the outer ring channel 15, the inner ring channel 19 is located on the side of the outer ring channel 15 closer to the evaporator shell 8, and the limiting ring groove 20 is located on the side of the inner ring channel 19 away from the evaporator shell 8. The connecting component also includes a limiting ring 18, which is sleeved on the docking channel 16 and has a mating part 22. When installing the limiting ring 18, the mating part 22 and the notch 17 are aligned, at which point the limiting ring 18 can be engaged in the limiting ring groove 20. Then, the limiting ring groove 20 is rotated to misalign the mating part 22 and the notch 17, and the limiting ring 18 abuts against the end of the inner ring channel 19 away from the evaporator shell 8, so that the limiting ring 18 can play a role in preventing the inner ring channel 19 from loosening. It should be noted that after the limiting ring 18 is engaged with the mating part 22, the rotation direction in the limiting ring groove 20 is the same as the rotation direction when the inner ring channel 19 rotates out of the outer ring channel 15. For example, if the inner ring channel 19 rotates clockwise out of the outer ring channel 15, then the limiting ring 18 will also rotate clockwise in the limiting ring groove 20. Since the inner ring channel 19 cannot rotate counterclockwise to continue rotating into the outer ring channel 15 when it moves to the limit position, it can only rotate clockwise out of the outer ring channel 15. Therefore, the limiting ring 18 can be installed by rotating clockwise to prevent the risk of the limiting ring 18 coming out of the limiting ring groove 20.

[0064] A stop part 21 may be provided in the limiting ring groove 20 to limit the angle of rotation of the limiting ring 18.

[0065] In this embodiment, the ports of the docking channel 16 welded to the liquid pipeline 4 and the steam pipeline 3 can be flared horn ports 14 for the liquid pipeline 4 and the steam pipeline 3 to be inserted, which increases the welding space of the docking channel 16 and improves the welding reliability.

[0066] Of course, the connecting component in this embodiment can also be disposed on the compensation component 7 or the condensation component 2.

[0067] like Figure 9 The present invention also proposes a loop heat pipe cooling method assisted by a piezoelectric micropump, comprising the following steps: Step 1: Initial Setup and Debugging First, the bottom heat source contact surface of the evaporator shell 8 of the evaporator assembly 1 is tightly attached to the surface of the heat source to be cooled, and thermally conductive interface material is filled between the contact surfaces; the condenser assembly 2 is connected to the external cold source, and the air-cooled or liquid-cooled heat exchange method is selected according to the heat dissipation scenario to complete the cold circuit connection; the initial driving frequency and output voltage parameters of the piezoelectric micropump 5 are preset according to the rated heating power of the heat source.

[0068] Step 2: Loop heat pipe start-up and working fluid circulation auxiliary drive: The heat source generates heat upon startup, which is rapidly conducted to the capillary wick 9 through the evaporator shell 8. The liquid working fluid adsorbed in the pores of the capillary wick 9 absorbs the heat and undergoes a liquid-gas phase change, evaporating into high-temperature, high-pressure steam, which collects at the steam outlet of the evaporator assembly 1. The controller 6 drives the piezoelectric micropump 5 to start operation, and the piezoelectric ceramic oscillator 10 generates reciprocating vibration under high-frequency alternating voltage, driving the fluid in the oscillator cavity 11 to flow in a directional manner, forming a directional suction driving force in the steam pipeline 3. This creates an active suction effect on the high-temperature steam at the steam outlet of the evaporator assembly 1, reducing the pressure in the evaporator chamber of the evaporator assembly 1, while simultaneously increasing the pressure at the steam inlet of the condenser assembly 2, forming a stable pressure difference between the two ends of the steam pipeline 3. Under the active drive of the piezoelectric micropump 5 and the synergistic effect of the capillary force of the capillary wick 9, the high-temperature steam flows out from the steam outlet of the evaporator assembly 1, enters the steam pipeline 3, and after being pressurized and transported by the piezoelectric micropump 5, it quickly flows into the steam inlet of the condenser assembly 2, completing the active directional transport of steam and solving the problem of startup difficulties caused by insufficient capillary driving force in traditional loop heat pipes.

[0069] Step 3: Condensation heat exchange and working fluid liquefaction: High-temperature and high-pressure steam enters the condenser shell 12 of the condenser assembly 2 and flows along the serpentine condenser channel. The latent heat of vaporization carried by the steam is quickly transferred to the external cold source through the condenser shell 12 and fins 13. After the steam releases heat, a gas-liquid phase change occurs, and it condenses into a low-temperature liquid working fluid. Under the action of pressure difference and gravity, the liquid working fluid formed by condensation gathers at the liquid outlet of the condenser assembly 2 and flows into the liquid pipeline 4, completing the condensation and liquefaction of the working fluid and the heat removal.

[0070] Step 4: Working fluid compensation and vapor-liquid separation: The low-temperature liquid working fluid in the liquid pipeline 4 flows into the compensation component 7. The vapor-liquid separation chamber inside the compensation component 7 separates the trace amounts of non-condensable gases and incompletely condensed vapors entrained in the working fluid, preventing vapors from entering the liquid pipeline 4 and affecting the working fluid reflux. The liquid storage chamber of the compensation component 7 stores excess liquid working fluid. Based on the working fluid circulation volume in the loop and the liquid supply demand of the evaporation component 1, the liquid working fluid is stably supplied to the liquid inlet of the evaporation component 1 through the liquid replenishment channel. Dynamic replenishment of the working fluid is achieved when the heat source load fluctuates, stabilizing the total amount of working fluid in the loop, suppressing overheating vaporization of the working fluid, ensuring continuous liquid supply to the evaporation component 1, and avoiding dry burning.

[0071] Step 5: Liquid working fluid reflux and circulation: After being stabilized and replenished by the compensation component 7, the low-temperature liquid working fluid flows into the evaporation shell 8 from the liquid inlet end of the evaporation component 1 through the liquid pipeline 4. It is adsorbed by the capillary core 9 and evenly spread to the evaporation surface, continuously replenishing the liquid working fluid for the liquid-gas phase change process. The liquid working fluid that flows back into the evaporation component 1 absorbs heat from the heat source again and undergoes phase change evaporation, forming a continuous and stable working fluid phase change cycle. With the assistance of the piezoelectric micro-pump 5, the heat generated by the heat source is continuously and efficiently transferred to the external cold source, thereby achieving continuous cooling of the heat source.

[0072] Step 6: Dynamic Control and Protection of Operating Status During system operation, controller 6 collects the temperature data of the heat source in real time. Based on the load changes and temperature fluctuations of the heat source, it dynamically adjusts the driving frequency and output voltage of piezoelectric micropump 5, changes the inlet and outlet pressure difference of piezoelectric micropump 5 and the working fluid delivery flow rate, and thus adjusts the evaporation temperature and circulation rate of the working fluid to achieve precise closed-loop control of the operating temperature of the loop heat pipe.

[0073] When the heat source is in a low-load standby state, the controller 6 reduces the driving power of the piezoelectric micropump 5 to reduce energy consumption and relies on the capillary force of the capillary wick 9 to maintain the basic working fluid circulation; when the heat source is in a high-load full-power operating state, the controller 6 increases the driving power of the piezoelectric micropump 5, greatly enhances the driving force of the working fluid circulation, improves the heat transfer limit of the loop, and meets the heat dissipation requirements of the high-power heat source.

[0074] When abnormal pressure fluctuations occur within the loop, the compensation component 7 balances the pressure within the loop to prevent excessive system pressure.

[0075] Step 7: System Shutdown and State Maintenance After the heat source stops operating, the controller 6 first maintains the piezoelectric micropump 5 at low power for a period of time. After the working fluid in the evaporation component 1 has been completely condensed and the temperature in the loop has dropped to the ambient temperature, the controller controls the piezoelectric micropump 5 to stop operating.

[0076] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Any modifications, alterations, substitutions, or variations made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention shall fall within the protection scope defined by the claims of the present invention.

Claims

1. A loop heat pipe with embedded piezoelectric micropump-assisted drive, characterized in that, include: Evaporation assembly (1); Condensation assembly (2); Steam pipe (3) connects the steam outlet of the evaporation assembly (1) and the steam inlet of the condensation assembly (2); Liquid pipeline (4) connects the liquid outlet of the condensation component (2) and the liquid inlet of the evaporation component (1); A piezoelectric micropump (5) is installed in the steam pipeline (3).

2. The loop heat pipe with embedded piezoelectric micropump assisted drive according to claim 1, characterized in that, It also includes a compensation component (7), which is disposed on the liquid pipeline (4).

3. The loop heat pipe with embedded piezoelectric micropump assisted drive according to claim 2, characterized in that, The compensation component (7) is made of copper or stainless steel.

4. The loop heat pipe with embedded piezoelectric micropump assisted drive according to claim 2, characterized in that, The compensation component (7) is formed by 3D printing.

5. The loop heat pipe with embedded piezoelectric micropump assisted drive according to claim 1, characterized in that, The evaporation assembly (1) includes an evaporation shell (8) and a capillary wick (9) housed within the evaporation shell (8). The evaporation shell (8) is made of copper or stainless steel.

6. The loop heat pipe with embedded piezoelectric micropump assisted drive according to claim 5, characterized in that, The capillary core (9) is configured to be machined or sintered.

7. The loop heat pipe with embedded piezoelectric micropump assisted drive according to claim 1, characterized in that, The condensation assembly (2) includes a condensation shell (12) and fins (13) housed within the condensation shell (12). The condensation shell (12) is made of copper or stainless steel.

8. The loop heat pipe with intercalated piezoelectric micropump assisted drive according to claim 7, characterized in that, The condensation component (2) is formed by 3D printing.

9. The loop heat pipe with embedded piezoelectric micropump assisted drive according to claim 1, characterized in that, The steam pipe (3) and the liquid pipe (4) are made of metal. The steam pipe (3) is welded to the evaporation assembly (1) and the condensation assembly (2). The liquid pipe (4) is welded to the evaporation assembly (1) and the condensation assembly (2).

10. The loop heat pipe with intercalated piezoelectric micropump assisted drive according to claim 9, characterized in that, The evaporation assembly (1) includes an evaporation shell (8), the evaporation shell (8) being provided with a connecting component, the connecting component including: The outer ring channel (15) is connected to the evaporation shell (8); Inner ring channel (19), outer ring channel (15) sleeved on inner ring channel (19), inner ring channel (19) and outer ring channel (15) threaded connection; A docking channel (16) is used to weld with the steam pipeline (3) or the liquid pipeline (4). An inner ring channel (19) is fitted onto the docking channel (16), and the inner ring channel (19) and the docking channel (16) are welded together.

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